公开(公告)号：WO0250487A9

公开(公告)日：2003-04-17

申请号：PCT/US0147686

申请日：2001-12-14

Applicant: THERMASYS CORP

Inventor： MELLER MARK ,  THORNTON JR DOUG

IPC: B23K1/00 ,  F28D1/053 ,  F28F1/04 ,  F28F1/12 ,  F28F9/00 ,  F28F9/013 ,  F28F9/02 ,  F28D1/02 ,  B23K1/20 ,  B23K31/02 ,  F28F3/00

CPC classification number: F28D1/05383 ,  B23K1/0012 ,  B23K2201/14 ,  F28F1/045 ,  F28F1/126 ,  F28F9/001 ,  F28F9/0221 ,  F28F2240/00

Abstract: A fin-tube block type heat exchanger (10) in which extruded tubes (16) are alternatingly arranged with corrugated fins (20), the fins (20) being shorter in overall length than the tubes (16) and having elongated bars (24) at their ends serving as spacer bars (24) between the tubes (16). The side walls (24a) of the spacer bar preferably taper towards each other such that the thickness of the spacer bar at the inner wall is less than the thickness of the spacer bar at the outer wall (24b). The side walls (24a) include one or more recesses (26) or grooves extending lengthwise with the spacer bar into which low temperature melting alloy (28) is captively inserted. During brazing, the alloy melts and is drawn by capillary action into the space created between the tapered side walls (24a) of the spacer bar and the facing surfaces of the adjacent tubes so that a complete joint is formed between the spacer bar (24) and the adjacent tubes (16).

Abstract translation: 一种翅片管式热交换器（10），其中挤压管（16）交替地布置有波纹状散热片（20），翅片（20）的总长度比管（16）短，并且具有细长条 ）在它们的端部用作管（16）之间的间隔杆（24）。 间隔杆的侧壁（24a）优选地朝向彼此逐渐变细，使得内壁处的间隔条的厚度小于外壁（24b）处的间隔条的厚度。 侧壁（24a）包括一个或多个凹槽（26）或凹槽，该凹槽（26）或纵向延伸与隔离杆延伸，低温熔融合金（28）被固定插入该凹槽中。 在钎焊期间，合金熔融并通过毛细管作用被拉入到间隔棒的锥形侧壁（24a）和相邻管的相对表面之间产生的空间中，使得在间隔杆（24）之间形成完整的接头， 和相邻的管（16）。

公开(公告)号：WO02051576A1

公开(公告)日：2002-07-04

申请号：PCT/FR2001/004016

申请日：2001-12-17

IPC: B23K20/00 ,  B23K1/008 ,  B23K1/19 ,  B23K1/20 ,  B23K31/02 ,  B23K35/30 ,  B23K35/32 ,  B23K103/18 ,  B32B15/00

CPC classification number: B23K1/008 ,  Y10T428/12806

Abstract: The invention concerns a method for making a plated product (1) comprising a steel support component (2) and an anti-corrosive metal coating (3), characterised in that the anti-corrosive coating (3) is fixed on the support component (2) by brazing under controlled atmosphere, in particular under vacuum. The method enables to fix solidly on a steel plate an anti-corrosive coating having a thickness less than 1 mm.

Abstract translation: 本发明涉及一种用于制造包括钢支撑部件（2）和防腐蚀金属涂层（3）的镀覆产品（1）的方法，其特征在于，所述防腐蚀涂层（3）固定在所述支撑部件 2）通过在受控气氛下钎焊，特别是在真空下。 该方法能够在钢板上牢固地固定厚度小于1mm的防腐涂层。

公开(公告)号：WO02038326A2

公开(公告)日：2002-05-16

申请号：PCT/EP2001/012574

申请日：2001-10-30

IPC: B23K31/02 ,  B23K1/18 ,  B23K20/02 ,  B23K20/16 ,  B23K35/00 ,  B23K35/02 ,  B23K35/22 ,  B23K35/28 ,  B23K103/10 ,  B32B15/01 ,  C22C21/14 ,  C25D3/56 ,  C25D5/10

CPC classification number: B23K1/18 ,  B23K20/023 ,  B23K20/16 ,  B23K35/002 ,  B23K35/0227 ,  B23K35/0238 ,  B23K35/0261 ,  B23K35/286 ,  B23K2203/10 ,  C25D3/562 ,  C25D5/10 ,  Y10S165/905 ,  Y10S428/926 ,  Y10S428/935 ,  Y10S428/936 ,  Y10T428/12708 ,  Y10T428/12722 ,  Y10T428/12736 ,  Y10T428/1275 ,  Y10T428/12764 ,  Y10T428/12792 ,  Y10T428/12861 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12944

Abstract: The invention relates to an aluminium brazing product, such as a brazing sheet product, comprising an aluminium alloy base substrate (1) of an aluminium alloy comprising silicon in an amount in the range of 2 to 18% by weight, and on at least one outlet surface a layer (2) comprising nickel, wherein a separately deposited layer (3) is applied on one side of said layer (2) comprising nickel, and wherein said layer (3) comprising a metal such that taken together said aluminium base substrate (1) and all layers exterior thereto form a metal filler having a liquidus temperature in the range of 490 to 570 DEG C. The invention also relates to a method of manufacturing such an aluminium brazing product and to a brazed assembly comprising at least one component made of the aluminium brazing product.

Abstract translation: 本发明涉及一种铝钎焊产品，例如钎焊片材产品，其包括铝合金基底（1），铝基合金包含2至18重量％范围内的硅和至少一个 出口表面包括镍的层（2），其中在包括镍的所述层（2）的一侧上施加单独沉积的层（3），并且其中所述层（3）包括金属，使得所述铝基底 （1）并且其外部的所有层形成液相线温度在490至570℃范围内的金属填料。本发明还涉及一种制造这种铝钎焊产品的方法和一种钎焊组件，其包括至少一种组分 由铝钎焊制成。

公开(公告)号：WO02024391A1

公开(公告)日：2002-03-28

申请号：PCT/US2001/029509

申请日：2001-09-21

IPC: B23K3/06 ,  B23K35/14 ,  H01L21/48 ,  H01L21/60 ,  H01L23/498 ,  H05K3/34 ,  B23K1/20 ,  B23K31/02

CPC classification number: B23K3/0623 ,  H01L21/4853 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/10126 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/13565 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K3/3436 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A method of forming a polymer support ring, or collar, around the base of solder balls (30/32) used to form solder joints includes forming patterned regions (26/28) of uncured polymer material over each of the conductive solder bump pads (22/24) on an IC package or other substrate (20) to which the solder balls are to be attached. Preferably, the uncured polymer material is a no-flow underfill material that fluxes the solder bump pads. Pre-formed solder balls are then placed into the uncured polymer material onto their respective solder bump pads. A subsequent heating cycle raises the assembly to the reflow temperature of the solder balls, thereby attaching the solder balls to the underlying solder bump pads, and at least partially curing the polymer material to form a support collar at the base region of each attached solder ball.

Abstract translation: 在用于形成焊接接头的焊球（30/32）的基部周围形成聚合物支撑环或环的方法包括在每个导电焊料凸块焊盘上形成未固化的聚合物材料的图案化区域（26/28） 22/24）放置在要封装焊锡球的IC封装或其他衬底（20）上。 优选地，未固化的聚合物材料是助焊剂焊盘的无流动底部填充材料。 然后将预先形成的焊球放入未固化的聚合物材料到它们各自的焊料凸块上。 随后的加热循环将组装升高到焊球的回流温度，从而将焊球附接到下面的焊料凸块焊盘，并且至少部分地固化聚合物材料，以在每个附着的焊球的基部区域形成支撑环 。

公开(公告)号：WO02016072A1

公开(公告)日：2002-02-28

申请号：PCT/US2001/025608

申请日：2001-08-14

IPC: B23D61/02 ,  B23D65/00 ,  B23K31/02

CPC classification number: B23K31/025 ,  B23D61/025 ,  B23D65/00

Abstract: A method of brazing a strob insert (144) to the trailing edge (32a) of a slot (32) in a strob circular saw blade (10), the strob insert (144) having first and second, opposed, substantially parallel surfaces, the first surface f the strob insert (144) to be brazed to the edge (32a), comprises the steps of placing the strob insert (144) on an electrode (50) with the second surface of the strob insert (144) in contact with the electrode (50) in heat transfer relationship therewith; applying brazing paste to the first surface of the insert (144); positioning the electrode (50) so that the first surface of the insert (144) is in a brazing position relative to the edge (32a); and passing an electrical current through the electrode (50) to resistively heat the electrode (50) to a temperature sufficient to cause brazing of the first surface of the strob insert (44) to the edge (32a).

Abstract translation: 一种将频闪插入件（144）钎焊到选通圆锯片（10）中的槽（32）的后缘（32a）的方法，所述选通插件（144）具有第一和第二，相对的基本上平行的表面， 将要钎焊到边缘（32a）的选通插入件（144）的第一表面包括以下步骤：将选通插入件（144）放置在电极（50）上，使选通插件（144）的第二表面接触 电极（50）与其传热关系; 将钎焊膏施加到所述插入件（144）的第一表面上; 定位电极（50）使得插入件（144）的第一表面相对于边缘（32a）处于钎焊位置; 并使电流通过所述电极（50）以将所述电极（50）电阻加热到足以使所述选通插入件（44）的所述第一表面钎焊到所述边缘（32a）的温度。

公开(公告)号：WO02009194A1

公开(公告)日：2002-01-31

申请号：PCT/US2001/023572

申请日：2001-07-26

IPC: H01L21/48 ,  H01L21/60 ,  H01L23/498 ,  H05K3/32 ,  H05K3/34 ,  H01L29/82 ,  B23K31/00 ,  B23K31/02 ,  H01L21/44 ,  H01L27/14 ,  H01L29/84

CPC classification number: H05K3/325 ,  H01L21/486 ,  H01L23/49827 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05568 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/1579 ,  H01L2924/19042 ,  H05K3/3436 ,  H05K2201/10378 ,  H01L2924/00015 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: An anisotropically conductive layer "ACL" (50) for mechanical and electrical bonding of two circuit containing structures, such as a flip chip and carrier is disclosed. The ACL is formed of a rigid insulating substrate (72) or membrane (61) with a top and bottom planar surfaces formed with a plurality of pins therein. The pins extend beyond the top and bottom surfaces so that a portion of each pin is exposed. The pins provide electrical connection between contact terminals or pads of the flip chip and carrier and additionally provide mechanical support between the flip chip and carrier so that the flip chip can undergo post-bonding processing without substantial deformation or breaking. A method of electrically and mechanically bonding the flip chip and carrier and a method of making a semiconductor device using the ACL is also disclosed.

Abstract translation: 公开了一种用于诸如倒装芯片和载体的两个电路结构的机械和电气结合的各向异性导电层“ACL”（50）。 ACL由刚性绝缘基板（72）或膜（61）形成，其中顶部和底部平面形成有多个销。 销延伸超过顶表面和底表面，使得每个销的一部分被暴露。 引脚在倒装芯片和载体的接触端子或焊盘之间提供电连接，并且另外在倒装芯片和载体之间提供机械支撑，使得倒装芯片可以进行后接合处理而没有实质的变形或断裂。 还公开了一种电气和机械地结合倒装芯片和载体的方法以及使用该ACL制造半导体器件的方法。

公开(公告)号：WO02006599A1

公开(公告)日：2002-01-24

申请号：PCT/JP2000/004794

申请日：2000-07-17

IPC: B23K31/02 ,  E04B1/24 ,  E04B1/58 ,  F16B7/18

CPC classification number: B23K31/02 ,  B23K2203/14 ,  E04B1/2403 ,  E04B2001/2415 ,  E04B2001/2451 ,  E04B2001/2457

Abstract: A technical field for a joint section, used for on-site joining of titanium structure materials when titanium structure materials (including titanium alloy structure materials, the same in the followings) are used for columns and beams of a building. A stress (load) on a titanium structure material used for a building column and beam is dividedly burdened by a bolt joint and a welding joint so as to downsize a bolt joint structure to an inconspicuous level on one side, and to overcome a difficulty in weld-joining a titanium structure material on the other side to thereby ensure stable quality and strength, whereby a joint section for a hollow titanium structure material, high in quality and joint strength reliability, can be provided.

Abstract translation: 当钛结构材料（包括钛合金结构材料，以下相同）用于建筑物的柱和梁时，用于接合部分的技术领域用于钛结构材料的现场连接。 用于建筑物柱和梁的钛结构材料的应力（载荷）由螺栓接头和焊接接头分开加载，以将螺栓接头结构的尺寸缩小至一侧不显眼的水平，并克服了难度 在另一侧焊接接合钛结构材料，从而确保质量和强度的稳定性，由此可以提供高质量和接合强度可靠性的中空钛结构材料的接合部分。

公开(公告)号：WO01069989A1

公开(公告)日：2001-09-20

申请号：PCT/US2001/007579

申请日：2001-03-09

IPC: H01L21/56 ,  H01L21/60 ,  H01L21/603 ,  H05K1/16 ,  B23K31/02 ,  H05K3/34

CPC classification number: H01L21/563 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/73203 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/83191 ,  H01L2224/83194 ,  H01L2224/92125 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2924/01028 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A method for forming metallurgical interconnections and polymer adhesion of a flip chip (12) to a substrate (16) includes providing a chip (12) having a set of bumps (14) formed on a bumped side (22) thereof and a substrate (16) having a set of interconnect points (18) on a metallization thereon, providing a measured quantity of polymer adhesive (24) in a middle region of the chip (12) on the bump side (22), aligning the chip (12) with the substate (16) so that the set of bumps (14) aligns with the set of interconnect points (18), pressing the chip (12) and the substrate (16) toward one another so that a portion of the polymer adhesive (24) contacts the substrate (16) and the bumps (14) contact the interconnect points (18), and heating the bumps (14) to a temperature sufficiently high to form a metallurgical connection between the bumps (14) and the interconnect (18). Also, a flip chip (12) package is made by the method. In some embodiments the metallurgical connection includes an alloy of gold and tin at the interface between the bumps (14) and the interconnect points (18).

Abstract translation: 一种用于形成倒装芯片（12）与基片（16）的冶金互连和聚合物粘附的方法包括提供一个芯片（12），其具有形成在其凸起侧（22）上的一组凸块（14）和基底 16）在其上的金属化上具有一组互连点（18），在所述突起侧（22）上的所述芯片（12）的中间区域中提供测量量的聚合物粘合剂（24），使所述芯片（12）对准， 与基座（16）一起使得一组凸块（14）与该组互连点（18）对齐，将芯片（12）和基板（16）朝向彼此挤压，使得一部分聚合物粘合剂 24）接触基板（16）并且凸块（14）接触互连点（18），并将凸块（14）加热到足够高的温度，以在凸块（14）和互连件（18）之间形成冶金连接 ）。 此外，通过该方法制造倒装芯片（12）封装。 在一些实施例中，冶金连接包括在凸块（14）和互连点（18）之间的界面处的金和锡的合金。

公开(公告)号：WO01068311A1

公开(公告)日：2001-09-20

申请号：PCT/US2001/007580

申请日：2001-03-09

IPC: B23K20/00 ,  H01L21/60 ,  H01L21/603 ,  H05K3/32 ,  B23K31/02 ,  H05K1/16 ,  H05K3/34

CPC classification number: H01L23/522 ,  H01L21/76838 ,  H01L23/53228 ,  H01L23/53242 ,  H01L24/16 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1411 ,  H01L2224/1601 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/17107 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81345 ,  H01L2224/81385 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/325 ,  Y10T428/24917 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A flip chip structure (10) is formed by mechanically interlocking joining surfaces of a first (12) and a second (14) element. The first element (12), which may be a bump on an integrated circuit chip, includes a soft, deformable material with a low yield strength and high elongation to failure. The surface of the second element (14), which may for example be a substrate pad, is provided with asperities (16) into which the first element (12) deforms plastically under pressure to form the mechanical interlock.

Abstract translation: 通过机械地互锁第一（12）和第二（14）元件的接合表面来形成倒装芯片结构（10）。 可以是集成电路芯片上的凸块的第一元件（12）包括具有低屈服强度和高的失效延伸率的柔软的可变形材料。 第二元件（14）的表面（其可以例如是衬底垫）设置有凹凸（16），第一元件（12）在压力下塑性变形到其中以形成机械互锁。

公开(公告)号：WO01039921A1

公开(公告)日：2001-06-07

申请号：PCT/US1999/028324

申请日：1999-11-30

IPC: B23K13/02 ,  B23K31/02

CPC classification number: B23K13/02 ,  B23K2201/18

Abstract: In high frequency welding apparatus in which high frequency electrical heating current is supplied to metal surfaces (10, 11; 42-49;52, 54) to be welded together by contacts engaging the metal which is advanced toward a weld point (1; 1a-f), the contacts (8-9; 25-26) engage the metal in advance of the weld point (1; 1a-f) and have contact faces with downstream edges (12-30) contacting the metal. The downstream edge of one of the contacts (8 or 9 or 25 or 26), or the downstream edges of the both of the contacts (8-9; 25-26), is or are skewed with respect to the path or paths of the metal surfaces (10-11; 42-49; 52-54) to be heated so that the downstream edge (12 or 13) or edges (12-13) extend at an acute angle of about 35 DEG to about 55 DEG with respect to the path or paths of the metal surface or surfaces (10-11; 42-49; 52-54), the angle being intermediate the contacts (8-9; 25-26) and the weld points (1; 1a-f).

Abstract translation: 在高频电加热电流被供给到金属表面（10,11; 42-49; 52,54）的高频焊接装置中，通过接触金属的触点焊接在一起，该金属是朝着焊接点（1; 1a） -f），所述触头（8-9; 25-26）在所述焊接点（1; 1a-f）之前接合所述金属，并且具有与所述金属接触的下游边缘（12-30）的接触面。 一个触点（8或9或25或26）的下游边缘或两个触点（8-9; 25-26）的下游边缘相对于路径或路径偏斜 待加热的金属表面（10-11; 42-49; 52-54），使得下游边缘（12或13）或边缘（12-13）以大约35°至大约55°的锐角延伸， 相对于金属表面或表面（10-11; 42-49; 52-54）的路径或路径，该角度位于触点（8-9; 25-26）和焊接点（1; 1〜 F）。