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    SEMICONDUCTOR PACKAGE WITH GEL FILLED CAVITY
    2.
    发明申请
    SEMICONDUCTOR PACKAGE WITH GEL FILLED CAVITY 有权
    具有凝胶填充孔的半导体封装

    公开(公告)号：US20150137278A1

    公开(公告)日：2015-05-21

    申请号：US14086919

    申请日：2013-11-21

    申请人： Stanley Job Doraisamy ,  Soon Kang Chan ,  Soo Choong Chee

    发明人： Stanley Job Doraisamy ,  Soon Kang Chan ,  Soo Choong Chee

    IPC分类号： H01L23/31 ,  H01L29/84 ,  H01L21/56

    CPC分类号： H01L29/84 ,  H01L21/50 ,  H01L23/24 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/00014

    摘要： A semiconductor device package is assembled using a jig that alters the shape of gel material disposed in a cavity in the package. In one embodiment, a jig having a concave bottom surface is inserted onto uncured gel material disposed within a cavity in a housing of the package to change a top surface of the gel from having a concave shape to a convex shape. The gel is then cured with the jig in place. When the jig is subsequently removed, the cured gel retains the convex shape, which helps to avoid any bond wires from being exposed. The re-shaped gel material reduces internal stresses during thermal cycling and can therefore reduce permanent damage to the package otherwise resulting from such thermal cycling.

    摘要翻译： 使用改变设置在包装中的空腔中的凝胶材料的形状的夹具来组装半导体器件封装。 在一个实施例中，将具有凹底表面的夹具插入到设置在包装壳体中的空腔内的未固化的凝胶材料上，以将凝胶的顶表面从凹形变为凸形。 然后将凝胶用夹具固化就位。 当夹具随后被去除时，固化的凝胶保持凸形，这有助于避免任何接合线暴露。 重新形成的凝胶材料在热循环期间降低内部应力，因此可以减少由于这种热循环导致的对包装的永久性损坏。

    Integrated Semiconductor Outline Package
    8.
    发明申请
    Integrated Semiconductor Outline Package 有权
    集成半导体外形封装

    公开(公告)号：US20100007006A1

    公开(公告)日：2010-01-14

    申请号：US12513906

    申请日：2006-12-05

    申请人： Stanley Job Doraisamy ,  Wae Chet Young

    发明人： Stanley Job Doraisamy ,  Wae Chet Young

    IPC分类号： H01L23/50

    CPC分类号： H05K1/18 ,  H01L23/49541 ,  H01L23/49555 ,  H01L23/49562 ,  H01L2924/0002 ,  H05K1/0263 ,  H05K1/181 ,  H05K2201/10166 ,  H05K2201/10659 ,  H01L2924/00

    摘要： A transistor outline package is provided for a semiconductor integrated device suitable for use in a control module of an automobile for connection between a printed circuit board and a bus bar of such a module. The package includes a package housing, having a first end suitable for mounting to a PCB and which has a width. The package is also formed with a leadframe which includes a heat sink and ground plane blade suitable for connection to a bus bar, a plurality of connector leads suitable for connection to a PCB and at least one source tab lead suitable for connection to a module connector of such a control module. The plurality of connection leads and the source tab lead extend from the first end of the package housing side by side in the direction along and within the width of the first end of the package housing.

    摘要翻译： 为适用于汽车的控制模块的半导体集成器件提供晶体管外形封装，用于连接印刷电路板和这种模块的母线。 封装包括封装壳体，其具有适于安装到PCB并具有宽度的第一端。 该封装还形成有引线框架，该引线框架包括适于连接到母线的散热器和接地平面叶片，适合于连接到PCB的多个连接器引线和适于连接到模块连接器的至少一个源极突起引线 的这种控制模块。 多个连接引线和源极突片从包装壳体的第一端沿着包装壳体的第一端的宽度方向并排地延伸。

    Integrated Semiconductor Outline Package
    10.
    发明申请
    Integrated Semiconductor Outline Package 审中-公开
    集成半导体外形封装

    公开(公告)号：US20120162924A1

    公开(公告)日：2012-06-28

    申请号：US13412881

    申请日：2012-03-06

    申请人： Stanley Job Doraisamy ,  Wae Chet Yong

    发明人： Stanley Job Doraisamy ,  Wae Chet Yong

    IPC分类号： H05K7/20 ,  H05K7/06

    CPC分类号： H05K1/18 ,  H01L23/49541 ,  H01L23/49555 ,  H01L23/49562 ,  H01L2924/0002 ,  H05K1/0263 ,  H05K1/181 ,  H05K2201/10166 ,  H05K2201/10659 ,  H01L2924/00

    摘要： A transistor outline package is provided for a semiconductor integrated device suitable for use in a control module of an automobile for connection between a printed circuit board and a bus bar of such a module. The package includes a package housing, having a first end suitable for mounting to a PCB and which has a width. The package is also formed with a leadframe which includes a heat sink and ground plane blade suitable for connection to a bus bar, a plurality of connector leads suitable for connection to a PCB and at least one source tab lead suitable for connection to a module connector of such a control module. The plurality of connection leads and the source tab lead extend from the first end of the package housing side by side in the direction along and within the width of the first end of the package housing.

    摘要翻译： 为适用于汽车的控制模块的半导体集成器件提供晶体管外形封装，用于连接印刷电路板和这种模块的母线。 封装包括封装壳体，其具有适于安装到PCB并具有宽度的第一端。 该封装还形成有引线框架，该引线框架包括适于连接到母线的散热器和接地平面叶片，适合于连接到PCB的多个连接器引线和适于连接到模块连接器的至少一个源极突起引线 的这种控制模块。 多个连接引线和源极突片从包装壳体的第一端沿着包装壳体的第一端的宽度方向并排地延伸。