公开(公告)号：US08063846B2

公开(公告)日：2011-11-22

申请号：US11966130

申请日：2007-12-28

申请人： Toshikazu Imaoka ,  Takeshi Otsuka ,  Tetsuro Sawai

发明人： Toshikazu Imaoka ,  Takeshi Otsuka ,  Tetsuro Sawai

IPC分类号： H01Q1/52

CPC分类号： H01Q1/2283 ,  H01L24/73 ,  H01L2223/6677 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06135 ,  H01L2224/13025 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q1/52 ,  H01Q7/00 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A semiconductor module includes a multilayer board, a first circuit element mounted on the multilayer board, a second circuit element stacked on the first circuit element, an interposer board, provided between the first circuit element and the second circuit element, which includes an antenna conductor, a passive element, mounted on the multilayer board, which is connected to the antenna conductor, and a molded resin layer which seals the respective elements. The antenna conductor is structured by a spiral-shaped wiring pattern and the both ends of the antenna conductor are connected to the passive element via a bonding wire. The antenna conductor functions as a loop antenna with the passive element inserted.

摘要翻译： 半导体模块包括多层板，安装在多层板上的第一电路元件，堆叠在第一电路元件上的第二电路元件，设置在第一电路元件和第二电路元件之间的插入板，其包括天线导体 安装在与天线导体连接的多层板上的无源元件和密封各元件的模制树脂层。 天线导体由螺旋状的布线图形构成，天线导体的两端通过接合线与无源元件连接。 天线导体用作插入无源元件的环形天线。

公开(公告)号：US20080158091A1

公开(公告)日：2008-07-03

申请号：US11966130

申请日：2007-12-28

申请人： Toshikazu Imaoka ,  Takeshi Otsuka ,  Tetsuro Sawai

发明人： Toshikazu Imaoka ,  Takeshi Otsuka ,  Tetsuro Sawai

IPC分类号： H01Q1/52

CPC分类号： H01Q1/2283 ,  H01L24/73 ,  H01L2223/6677 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06135 ,  H01L2224/13025 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q1/52 ,  H01Q7/00 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A semiconductor module includes a multilayer board, a first circuit element mounted on the multilayer board, a second circuit element stacked on the first circuit element, an interposer board, provided between the first circuit element and the second circuit element, which includes an antenna conductor, a passive element, mounted on the multilayer board, which is connected to the antenna conductor, and a molded resin layer which seals the respective elements. The antenna conductor is structured by a spiral-shaped wiring pattern and the both ends of the antenna conductor are connected to the passive element via a bonding wire. The antenna conductor functions as a loop antenna with the passive element inserted.

摘要翻译： 半导体模块包括多层板，安装在多层板上的第一电路元件，堆叠在第一电路元件上的第二电路元件，设置在第一电路元件和第二电路元件之间的插入板，其包括天线导体 安装在与天线导体连接的多层板上的无源元件和密封各元件的模制树脂层。 天线导体由螺旋状的布线图形构成，天线导体的两端通过接合线与无源元件连接。 天线导体用作插入无源元件的环形天线。

公开(公告)号：US20060131724A1

公开(公告)日：2006-06-22

申请号：US11314039

申请日：2005-12-20

申请人： Akihiro Sato ,  Satoru Sekiguchi ,  Kiyokazu Kamado ,  Kazunari Kurokawa ,  Makoto Tsubonoya ,  Kiyoshi Mita ,  Yoichi Nabeta ,  Tetsuro Sawai ,  Toshikazu Imaoka

发明人： Akihiro Sato ,  Satoru Sekiguchi ,  Kiyokazu Kamado ,  Kazunari Kurokawa ,  Makoto Tsubonoya ,  Kiyoshi Mita ,  Yoichi Nabeta ,  Tetsuro Sawai ,  Toshikazu Imaoka

IPC分类号： H01L23/48

CPC分类号： H01L23/645 ,  H01F2017/008 ,  H01F2017/0086 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/12034 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19106 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor apparatus comprises a substrate, a semiconductor chip fixedly secured on one side of the substrate, a spirally shaped coil formed on the other side of the substrate and electrically connected to the semiconductor chip, and a conductive pattern formed on a surface of the one side of the substrate facing to the semiconductor chip for stabilizing an inductance characteristic of the coil.

摘要翻译： 一种半导体装置，包括基板，固定在基板的一侧的半导体芯片，形成在基板的另一侧并与半导体芯片电连接的螺旋形线圈，以及形成在该基板的表面上的导电图案 面向半导体芯片的衬底的侧面，用于稳定线圈的电感特性。

公开(公告)号：US5590412A

公开(公告)日：1996-12-31

申请号：US342220

申请日：1994-11-18

申请人： Tetsuro Sawai ,  Hisanori Uda ,  Toshikazu Hirai ,  Toshikazu Imaoka ,  Yasoo Harada ,  Keiichi Honda ,  Masao Nishida

发明人： Tetsuro Sawai ,  Hisanori Uda ,  Toshikazu Hirai ,  Toshikazu Imaoka ,  Yasoo Harada ,  Keiichi Honda ,  Masao Nishida

IPC分类号： H03F3/193 ,  H03F3/72 ,  H04B1/44 ,  H04B1/48 ,  H03F3/62

CPC分类号： H04B1/44 ,  H03F3/1935 ,  H03F3/72 ,  H04B1/48

摘要： A communication apparatus for use in a portable telephone is disclosed which has a transmit-receive common amplifier for amplifying a transmitted signal or received signal, and a mixer for frequency-mixing the transmitted signal or the received signal with a local oscillator output, wherein connection between the mixer and an input side of the amplifier and connection between the mixer and an output side of the amplifier are made by means of respective signal-path selector switches. During reception, a deep bias is applied to an FET of the transmit-receive common amplifier to reduce current consumption, and during transmission, a shallow bias is applied to the FET of the transmit-receive common amplifier for increased output.

摘要翻译： 公开了一种用于便携式电话的通信装置，其具有用于放大发射信号或接收信号的发射 - 接收公共放大器，以及用本地振荡器输出对发射信号或接收信号进行频率混频的混频器，其中连接 在混频器和放大器的输入侧之间，混频器和放大器的输出侧之间的连接通过相应的信号路径选择器开关进行。 在接收期间，向发射接收公共放大器的FET施加深偏压以减少电流消耗，并且在传输期间，将浅偏压施加到发射 - 接收公共放大器的FET以增加输出。

公开(公告)号：US07450397B2

公开(公告)日：2008-11-11

申请号：US11388705

申请日：2006-03-24

申请人： Atsushi Saita ,  Toshikazu Imaoka ,  Tetsuro Sawai

发明人： Atsushi Saita ,  Toshikazu Imaoka ,  Tetsuro Sawai

IPC分类号： H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

CPC分类号： H05K1/024 ,  B32B15/08 ,  H05K1/0242 ,  H05K1/0298 ,  H05K3/4688 ,  H05K2201/0191 ,  H05K2201/035 ,  H05K2201/0715 ,  H05K2201/098 ,  Y10T428/24917 ,  Y10T428/24926

摘要： A wiring board in which a line can be made narrower and/or a transmission loss can be reduced is developed. The wiring board includes a first conductor and a second conductor maintained at the same potential, a dielectric material layer provided between the first and second conductors, and a third conductor embedded in the dielectric material layer. In the wiring board, a thickness of the dielectric material layer in a first region located between the third conductor and the first conductor is larger than a thickness of the dielectric material layer in a second region located between the third conductor and the second conductor. Moreover, a cross-sectional shape of the third conductor is trapezoidal in which angles of respective ends of the third conductor on a side closer to the second conductor are obtuse.

摘要翻译： 开发了可以使线路变窄和/或可以减小传输损耗的布线板。 布线板包括保持在相同电位的第一导体和第二导体，设置在第一和第二导体之间的介电材料层和嵌入电介质材料层中的第三导体。 在布线板中，位于第三导体和第一导体之间的第一区域中的电介质材料层的厚度大于位于第三导体和第二导体之间的第二区域中的电介质材料层的厚度。 此外，第三导体的横截面形状是梯形的，其中第三导体在更靠近第二导体的一侧的各端的角度是钝的。

公开(公告)号：US07432580B2

公开(公告)日：2008-10-07

申请号：US11314039

申请日：2005-12-20

申请人： Akihiro Sato ,  Satoru Sekiguchi ,  Kiyokazu Kamado ,  Kazunari Kurokawa ,  Makoto Tsubonoya ,  Kiyoshi Mita ,  Yoichi Nabeta ,  Tetsuro Sawai ,  Toshikazu Imaoka

发明人： Akihiro Sato ,  Satoru Sekiguchi ,  Kiyokazu Kamado ,  Kazunari Kurokawa ,  Makoto Tsubonoya ,  Kiyoshi Mita ,  Yoichi Nabeta ,  Tetsuro Sawai ,  Toshikazu Imaoka

IPC分类号： H01L23/58 ,  H05K7/00

CPC分类号： H01L23/645 ,  H01F2017/008 ,  H01F2017/0086 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/12034 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19106 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor apparatus comprises a substrate, a semiconductor chip fixedly secured on one side of the substrate, a spirally shaped coil formed on the other side of the substrate and electrically connected to the semiconductor chip, and a conductive pattern formed on a surface of the one side of the substrate facing to the semiconductor chip for stabilizing an inductance characteristic of the coil.

摘要翻译： 一种半导体装置，包括基板，固定在基板的一侧的半导体芯片，形成在基板的另一侧并与半导体芯片电连接的螺旋形线圈，以及形成在该基板的表面上的导电图案 面向半导体芯片的衬底的侧面，用于稳定线圈的电感特性。

公开(公告)号：US20080078571A1

公开(公告)日：2008-04-03

申请号：US11861712

申请日：2007-09-26

申请人： Toshikazu Imaoka ,  Tetsuro Sawai

发明人： Toshikazu Imaoka ,  Tetsuro Sawai

IPC分类号： H05K1/11

CPC分类号： H05K1/0245 ,  H01L25/0657 ,  H01L25/16 ,  H01L2223/6638 ,  H01L2224/05553 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3011 ,  H05K1/0248 ,  H05K2201/09236 ,  H05K2201/09627 ,  H05K2201/09672 ,  H05K2201/10545 ,  H05K2201/10674 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A device mounting board includes: a wiring layer; opposing signal wires formed on respective conductive layers, being arranged in parallel with each other; a pair of pad electrodes formed on the top of the wiring layer; a pair of pad electrodes formed on the bottom of the wiring layer; conductor parts which are formed through insulating layers and establish electrical connection between the top and bottom conductive layers; a circuit device mounted on the top side of the wiring layer; and a pair of signal electrodes formed on this circuit device, being connected to the pair of pad electrodes via conductive members. A line extending from one of the pad electrodes on the top to one of the pad electrodes on the bottom through one signal wire and a line extending from the other pad electrode on the top to the other pad electrode on the bottom through the other signal wire constitute a pair of differential transmission lines of equal lengths.

摘要翻译： 装置安装板包括：布线层; 形成在各个导电层​​上的相对的信号线彼此平行布置; 形成在所述布线层的顶部上的一对焊盘电极; 形成在布线层的底部的一对焊盘电极; 导体部分，其通过绝缘层形成并且在顶部和底部导电层之间建立电连接; 安装在所述布线层的上侧的电路装置; 以及形成在该电路装置上的一对信号电极，经由导电部件与一对焊盘电极连接。 从顶部的一个焊盘电极延伸到底部的焊盘电极之一，通过一个信号线和从顶部的另一个焊盘电极延伸到底部的另一焊盘电极的另一个信号线 构成长度相等的差动传输线对。

公开(公告)号：US5559457A

公开(公告)日：1996-09-24

申请号：US215193

申请日：1994-03-21

申请人： Hisanori Uda ,  Tetsuro Sawai ,  Toshikazu Imaoka ,  Toshikazu Hirai ,  Yasoo Harada

发明人： Hisanori Uda ,  Tetsuro Sawai ,  Toshikazu Imaoka ,  Toshikazu Hirai ,  Yasoo Harada

IPC分类号： H03D7/00 ,  H03D7/12 ,  H03D7/14 ,  H03D9/06 ,  H04B1/28 ,  H04B1/26

CPC分类号： H03D7/1441 ,  H03D7/1458 ,  H03D2200/0007 ,  H03D2200/0084 ,  H03D2200/0088 ,  H03D7/125 ,  H03D9/0658

摘要： A double-balanced mixer circuit which consumes less power, and is capable of operating on a low voltage power source, because an output of a first signal having a phase lag of 90.degree. from a first frequency signal and an output of a second signal having a phase lead of 90.degree. over the first frequency signal are provided by means of a first phase shifter, an output of a third signal having a phase lag of 90.degree. from a second frequency signal and an output of fourth signal having a phase lead of 90.degree. over the second frequency signal are provided by means of a second phase shifter, thereby generating a radio frequency signal by mixing the first signal and the third signal in a first dual gate circuit, and generating a radio frequency signal by mixing the second signal and the fourth signal in a second dual gate circuit.

摘要翻译： 一种双平衡混频器电路，其消耗较少的功率，并且能够在低电压电源上工作，因为与第一频率信号相差90度的第一信号的输出和具有第一信号的第二信号的输出， 通过第一移相器提供90°以上的第一频率信号的相位引导，从第二频率信号输出具有90°的相位滞后的第三信号和具有相位引导的第四信号的输出 通过第二移相器提供第二频率信号的90°，从而通过在第一双门电路中混合第一信号和第三信号来产生射频信号，并且通过混合第二信号来产生射频信号 以及第二双门电路中的第四信号。

公开(公告)号：US20100252936A1

公开(公告)日：2010-10-07

申请号：US12602462

申请日：2008-05-27

申请人： Toshikazu Imaoka ,  Tetsuro Sawai ,  Kenichi Kobayashi ,  Atsushi Nakano

发明人： Toshikazu Imaoka ,  Tetsuro Sawai ,  Kenichi Kobayashi ,  Atsushi Nakano

IPC分类号： H01L23/48

CPC分类号： H05K1/141 ,  H01L24/73 ,  H01L25/0657 ,  H01L2223/6638 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06572 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15174 ,  H01L2924/15182 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K1/181 ,  H05K1/182 ,  H05K3/3436 ,  H05K2201/09136 ,  H05K2201/09418 ,  H05K2201/10545 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

摘要： A semiconductor module includes: a substrate having a wiring layer; a first rectangular-shaped semiconductor device mounted on one surface of the substrate; a second rectangular-shaped semiconductor device mounted on the other surface of the substrate. The first semiconductor device is arranged such that each side thereof is not parallel to that of the second semiconductor device, and that the first semiconductor device is superimposed on the second semiconductor device, when seen from the direction perpendicular to the surface of the substrate.

摘要翻译： 半导体模块包括：具有布线层的基板; 安装在所述基板的一个表面上的第一矩形半导体器件; 安装在所述基板的另一表面上的第二矩形半导体器件。 第一半导体器件布置成使得其每侧不与第二半导体器件的平行平行，并且当从垂直于衬底的表面的方向看时，第一半导体器件重叠在第二半导体器件上。

公开(公告)号：US20060238961A1

公开(公告)日：2006-10-26

申请号：US11391680

申请日：2006-03-29

申请人： Atsushi Saita ,  Toshikazu Imaoka ,  Tetsuro Sawai ,  Yasunori Inoue

发明人： Atsushi Saita ,  Toshikazu Imaoka ,  Tetsuro Sawai ,  Yasunori Inoue

IPC分类号： H02B1/00

CPC分类号： H01L23/50 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48237 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/4943 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19104 ,  H01L2924/19107 ,  H01L2924/20752 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

摘要： The ground noise is reduced which propagates between circuit elements in a circuit device having a multiple stack structure. A grounding bonding pad provided on the surface of a second circuit element is connected to a bonding wire provided on the surface of a conduction layer via a grounding wire such as gold. A bonding pad provided on the surface of the conductive layer is connected to a lead provided on a ground wire via a grounding wire such as gold. This structure creates a capacitance between the second circuit element and the conduction layer so as to prevent the propagation of noise circuit from element to the ground wiring.

摘要翻译： 降低了在具有多堆叠结构的电路装置中的电路元件之间传播的接地噪声。 设置在第二电路元件的表面上的接地焊盘通过诸如金的接地线连接到设置在导电层的表面上的接合线。 设置在导电层的表面上的接合焊盘通过诸如金的接地线连接到设置在接地线上的引线。 该结构在第二电路元件和导电层之间产生电容，以防止噪声电路从元件传播到接地布线。