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13 条记录 (耗时 0.022 秒)

    Method and apparatus for reconfiguring circuit board and integrated circuit packet arrangement with one-time programmable elements
    3.
    发明授权
    Method and apparatus for reconfiguring circuit board and integrated circuit packet arrangement with one-time programmable elements 失效
    用于重构电路板的方法和装置以及具有一次性可编程元件的集成电路分组布置

    公开(公告)号：US06732266B1

    公开(公告)日：2004-05-04

    申请号：US09650630

    申请日：2000-08-28

    申请人： Charles Anderson ,  James J. Casto ,  Alexander C. Tain

    发明人： Charles Anderson ,  James J. Casto ,  Alexander C. Tain

    IPC分类号： G06F124

    CPC分类号： H05K1/029 ,  H05K2201/10212 ,  H05K2201/10325 ,  H05K2201/10689 ,  H05K2203/176

    摘要： An arrangement and method of reconfiguring a circuit board and package arrangement employs one-time programmable elements on a package to allow a programmable first package arrangement having a first package board and a first integrated circuit to be readily replaced. The first package arrangement was programmed to operate with a first set of operating parameters. The replacement package arrangement, having a second package board and a second integrated circuit, may be substantially identical to the first package arrangement except programmed to operate with a second set of operating parameters different from the first set of op crating parameters. The replacement of the first package arrangement by the second, differently programmed package arrangement, provides a reconfigured circuit board and package arrangement while avoiding the obsoleting of the circuit board.

    摘要翻译： 重新配置电路板和封装布置的布置和方法在封装上使用一次性可编程元件，以允许具有第一封装板和第一集成电路的可编程第一封装布置容易地被替换。 第一封装装置被编程为用第一组操作参数进行操作。 具有第二封装板和第二集成电路的替换封装装置可以基本上与第一封装布置相同，除了被编程为以与第一组操作参数不同的第二组操作参数进行操作。 通过第二种不同编程的封装布置来替代第一封装布置提供了重新配置的电路板和封装装置，同时避免了电路板的过时。

    Plastic pad array electronic AC device
    4.
    发明授权
    Plastic pad array electronic AC device 失效
    塑料垫阵列电子交流设备

    公开(公告)号：US5045914A

    公开(公告)日：1991-09-03

    申请号：US663225

    申请日：1991-03-01

    申请人： James J. Casto ,  Michael B. McShane ,  Paul T. Lin

    发明人： James J. Casto ,  Michael B. McShane ,  Paul T. Lin

    IPC分类号： H01L23/31 ,  H01L23/367 ,  H01L23/495 ,  H01L25/10 ,  H05K3/34

    CPC分类号： H05K3/3436 ,  H01L23/3107 ,  H01L23/367 ,  H01L23/49517 ,  H01L23/49589 ,  H01L25/105 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K2201/09709 ,  H05K2201/10515 ,  H05K2201/10568 ,  H05K2201/10689 ,  H05K2201/10734 ,  H05K2201/10924 ,  H05K2201/10931 ,  H05K2201/2036 ,  H05K3/3426 ,  Y02P70/613

    摘要： A pad array electronic device for mounting on a substrate, such as a printed circuit board (PCB), has a relatively rigid package body with a plurality of holes bearing connecting mechanisms for bonding to lands on the PCB. The package body may be a thermoset plastic or other material that can be injection molded around an electronic component, such as an integrated circuit (IC) bonded to a lead frame. An integrated circuit die or other electronic component is mounted in proximity with or on the lead frame and electrical connections between the integrated circuit chip and the frame are made by any conventional means. In one aspect, the substrate leads are provided at their outer ends that are exposed by holes in the package with solder balls or pads for making connections to the PCB. The package body may be optionally used to stand off the device a set distance from the PCB so that the solder balls will form the proper concave structure. The periphery of the package body may function as a carrier structure to protect the lead or connection structures during testing, handling and board mounting. The open vias permit back side testing of the device before or after mounting of the package to the PCB. Additionally, a heat sink structure and/or capacitor may be directly bonded to the side or the top of the pad array electronic device which may be used singly or in multiple, stacked configurations, to facilitate the thermal dissipation from the device.

    摘要翻译： 用于安装在诸如印刷电路板（PCB）的基板上的焊盘阵列电子器件具有相对刚性的封装体，其具有多个孔，该多个孔承载用于结合到PCB上的焊盘的连接机构。 封装体可以是可以围绕电子部件注射模制的热固性塑料或其它材料，例如结合到引线框架的集成电路（IC）。 集成电路芯片或其他电子部件安装在引线框架附近或之上，并且通过任何常规方式制造集成电路芯片和框架之间的电连接。 在一个方面，衬底引线设置在其外端处，其被封装中的孔暴露以用于与PCB连接的焊球或焊盘。 封装体可以可选地用于从PCB离开设备一定距离，使得焊球将形成适当的凹形结构。 封装主体的周边可以用作载体结构，以在测试，处理和板安装期间保护引线或连接结构。 打开的通孔允许在将封装安装到PCB之前或之后对器件进行背面测试。 此外，散热器结构和/或电容器可以直接结合到可以单独使用或以多个堆叠配置使用的焊盘阵列电子器件的侧面或顶部，以便于从器件散热。

    Multiple layer lead frame
    5.
    发明授权
    Multiple layer lead frame 失效
    多层引线框架

    公开(公告)号：US5014113A

    公开(公告)日：1991-05-07

    申请号：US457444

    申请日：1989-12-27

    申请人： James J. Casto

    发明人： James J. Casto

    IPC分类号： H01L21/60 ,  H01L23/495 ,  H01L23/50 ,  H01L23/538 ,  H05K3/34

    CPC分类号： H01L23/49534 ,  H05K3/3426 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H05K2201/10689 ,  H05K2201/10909 ,  H05K2201/2081 ,  Y02P70/613

    摘要： A lead frame having multiple layers permits fine connection to a large number of bonding pads on an electronic component such as an integrated circuit (IC), but strong external package leads. A fully featured or completely extensive lead frame layer bears proximal ends that may be finely dimensioned for connection with the bonding pads of an IC. A second frame layer is laminated with the first layer, but does not have proximal ends that extend as far as those of the fully featured frame layer. The doubled external leads for mounting to a printed circuit board (PCB) are relatively stronger than the single, more finely featured proximal lead ends that are bonded to the component. The lead frame layers may also differ with respect to their thicknesses, electrical conductivity, strength and solder-wetting characteristics.

    摘要翻译： 具有多个层的引线框允许与诸如集成电路（IC）的电子部件上的大量接合焊盘的精细连接，但是强的外部封装引线。 全功能或完全广泛的引线框架层具有近端，其可以被精细尺寸以与IC的接合焊盘连接。 第二框架层与第一层层叠，但是不具有延伸到全功能框架层的近端的近端。 用于安装到印刷电路板（PCB）的双倍的外部引线比结合到组件的单个更精细的近端引线端相对更强。 引线框架层也可以相对于它们的厚度，电导率，强度和焊料润湿特性而不同。

    TAB bonded semiconductor device having off-chip power and ground distribution
    9.
    发明授权
    TAB bonded semiconductor device having off-chip power and ground distribution 失效
    具有片外电源和接地分布的TAB键合半导体器件

    公开(公告)号：US5060052A

    公开(公告)日：1991-10-22

    申请号：US577234

    申请日：1990-09-04

    申请人： James J. Casto ,  Charles G. Bigler

    发明人： James J. Casto ,  Charles G. Bigler

    IPC分类号： H01L23/495

    CPC分类号： H01L23/49572 ,  H01L2924/0002

    摘要： In a TAB bonded semiconductor device, off-chip power and ground distribution is provided by electrically conductive leads spanning across the face of the semiconductor device. Means for supporting at least one TAB lead carrying a power or ground signal across the face of the semiconductor device to an external bonding site is positioned in a central portion of the chip bonding area. In accordance with one embodiment of the invention, a semiconductor device is provided having a plurality of bonding pads arrayed on at least two sides of a face surface thereon. At least one TAB lead is bonded to a bonding pad on a first side of the face surface and spans across the face surface and is bonded to a bonding pad located in a second side of the face surface. An interior tape section overlies a central portion of the face surface supporting the TAB lead.

    摘要翻译： 在TAB键合半导体器件中，通过横跨半导体器件的表面的导电引线提供片外电源和接地分布。 用于将携带电源或接地信号的至少一个TAB引线跨过半导体器件的表面支撑到外部接合部位的装置位于芯片接合区域的中心部分。 根据本发明的一个实施例，提供一种半导体器件，其具有排列在其表面的至少两侧上的多个焊盘。 至少一个TAB引线被接合到面表面的第一侧上的接合焊盘，跨越面表面并且结合到位于面表面的第二侧中的接合焊盘。 内部带部分覆盖支撑TAB引线的面表面的中心部分。