公开(公告)号：US07893539B2

公开(公告)日：2011-02-22

申请号：US12022840

申请日：2008-01-30

申请人： Takeshi Otsuka ,  Toshikazu Imaoka

发明人： Takeshi Otsuka ,  Toshikazu Imaoka

IPC分类号： H01L23/48

CPC分类号： H01L23/3128 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/49171 ,  H01L2224/49433 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06562 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor apparatus includes: a wiring board; a first semiconductor device mounted on the wiring board; a second semiconductor device which is stacked on the first semiconductor device and a projection part projects from the outer edge of the first semiconductor device; and a sealing resin layer which seals each semiconductor device. And the second semiconductor device has thereon a first analog cell, and a second analog cell which reaches a higher temperature than the first analog cell, and the second analog cell is arranged so as to include the projection part of the second semiconductor device.

摘要翻译： 一种半导体装置，包括：布线板; 安装在所述布线板上的第一半导体器件; 堆叠在第一半导体器件上的第二半导体器件和从第一半导体器件的外边缘突出的突出部分; 以及密封每个半导体器件的密封树脂层。 并且第二半导体器件具有第一模拟单元和达到比第一模拟单元更高温度的第二模拟单元，并且第二模拟单元布置成包括第二半导体器件的突出部分。

公开(公告)号：US07875980B2

公开(公告)日：2011-01-25

申请号：US11215121

申请日：2005-08-31

申请人： Toshikazu Imaoka ,  Ryosuke Usui

发明人： Toshikazu Imaoka ,  Ryosuke Usui

IPC分类号： H01L23/12

CPC分类号： H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/82 ,  H01L25/0652 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24145 ,  H01L2224/24195 ,  H01L2224/24226 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30105 ,  H05K1/183 ,  H05K1/185 ,  H05K3/284 ,  H05K3/4644 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A technique for reducing the size of a semiconductor device is provided. A semiconductor device comprises a base, a semiconductor chip, a chip component, an insulating base, a wiring pattern, a via plug, an external lead-out electrode, a recess, and a resin. The insulating base has a multi-layer structure formed by laminating a plurality of insulator films. The semiconductor chip and the chip component are mounted on the base and embedded in the insulating base. A recess is formed on the surface of the semiconductor device and reaches down to any of wiring conductor layers. The semiconductor chip and the chip component are mounted on the recess.

摘要翻译： 提供了一种用于减小半导体器件的尺寸的技术。 半导体器件包括基底，半导体芯片，芯片部件，绝缘基底，布线图案，通孔塞，外部引出电极，凹部和树脂。 绝缘基底具有通过层叠多个绝缘膜形成的多层结构。 半导体芯片和芯片组件安装在基座上并嵌入绝缘基座中。 在半导体器件的表面上形成凹部，并且到达布线导体层中的任何一个。 半导体芯片和芯片组件安装在凹槽上。

公开(公告)号：US20060131724A1

公开(公告)日：2006-06-22

申请号：US11314039

申请日：2005-12-20

申请人： Akihiro Sato ,  Satoru Sekiguchi ,  Kiyokazu Kamado ,  Kazunari Kurokawa ,  Makoto Tsubonoya ,  Kiyoshi Mita ,  Yoichi Nabeta ,  Tetsuro Sawai ,  Toshikazu Imaoka

发明人： Akihiro Sato ,  Satoru Sekiguchi ,  Kiyokazu Kamado ,  Kazunari Kurokawa ,  Makoto Tsubonoya ,  Kiyoshi Mita ,  Yoichi Nabeta ,  Tetsuro Sawai ,  Toshikazu Imaoka

IPC分类号： H01L23/48

CPC分类号： H01L23/645 ,  H01F2017/008 ,  H01F2017/0086 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/12034 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19106 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor apparatus comprises a substrate, a semiconductor chip fixedly secured on one side of the substrate, a spirally shaped coil formed on the other side of the substrate and electrically connected to the semiconductor chip, and a conductive pattern formed on a surface of the one side of the substrate facing to the semiconductor chip for stabilizing an inductance characteristic of the coil.

摘要翻译： 一种半导体装置，包括基板，固定在基板的一侧的半导体芯片，形成在基板的另一侧并与半导体芯片电连接的螺旋形线圈，以及形成在该基板的表面上的导电图案 面向半导体芯片的衬底的侧面，用于稳定线圈的电感特性。

公开(公告)号：US20060043606A1

公开(公告)日：2006-03-02

申请号：US11215121

申请日：2005-08-31

申请人： Toshikazu Imaoka ,  Ryosuke Usui

发明人： Toshikazu Imaoka ,  Ryosuke Usui

IPC分类号： H01L23/48

CPC分类号： H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/82 ,  H01L25/0652 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24145 ,  H01L2224/24195 ,  H01L2224/24226 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30105 ,  H05K1/183 ,  H05K1/185 ,  H05K3/284 ,  H05K3/4644 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A technique for reducing the size of a semiconductor device is provided. A semiconductor device comprises a base, a semiconductor chip, a chip component, an insulating base, a wiring pattern, a via plug, an external lead-out electrode, a recess, and a resin. The insulating base has a multi-layer structure formed by laminating a plurality of insulator films. The semiconductor chip and the chip component are mounted on the base and embedded in the insulating base. A recess is formed on the surface of the semiconductor device and reaches down to any of wiring conductor layers. The semiconductor chip and the chip component are mounted on the recess.

摘要翻译： 提供了一种用于减小半导体器件的尺寸的技术。 半导体器件包括基底，半导体芯片，芯片部件，绝缘基底，布线图案，通孔塞，外部引出电极，凹部和树脂。 绝缘基底具有通过层叠多个绝缘膜形成的多层结构。 半导体芯片和芯片组件安装在基座上并嵌入绝缘基座中。 在半导体器件的表面上形成凹部，并且到达布线导体层中的任何一个。 半导体芯片和芯片组件安装在凹槽上。

公开(公告)号：US20050067712A1

公开(公告)日：2005-03-31

申请号：US10951214

申请日：2004-09-27

申请人： Toshikazu Imaoka ,  Ryosuke Usui ,  Atsushi Nakano ,  Atsushi Kato

发明人： Toshikazu Imaoka ,  Ryosuke Usui ,  Atsushi Nakano ,  Atsushi Kato

IPC分类号： H01L23/12 ,  H01L23/498 ,  H01L23/48

CPC分类号： H01L23/49827 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/48 ,  H01L2224/48237 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor apparatus includes a first conductive film and a second conductive film provided on respective sides of an insulating resin film. A circuit element is mounted on the second conductive film. The circuit element is electrically connected to the second conductive film. The second conductive film is provided to cover a via plug. The via plug is tapered with a progressively smaller diameter toward the second conductive film and away from the first conductive film.

摘要翻译： 半导体装置包括设置在绝缘树脂膜的两侧的第一导电膜和第二导电膜。 电路元件安装在第二导电膜上。 电路元件电连接到第二导电膜。 第二导电膜被设置成覆盖通孔塞。 通孔塞逐渐变细，朝向第二导电膜逐渐变小，并远离第一导电膜。

公开(公告)号：US5590412A

公开(公告)日：1996-12-31

申请号：US342220

申请日：1994-11-18

申请人： Tetsuro Sawai ,  Hisanori Uda ,  Toshikazu Hirai ,  Toshikazu Imaoka ,  Yasoo Harada ,  Keiichi Honda ,  Masao Nishida

发明人： Tetsuro Sawai ,  Hisanori Uda ,  Toshikazu Hirai ,  Toshikazu Imaoka ,  Yasoo Harada ,  Keiichi Honda ,  Masao Nishida

IPC分类号： H03F3/193 ,  H03F3/72 ,  H04B1/44 ,  H04B1/48 ,  H03F3/62

CPC分类号： H04B1/44 ,  H03F3/1935 ,  H03F3/72 ,  H04B1/48

摘要： A communication apparatus for use in a portable telephone is disclosed which has a transmit-receive common amplifier for amplifying a transmitted signal or received signal, and a mixer for frequency-mixing the transmitted signal or the received signal with a local oscillator output, wherein connection between the mixer and an input side of the amplifier and connection between the mixer and an output side of the amplifier are made by means of respective signal-path selector switches. During reception, a deep bias is applied to an FET of the transmit-receive common amplifier to reduce current consumption, and during transmission, a shallow bias is applied to the FET of the transmit-receive common amplifier for increased output.

摘要翻译： 公开了一种用于便携式电话的通信装置，其具有用于放大发射信号或接收信号的发射 - 接收公共放大器，以及用本地振荡器输出对发射信号或接收信号进行频率混频的混频器，其中连接 在混频器和放大器的输入侧之间，混频器和放大器的输出侧之间的连接通过相应的信号路径选择器开关进行。 在接收期间，向发射接收公共放大器的FET施加深偏压以减少电流消耗，并且在传输期间，将浅偏压施加到发射 - 接收公共放大器的FET以增加输出。

公开(公告)号：US07450397B2

公开(公告)日：2008-11-11

申请号：US11388705

申请日：2006-03-24

申请人： Atsushi Saita ,  Toshikazu Imaoka ,  Tetsuro Sawai

发明人： Atsushi Saita ,  Toshikazu Imaoka ,  Tetsuro Sawai

IPC分类号： H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

CPC分类号： H05K1/024 ,  B32B15/08 ,  H05K1/0242 ,  H05K1/0298 ,  H05K3/4688 ,  H05K2201/0191 ,  H05K2201/035 ,  H05K2201/0715 ,  H05K2201/098 ,  Y10T428/24917 ,  Y10T428/24926

摘要： A wiring board in which a line can be made narrower and/or a transmission loss can be reduced is developed. The wiring board includes a first conductor and a second conductor maintained at the same potential, a dielectric material layer provided between the first and second conductors, and a third conductor embedded in the dielectric material layer. In the wiring board, a thickness of the dielectric material layer in a first region located between the third conductor and the first conductor is larger than a thickness of the dielectric material layer in a second region located between the third conductor and the second conductor. Moreover, a cross-sectional shape of the third conductor is trapezoidal in which angles of respective ends of the third conductor on a side closer to the second conductor are obtuse.

摘要翻译： 开发了可以使线路变窄和/或可以减小传输损耗的布线板。 布线板包括保持在相同电位的第一导体和第二导体，设置在第一和第二导体之间的介电材料层和嵌入电介质材料层中的第三导体。 在布线板中，位于第三导体和第一导体之间的第一区域中的电介质材料层的厚度大于位于第三导体和第二导体之间的第二区域中的电介质材料层的厚度。 此外，第三导体的横截面形状是梯形的，其中第三导体在更靠近第二导体的一侧的各端的角度是钝的。

公开(公告)号：US07432580B2

公开(公告)日：2008-10-07

申请号：US11314039

申请日：2005-12-20

申请人： Akihiro Sato ,  Satoru Sekiguchi ,  Kiyokazu Kamado ,  Kazunari Kurokawa ,  Makoto Tsubonoya ,  Kiyoshi Mita ,  Yoichi Nabeta ,  Tetsuro Sawai ,  Toshikazu Imaoka

发明人： Akihiro Sato ,  Satoru Sekiguchi ,  Kiyokazu Kamado ,  Kazunari Kurokawa ,  Makoto Tsubonoya ,  Kiyoshi Mita ,  Yoichi Nabeta ,  Tetsuro Sawai ,  Toshikazu Imaoka

IPC分类号： H01L23/58 ,  H05K7/00

CPC分类号： H01L23/645 ,  H01F2017/008 ,  H01F2017/0086 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/12034 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19106 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor apparatus comprises a substrate, a semiconductor chip fixedly secured on one side of the substrate, a spirally shaped coil formed on the other side of the substrate and electrically connected to the semiconductor chip, and a conductive pattern formed on a surface of the one side of the substrate facing to the semiconductor chip for stabilizing an inductance characteristic of the coil.

摘要翻译： 一种半导体装置，包括基板，固定在基板的一侧的半导体芯片，形成在基板的另一侧并与半导体芯片电连接的螺旋形线圈，以及形成在该基板的表面上的导电图案 面向半导体芯片的衬底的侧面，用于稳定线圈的电感特性。

公开(公告)号：US20080211110A1

公开(公告)日：2008-09-04

申请号：US12022840

申请日：2008-01-30

申请人： Takeshi Otsuka ,  Toshikazu Imaoka

发明人： Takeshi Otsuka ,  Toshikazu Imaoka

IPC分类号： H01L23/52

CPC分类号： H01L23/3128 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/49171 ,  H01L2224/49433 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06562 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor apparatus includes: a wiring board; a first semiconductor device mounted on the wiring board; a second semiconductor device which is stacked on the first semiconductor device and a projection part projects from the outer edge of the first semiconductor device; and a sealing resin layer which seals each semiconductor device. And the second semiconductor device has thereon a first analog cell, and a second analog cell which reaches a higher temperature than the first analog cell, and the second analog cell is arranged so as to include the projection part of the second semiconductor device.

摘要翻译： 一种半导体装置，包括：布线板; 安装在所述布线板上的第一半导体器件; 堆叠在第一半导体器件上的第二半导体器件和从第一半导体器件的外边缘突出的突出部分; 以及密封每个半导体器件的密封树脂层。 并且第二半导体器件具有第一模拟单元和达到比第一模拟单元更高温度的第二模拟单元，并且第二模拟单元布置成包括第二半导体器件的突出部分。

公开(公告)号：US20080158091A1

公开(公告)日：2008-07-03

申请号：US11966130

申请日：2007-12-28

申请人： Toshikazu Imaoka ,  Takeshi Otsuka ,  Tetsuro Sawai

发明人： Toshikazu Imaoka ,  Takeshi Otsuka ,  Tetsuro Sawai

IPC分类号： H01Q1/52

CPC分类号： H01Q1/2283 ,  H01L24/73 ,  H01L2223/6677 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06135 ,  H01L2224/13025 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q1/52 ,  H01Q7/00 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A semiconductor module includes a multilayer board, a first circuit element mounted on the multilayer board, a second circuit element stacked on the first circuit element, an interposer board, provided between the first circuit element and the second circuit element, which includes an antenna conductor, a passive element, mounted on the multilayer board, which is connected to the antenna conductor, and a molded resin layer which seals the respective elements. The antenna conductor is structured by a spiral-shaped wiring pattern and the both ends of the antenna conductor are connected to the passive element via a bonding wire. The antenna conductor functions as a loop antenna with the passive element inserted.

摘要翻译： 半导体模块包括多层板，安装在多层板上的第一电路元件，堆叠在第一电路元件上的第二电路元件，设置在第一电路元件和第二电路元件之间的插入板，其包括天线导体 安装在与天线导体连接的多层板上的无源元件和密封各元件的模制树脂层。 天线导体由螺旋状的布线图形构成，天线导体的两端通过接合线与无源元件连接。 天线导体用作插入无源元件的环形天线。