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公开(公告)号：CN105210157A
公开(公告)日：2015-12-30
申请号：CN201480021985.4
申请日：2014-09-12
申请人： 积水化学工业株式会社
CPC分类号： H01R13/03 , H01B1/22 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/04026 , H01L2224/05611 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/0568 , H01L2224/05684 , H01L2224/2732 , H01L2224/29082 , H01L2224/2919 , H01L2224/2929 , H01L2224/29294 , H01L2224/29338 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29366 , H01L2224/29386 , H01L2224/29387 , H01L2224/2939 , H01L2224/29393 , H01L2224/29401 , H01L2224/29409 , H01L2224/29411 , H01L2224/29413 , H01L2224/29416 , H01L2224/29417 , H01L2224/29418 , H01L2224/2942 , H01L2224/29424 , H01L2224/29439 , H01L2224/29444 , H01L2224/29447 , H01L2224/29455 , H01L2224/29457 , H01L2224/29464 , H01L2224/29466 , H01L2224/29469 , H01L2224/29471 , H01L2224/29486 , H01L2224/29487 , H01L2224/2949 , H01L2224/29493 , H01L2224/29499 , H01L2224/32227 , H01L2224/83101 , H01L2224/83203 , H01L2224/83411 , H01L2224/83424 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/8348 , H01L2224/83484 , H01L2224/83851 , H01L2224/83855 , H01L2224/83862 , H01L2224/83877 , H01L2924/15788 , H01R4/04 , H05K3/323 , H05K3/361 , H05K2201/0218 , H05K2201/0221 , H01L2924/00 , H01L2924/00014 , H01L2924/05442 , H01L2924/05432 , H01L2924/05342 , H01L2924/0549 , H01L2924/0532 , H01L2924/01056 , H01L2924/0534 , H01L2924/01022 , H01L2924/01006 , H01L2924/01014 , H01L2924/01032 , H01L2924/01048 , H01L2924/0543 , H01L2924/01049 , H01L2924/0544 , H01L2924/0105 , H01L2924/01015 , H01L2924/01005 , H01L2924/0781 , H01L2924/04563 , H01L2924/01082 , H01L2924/01047 , H01L2924/01029 , H01L2924/00012
摘要： 本发明提供一种导电性粒子，其对电极间进行电连接的情况下，可以降低连接电阻。本发明的导电性粒子1具备：基材粒子2、配置于基材粒子2表面上的导电部3，导电部3在外表面上具有多个突起3a，导电部3具有晶体结构，在导电部3的具有突起3a的部分和不具有突起3a的部分，晶体结构是连续的。
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公开(公告)号：CN104471650A
公开(公告)日：2015-03-25
申请号：CN201380037610.2
申请日：2013-09-30
申请人： 积水化学工业株式会社
发明人： 西冈敬三
CPC分类号： H01B1/02 , B22F1/025 , H01B1/04 , H01B1/22 , H01B1/24 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/04026 , H01L2224/05187 , H01L2224/05611 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/0568 , H01L2224/05684 , H01L2224/271 , H01L2224/2731 , H01L2224/2732 , H01L2224/27334 , H01L2224/2929 , H01L2224/29338 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29366 , H01L2224/29387 , H01L2224/2939 , H01L2224/29393 , H01L2224/29399 , H01L2224/294 , H01L2224/29401 , H01L2224/29409 , H01L2224/29411 , H01L2224/29413 , H01L2224/29414 , H01L2224/29416 , H01L2224/29417 , H01L2224/29418 , H01L2224/2942 , H01L2224/29424 , H01L2224/29438 , H01L2224/29439 , H01L2224/29444 , H01L2224/29447 , H01L2224/29455 , H01L2224/29457 , H01L2224/2946 , H01L2224/29464 , H01L2224/29466 , H01L2224/29469 , H01L2224/29471 , H01L2224/2948 , H01L2224/29484 , H01L2224/29487 , H01L2224/2949 , H01L2224/29499 , H01L2224/32227 , H01L2224/8301 , H01L2224/83022 , H01L2224/83192 , H01L2224/83203 , H01L2224/83851 , H01L2924/15788 , H01L2924/30101 , H01L2924/365 , H01R11/01 , H01R13/03 , H05K3/323 , H05K3/361 , H05K2201/0221 , H01L2924/00012 , H01L2924/05442 , H01L2924/01006 , H01L2924/00014 , H01L2924/01014 , H01L2924/01032 , H01L2924/01048 , H01L2924/0543 , H01L2924/01049 , H01L2924/0105 , H01L2924/014 , H01L2924/01015 , H01L2924/01005 , H01L2924/04563 , H01L2924/04541 , H01L2924/0455 , H01L2924/01073 , H01L2924/01013 , H01L2924/01031 , H01L2924/00
摘要： 本发明提供一种在对电极间进行了连接的情况下可以使连接电阻降低的导电性粒子、以及使用了该导电性粒子的导电材料。本发明的导电性粒子1具备基体材料粒子2、以及在基体材料粒子2的表面上的一部分区域配置的导电材料4，且导电材料4的材质为莫氏硬度高于镍的材质。
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公开(公告)号：CN105405824B
公开(公告)日：2018-05-22
申请号：CN201510554070.6
申请日：2015-09-02
申请人： 英飞凌科技股份有限公司
发明人： F.克勒纳
IPC分类号： H01L23/488 , H01L23/495 , H01L21/58
CPC分类号： H01L24/29 , B23K1/0016 , B23K35/0233 , B23K35/0238 , B23K35/0244 , B23K35/302 , B23K35/32 , B23K35/36 , B23K2101/40 , B23K2103/172 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/27 , H01L24/32 , H01L24/83 , H01L2224/03462 , H01L2224/04026 , H01L2224/05647 , H01L2224/05747 , H01L2224/05893 , H01L2224/06181 , H01L2224/271 , H01L2224/2711 , H01L2224/2712 , H01L2224/27442 , H01L2224/2746 , H01L2224/276 , H01L2224/2908 , H01L2224/29082 , H01L2224/29083 , H01L2224/29111 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29157 , H01L2224/29193 , H01L2224/29247 , H01L2224/29271 , H01L2224/29393 , H01L2224/29447 , H01L2224/29471 , H01L2224/32013 , H01L2224/32014 , H01L2224/32057 , H01L2224/32058 , H01L2224/32245 , H01L2224/831 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83447 , H01L2224/83693 , H01L2224/8382 , H01L2224/83825 , H01L2924/0105 , H01L2924/0132 , H01L2924/014 , H01L2924/2064 , H01L2924/20641 , H01L2924/20642 , H01L2924/20643 , H01L2924/20644 , H01L2924/351 , H01L2924/00014 , H01L2924/01006 , H01L2924/00012
摘要： 本发明涉及预制结构及其形成方法、和焊接半导体芯片布置的方法。用于焊接半导体芯片布置的预制结构包括碳纤维复合片以及在碳纤维复合片之上形成的焊料层。
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公开(公告)号：CN105210157B
公开(公告)日：2017-05-31
申请号：CN201480021985.4
申请日：2014-09-12
申请人： 积水化学工业株式会社
CPC分类号： H01R13/03 , H01B1/22 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/04026 , H01L2224/05611 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/0568 , H01L2224/05684 , H01L2224/2732 , H01L2224/29082 , H01L2224/2919 , H01L2224/2929 , H01L2224/29294 , H01L2224/29338 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29366 , H01L2224/29386 , H01L2224/29387 , H01L2224/2939 , H01L2224/29393 , H01L2224/29401 , H01L2224/29409 , H01L2224/29411 , H01L2224/29413 , H01L2224/29416 , H01L2224/29417 , H01L2224/29418 , H01L2224/2942 , H01L2224/29424 , H01L2224/29439 , H01L2224/29444 , H01L2224/29447 , H01L2224/29455 , H01L2224/29457 , H01L2224/29464 , H01L2224/29466 , H01L2224/29469 , H01L2224/29471 , H01L2224/29486 , H01L2224/29487 , H01L2224/2949 , H01L2224/29493 , H01L2224/29499 , H01L2224/32227 , H01L2224/83101 , H01L2224/83203 , H01L2224/83411 , H01L2224/83424 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/8348 , H01L2224/83484 , H01L2224/83851 , H01L2224/83855 , H01L2224/83862 , H01L2224/83877 , H01L2924/15788 , H01R4/04 , H05K3/323 , H05K3/361 , H05K2201/0218 , H05K2201/0221 , H01L2924/00 , H01L2924/00014 , H01L2924/05442 , H01L2924/05432 , H01L2924/05342 , H01L2924/0549 , H01L2924/0532 , H01L2924/01056 , H01L2924/0534 , H01L2924/01022 , H01L2924/01006 , H01L2924/01014 , H01L2924/01032 , H01L2924/01048 , H01L2924/0543 , H01L2924/01049 , H01L2924/0544 , H01L2924/0105 , H01L2924/01015 , H01L2924/01005 , H01L2924/0781 , H01L2924/04563 , H01L2924/01082 , H01L2924/01047 , H01L2924/01029 , H01L2924/00012
摘要： 本发明提供一种导电性粒子，其对电极间进行电连接的情况下，可以降低连接电阻。本发明的导电性粒子1具备：基材粒子2、配置于基材粒子2表面上的导电部3，导电部3在外表面上具有多个突起3a，导电部3具有晶体结构，在导电部3的具有突起3a的部分和不具有突起3a的部分，晶体结构是连续的。
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公开(公告)号：CN104025273B
公开(公告)日：2016-12-21
申请号：CN201280054633.X
申请日：2012-10-31
申请人： 迪睿合电子材料有限公司
发明人： 斋藤崇之
IPC分类号： H01L21/60
CPC分类号： H01L24/742 , H01L21/563 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/97 , H01L25/50 , H01L2224/16145 , H01L2224/16225 , H01L2224/16238 , H01L2224/27003 , H01L2224/27334 , H01L2224/2919 , H01L2224/2929 , H01L2224/29311 , H01L2224/29316 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29357 , H01L2224/2936 , H01L2224/29371 , H01L2224/29386 , H01L2224/29388 , H01L2224/2939 , H01L2224/29411 , H01L2224/29416 , H01L2224/29424 , H01L2224/29439 , H01L2224/29444 , H01L2224/29447 , H01L2224/29455 , H01L2224/29457 , H01L2224/2946 , H01L2224/29471 , H01L2224/29486 , H01L2224/2949 , H01L2224/32145 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/75252 , H01L2224/75301 , H01L2224/75315 , H01L2224/7598 , H01L2224/81 , H01L2224/81193 , H01L2224/81203 , H01L2224/81903 , H01L2224/83101 , H01L2224/83192 , H01L2224/83203 , H01L2224/8385 , H01L2224/83851 , H01L2224/83862 , H01L2224/97 , H01L2225/06513 , H01L2225/06541 , H01L2225/06565 , H01L2924/01029 , H01L2924/07802 , H01L2924/07811 , H01L2924/3512 , H01L2924/00014 , H01L2924/00012 , H01L2924/0665 , H01L2924/053 , H01L2924/00 , H01L2224/83 , H01L2924/069 , H01L2924/0635
摘要： 防止电子部件的破裂。具有：载放部（5），载放与热固化性的粘接剂层（6）层叠的电子部件2、12）；加热按压头（7），对电子部件（2、12）进行加热按压；第1弹性体（8），配置于电子部件（2、12）与加热按压头（7）的按压面（7a）之间，对电子部件（2、12）的上表面进行按压；以及支撑构件9），配置于电子部件（2、12）的周围，并且支撑第1弹性体。
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公开(公告)号：CN105473257A
公开(公告)日：2016-04-06
申请号：CN201480045035.5
申请日：2014-07-09
申请人： 汉高知识产权控股有限责任公司
CPC分类号： B23K35/3006 , B22F1/0025 , B22F1/0059 , B22F3/10 , B22F3/1003 , B22F3/1035 , B22F3/23 , B22F7/08 , B23K35/0233 , B23K35/262 , B23K35/302 , B23K35/3066 , B23K35/362 , B82Y30/00 , C22C1/0491 , C22C5/06 , C22C9/00 , C22C13/00 , C22C26/00 , C22C38/002 , C22C38/02 , C22C38/04 , C22C38/06 , C22C38/52 , C22C49/12 , C22C2026/002 , C23C24/106 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2224/2711 , H01L2224/2929 , H01L2224/29309 , H01L2224/29311 , H01L2224/29313 , H01L2224/29318 , H01L2224/2932 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29349 , H01L2224/29355 , H01L2224/29357 , H01L2224/2936 , H01L2224/29364 , H01L2224/29369 , H01L2224/29371 , H01L2224/29372 , H01L2224/2938 , H01L2224/29384 , H01L2224/29386 , H01L2224/29393 , H01L2224/29409 , H01L2224/29411 , H01L2224/29413 , H01L2224/29418 , H01L2224/2942 , H01L2224/29424 , H01L2224/29439 , H01L2224/29447 , H01L2224/29449 , H01L2224/29455 , H01L2224/29457 , H01L2224/2946 , H01L2224/29464 , H01L2224/29469 , H01L2224/29471 , H01L2224/29472 , H01L2224/2948 , H01L2224/29484 , H01L2224/29499 , H01L2224/32225 , H01L2224/83101 , H01L2224/83192 , H01L2224/83825 , H01L2224/8384
摘要： 任选地使用固体或半固体有机粘合剂制备包含一种或多种金属、一种或多种金属合金、或一种或多种金属和一种或多种金属合金的混合物的烧结膜。该有机粘合剂可以具有助熔官能团；该有机粘合剂可以为在组合物中的金属或金属合金烧结时会部分或完全分解的有机粘合剂。在一个实施方式中，该烧结膜被提供于最终用途基材上，例如硅芯片或晶圆、或金属电路板或箔，或该烧结膜被提供于载体上，例如金属网。制备是通过以下完成的：在有或没有粘合剂情况下，在合适的溶剂中分散金属或金属合金，并且将该组合物暴露于高温下以蒸发掉该溶剂以及部分地烧结该金属或金属合金。
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公开(公告)号：CN105405824A
公开(公告)日：2016-03-16
申请号：CN201510554070.6
申请日：2015-09-02
申请人： 英飞凌科技股份有限公司
发明人： F.克勒纳
IPC分类号： H01L23/488 , H01L23/495 , H01L21/58
CPC分类号： H01L24/29 , B23K1/0016 , B23K35/0233 , B23K35/0238 , B23K35/0244 , B23K35/302 , B23K35/32 , B23K35/36 , B23K2101/40 , B23K2103/172 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/27 , H01L24/32 , H01L24/83 , H01L2224/03462 , H01L2224/04026 , H01L2224/05647 , H01L2224/05747 , H01L2224/05893 , H01L2224/06181 , H01L2224/271 , H01L2224/2711 , H01L2224/2712 , H01L2224/27442 , H01L2224/2746 , H01L2224/276 , H01L2224/2908 , H01L2224/29082 , H01L2224/29083 , H01L2224/29111 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29157 , H01L2224/29193 , H01L2224/29247 , H01L2224/29271 , H01L2224/29393 , H01L2224/29447 , H01L2224/29471 , H01L2224/32013 , H01L2224/32014 , H01L2224/32057 , H01L2224/32058 , H01L2224/32245 , H01L2224/831 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83447 , H01L2224/83693 , H01L2224/8382 , H01L2224/83825 , H01L2924/0105 , H01L2924/0132 , H01L2924/014 , H01L2924/2064 , H01L2924/20641 , H01L2924/20642 , H01L2924/20643 , H01L2924/20644 , H01L2924/351 , H01L2924/00014 , H01L2924/01006 , H01L2924/00012
摘要： 本发明涉及预制结构及其形成方法、和焊接半导体芯片布置的方法。用于焊接半导体芯片布置的预制结构包括碳纤维复合片以及在碳纤维复合片之上形成的焊料层。
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公开(公告)号：CN104025273A
公开(公告)日：2014-09-03
申请号：CN201280054633.X
申请日：2012-10-31
申请人： 迪睿合电子材料有限公司
发明人： 斋藤崇之
IPC分类号： H01L21/60
CPC分类号： H01L24/742 , H01L21/563 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/97 , H01L25/50 , H01L2224/16145 , H01L2224/16225 , H01L2224/16238 , H01L2224/27003 , H01L2224/27334 , H01L2224/2919 , H01L2224/2929 , H01L2224/29311 , H01L2224/29316 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29357 , H01L2224/2936 , H01L2224/29371 , H01L2224/29386 , H01L2224/29388 , H01L2224/2939 , H01L2224/29411 , H01L2224/29416 , H01L2224/29424 , H01L2224/29439 , H01L2224/29444 , H01L2224/29447 , H01L2224/29455 , H01L2224/29457 , H01L2224/2946 , H01L2224/29471 , H01L2224/29486 , H01L2224/2949 , H01L2224/32145 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/75252 , H01L2224/75301 , H01L2224/75315 , H01L2224/7598 , H01L2224/81 , H01L2224/81193 , H01L2224/81203 , H01L2224/81903 , H01L2224/83101 , H01L2224/83192 , H01L2224/83203 , H01L2224/8385 , H01L2224/83851 , H01L2224/83862 , H01L2224/97 , H01L2225/06513 , H01L2225/06541 , H01L2225/06565 , H01L2924/01029 , H01L2924/07802 , H01L2924/07811 , H01L2924/3512 , H01L2924/00014 , H01L2924/00012 , H01L2924/0665 , H01L2924/053 , H01L2924/00 , H01L2224/83 , H01L2924/069 , H01L2924/0635
摘要： 防止电子部件的破裂。具有：载放部（5），载放与热固化性的粘接剂层（6）层叠的电子部件（2、12）；加热按压头（7），对电子部件（2、12）进行加热按压；第1弹性体（8），配置于电子部件（2、12）与加热按压头（7）的按压面（7a）之间，对电子部件（2、12）的上表面进行按压；以及支撑构件（9），配置于电子部件（2、12）的周围，并且支撑第1弹性体。
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