公开(公告)号：US5671316A

公开(公告)日：1997-09-23

申请号：US601657

申请日：1996-02-14

申请人： Toshiya Yuhara ,  Hisao Iitsuka ,  Kazuyuki Fukuda ,  Makoto Shimaoka ,  Tetsuo Kumazawa

发明人： Toshiya Yuhara ,  Hisao Iitsuka ,  Kazuyuki Fukuda ,  Makoto Shimaoka ,  Tetsuo Kumazawa

IPC分类号： G02B6/30 ,  G02B6/38 ,  G02B6/00

CPC分类号： G02B6/30 ,  G02B6/3812 ,  G02B6/3838 ,  G02B6/3861

摘要： A connecting structure of an optical fiber to an optical waveguide includes a circular cylindrical holder having a bore with a circular cross-section communicating one end thereof to the other. The protecting layer removal end of the optical fiber is inserted into the bore. An end plane of the protecting layer removal end and a side plane of the holder are co-planar to be connected to an end surface of an optical waveguide.

摘要翻译： 光纤到光波导的连接结构包括圆柱形保持器，该圆柱形保持器具有将其一端连接到另一端的圆形横截面的孔。 将光纤的保护层去除端插入孔中。 保护层去除端的端面和保持器的侧面是共面的，以连接到光波导的端面。

公开(公告)号：US4880290A

公开(公告)日：1989-11-14

申请号：US99072

申请日：1987-09-21

申请人： Tetsuo Kumazawa ,  Makoto Shimaoka ,  Kazuyuki Fukuda ,  Eiichi Adachi

发明人： Tetsuo Kumazawa ,  Makoto Shimaoka ,  Kazuyuki Fukuda ,  Eiichi Adachi

IPC分类号： G02B6/00 ,  G02B6/245 ,  G02B6/38 ,  G02B6/42

CPC分类号： G02B6/3861 ,  G02B6/245 ,  G02B6/3889 ,  G02B6/4202 ,  G02B6/4236 ,  G02B6/4248 ,  G02B6/4239

摘要： An optical fiber apparatus having an optical fiber jacket guide for receiving and guiding an optical fiber therethrough to enable proper optical coupling with an optical component of an opto-electronic package device. An optical fiber core extends through the jacket guide and has a coating material coated thereon and extending within at least a part of the jacket guide. At least a part of the coating material within the jacket guide has an irregular peripheral surface and adhesive within the jacket guide bonds at least the coating material and the jacket guide.

摘要翻译： 一种光纤设备，具有用于接收和引导光纤穿过其中的光纤护套引导件，以实现与光电子封装器件的光学部件的适当的光耦合。 光纤芯延伸穿过护套引导件并且涂覆有涂层材料并且在护套引导件的至少一部分内延伸。 护套引导件内的涂层材料的至少一部分具有不规则的周边表面，并且护套引导件内的粘合剂至少粘合涂层材料和护套引导件。

公开(公告)号：US5195155A

公开(公告)日：1993-03-16

申请号：US525675

申请日：1990-05-21

申请人： Makoto Shimaoka ,  Tetsuo Kumazawa ,  Yasutoshi Yagiu ,  Atsushi Sasayama

发明人： Makoto Shimaoka ,  Tetsuo Kumazawa ,  Yasutoshi Yagiu ,  Atsushi Sasayama

IPC分类号： G02B6/42

CPC分类号： G02B6/4208 ,  G02B6/4226

摘要： An optical coupling apparatus including a light emitting diode, a lens, an optical isolator and an optical fiber disposed on a common optical axis is improved in the optical coupling efficiency. The individual optical elements are roughly adjusted in the respective positions and fixed, and then a precise and fine adjustment is effectuated by plastically deforming a portion of a holder for supporting the lens or the optical isolator and/or by adjusting inclination of the holder. The holder imparted with the fine adjustment capability can be implemented as a lens holder.

摘要翻译： 包括发光二极管，透镜，光隔离器和布置在公共光轴上的光纤的光耦合装置在光耦合效率方面得到改善。 各个光学元件在各个位置上大致调整并固定，然后通过使用于支撑透镜或光隔离器的保持器的一部分塑性变形和/或通过调整保持器的倾斜来实现精确和精细的调整。 赋予微调能力的保持器可以实现为透镜保持器。

公开(公告)号：US5046798A

公开(公告)日：1991-09-10

申请号：US387984

申请日：1989-08-01

申请人： Yasutoshi Yagiu ,  Tetsuo Kumazawa ,  Makoto Shimaoka ,  Kunio Aiki

发明人： Yasutoshi Yagiu ,  Tetsuo Kumazawa ,  Makoto Shimaoka ,  Kunio Aiki

IPC分类号： G02B6/42 ,  H01L33/58 ,  H01S5/00

CPC分类号： G02B6/4209 ,  G02B6/4204 ,  G02B6/4206 ,  H01L2224/48091 ,  H01L2224/48247

摘要： A collimated-beam generating device using a semiconductor laser includes a two-lens system in which light converged by a first lens is converted into a collimated beam by a second lens, whereby a distance between the semiconductor laser and the first lens is made large, assembly of the device is made easy, and a collimated beam having a small beam diameter can be produced.

摘要翻译： 使用半导体激光器的准直光束产生装置包括双透镜系统，其中由第一透镜会聚的光被第二透镜转换成准直光束，由此半导体激光器和第一透镜之间的距离变大， 装置的组装变得容易，并且可以产生具有小光束直径的准直光束。

公开(公告)号：US06197603B1

公开(公告)日：2001-03-06

申请号：US09157153

申请日：1998-09-18

申请人： Ryuji Kohno ,  Tetsuo Kumazawa ,  Makoto Kitano ,  Akihiko Ariga ,  Yuji Wada ,  Naoto Ban ,  Shuji Shibuya ,  Yasuhiro Motoyama ,  Kunio Matsumoto ,  Susumu Kasukabe ,  Terutaka Mori ,  Hidetaka Shigi ,  Takayoshi Watanabe

发明人： Ryuji Kohno ,  Tetsuo Kumazawa ,  Makoto Kitano ,  Akihiko Ariga ,  Yuji Wada ,  Naoto Ban ,  Shuji Shibuya ,  Yasuhiro Motoyama ,  Kunio Matsumoto ,  Susumu Kasukabe ,  Terutaka Mori ,  Hidetaka Shigi ,  Takayoshi Watanabe

IPC分类号： G01R3126

CPC分类号： G01R3/00 ,  G01R1/0735

摘要： Dispersion of a load may be kept within a predetermined allowance even when a plurality of probes in a large area are pressed in batch by pressing the probes provided in a membrane against a wafer by applying a pressure load to a plurality of places on a plane of the pressure members on the side opposite the wafer in a probe test step, burn-in test step which represent typical semiconductor device manufacturing steps. It is then possible to provide semiconductor devices and a manufacturing method thereof which enhance the reliability and productivity of the semiconductor devices by probing a large number of integrated circuits or a large size integrated circuit at the same time.

摘要翻译： 即使当大量区域中的多个探针通过将设置在膜中的探针压在晶片上时，通过将压力负载施加到多个位置的平面上的多个位置，负载的分散也可以保持在预定容限内 在探针测试步骤中与晶片相对的一侧的压力构件，代表典型的半导体器件制造步骤的老化测试步骤。 因此，可以提供通过同时探测大量集成电路或大尺寸集成电路来提高半导体器件的可靠性和生产率的半导体器件及其制造方法。

公开(公告)号：US5608265A

公开(公告)日：1997-03-04

申请号：US207697

申请日：1994-03-09

申请人： Makoto Kitano ,  Asao Nishimura ,  Akihiro Yaguchi ,  Nae Yoneda ,  Ryuji Kohno ,  Naotaka Tanaka ,  Tetsuo Kumazawa

发明人： Makoto Kitano ,  Asao Nishimura ,  Akihiro Yaguchi ,  Nae Yoneda ,  Ryuji Kohno ,  Naotaka Tanaka ,  Tetsuo Kumazawa

IPC分类号： H01L21/56 ,  H01L23/12 ,  H01L23/13 ,  H01L23/28 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H01L25/10 ,  H01L25/11 ,  H01L25/16 ,  H01L25/18 ,  H05K1/18 ,  H05K3/34 ,  H01L23/48 ,  H01L23/02 ,  H01L29/40

CPC分类号： H01L23/3107 ,  H01L21/565 ,  H01L23/13 ,  H01L23/4951 ,  H01L23/49541 ,  H01L25/105 ,  H01L25/16 ,  H05K1/181 ,  H05K3/3436 ,  H01L2224/16145 ,  H01L2224/16237 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H05K2201/09472 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10818 ,  H05K2201/10931 ,  H05K3/3426 ,  H05K3/3431 ,  Y02P70/611 ,  Y02P70/613

摘要： A semiconductor device, provided in a plastic encapsulated package, having a semiconductor chip, a lead and a member for electrically connecting them together. The semiconductor device has one or more first holes respectively extending from one surface of the package to a first side of the lead which is provided inside of the package, and has one or more second holes formed which are aligned with the first holes, respectively, in a manner such that each second hole is extended from the opposing surface of the package to a corresponding location on a second side of the lead and is aligned with a corresponding, opposing first hole, in the package, extending to the first side of the lead. These holes are provided as a plurality of sets of individual pairs of aligned holes respectively extending inwardly, from opposing surfaces of the package, to opposite sides of the corresponding leads. In the device the leads or the leads with resin act as partitions thereby effecting isolation between the first and second holes of each pair aligned holes.

摘要翻译： 设置在塑料封装封装中的半导体器件具有半导体芯片，引线和用于将它们电连接在一起的部件。 半导体器件具有分别从封装的一个表面延伸到设置在封装内部的引线的第一侧的一个或多个第一孔，并且分别具有与第一孔对准的一个或多个第二孔， 以使得每个第二孔从包装的相对表面延伸到引线的第二侧上的对应位置并且与包装中的相应的相对的第一孔对准，延伸到包装的第一侧 铅。 这些孔被设置为多组对齐的对齐的孔，分别从包装的相对表面向内延伸到相应引线的相对侧。 在装置中，引线或具有树脂的引线作为隔板，从而实现每对对齐的孔的第一和第二孔之间的隔离。

公开(公告)号：US06455335B1

公开(公告)日：2002-09-24

申请号：US09653624

申请日：2000-08-31

申请人： Ryuji Kohno ,  Tetsuo Kumazawa ,  Makoto Kitano ,  Akihiko Ariga ,  Yuji Wada ,  Naoto Ban ,  Shuji Shibuya ,  Yasuhiro Motoyama ,  Kunio Matsumoto ,  Susumu Kasukabe ,  Terutaka Mori ,  Hidetaka Shigi ,  Takayoshi Watanabe

发明人： Ryuji Kohno ,  Tetsuo Kumazawa ,  Makoto Kitano ,  Akihiko Ariga ,  Yuji Wada ,  Naoto Ban ,  Shuji Shibuya ,  Yasuhiro Motoyama ,  Kunio Matsumoto ,  Susumu Kasukabe ,  Terutaka Mori ,  Hidetaka Shigi ,  Takayoshi Watanabe

IPC分类号： G01R3126

CPC分类号： G01R3/00 ,  G01R1/0735

摘要： Dispersion of load may be kept within an allowance even when a plurality of probes in a large area are pressed in batch by pressing the probes provided in a membrane to a wafer by applying a pressure load to a plurality of places of a plane of pressure members on the side opposite from the wafer in a probe test step/burn-in test step which is one of semiconductor device manufacturing steps. It is then possible to provide semiconductor devices and a manufacturing method thereof which enhance the reliability and productivity of the semiconductor devices by probing a large number of integrated circuits or a large size integrated circuit in the same time.

公开(公告)号：US06297073B1

公开(公告)日：2001-10-02

申请号：US09547937

申请日：2000-04-11

申请人： Makoto Kitano ,  Ryuji Kohno ,  Naotaka Tanaka ,  Akihiro Yaguchi ,  Tetsuo Kumazawa ,  Ichiro Anjoh ,  Hideki Tanaka ,  Asao Nishimura ,  Shuji Eguchi ,  Akira Nagai ,  Mamoru Mita

发明人： Makoto Kitano ,  Ryuji Kohno ,  Naotaka Tanaka ,  Akihiro Yaguchi ,  Tetsuo Kumazawa ,  Ichiro Anjoh ,  Hideki Tanaka ,  Asao Nishimura ,  Shuji Eguchi ,  Akira Nagai ,  Mamoru Mita

IPC分类号： H01L21283

CPC分类号： H01L24/50 ,  H01L23/3114 ,  H01L23/49572 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/15787 ,  H01L2924/00

摘要： A semiconductor device, is provided will semiconductor chips having a plurality of electrodes for external connection, elastomer resin portions formed of an elastomer resin, which are bonded to the semiconductor chip excepting at least some of the plurality of electrodes, a tape layer of resin including tape wiring patterns on the surface thereof, a plurality of solder bumps for bonding the printed wiring pattern to the tape wiring patterns, leads for connecting the plurality of electrodes of the semiconductor chips to the tape wiring patterns, and seal resin for covering the leads and the plurality of electrodes which are connected by the leads. The elastomer resin has a modulus of transverse elasticity not less than 50 MPa and not more than 750 MPa.

摘要翻译： 提供一种半导体器件，具有多个用于外部连接的电极的半导体芯片，除弹性体树脂形成的弹性体树脂部分，其除了多个电极中的至少一些外部结合到半导体芯片，包括树脂的带层，包括 表面上的带状布线图案，用于将印刷布线图案接合到带布线图案的多个焊料凸块，用于将半导体芯片的多个电极连接到带布线图案的引线，以及密封用于覆盖引线的树脂， 由引线连接的多个电极。 弹性体树脂的横向弹性模量不小于50MPa且不大于750MPa。

公开(公告)号：US6130112A

公开(公告)日：2000-10-10

申请号：US166857

申请日：1998-10-06

申请人： Makoto Kitano ,  Ryuji Kohno ,  Naotaka Tanaka ,  Akihiro Yaguchi ,  Tetsuo Kumazawa ,  Ichiro Anjoh ,  Hideki Tanaka ,  Asao Nishimura ,  Shuji Eguchi ,  Akira Nagai ,  Mamoru Mita

发明人： Makoto Kitano ,  Ryuji Kohno ,  Naotaka Tanaka ,  Akihiro Yaguchi ,  Tetsuo Kumazawa ,  Ichiro Anjoh ,  Hideki Tanaka ,  Asao Nishimura ,  Shuji Eguchi ,  Akira Nagai ,  Mamoru Mita

IPC分类号： H01L21/60 ,  H01L23/04 ,  H01L23/12 ,  H01L23/31 ,  H01L23/495 ,  H01L21/48

CPC分类号： H01L24/50 ,  H01L23/3114 ,  H01L23/49572 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/15787

摘要： A semiconductor device, is provided will semiconductor chips having a plurality of electrodes for external connection, elastomer resin portions formed of an elastomer resin, which are bonded to the semiconductor chip excepting at least some of the plurality of electrodes, a tape layer of resin including tape wiring patterns on the surface thereof, a plurality of solder bumps for bonding the printed wiring pattern to the tape wiring patterns, leads for connecting the plurality of electrodes of the semiconductor chips to the tape wiring patterns, and seal resin for covering the leads and the plurality of electrodes which are connected by the leads. The elastomer resin has a modulus of transverse elasticity not less than 50 MPa and not more than 750 MPa.

公开(公告)号：US5569960A

公开(公告)日：1996-10-29

申请号：US438466

申请日：1995-05-10

申请人： Tetsuo Kumazawa ,  Makoto Kitano ,  Akihiro Yaguchi ,  Ryuji Kohno ,  Naotaka Tanaka ,  Nae Yoneda ,  Ichiro Anjoh

发明人： Tetsuo Kumazawa ,  Makoto Kitano ,  Akihiro Yaguchi ,  Ryuji Kohno ,  Naotaka Tanaka ,  Nae Yoneda ,  Ichiro Anjoh

IPC分类号： H05K1/18 ,  H01L21/60 ,  H01L23/12 ,  H01L23/31 ,  H01L23/50 ,  H05K1/11 ,  H05K3/34 ,  H01L23/48

CPC分类号： H01L24/11 ,  H01L23/3128 ,  H05K3/3436 ,  H01L2224/13099 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/20752 ,  H05K1/11 ,  H05K1/111 ,  H05K2201/094 ,  H05K2203/0465 ,  H05K3/3431 ,  Y02P70/613

摘要： An electronic component unit is provided with two electronic components which are disposed in parallel with each other and each of which has an internal electric circuit therein. Electrode pads are provided on the opposed surfaces of the two electronic components and are electrically connected to the internal electric circuits. The pads on one of the electronic components are respectively electrically and mechanically connected to the corresponding pads on the other electronic component by solder bumps. The areas of the pads increase or decrease stepwise in the direction from the central portions toward the outer peripheral edges of the two electronic components, while the volumes of the solder bumps are constant. Alternatively, the volumes of the solder bumps decrease or increase in the direction from the central portions toward the outer peripheral edges of the two electronic components, while the areas of all pads are constant. Each of the pads of the two electronic components is bonded to an associated solder bump over the whole area of the pad, whereby the shapes of the solder bumps respectively connected to the pads of the two electronic components change in the direction from the central portions toward the outer peripheral edges of the two electronic components to provide the solder bumps with different durabilities to stress, thereby assuring high reliability of the connection between the two electronic components.

摘要翻译： 电子部件单元设置有彼此并联布置的两个电子部件，每个电子部件在其中具有内部电路。 电极焊盘设置在两个电子部件的相对表面上并与内部电路电连接。 其中一个电子部件上的焊盘通过焊料凸块分别电连接和机械连接到另一电子部件上的对应的焊盘。 焊盘的面积在从两个电子部件的中心部分朝向外周边缘的方向上逐渐增加或减小，而焊料凸块的体积是恒定的。 或者，焊料凸块的体积在从两个电子部件的中心部分朝向外周边缘的方向上减小或增加，而所有焊盘的面积是恒定的。 两个电子部件的每个焊盘在焊盘的整个区域上结合到相关联的焊料凸块，由此分别连接到两个电子部件的焊盘的焊料凸块的形状在从中心部分朝向 两个电子部件的外周边缘，以使焊料凸块具有不同的应力耐久性，从而确保两个电子部件之间的连接的高可靠性。