公开(公告)号：WO2003001666A1

公开(公告)日：2003-01-03

申请号：PCT/JP2002/006041

申请日：2002-06-18

申请人： 松下電器産業株式会社 ,  池田 和生 ,  西村 和紀 ,  村瀬 恭通

发明人： 池田 和生 ,  西村 和紀 ,  村瀬 恭通

IPC分类号： H03H9/145

CPC分类号： H03H9/6473 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/16195 ,  H03H3/08 ,  H03H9/02913 ,  H03H9/02921 ,  H03H9/059 ,  H03H9/1071 ,  H03H9/25 ,  H03H9/6433 ,  H03H9/6463 ,  H01L2224/05624 ,  H01L2924/00014 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671

摘要： A surface acoustic wave device, wherein comb electrodes (2) and reflector electrodes (3) are surrounded by a plurality of auxiliary electrodes (6a, 6b) electrically independent of each other and having different widths according to the positions thereof, whereby a charge generated by the pyroelectricity of a substrate (1) with a piezoelectricity can be electrically uniformized efficiently.

摘要翻译： 一种表面声波装置，其中梳状电极（2）和反射器电极（3）被多个辅助电极（6a，6b）包围，所述多个辅助电极彼此电独立并且根据其位置具有不同的宽度，从而产生电荷 通过具有压电性的基板（1）的热电性可以有效地电均匀化。

公开(公告)号：WO2002101827A2

公开(公告)日：2002-12-19

申请号：PCT/US2002/017531

申请日：2002-05-30

申请人： XILINX, INC.

发明人： EGHAN, Abu, K. ,  HOANG, Lan, H.

IPC分类号： H01L23/00

CPC分类号： H01L23/4334 ,  H01L23/055 ,  H01L23/10 ,  H01L23/13 ,  H01L23/24 ,  H01L23/49822 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/18161 ,  H01L2224/0401

摘要： The present invention provides an improved semiconductor flipchip package that includes a central cavity area on the first major side for receiving a flipchip die therein. The package substrate is substantially made from a single material that serves as the support and stiffener and provides within the cavity floor all the connecting points for flipchip interconnection to the silicon die. The integral cavity wall serves as a stiffener member of the package and provides the required mechanical stability of the whole arrangement without the need for a separate stiffener material to be adhesively attached. The cavity walls may contain extra routing metallization to create bypass capacitors to enhance electrical performance. The invention discloses optional methods to cover the silicon die to enhance thermal performance of the package.

摘要翻译： 本发明提供了一种改进的半导体倒装芯片封装，其包括在第一主侧上的用于在其中接收倒装芯片裸片的中心腔区。 封装衬底基本上由用作支撑和加强件的单一材料制成，并且在空腔底板内提供所有连接点以用于芯片与硅管芯的互连。 一体的腔壁用作包装的加强件，并提供整个布置所需的机械稳定性，而不需要单独的加强材料粘合地附接。 空腔壁可以包含额外的路线选择性金属化以产生旁路电容器以增强电性能。 本发明公开了覆盖硅片的可选方法以增强封装的热性能。

公开(公告)号：WO02061825A3

公开(公告)日：2002-11-21

申请号：PCT/US0144650

申请日：2001-11-20

申请人： INTEL CORP ,  CHRYSLER GREGORY M ,  WATWE ABHAY A

发明人： CHRYSLER GREGORY M ,  WATWE ABHAY A

IPC分类号： H01L23/02 ,  H01L23/36 ,  H01L23/373 ,  H01L23/433

CPC分类号： H01L23/36 ,  H01L23/3732 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01046 ,  H01L2924/01055 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/00

摘要： To accommodate high power densities associated with high performance integrated circuits, an integrated circuit package includes a heat-dissipating structure in which heat is dissipated from a surface of one or more dice (40) to an integrated heat spreader (IHS) through a high capacity thermal (110) interface formed of diamond, a diamond composite, or graphite. In one embodiment, a diamond layer is grown on the IHS (122). In another embodiment, a diamond layer is separately formed and affixed to the IHS. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.

摘要翻译： 为了适应与高性能集成电路相关联的高功率密度，集成电路封装包括散热结构，其中热量通过高容量从一个或多个骰子（40）的表面散发到集成散热器（IHS） 由金刚石，金刚石复合材料或石墨形成的热（110）界面。 在一个实施例中，在IHS（122）上生长金刚石层。 在另一个实施方案中，分开形成金刚石层并固定在IHS上。 还描述了制造方法以及将包装应用于电子组件和电子系统。

公开(公告)号：WO02043141A1

公开(公告)日：2002-05-30

申请号：PCT/JP2001/010302

申请日：2001-11-27

IPC分类号： B23K35/26 ,  B23K35/30 ,  H01L21/50 ,  H01L23/10

CPC分类号： B23K35/3013 ,  B23K2201/36 ,  H01L21/50 ,  H01L23/10 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16195 ,  H01L2924/166 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A method for hermetic sealing of electronic parts which involves the step of joining a base having a semiconductor element placed thereon and a cap via a solder, wherein the solder comprises Au in an amount of 78 wt % to 79.5 wt % and Sn in the residual amount. It is preferred that the cap is plated with cold and use is made of a solder comprising Au in an amount of 78 wt % to 79 wt % and Sn in the residual amount.

摘要翻译： 一种电子部件的气密密封方法，其特征在于，包括通过焊料将具有半导体元件的基底与盖接合的步骤，其中焊料包含金属量为78重量％〜79.5重量％，余量为Sn 量。 优选的是，盖被冷镀，并且使用包含量为78重量％至79重量％的Au的焊料和剩余量的Sn。

公开(公告)号：WO0226479A2

公开(公告)日：2002-04-04

申请号：PCT/US0130352

申请日：2001-09-26

申请人： INTEL CORP ,  HOULE SABINA ,  CHRYSLER GREGORY ,  KONING PAUL

发明人： HOULE SABINA ,  CHRYSLER GREGORY ,  KONING PAUL

IPC分类号： H01L23/373 ,  B29C70/30 ,  B29C70/22

CPC分类号： H01L21/4882 ,  H01L23/373 ,  H01L23/3733 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/15321 ,  H01L2924/16195 ,  Y10T428/24994 ,  Y10T428/249945 ,  H01L2224/0401

摘要： A heat spreader, comprised of a plurality of carbon fibers oriented in a plurality of directions, with a carbon or metal matrix material dispersed about the fibers, is described. The carbon fibers facilitate the spreading of heat away from the smaller semiconductor device and up to a larger heat removal device, such as a heat sink.

摘要翻译： 描述了由在多个方向上取向的多个碳纤维构成的散热器，其中分布在纤维周围的碳或金属基体材料。 碳纤维有助于将热量从较小的半导体器件扩散到更大的散热装置，例如散热器。

公开(公告)号：WO0223674A2

公开(公告)日：2002-03-21

申请号：PCT/US0126965

申请日：2001-08-29

申请人： XYTRANS INC

发明人： AMMAR DAN F

IPC分类号： H05K3/46 ,  H01L21/60 ,  H01L23/043 ,  H01L23/32 ,  H01L23/34 ,  H01L23/538 ,  H01L23/66 ,  H01L25/16 ,  H01L27/12 ,  H01L29/40 ,  H01Q21/00 ,  H04B1/18 ,  H04B1/38 ,  H05K1/02 ,  H05K1/03 ,  H05K1/16 ,  H05K3/00

CPC分类号： H01L23/66 ,  H01L23/043 ,  H01L23/5383 ,  H01L23/5389 ,  H01L24/29 ,  H01L24/83 ,  H01L25/165 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/83101 ,  H01L2224/83136 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/0237 ,  H05K1/0306 ,  H05K1/162 ,  H05K1/167 ,  H05K3/0058 ,  H05K3/4611 ,  H05K3/4629 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014

摘要： A thick film millimeter wave transceiver module includes a base plate and a multi-layer substrate board having a plurality of layers of low temperature transfer tape received on the base plate. The different layers can vary. They can include a DC signals layer having signal tracks in connection; a ground layer having ground connections; a device layer having capacitors and resistors embedded therein; and a top layer having cut-outs for receiving MMIC chips therein. A solder preform layer is located between the device layer and the top layer for securing any MMIC chips. A channelization plate is received over the multi-layer substrate board and a channel is formed to receive MMIC chips and provide isolation between transmit and receive signals.

摘要翻译： 厚膜毫米波收发器模块包括基板和多层基板，多层基板具有容纳在基板上的多层低温传输带。 不同的层可以有所不同。 它们可以包括具有连接的信号轨道的DC信号层; 具有接地连接的接地层; 其中嵌入有电容器和电阻器的器件层; 以及具有用于在其中接收MMIC芯片的切口的顶层。 焊料预制棒层位于器件层和顶层之间，用于固定任何MMIC芯片。 在多层基板上接收沟道板，形成沟道以接收MMIC芯片并提供发射和接收信号之间的隔离。

公开(公告)号：WO02003499A1

公开(公告)日：2002-01-10

申请号：PCT/JP2001/005102

申请日：2001-06-15

IPC分类号： H01Q1/24 ,  H01Q1/38 ,  H01Q9/04 ,  H01Q21/00 ,  H01Q21/06 ,  H05K1/00 ,  H05K1/02 ,  H01Q13/08 ,  H01L25/04 ,  H05K3/46

CPC分类号： H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/15192 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/19032 ,  H01L2924/19039 ,  H01L2924/30107 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q9/0457 ,  H01Q21/0075 ,  H01Q21/0087 ,  H01Q21/065 ,  H01Q21/068 ,  H05K1/0237 ,  H05K1/0298 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： First to third dielectric layers (201-203) are deposited to form a multilayered dielectric substrate (220). A plurality of conductor patches (204a-204d) are formed on the surface of the first dielectric layer (201). An antenna-feeding microstrip line (205) is formed between the first and second dielectric layers. A ground layer (206) is formed between the second and third dielectric layers (202, 203). Microstrip lines (208a, 208b) for high-frequency circuits are formed on the back of the third dielectric layer (203). The ground layer (206) has a slot (207) though which the antenna-feeding microstrip line (205) and the high-frequency microstrip line (208a) are coupled electromagnetically. Thus, the efficiency and directivity of an antenna are improved.

摘要翻译： 沉积第一至第三介电层（201-203）以形成多层电介质基板（220）。 多个导体贴片（204a-204d）形成在第一介电层（201）的表面上。 在第一和第二电介质层之间形成天线馈送微带线（205）。 在第二和第三电介质层（202,203）之间形成接地层（206）。 用于高频电路的微带线（208a，208b）形成在第三介电层（203）的背面。 接地层（206）具有槽（207），天线馈送微带线路（205）和高频微带线路（208a）电磁耦合。 因此，提高了天线的效率和方向性。

公开(公告)号：WO01033638A1

公开(公告)日：2001-05-10

申请号：PCT/FR2000/003023

申请日：2000-10-30

IPC分类号： H01L27/14 ,  H01L25/16 ,  H01L31/02 ,  H01L31/0203

CPC分类号： H01L31/0203 ,  H01L25/167 ,  H01L2224/05553 ,  H01L2224/48247 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00012

摘要： The invention concerns a method for making an optical semiconductor housing and an optical semiconductor housing, wherein the front face of a first semiconductor component (4) such as microprocessor is fixed on a rear face of an electrical connection support plate (30), first electrical connection means (7) connect said first component to said support plate, the rear face of a second semiconductor component (19) is borne by said support plate, its front face comprising an optical sensor (21), second electrical connection means (22) connect said optical component to said support plate, said first component (4) is encapsulated in a coating block (15), an encapsulating wall projecting (17) on the front face of said support plate defines a cavity (18) at the bottom of which is arranged said optical component (19), a cover is fixed on the front end of said projecting wall and at least partly transparent, and external electrical connection means (28) arranged on an exposed part of said support plate.

摘要翻译： 本发明涉及一种制造光学半导体外壳和光学半导体外壳的方法，其中诸如微处理器的第一半导体部件（4）的前表面固定在电连接支撑板（30）的后表面上，第一电 连接装置（7）将所述第一部件连接到所述支撑板，第二半导体部件（19）的后表面由所述支撑板承载，其前表面包括光学传感器（21），第二电气连接装置（22） 将所述光学部件连接到所述支撑板，所述第一部件（4）被封装在涂覆块（15）中，在所述支撑板的前表面上突出（17）的封装壁限定了位于所述支撑板底部的空腔（18） 其布置在所述光学部件（19）上，盖固定在所述突出壁的前端并且至少部分透明，并且外部电连接装置（28）布置在所述支架的暴露部分 rt板。

公开(公告)号：WO01029903A1

公开(公告)日：2001-04-26

申请号：PCT/EP2000/009931

申请日：2000-10-09

IPC分类号： H01L27/14 ,  H01L31/0203 ,  H01L31/0216 ,  H04N5/335

CPC分类号： H01L31/0203 ,  H01L31/02164 ,  H01L2224/48091 ,  H01L2924/16195 ,  H01L2924/00014

摘要： The invention relates to a solid-state imaging device (1) which is encapsulated in a ceramic package covered by a transparent window (6) comprising a phosphorus-containing glass. The window is provided with a coating (8), for example of chromium, at the circumference of the window to counteract degradation of the joint between the window and the ceramic package, which degradation results from the sensitivity of phosphorus glass to moisture. The use of phosphorus glass has the advantage that it is opaque to infrared radiation, so that the application of a separate coating serving as an IR filter is avoided and hence the dependence of the sensitivity of the imaging device on the angle of incidence of the radiation to be detected.

摘要翻译： 本发明涉及一种固态成像装置（1），其被封装在由包含含磷玻璃的透明窗（6）覆盖的陶瓷封装中。 窗口在窗口的周边处设置有例如铬的涂层（8），以抵消窗和陶瓷封装之间的接合的劣化，这种劣化是由磷玻璃对水分的敏感性引起的。 磷玻璃的使用具有对红外辐射不透明的优点，因此避免了用作IR滤光器的单独涂层的应用，因此成像器件的灵敏度对辐射入射角的依赖性 被检测。

公开(公告)号：WO01024252A1

公开(公告)日：2001-04-05

申请号：PCT/JP2000/006646

申请日：2000-09-27

IPC分类号： H01L21/50 ,  H01L21/60 ,  H01L23/057 ,  H01L23/13 ,  H01L23/552 ,  H03H9/25 ,  H01L21/301 ,  H01L23/12

CPC分类号： H01L24/80 ,  H01L21/50 ,  H01L23/057 ,  H01L23/13 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83136 ,  H01L2224/8547 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15787 ,  H01L2924/1617 ,  H01L2924/16195 ,  H01L2924/3025 ,  H03H9/1071 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： An electronic device comprises a case with steps on its inner wall, in which components are accurately mounted in place. A package (13) has an inner wall with steps (26), on which inner connection electrodes (14) are formed. The bottom of the package (13) is provided with a shield electrode (15), on which a component (17) is fixed with an adhesive layer (16). The component (17) and the inner connection electrodes (14) are connected through wires (19) electrically. Any of the component (17) and the wire (19) is positioned and fixed a predetermined position with respect to areas (18a, 18b) on the bottom of the package (13) where no electrode exists.

摘要翻译： 电子设备包括在其内壁上具有台阶的壳体，其中部件被精确地安装就位。 封装（13）具有带有台阶（26）的内壁，在其上形成有内部连接电极（14）。 封装（13）的底部设有屏蔽电极（15），组件（17）用粘合剂层（16）固定在该屏蔽电极上。 部件（17）和内部连接电极（14）通过电线（19）电连接。 组件（17）和电线（19）中的任一个相对于没有电极存在的封装（13）的底部上的区域（18a，18b）定位和固定预定位置。