公开(公告)号：EP0657932A2

公开(公告)日：1995-06-14

申请号：EP94119486.2

申请日：1994-12-09

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Tomura, Yoshihiro ,  Bessho, Yoshihiro ,  Hakotani, Yasuhiko

IPC: H01L23/498 ,  H01L21/48

CPC classification number: H05K3/4007 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/351 ,  H05K1/181 ,  H05K3/243 ,  H05K3/321 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/09845 ,  H05K2201/10568 ,  H05K2201/10719 ,  H05K2201/10984 ,  H05K2203/0577 ,  H05K2203/167 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

Abstract: A chip carrier according to the present invention includes: a carrier body including an upper face, a lower face, and an internal conductor; and a plurality of terminal electrodes formed on the upper face of the carrier body, the plurality of terminal electrodes electrically connecting an LSI chip to the internal conductor. A plurality of concave portions for electrically connecting a plurality of electrodes on a circuit substrate to the internal conductor are provided on the lower face of the carrier body, the concave portions being electrically connected to the internal conductor.

Abstract translation: 根据本发明的芯片载体包括：载体，其包括上表面，下表面和内导体; 以及形成在所述载体主体的上表面上的多个端子电极，所述多个端子电极将LSI芯片电连接到所述内部导体。 用于将电路基板上的多个电极电连接到内部导体的多个凹部设置在载体主体的下表面上，凹部电连接到内部导体。

公开(公告)号：EP0641153A1

公开(公告)日：1995-03-01

申请号：EP94306220.8

申请日：1994-08-23

Applicant: POLY-FLEX CIRCUITS, INC.

Inventor： Durand, David ,  Iannetta, Roger A., Jr.

IPC: H05K3/10 ,  H05K3/32 ,  H01L21/60

CPC classification number: H01L24/83 ,  C08L2666/54 ,  C09J163/00 ,  H01B1/22 ,  H01L21/4867 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/13111 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29399 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/3025 ,  H01R4/04 ,  H05K1/095 ,  H05K1/181 ,  H05K3/0023 ,  H05K3/107 ,  H05K3/1258 ,  H05K3/28 ,  H05K3/321 ,  H05K2201/0125 ,  H05K2201/0218 ,  H05K2201/023 ,  H05K2201/0245 ,  H05K2201/0272 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2203/0307 ,  H05K2203/0568 ,  H05K2203/1105 ,  H05K2203/1453 ,  Y10T29/49144 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A method of making a planar, subsurface electronic circuit having at least one electronic circuit component assembled therewith comprises forming three dimensional, essentially square channels (14) interspersed with lands within a dielectric material (12) on a substrate (10). The channels are then filled in one pass with a curable polymeric material (16) containing a conductive metal filler so that the upper surfaces of the circuit trace formed by this conductive material are at essentially the same level as the upper surface of the lands. Circuit components (20) are placed to engage the conductive material. The curable material is then cured after placing the electronic component(s).

Abstract translation: 一种制造平面的方法，具有包括形成在基底（10）上的介电材料（12）内与土地穿插三维的，实质上方形通道（14）组装有至少一个电子电路元件地下电子电路。 然后，信道被填充在一个道次与含有导电性金属填料的可固化聚合物材料（16）所以没有由该导电材料形成的电路迹线的上表面是在基本上相同的水平为土地的上表面上。 电路部件（20）被放置成接合导电材料。 然后，将可固化材料放置电子元件（一个或多个）之后固化。

公开(公告)号：EP0613590A4

公开(公告)日：1994-10-12

申请号：EP93900582

申请日：1992-11-20

Applicant: CLEMENTS JAMES R

Inventor： CLEMENTS JAMES R

IPC: H01L21/60 ,  H01L23/482 ,  H01L23/498 ,  H01L29/06 ,  H01R4/04 ,  H05K3/32

CPC classification number: H01L24/31 ,  H01L23/4828 ,  H01L23/49883 ,  H01L24/29 ,  H01L24/83 ,  H01L29/0657 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83141 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10157 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01R4/04 ,  H05K3/323 ,  H05K2201/0367 ,  H05K2201/09472 ,  H05K2201/10674 ,  H05K2203/0278 ,  Y10T29/4913 ,  H01L2924/00

Abstract: An electronic device (10) is made by a method of connecting a circuit member (18) to a substrate (12). The circuit member has a discontinuous passivating layer (20) with recesses therein establishing electrical contacts. The member is connected to a mounting surface (14) of a substrate having conductive paths (16). An adhesive (26) including a resin with spaced conductive metal particles suspended therein is applied over the conductive paths. The distance between electrical contacts (22) and the conductive paths is decreased to provide electrical conduction through the adhesive, while maintaining the adhesive between conductive paths non-conductive. The conductive paths may have established thereon raised or protruding contact surfaces (24) over a portion thereof. The member is mounted on the adhesive while vertically aligning the contacts over preselected protruding contact surfaces. Pressure is applied to concentrate the conductive metal particles between the contacts and conductive paths allowing conduction therethrough.

公开(公告)号：EP0369919B1

公开(公告)日：1994-05-11

申请号：EP89480159.6

申请日：1989-10-10

Applicant: International Business Machines Corporation

Inventor： Christiansen, Robert Arnold ,  DiGirolamo, Joel Alan

IPC: H05K3/32 ,  H05K1/18 ,  H05K3/40

CPC classification number: H01L24/48 ,  H01L24/45 ,  H01L24/49 ,  H01L25/16 ,  H01L2223/6611 ,  H01L2224/05647 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48472 ,  H01L2224/48747 ,  H01L2224/49111 ,  H01L2224/78313 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/19107 ,  H05K1/0203 ,  H05K1/0393 ,  H05K1/112 ,  H05K3/222 ,  H05K3/328 ,  H05K2201/0154 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/096 ,  H05K2201/10363 ,  H05K2201/10477 ,  H05K2201/10553 ,  H05K2203/0285 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/00

公开(公告)号：EP0367933B1

公开(公告)日：1994-01-12

申请号：EP89116269.5

申请日：1989-09-04

Applicant: International Business Machines Corporation

Inventor： Albrechta, Stanley Michael ,  Burns, Francis Charles ,  Carden, Gary Richard ,  Chen, William Tze-You ,  Gresko, Andrew Richard ,  Skarvinko, Eugene Peter ,  Kaufman, John Julian ,  Tonsi, Nadia

IPC: H05K1/05 ,  H05K3/00

CPC classification number: H05K1/056 ,  H05K1/112 ,  H05K1/118 ,  H05K3/002 ,  H05K3/388 ,  H05K2201/0154 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2203/0723 ,  H05K2203/107

公开(公告)号：EP0358232A3

公开(公告)日：1992-01-08

申请号：EP89116680.3

申请日：1989-09-08

Applicant: PHILLIPS PETROLEUM COMPANY

Inventor： Thorsrud, Agmund Kristian

IPC: C08K5/43 ,  B29C35/10 ,  C08L0/00

CPC classification number: B29C44/34 ,  B29B13/02 ,  B29C35/08 ,  B29C35/12 ,  B29C43/52 ,  C08K5/43 ,  H05K3/3447 ,  H05K3/3468 ,  H05K2201/09472 ,  H05K2201/10704 ,  H05K2203/0455 ,  Y10S264/05

Abstract: Improved methods of preparing molded thermoplastic articles are provided. The methods are basically comprised of the steps of admixing a radio frequency energy sensitizing agent comprised of N-ethyl toluenesulfonamide with a thermoplastic polymer, applying radio frequency energy to the mixture formed for a time sufficient to produce a moldable consistency in the mixture, and then compression molding the mixture to produce a molded article therefrom.

公开(公告)号：EP0439546A1

公开(公告)日：1991-08-07

申请号：EP89912626

申请日：1989-10-20

Applicant: SIEMENS AG

Inventor： MUELLER SVEN-HEIKO ,  SPREITZER WILHELM

IPC: H05K3/34

CPC classification number: H05K3/3484 ,  H05K3/3421 ,  H05K3/3452 ,  H05K2201/09118 ,  H05K2201/09472 ,  H05K2201/09909 ,  H05K2201/10689 ,  H05K2203/0191 ,  H05K2203/0568 ,  H05K2203/166 ,  Y02P70/613

Abstract: Selon un procédé de soudage des connexions de composants (3) pour montage en surface sur une carte de circuits imprimés (1), on forme sur la carte de circuits imprimés (1) une structure en surface telle que des dépressions sont situées aux endroits où les connexions doivent être soudées. Les composants (3) pour montage en surface sont posés avec leurs connexions (31) dans les dépressions remplies de soudure.

公开(公告)号：EP0426665A1

公开(公告)日：1991-05-15

申请号：EP88908896.0

申请日：1988-09-02

Applicant: WESTINGHOUSE ELECTRIC CORPORATION

Inventor： KING, David, R. ,  LEE, Mark, S. ,  DECKER, Richard, W.

IPC: H05K1 ,  H05K3

CPC classification number: H05K3/4647 ,  H05K1/112 ,  H05K3/205 ,  H05K3/243 ,  H05K3/28 ,  H05K3/4007 ,  H05K3/423 ,  H05K3/4614 ,  H05K3/4652 ,  H05K3/4658 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/09563 ,  H05K2203/0152 ,  H05K2203/061 ,  H05K2203/063 ,  H05K2203/0726 ,  H05K2203/0733

Abstract: Le procédé décrit consiste, dans une première étape, à fabriquer un premier panneau de carte (10) possédant une première configuration de circuit (15) électroconducteur en relief, partant d'une couche de base (14) de matériau conducteur, et une deuxième configuration de circuit (20) électroconducteur en relief, partant de la première configuration de circuit (15). On fabrique ensuite un deuxième panneau de carte (30) présentant une troisième configuration de circuit (35) électroconducteur en relief, qui part d'une autre couche de base (34) de matériau conducteur. Le premier panneau de carte (10) est stratifié sur le deuxième panneau de carte (30), un matériau isolant (40) étant disposé entre les deux pour isoler électriquement la première configuration de circuit (15) de la troisième configuration de circuit (35), la deuxième configuration de circuit (20) étant en contact électrique avec la première configuration de circuit (15) à des emplacements choisis de celui-ci. Pour finir, les couches de base (14, 34) de matériau conducteur sont ôtées du matériau isolant stratifié (40).

公开(公告)号：EP0358332A2

公开(公告)日：1990-03-14

申请号：EP89308027.5

申请日：1989-08-07

Applicant: NORTHERN TELECOM LIMITED

Inventor： Hagner, George R.

IPC: H05K1/00 ,  H05K3/34

CPC classification number: H05K3/3468 ,  H05K1/114 ,  H05K1/116 ,  H05K1/141 ,  H05K3/107 ,  H05K3/184 ,  H05K3/3415 ,  H05K3/3447 ,  H05K3/368 ,  H05K3/426 ,  H05K2201/049 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2201/09472 ,  H05K2201/09845 ,  H05K2201/09981 ,  H05K2201/10303 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2203/0455 ,  Y02P70/613

Abstract: Circuit boards that permit wave soldering of both leaded and surface mounted components to a common side. The circuit board carries plated grooves to provide inter­connections between the components to be mounted to the board. For leaded components on the circuit board, holes are provided extending completely through the board, and the leaded components are mounted and soldered in a conventional fashion. For surface mounted (or leadless) components, small recesses or grooves are provided to accept the terminals of the components themselves. The grooves are plated with an electrically conductive material, and contain a hole that passes from the upper surface to the bottom surface of the circuit board. When the circuit board is wave soldered, in a conventional manner, solder from the wave soldering process engages the holes, passes through the holes to the upper surface of the circuit board, and then runs along the grooves in the upper surface of the circuit board. Upon solidifying, the solder provides an electrical connection between the components.

Abstract translation: 允许将铅和表面安装的组件波形焊接到公共侧的电路板。 电路板带有电镀槽，以在要安装到电路板的组件之间提供互连。 对于电路板上的引线元件，提供完全延伸穿过电路板的孔，并且有铅元件以常规方式安装和焊接。 对于表面安装（或无引线）部件，提供小的凹槽或凹槽来接纳部件本身的端子。 凹槽用导电材料镀覆，并且包含从电路板的上表面延伸到底表面的孔。 当电路板被波焊时，以常规的方式，焊接波形焊接工艺与孔接合，穿过孔到电路板的上表面，然后沿着电路板的上表面的槽延伸 。 在固化时，焊料在组件之间提供电连接。

公开(公告)号：EP0285820A2

公开(公告)日：1988-10-12

申请号：EP88103369.0

申请日：1988-03-04

Applicant: International Business Machines Corporation

Inventor： Lamey, Patrick J. ,  Peterman, Steven L.

IPC: H01L23/48 ,  H01L23/54

CPC classification number: H01L24/06 ,  H01L23/544 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2224/0401 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K1/0269 ,  H05K1/0393 ,  H05K1/112 ,  H05K1/116 ,  H05K3/3457 ,  H05K2201/0394 ,  H05K2201/09381 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09781

Abstract: To facilitate inspection, the pad metal level of a semiconductor chip (10) includes terminal pads having two different shapes. The terminal pads (18) that are to be functional are patterned in a first shape and the non-functional terminal pads (20) are patterned in an easily distinguishable second shape. Since the final passivation layer is transparent, the two shapes can be distinguished during inspection following the fabrication of solder balls, and rework of defective solder balls on non-functional pads can be avoided.

Abstract translation: 为了便于检查，半导体芯片（10）的焊盘金属层包括具有两种不同形状的端子焊盘。 待功能的端子焊盘（18）被图案化为第一形状，并且非功能端子焊盘（20）以易于区分的第二形状被图案化。 由于最终钝化层是透明的，所以在制造焊球之前的检查期间可以区分两种形状，并且可以避免在非功能性焊盘上的有缺陷的焊球的返工。