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    Multilayer wiring board
    2.
    发明授权
    Multilayer wiring board 有权
    多层接线板

    公开(公告)号：US09119333B2

    公开(公告)日：2015-08-25

    申请号：US13399547

    申请日：2012-02-17

    申请人： Takuya Hando ,  Masahiro Inoue ,  Hajime Saiki ,  Atsuhiko Sugimoto ,  Hidetoshi Wada

    发明人： Takuya Hando ,  Masahiro Inoue ,  Hajime Saiki ,  Atsuhiko Sugimoto ,  Hidetoshi Wada

    IPC分类号： H05K3/40 ,  H01L23/498 ,  H01L23/00 ,  H01L21/683 ,  H05K3/46 ,  H05K3/00

    CPC分类号： H05K3/4007 ,  H01L21/6835 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/16 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2924/01084 ,  H05K3/0097 ,  H05K3/4682 ,  H05K2201/0367

    摘要： A multilayer wiring board including a build-up layer, formed from one or more conductor and resin insulation layers that are layered one on top of the other, having conductive pads formed on a surface of at least one resin insulation layer so as to project from the surface are provided. The conductive pads may each include a columnar portion situated at a lower part thereof and a convex portion situated at a higher part thereof, wherein a surface of the convex portion may assume a continual curved shape. A solder layer may be formed over an upper surface of the conductive pads. Certain embodiments make it possible to minimize or eliminate the concentration of stress on the conductive pads, and may inhibit the occurrence of defective connections to a semiconductor element and infliction of damage to the conductive pads.

    摘要翻译： 一种多层布线基板，包括由一层或多层导体和树脂绝缘层形成的堆积层，所述导体和树脂绝缘层层叠在另一层之上，具有形成在至少一层树脂绝缘层的表面上的导电焊盘，以便从 提供表面。 导电垫可以各自包括位于其下部的柱状部分和位于其较高部分的凸部，其中凸部的表面可以呈现连续的弯曲形状。 可以在导电焊盘的上表面上形成焊料层。 某些实施例使得可以最小化或消除导电焊盘上的应力集中，并且可以抑制对半导体元件的不良连接的发生以及对导电焊盘的损坏。

    Method for manufacturing wiring board for mounting electronic component, wiring board for mounting electronic component, and method for manufacturing wiring board having an electronic component
    3.
    发明授权
    Method for manufacturing wiring board for mounting electronic component, wiring board for mounting electronic component, and method for manufacturing wiring board having an electronic component 有权
    用于制造电子部件安装用布线板的方法，电子部件安装用布线板以及具有电子部件的布线基板的制造方法

    公开(公告)号：US08937256B2

    公开(公告)日：2015-01-20

    申请号：US13353965

    申请日：2012-01-19

    申请人： Masahiro Inoue ,  Hajime Saiki ,  Atsuhiko Sugimoto

    发明人： Masahiro Inoue ,  Hajime Saiki ,  Atsuhiko Sugimoto

    IPC分类号： H01K1/02 ,  H05K13/04 ,  H05K3/34 ,  H01L23/00

    CPC分类号： H05K3/3478 ,  H01L24/81 ,  H01L2224/10126 ,  H01L2224/16225 ,  H01L2924/14 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/10977 ,  H01L2924/00

    摘要： A method for manufacturing a wiring board for mounting an electronic component, a wiring board for mounting an electronic component, and a method for manufacturing an electronic-component-mounted wiring board are provided. A bonding material paste, which can include solder and an electric insulation material made of a resin, can be placed on chip mount terminal pads and heated to fuse the solder and soften the electric insulation material. Subsequently, the solder is solidified to form solder bumps. Further, the electric insulation material is cured on a surface of each of the solder bumps and a surface of a multilayer board around each of the solder bumps to form an electric insulation surface layer. Accordingly, when a chip is mounted to such wiring boards, the electric insulation surface layer minimizes or eliminates the connection between adjacent solder bumps during re-fusing of the solder.

    摘要翻译： 本发明提供一种电子部件安装用布线基板的制造方法，电子部件的安装用布线基板以及电子元件搭载布线基板的制造方法。 可以将包括焊料和由树脂制成的电绝缘材料的接合材料糊料放置在芯片安装端子焊盘上并加热以熔化焊料并软化电绝缘材料。 随后，焊料固化形成焊料凸块。 此外，电绝缘材料在每个焊料凸块的表面和每个焊料凸块周围的多层板的表面上固化，以形成电绝缘表面层。 因此，当芯片安装到这种布线板时，电绝缘表面层在焊料的再熔合期间使相邻焊料凸块之间的连接最小化或消除。

    Multilayered wiring substrate
    5.
    发明授权
    Multilayered wiring substrate 失效
    多层布线基板

    公开(公告)号：US08581388B2

    公开(公告)日：2013-11-12

    申请号：US12976427

    申请日：2010-12-22

    申请人： Shinnosuke Maeda ,  Tetsuo Suzuki ,  Atsuhiko Sugimoto ,  Tatsuya Ito ,  Takuya Hando ,  Satoshi Hirano

    发明人： Shinnosuke Maeda ,  Tetsuo Suzuki ,  Atsuhiko Sugimoto ,  Tatsuya Ito ,  Takuya Hando ,  Satoshi Hirano

    IPC分类号： H01L23/053 ,  H01L21/4763

    CPC分类号： H05K3/3452 ,  H01L23/49811 ,  H01L23/49822 ,  H01L2924/0002 ,  H05K1/113 ,  H05K3/205 ,  H05K3/383 ,  H05K3/4682 ,  H05K2201/068 ,  H05K2201/094 ,  H05K2201/09527 ,  H05K2201/099 ,  H05K2203/0346 ,  H05K2203/0369 ,  H01L2924/00

    摘要： A multilayered wiring substrate, comprising: a plurality of first main surface side connecting terminals arranged in a first main surface of a stack structure; and a plurality of second main surface side connecting terminals being arranged in a second main surface of the stack structure; wherein a plurality of conductor layers are alternately formed in a plurality of stacked resin insulation layers and are operably connected to each other through via conductors tapered such that diameters thereof are widened toward the first or the second main surface, wherein a plurality of openings are formed in an exposed outermost resin insulation layer in the second main surface, and terminal outer surfaces of the second main surface side connecting terminals arranged to match with the plurality of the openings are positioned inwardly from an outer main surface of the exposed outermost resin insulation layer, and edges of terminal inner surfaces are rounded.

    摘要翻译： 一种多层布线基板，包括：布置在堆叠结构的第一主表面中的多个第一主表面侧连接端子; 并且多个第二主表面侧连接端子布置在所述堆叠结构的第二主表面中; 其中多个导体层交替地形成在多个堆叠的树脂绝缘层中，并且通过锥形的通孔导体可操作地连接，使得其直径朝向第一或第二主表面加宽，其中形成多个开口 在第二主表面中暴露的最外层树脂绝缘层中，并且布置成与多个开口相匹配的第二主表面侧连接端子的端子外表面从暴露的最外层树脂绝缘层的外主表面位于内侧， 并且端子内表面的边缘是圆形的。

    Process for manufacturing a wiring substrate
    8.
    发明授权
    Process for manufacturing a wiring substrate 有权
    制造布线基板的工艺

    公开(公告)号：US07202156B2

    公开(公告)日：2007-04-10

    申请号：US10989515

    申请日：2004-11-17

    申请人： Hajime Saiki ,  Atsuhiko Sugimoto ,  Mikiya Sakurai

    发明人： Hajime Saiki ,  Atsuhiko Sugimoto ,  Mikiya Sakurai

    IPC分类号： H01L21/4763

    CPC分类号： H05K3/4661 ,  H05K3/108 ,  H05K3/181 ,  H05K3/4602 ,  H05K2201/0209

    摘要： A process for manufacturing a wiring substrate, comprising: a step of forming an insulating resin layer containing an inorganic filler over a wiring layer formed on at least one surface of an insulating substrate; a step of forming a thin copper film layer by roughening a surface of the insulating resin layer and plating the same electrolessly with copper; a step of forming an insulating film over the thin copper film layer; a step of forming plated resists profiling a pattern by exposing and developing the insulating film with the pattern; and a step of forming wiring pattern layers by an electrolytic copper plating on a surface of the insulating resin layer having the plated resists formed thereon, wherein at least one of the plated resists has a width of less than 20 μm, and the plated resists include adjoining plated resists in which a clearance between said adjoining plated resists has a width of less than 20 μm.

    摘要翻译： 一种布线基板的制造方法，包括：在绝缘基板的至少一个面上形成的布线层上形成含有无机填料的绝缘树脂层的工序; 通过使绝缘树脂层的表面粗糙化并用铜电化而使其形成薄铜膜层的步骤; 在所述薄铜膜层上形成绝缘膜的步骤; 通过用图案曝光和显影绝缘膜来形成电镀抗蚀剂的步骤; 以及在其上形成有电镀抗蚀剂的绝缘树脂层的表面上通过电解铜电镀形成布线图案层的步骤，其中至少一个电镀抗蚀剂具有小于20μm的宽度，并且电镀抗蚀剂包括 邻接的电镀抗蚀剂，其中所述相邻的电镀抗蚀剂之间的间隙具有小于20μm的宽度。

    Process for manufacturing a wiring substrate
    9.
    发明申请
    Process for manufacturing a wiring substrate 审中-公开
    制造布线基板的工艺

    公开(公告)号：US20050102830A1

    公开(公告)日：2005-05-19

    申请号：US10989411

    申请日：2004-11-17

    申请人： Hajime Saiki ,  Atsuhiko Sugimoto

    发明人： Hajime Saiki ,  Atsuhiko Sugimoto

    IPC分类号： H05K3/18 ,  C23F1/18 ,  C25D5/02 ,  H05K3/10 ,  H05K3/38 ,  H05K3/46 ,  H05K3/00

    CPC分类号： H05K3/383 ,  C23F1/18 ,  C25D5/022 ,  H05K3/108 ,  H05K3/4602 ,  H05K2203/0353 ,  Y10T29/49155 ,  Y10T29/49156

    摘要： A process for manufacturing a wiring substrate, comprising: a step of forming thin copper film layers on surfaces of insulating resin layers by plating the same electrolessly with copper; a step of forming plated resists of a pattern over the thin copper film layers; a step of forming wiring pattern layers in clearances of the plated resists by plating the same electrolytically with copper; a step of removing the plated resists and the thin copper film layers just below the plated resists; a step of etching surfaces of the wiring pattern layers to remove a thickness of 1 μm or less from the wiring pattern layers; and a step of forming another insulating resin layers over the insulating resin layers and the wiring pattern layers etched.

    摘要翻译： 一种布线基板的制造方法，其特征在于，包括以下步骤：在铜绝缘层的表面上形成薄铜层; 在薄铜膜层上形成图案的电镀抗蚀剂的步骤; 通过用铜电解电镀形成电镀抗蚀剂间隙的布线图案层的步骤; 去除电镀抗蚀剂和刚好在电镀抗蚀剂下面的薄铜膜层的步骤; 蚀刻布线图案层的表面以从布线图案层去除1μm或更小的厚度的步骤; 以及在绝缘树脂层和蚀刻的布线图案层上形成另一绝缘树脂层的步骤。