公开(公告)号：US20080122056A1

公开(公告)日：2008-05-29

申请号：US11983451

申请日：2007-11-09

申请人： Shle-Ge Lee ,  Dong-Kil Shin ,  Min-Young Son

发明人： Shle-Ge Lee ,  Dong-Kil Shin ,  Min-Young Son

IPC分类号： H01L23/488

CPC分类号： H01L23/13 ,  H01L23/49816 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Provided is a semiconductor device package comprising a printed circuit board, the printed circuit board including a window at a central portion and a connection part, a semiconductor chip including center-type bonding pads, wherein the semiconductor chip is mounted on an upper surface of the printed circuit board such that the center-type bonding pads are exposed by the window, bonding wires electrically connecting the center-type bonding pads with the printed circuit board through the window, a lower molding material at a lower surface of the printed circuit board, the lower molding material encapsulating the center-type bonding pads and the bonding wires, and an upper molding material encapsulating the semiconductor chip and the upper surface of the printed circuit board, wherein the lower molding material and the upper molding material are connected to each other through the connection part of the printed circuit board.

摘要翻译： 提供一种半导体器件封装，其包括印刷电路板，印刷电路板包括在中心部分处的窗口和连接部分，包括中心型接合焊盘的半导体芯片，其中半导体芯片安装在 印刷电路板，使得中心型接合焊盘由窗户露出，通过窗口将中心型接合焊盘与印刷电路板电连接的接合线，印刷电路板的下表面处的下部成型材料， 封装中心型接合焊盘和接合线的下部成型材料以及封装半导体芯片和印刷电路板的上表面的上部成型材料，其中下部成型材料和上部成型材料彼此连接 通过印刷电路板的连接部分。

公开(公告)号：US07812265B2

公开(公告)日：2010-10-12

申请号：US12124915

申请日：2008-05-21

申请人： Mu-Seob Shin ,  Byung-Seo Kim ,  Min-Young Son ,  Min-Keun Kwak

发明人： Mu-Seob Shin ,  Byung-Seo Kim ,  Min-Young Son ,  Min-Keun Kwak

IPC分类号： H01L23/28

CPC分类号： H01L21/565 ,  H01L23/3128 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/05553 ,  H01L2224/06136 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Provided are a semiconductor package and a method for forming the same, and a PCB (printed circuit board). The semiconductor package comprises: a PCB including a slit at a substantially central portion thereof, the PCB including an upper surface and a lower surface; a semiconductor chip mounted on the upper surface of the PCB; an upper molding layer disposed on the upper surface and covering the semiconductor chip; and a lower molding layer filling the slit and covering a portion of the lower surface of the PCB, wherein the PCB comprises a connecting recess at a side surface thereof, and the upper molding layer and the lower molding layer are in contact with each other at the connecting recess.

摘要翻译： 提供一种半导体封装及其形成方法，以及PCB（印刷电路板）。 所述半导体封装包括：PCB，其在其大致中央部分包括狭缝，所述PCB包括上表面和下表面; 安装在PCB的上表面上的半导体芯片; 上模制层，设置在上表面并覆盖半导体芯片; 以及填充所述狭缝并覆盖所述PCB的下表面的一部分的下成型层，其中所述PCB包括在其侧表面处的连接凹部，并且所述上成型层和所述下成型层彼此接触 连接凹槽。

公开(公告)号：US06825511B2

公开(公告)日：2004-11-30

申请号：US10269202

申请日：2002-10-10

申请人： Young-Hee Song ,  Ill-Heung Choi ,  Min-Young Son ,  Min-Sang Park

发明人： Young-Hee Song ,  Ill-Heung Choi ,  Min-Young Son ,  Min-Sang Park

IPC分类号： H01L2710

CPC分类号： H01L24/05 ,  H01L23/5258 ,  H01L24/03 ,  H01L24/45 ,  H01L24/48 ,  H01L27/10897 ,  H01L2224/04042 ,  H01L2224/05155 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor device, capable of improving integration density and solving problems that may occur in a laser repair process, and a method of fabricating the same are provided. A fuse circuit is formed in a cell region, not in a peripheral region, and thus it is possible to reduce the size of a semiconductor chip.

摘要翻译： 提供能够提高集成密度并解决激光修复过程中可能发生的问题的半导体器件及其制造方法。 在单元区域中形成熔丝电路，而不是在周边区域，因此可以减小半导体芯片的尺寸。

公开(公告)号：US08116088B2

公开(公告)日：2012-02-14

申请号：US12116123

申请日：2008-05-06

申请人： Mu-Seob Shin ,  Min-Young Son ,  Tae-Sung Yoon ,  Young-Hee Song ,  Byung-Seo Kim

发明人： Mu-Seob Shin ,  Min-Young Son ,  Tae-Sung Yoon ,  Young-Hee Song ,  Byung-Seo Kim

IPC分类号： H05K1/11 ,  H05K3/34 ,  H01L23/02 ,  H01L23/48

CPC分类号： H01L23/13 ,  H01L23/3128 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/05553 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/484 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： Provided are a semiconductor package, a method of forming the semiconductor package, and a printed circuit board (PCB). The semiconductor package includes: a PCB including at least two parts divided by an isolation region; a semiconductor chip mounted on the PCB; and a molding layer disposed in the isolation region. The method includes: preparing a PCB, the PCB including a plurality of chip regions and a scribe region; forming isolation regions dividing each of the chip regions into two parts, the isolation regions including inner isolation regions and outer isolation regions, the inner isolation regions being provided in the chip regions, the outer isolation regions being provided at both ends of the inner isolation regions so as to extend toward the scribe region; mounting semiconductor chips on the chip regions; and cutting the PCB along the scribe region to divide the chip regions into at least two parts.

摘要翻译： 提供半导体封装，形成半导体封装的方法和印刷电路板（PCB）。 半导体封装包括：PCB，其包括由隔离区域划分的至少两个部分; 安装在PCB上的半导体芯片; 以及设置在隔离区域中的成型层。 该方法包括：准备PCB，PCB包括多个芯片区域和划线区域; 形成将每个芯片区域分成两部分的隔离区域，隔离区域包括内部隔离区域和外部隔离区域，内部隔离区域设置在芯片区域中，外部隔离区域设置在内部隔离区域的两端 以扩展到划刻区域; 将半导体芯片安装在芯片区域上; 以及沿着划线区域切割PCB以将芯片区域分成至少两个部分。

公开(公告)号：US07589405B2

公开(公告)日：2009-09-15

申请号：US11286058

申请日：2005-11-23

申请人： Min-Young Son ,  Woo-Dong Lee

发明人： Min-Young Son ,  Woo-Dong Lee

IPC分类号： H01L23/02

CPC分类号： H01L23/5388 ,  H01L23/3121 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0655 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H05K3/284 ,  H05K3/3452 ,  H05K2201/0919 ,  H05K2201/0989 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Provided are a memory card and a method of fabricating the memory card. The memory card includes: a printed circuit board including conductive wires exposed to at least a portion of an outer wall of the printed circuit board; at least one electronic device mounted on the printed circuit board; and a molding part sealing the at least one electronic device on the printed circuit board and the conductive wires exposed to the outer wall of the printed circuit board, and simultaneously exposing at least a portion of the outer wall of the printed circuit board.

摘要翻译： 提供了存储卡和制造存储卡的方法。 存储卡包括：印刷电路板，包括暴露于印刷电路板的外壁的至少一部分的导线; 安装在印刷电路板上的至少一个电子装置; 以及密封印刷电路板上的至少一个电子器件和暴露于印刷电路板的外壁的导电线的成型部件，并且同时暴露印刷电路板的外壁的至少一部分。

公开(公告)号：US20090121332A1

公开(公告)日：2009-05-14

申请号：US12266765

申请日：2008-11-07

申请人： Sung-Hwan YOON ,  Sang-Wook Park ,  Min-Young Son

发明人： Sung-Hwan YOON ,  Sang-Wook Park ,  Min-Young Son

IPC分类号： H01L23/495

CPC分类号： H01L23/49575 ,  H01L23/293 ,  H01L23/3107 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor chip package includes a lead frame, an insulation member, a chip, bonding wires and a sealing member. The lead frame includes a plurality of first leads and a plurality of second leads. The second leads have a chip adhesion region. The insulation member fills a space between the second leads in the chip adhesion region. The chip is provided on at least one surface of the insulation member. The chip has single-side bonding pads. The bonding wires electrically connect the leads and the bonding pads. The sealing member covers the lead frame, the insulation member, the chip and the bonding wires. Since the space between the second leads is filled with the insulation member, voids may be prevented from occurring.

摘要翻译： 半导体芯片封装包括引线框架，绝缘构件，芯片，接合线和密封构件。 引线框架包括多个第一引线和多个第二引线。 第二引线具有芯片粘附区域。 绝缘构件填充芯片粘合区域中的第二引线之间的空间。 芯片设置在绝缘构件的至少一个表面上。 该芯片具有单面接合焊盘。 接合线将引线和接合焊盘电连接。 密封构件覆盖引线框架，绝缘构件，芯片和接合线。 由于第二引线之间的空间填充有绝缘构件，因此可以防止发生空隙。

公开(公告)号：US07368330B2

公开(公告)日：2008-05-06

申请号：US10971374

申请日：2004-10-22

申请人： Young-Hee Song ,  Ill-Heung Choi ,  Min-Young Son ,  Min-Sang Park

发明人： Young-Hee Song ,  Ill-Heung Choi ,  Min-Young Son ,  Min-Sang Park

IPC分类号： H01L21/82

CPC分类号： H01L24/05 ,  H01L23/5258 ,  H01L24/03 ,  H01L24/45 ,  H01L24/48 ,  H01L27/10897 ,  H01L2224/04042 ,  H01L2224/05155 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor device, capable of improving integration density and solving problems that may occur in a laser repair process, and a method of fabricating the same are provided. A fuse circuit is formed in a cell region, not in a peripheral region, and thus it is possible to reduce the size of a semiconductor chip.

摘要翻译： 提供能够提高集成密度并解决激光修复过程中可能发生的问题的半导体器件及其制造方法。 在单元区域中形成熔丝电路，而不是在周边区域，因此可以减小半导体芯片的尺寸。

公开(公告)号：US20060116014A1

公开(公告)日：2006-06-01

申请号：US11286058

申请日：2005-11-23

申请人： Min-Young Son ,  Woo-Dong Lee

发明人： Min-Young Son ,  Woo-Dong Lee

IPC分类号： H01R13/52

CPC分类号： H01L23/5388 ,  H01L23/3121 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0655 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H05K3/284 ,  H05K3/3452 ,  H05K2201/0919 ,  H05K2201/0989 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Provided are a memory card and a method of fabricating the memory card. The memory card includes: a printed circuit board including conductive wires exposed to at least a portion of an outer wall of the printed circuit board; at least one electronic device mounted on the printed circuit board; and a molding part sealing the at least one electronic device on the printed circuit board and the conductive wires exposed to the outer wall of the printed circuit board, and simultaneously exposing at least a portion of the outer wall of the printed circuit board.

公开(公告)号：US08129826B2

公开(公告)日：2012-03-06

申请号：US12355587

申请日：2009-01-16

申请人： Sang-Wook Park ,  Min-Young Son ,  Hyeong-Seob Kim

发明人： Sang-Wook Park ,  Min-Young Son ,  Hyeong-Seob Kim

IPC分类号： H01L23/495 ,  H01L23/48

CPC分类号： H01L25/0657 ,  H01L23/49531 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05553 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2225/06506 ,  H01L2225/06527 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/10161 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： Provided is a semiconductor package apparatus having a redistribution layer. The apparatus includes at least one or more semiconductor chips, a packing part protecting the semiconductor chips, and a support part supporting the semiconductor chips. The apparatus also includes external terminals extending outside the packing part, redistribution layers installed between the semiconductor chips and the support part and including redistribution paths, first signal transmitting units, and second signal transmitting units. The first signal transmitting units transmitting electrical signals generated from the semiconductor chips to the redistribution paths of the redistribution layers, and the second signal transmitting units transmit the electrical signals from the redistribution paths to the external terminals. Therefore, a size and a thickness of the semiconductor package apparatus can be reduced, and processes can be simplified to improve productivity.

摘要翻译： 提供了具有再分配层的半导体封装装置。 该装置包括至少一个或多个半导体芯片，保护半导体芯片的封装部分和支撑半导体芯片的支撑部件。 该设备还包括延伸到包装部分外部的外部端子，重新分配层安装在半导体芯片和支撑部分之间，并且包括再分配路径，第一信号发送单元和第二信号发送单元。 所述第一信号发送单元将从所述半导体芯片生成的电信号发送到所述再分配层的再分配路径，并且所述第二信号发送单元将所述电信号从所述再分配路径发送到所述外部终端。 因此，可以减小半导体封装装置的尺寸和厚度，并且可以简化工艺以提高生产率。

公开(公告)号：US06836018B2

公开(公告)日：2004-12-28

申请号：US10304264

申请日：2002-11-25

申请人： Gu-Sung Kim ,  Dong-Hyeon Jang ,  Min-Young Son ,  Sa-Yoon Kang

发明人： Gu-Sung Kim ,  Dong-Hyeon Jang ,  Min-Young Son ,  Sa-Yoon Kang

IPC分类号： H01L2348

CPC分类号： H01L24/10 ,  H01L23/3157 ,  H01L23/34 ,  H01L24/06 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05555 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K1/0271 ,  H05K3/3436 ,  H01L2924/00

摘要： A thermal-stress-absorbing interface structure is provided between a semiconductor integrated circuit chip and a surface-mount structure. The interface structure comprises an elongated conductive-bump pad having a first length-wise end and a second length-wise end, and a side. The pad has an interconnection line extending from the side thereof intermediate the first and the second ends. The interconnection line is electrically connected to the chip. The interface structure further includes a first polymer layer having an exposed surface, and a second polymer layer, each having a different modulus of elasticity, disposed below the pad. The second polymer layer extends over substantially the entire exposed surface of the first polymer layer to absorb a thermal stress during thermal cycling.

摘要翻译： 在半导体集成电路芯片和表面安装结构之间提供热应力吸收界面结构。 界面结构包括具有第一纵向端和第二纵向端以及侧面的细长导电凸块垫。 垫具有从第一端和第二端的中间的一侧延伸的互连线。 互连线电连接到芯片。 界面结构还包括设置在垫下方的具有暴露表面的第一聚合物层和每个具有不同弹性模量的第二聚合物层。 第二聚合物层在第一聚合物层的基本上整个暴露的表面上延伸以在热循环期间吸收热应力。