公开(公告)号：US09510495B2

公开(公告)日：2016-11-29

申请号：US13686102

申请日：2012-11-27

申请人： Stephen R. Hooper ,  Darrel R. Frear ,  William C. Stermer, Jr.

发明人： Stephen R. Hooper ,  Darrel R. Frear ,  William C. Stermer, Jr.

IPC分类号： H05K1/03 ,  H05K13/04 ,  G01L19/06 ,  B81B7/00 ,  H01L23/053 ,  H01L23/24 ,  H01L23/498

CPC分类号： H05K13/0469 ,  B81B7/0038 ,  G01L19/0654 ,  H01L23/053 ,  H01L23/24 ,  H01L23/49861 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/1461 ,  Y10T156/10 ,  H01L2924/00014 ,  H01L2924/00

摘要： Embodiments include devices and methods of their manufacture. A device embodiment includes a package housing, at least one electronic circuit (e.g., a sensor circuit), a first material, and a second material. The package housing includes a cavity that is partially defined by a cavity bottom surface, and the cavity bottom surface includes a mounting area and a non-mounting area. The at least one electronic circuit is attached to the cavity bottom surface over the mounting area. The first material has a relatively high, first modulus of elasticity, and covers the non-mounting area. The second material has a relatively low, second modulus of elasticity, and is disposed over the first material within the cavity.

摘要翻译： 实施例包括其制造的装置和方法。 器件实施例包括封装壳体，至少一个电子电路（例如，传感器电路），第一材料和第二材料。 包装壳体包括由腔底表面局部限定的空腔，腔体底面包括安装区域和非安装区域。 所述至少一个电子电路在所述安装区域上附接到所述空腔底表面。 第一种材料具有相对高的第一弹性模量，并且覆盖非安装区域。 第二材料具有相对低的第二弹性模量，并且设置在腔内的第一材料之上。

公开(公告)号：US09638597B2

公开(公告)日：2017-05-02

申请号：US14495095

申请日：2014-09-24

申请人： Stephen R. Hooper ,  Darrel R. Frear ,  Thomas C. Speight

发明人： Stephen R. Hooper ,  Darrel R. Frear ,  Thomas C. Speight

IPC分类号： G01L9/00 ,  G01L13/02 ,  G01L19/04 ,  G01L19/06

CPC分类号： G01L9/0052 ,  G01L13/025 ,  G01L19/04 ,  G01L19/069 ,  H01L2224/48145 ,  H01L2924/1815 ,  H01L2924/00012

摘要： A differential pressure sensor assembly includes a transducer having a first sensing surface and a second sensing surface. The second sensing surface is contained in a cavity. An Integrated Circuit (IC) is hermetically coupled to the transducer. The IC has a first aperture aligned to the cavity. A lead frame is coupled to the IC. The lead frame has a second aperture aligned to the first aperture of the IC. A package encapsulates the transducer, the IC and the lead frame. The package has a third aperture exposed to the first sensing surface. The package includes a molding compound providing a hermetic seal between the third aperture of the package and the first aperture of the IC. The molding compound is separated from the transducer by an encroachment distance.

公开(公告)号：US20160084722A1

公开(公告)日：2016-03-24

申请号：US14495095

申请日：2014-09-24

申请人： Stephen R. Hooper ,  Darrel R. Frear ,  Thomas C. Speight

发明人： Stephen R. Hooper ,  Darrel R. Frear ,  Thomas C. Speight

IPC分类号： G01L9/00

CPC分类号： G01L9/0052 ,  G01L13/025 ,  G01L19/04 ,  G01L19/069 ,  H01L2224/48145 ,  H01L2924/1815 ,  H01L2924/00012

摘要： A differential pressure sensor assembly includes a transducer having a first sensing surface and a second sensing surface. The second sensing surface is contained in a cavity. An Integrated Circuit (IC) is hermetically coupled to the transducer. The IC has a first aperture aligned to the cavity. A lead frame is coupled to the IC. The lead frame has a second aperture aligned to the first aperture of the IC. A package encapsulates the transducer, the IC and the lead frame. The package has a third aperture exposed to the first sensing surface. The package includes a molding compound providing a hermetic seal between the third aperture of the package and the first aperture of the IC. The molding compound is separated from the transducer by an encroachment distance.

摘要翻译： 差压传感器组件包括具有第一感测表面和第二感测表面的换能器。 第二感测表面包含在腔中。 集成电路（IC）与传感器气密耦合。 IC具有与空腔对准的第一孔。 引线框架耦合到IC。 引线框具有与IC的第一孔对准的第二孔。 封装封装了传感器，IC和引线框架。 该封装具有暴露于第一感测表面的第三孔。 该包装包括在封装的第三孔和IC的第一孔之间提供密封的模塑料。 模塑料通过侵入距离与换能器分离。

公开(公告)号：US07763976B2

公开(公告)日：2010-07-27

申请号：US12242550

申请日：2008-09-30

申请人： Jinbang Tang ,  Darrel R. Frear ,  Robert J. Wenzel

发明人： Jinbang Tang ,  Darrel R. Frear ,  Robert J. Wenzel

IPC分类号： H01L23/34

CPC分类号： H01L23/5389 ,  H01L21/568 ,  H01L23/50 ,  H01L24/19 ,  H01L2223/6627 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/96 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/14 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043

摘要： A disclosed integrated circuit (IC) module includes an IC panel and multi level circuit structure, referred to as an IPD structure, overlying an upper surface of the IC panel. The IC panel includes an electrically conductive embedded ground plane (EGP), an integrated circuit (IC) die, and an encapsulating material. The EGP is a substantially planar structure that includes or defines a plurality of cavities. The EGP may include or define an IC cavity and an IPD cavity. The IC die may be positioned within the IC cavity such that a perimeter of the IC cavity surrounds the IC die. The IPD structure may define or include a passive device such as an inductor. The passive device may be positioned or located overlying the void in the EGP.

摘要翻译： 所公开的集成电路（IC）模块包括覆盖在IC面板的上表面上的IC面板和称为IPD结构的多电平电路结构。 IC面板包括导电嵌入式接地平面（EGP），集成电路（IC）裸片和封装材料。 EGP是包括或限定多个空腔的基本上平面的结构。 EGP可以包括或限定IC腔和IPD腔。 IC芯片可以定位在IC腔内，使得IC腔的周边围绕IC管芯。 IPD结构可以定义或包括无源器件，例如电感器。 被动设备可以位于或位于EGP中的空隙上方。

公开(公告)号：US5300307A

公开(公告)日：1994-04-05

申请号：US944865

申请日：1992-09-14

申请人： Darrel R. Frear ,  Joseph R. Michael ,  Alton D. Romig, Jr.

发明人： Darrel R. Frear ,  Joseph R. Michael ,  Alton D. Romig, Jr.

IPC分类号： C22F1/057 ,  C23C14/18 ,  C23C14/58 ,  H01L21/768 ,  H01L23/532 ,  B05D5/12

CPC分类号： C23C14/5806 ,  C22F1/057 ,  C23C14/185 ,  C23C14/58 ,  C23C14/584 ,  H01L21/76838 ,  H01L23/53214 ,  H01L2924/0002 ,  Y10S438/927

摘要： A process for the forming of Al-Cu conductive thin films with reduced electromigration failures is useful, for example, in the metallization of integrated circuits. An improved formation process includes the heat treatment or annealing of the thin film conductor at a temperature within the range of from 200.degree. C. to 300.degree. C. for a time period between 10 minutes and 24 hours under a reducing atmosphere such as 15% H.sub.2 in N.sub.2 by volume. Al-Cu thin films annealed in the single phase region of a phase diagram, to temperatures between 200.degree. C. and 300.degree. C. have .theta.-phase Al.sub.2 Cu precipitates at the grain boundaries continuously become enriched in copper, due, it is theorized, to the formation of a thin coating of .theta.-phase precipitate at the grain boundary. Electromigration behavior of the aluminum is, thus, improved because the .theta.-phase precipitates with copper hinder aluminum diffusion along the grain boundaries. Electromigration, then, occurs mainly within the aluminum grains, a much slower process.

摘要翻译： 用于形成具有降低的电迁移故障的Al-Cu导电薄膜的方法在例如集成电路的金属化中是有用的。 改进的形成方法包括在200℃至300℃的温度范围内的薄膜导体的热处理或退火在10分钟至24小时之间的时间内在还原气氛下进行，例如15％ H2在N2中的体积。 在相图的单相区域退火的Al-Cu薄膜在200摄氏度到300摄氏度之间的温度下，在晶界处具有（θ）相Al2Cu沉淀物连续地富集铜，因为它是 理论上，在晶界处形成（θ）相沉淀物的薄涂层。 因此，铝的电迁移行为被改善，因为（θ）相在铜上沉淀阻碍了沿着晶界的铝扩散。 那么电迁移主要发生在铝粒内，这是一个很慢的过程。

公开(公告)号：US06630725B1

公开(公告)日：2003-10-07

申请号：US09684576

申请日：2000-10-06

申请人： Shun-Meen Kuo ,  Darrel R. Frear

发明人： Shun-Meen Kuo ,  Darrel R. Frear

IPC分类号： H01L23552

CPC分类号： B81C1/00269 ,  H01L23/10 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/81801 ,  H01L2224/97 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2224/81

摘要： An electronic component includes a substrate (210, 1510), a device (221, 222) supported by the substrate and including a first bond pad (223, 224, 225, 226), and a cap (231, 232, 631, 731, 732, 1531, 1532) overlying the substrate. The cap includes a second bond pad (241, 242, 243, 244) at an outside surface of the cap, a third bond pad (245, 246, 247, 248) at an inside surface of the cap and electrically coupled to the first bond pad, and an electrically conductive via (251, 252, 254, 751, 752, 753, 754) extending through the cap and electrically coupling together the second and third bond pads.

摘要翻译： 电子部件包括基板（210,1510），由基板支撑并包括第一接合焊盘（223,224,225,226）的盖子（231,232,631,731） ，732,1531,1532）。 所述盖包括在所述盖的外表面处的第二接合焊盘（241,242,243,244），在所述盖的内表面处的第三接合焊盘（245,246,247,248），并且电耦合到所述第一接合焊盘 接合焊盘和延伸穿过盖并电连接在一起的第二和第三接合焊盘的导电通孔（251,252,254,751,752,753,754）。

公开(公告)号：US5855323A

公开(公告)日：1999-01-05

申请号：US746602

申请日：1996-11-13

申请人： Frederick G. Yost ,  Darrel R. Frear ,  David T. Schmale

发明人： Frederick G. Yost ,  Darrel R. Frear ,  David T. Schmale

IPC分类号： B05B17/06 ,  B23K3/06 ,  H05K3/34 ,  B05B1/24 ,  B05B1/08

CPC分类号： H05K3/3457 ,  B05B17/0638 ,  B23K3/0623 ,  H05K2203/013 ,  H05K2203/0134

摘要： An apparatus and process for jetting molten solder in the form of balls directly onto all the metallized interconnects lands for a ball grid array package in one step with no solder paste required. Molten solder is jetted out of a grid of holes using a piston attached to a piezoelectric crystal. When voltage is applied to the crystal it expands forcing the piston to extrude a desired volume of solder through holes in the aperture plate. When the voltage is decreased the piston reverses motion creating an instability in the molten solder at the aperture plate surface and thereby forming spherical solder balls that fall onto a metallized substrate. The molten solder balls land on the substrate and form a metallurgical bond with the metallized lands. The size of the solder balls is determined by a combination of the size of the holes in the aperture plate, the duration of the piston pulse, and the displacement of the piston. The layout of the balls is dictated by the location of the hooks in the grid. Changes in ball size and layout can be easily accomplished by changing the grid plate. This invention also allows simple preparation of uniform balls for subsequent supply to BGA users.

摘要翻译： 一种将滚珠形式的熔融焊料直接喷射到所有金属化互连区域上的设备和方法，用于一个步骤中的球栅阵列封装，不需要焊膏。 使用连接到压电晶体的活塞将熔融的焊料从孔网喷射出来。 当电压施加到晶体时，其膨胀迫使活塞通过孔板中的孔挤出所需体积的焊料。 当电压降低时，活塞反转运动，在孔板表面处产生熔融焊料中的不稳定性，从而形成落入金属化基板上的球形焊球。 熔融焊球落在基板上并与金属化焊盘形成冶金结合。 焊球的尺寸由孔板中的孔的尺寸，活塞脉冲的持续时间和活塞的位移的组合决定。 球的布局由网格中的钩子的位置决定。 通过更换网格板可以轻松实现球体尺寸和布局的变化。 本发明还允许简单地制备用于随后供给BGA用户的均匀球。

公开(公告)号：US20090072357A1

公开(公告)日：2009-03-19

申请号：US11854776

申请日：2007-09-13

申请人： Jinbang Tang ,  Darrel R. Frear ,  Jong-Kai Lin

发明人： Jinbang Tang ,  Darrel R. Frear ,  Jong-Kai Lin

IPC分类号： H01L23/552 ,  H01L21/56

CPC分类号： H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/552 ,  H01L24/19 ,  H01L24/20 ,  H01L24/82 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/04105 ,  H01L2224/82039 ,  H01L2224/97 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2224/82 ,  H01L2924/00

摘要： An electromagnetic interference (EMI) and/or electromagnetic radiation shield is formed on a plurality of encapsulated modules by attaching a plurality of modules (30-33) to a process carrier (10) using a double side adhesive tape (12) before encapsulating the modules with a molding compound (16), and then forming shielding via ring structures (51-54) in the molding compound (16) to surround and shield each module. After removing the adhesive tape (12) to expose a surface of the encapsulated modules, a multi-layer circuit substrate (101) is formed over the exposed surface, where the circuit substrate includes shielding via structures (121-124) that are aligned with and electrically connected to the shielding via ring structures (51-54), thereby encircling and shielding the circuit module(s).

摘要翻译： 在多个封装的模块之间通过使用双面胶带（12）将多个模块（30-33）附接到处理载体（10）上而形成电磁干扰（EMI）和/或电磁辐射屏蔽， 具有模制化合物（16）的模块，然后通过模制化合物（16）中的环形结构（51-54）形成屏蔽以围绕和屏蔽每个模块。 在去除粘合带（12）以暴露封装模块的表面之后，在暴露表面上形成多层电路基板（101），其中电路基板包括屏蔽通孔结构（121-124），其与 并且电连接到屏蔽通孔环结构（51-54），从而环绕和屏蔽电路模块。

公开(公告)号：US20090057849A1

公开(公告)日：2009-03-05

申请号：US11846874

申请日：2007-08-29

申请人： Jinbang Tang ,  Darrel R. Frear ,  William H. Lytle

发明人： Jinbang Tang ,  Darrel R. Frear ,  William H. Lytle

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L23/5389 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/645 ,  H01L23/66 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L25/0655 ,  H01L25/16 ,  H01L2221/68359 ,  H01L2223/6622 ,  H01L2223/6677 ,  H01L2224/24227 ,  H01L2224/2518 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/19105

摘要： A packaged semiconductor device includes an interconnect layer over a first side of a polymer layer, a semiconductor device surrounded on at least three sides by the polymer layer and coupled to the interconnect layer, a first conductive element over a second side of the polymer layer, wherein the second side is opposite the first side, and a connector block within the polymer layer. The connector block has at least one electrical path extending from a first surface of the connector block to a second surface of the connector block. The at least one electrical path electrically couples the interconnect layer to the first conductive element. A method of forming the packaged semiconductor device is also described.

摘要翻译： 封装的半导体器件包括在聚合物层的第一侧上的互连层，在聚合物层的至少三个侧面上被耦合到互连层的半导体器件，在聚合物层的第二侧上的第一导电元件， 其中所述第二侧与所述第一侧相对，以及所述聚合物层内的连接器块。 连接器块具有从连接器块的第一表面延伸到连接器块的第二表面的至少一个电路径。 所述至少一个电路将所述互连层电耦合到所述第一导电元件。 还描述了形成封装半导体器件的方法。

公开(公告)号：US20150004902A1

公开(公告)日：2015-01-01

申请号：US13930250

申请日：2013-06-28

申请人： John M. Pigott ,  Fred T. Brauchler ,  Darrel R. Frear ,  Vivek Gupta ,  Randall C. Gray ,  Norman L. Owens ,  Carl E. D'Acosta

发明人： John M. Pigott ,  Fred T. Brauchler ,  Darrel R. Frear ,  Vivek Gupta ,  Randall C. Gray ,  Norman L. Owens ,  Carl E. D'Acosta

IPC分类号： H04B5/00 ,  H01L49/02

CPC分类号： H04B5/0031 ,  H01F19/08 ,  H01L23/3107 ,  H01L23/48 ,  H01L23/49575 ,  H01L23/5227 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L28/10 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/0557 ,  H01L2224/131 ,  H01L2224/16245 ,  H01L2224/27334 ,  H01L2224/29034 ,  H01L2224/2919 ,  H01L2224/32013 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48464 ,  H01L2224/73203 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/92147 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/19104 ,  H04B5/0093 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Embodiments of inductive communication devices include first and second galvanically isolated IC die. The first IC die has a first coil proximate to a first surface of the first IC die, and the second IC die has a second coil proximate to a first surface of the second IC die. The first and second IC die are arranged so that the first surfaces of the first and second IC die face each other, and the first coil and the second coil are aligned across a gap between the first and second IC die. One or more dielectric components are positioned within the gap directly between the first and second coils. During operation, a first signal is provided to the first coil, and the first coil converts the signal into a time-varying magnetic field. The magnetic field couples with the second coil, which produces a corresponding second signal.

摘要翻译： 感应通信设备的实施例包括第一和第二电隔离IC芯片。 第一IC管芯具有靠近第一IC管芯的第一表面的第一线圈，并且第二IC管芯具有靠近第二IC管芯的第一表面的第二线圈。 第一IC芯片和第二IC芯片被布置成使得第一和第二IC芯片的第一表面彼此面对，并且第一线圈和第二线圈跨越第一和第二IC芯片之间的间隙排列。 一个或多个电介质部件直接位于第一和第二线圈之间的间隙内。 在操作期间，向第一线圈提供第一信号，并且第一线圈将该信号转换成时变磁场。 磁场与第二线圈耦合，产生相应的第二信号。