公开(公告)号：EP0337064A3

公开(公告)日：1990-05-30

申请号：EP89102181.8

申请日：1989-02-09

申请人： International Business Machines Corporation

发明人： Gardner, David Alan ,  Ryan, James Gardner ,  Schaefer, Joseph George ,  Walton, Erick Gregory

IPC分类号： H01L23/48

CPC分类号： H01L24/11 ,  H01L24/02 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/19043 ,  Y10T428/12458 ,  Y10T428/12528 ,  Y10T428/12583

摘要： An alloy layer (12) contacting portions of a conductive interconnect layer (2) exposed through an overlaying organic insulating layer (4) having apertures there­through. The alloy contains chromium and titanium, and is formed such that at least 50 atom % of the total content of the alloy is titanium at the alloy-­insulating layer interface (6).

公开(公告)号：EP0349095A3

公开(公告)日：1990-05-02

申请号：EP89202084.3

申请日：1983-02-23

申请人： HITACHI, LTD.

发明人： Onuki, Jin ,  Suwa, Masateru ,  Koizumi, Masahiro ,  Iizuka, Tomio ,  Tamamura, Takeo

IPC分类号： H01L21/607 ,  H01L23/49 ,  B23K20/00

CPC分类号： H01L24/85 ,  B23K20/007 ,  B23K2201/42 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/48 ,  H01L23/49 ,  H01L23/4952 ,  H01L23/49582 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/78 ,  H01L2224/05624 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/43 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45164 ,  H01L2224/45166 ,  H01L2224/45169 ,  H01L2224/4517 ,  H01L2224/4518 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4845 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/4851 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48655 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48755 ,  H01L2224/48799 ,  H01L2224/48839 ,  H01L2224/48855 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85075 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85455 ,  H01L2224/85948 ,  H01L2224/92247 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  Y10T428/12431 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48824 ,  H01L2924/00015 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/2075 ,  H01L2924/01049 ,  H01L2924/01006

摘要： A metal wire for use in connection to integrated circuits has a ball at its tip. The wire has a diameter of 20 to 100 µm and a maximum elongation of not more than 60% at room temperature (20°C) and is an Al wire or a Cu wire. The wire has been annealed at a temperature higher than the recrystallization temperature of the metal material in a non-oxidizing atmosphere. The ball is spherical in shape and has a hardness substantially equal to that of the metal wire. When used, this wire avoids local deformation.

摘要翻译： 树脂封装的半导体器件包括半导体元件（3），导电端子（4）和连接元件（3）和端子（4）的导线（1）。 热固性树脂（12）密封该部件，以保护装置免受机械应力和环境气氛的影响。 为了在其端部实现线（1）的良好的接合，线（1）由处于退火状态的金属（例如Al）制成，室温下的最大伸长率不超过60％，线 在接合之前已经退火。

公开(公告)号：EP0284820A3

公开(公告)日：1989-03-08

申请号：EP88103400.3

申请日：1988-03-04

申请人： CANON KABUSHIKI KAISHA

发明人： Yoshizawa, Tetsuo ,  Nishida, Hideyuki ,  Imaizumi, Masaaki ,  Ichida, Yasuteru ,  Konishi, Masaki ,  Kondo, Hiroshi ,  Sakaki, Takashi

IPC分类号： H01L23/48 ,  H01L23/14

CPC分类号： H01L24/83 ,  H01L23/145 ,  H01L23/15 ,  H01L23/315 ,  H01L23/49531 ,  H01L23/49827 ,  H01L23/49866 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/2919 ,  H01L2224/29499 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/83439 ,  H01L2224/838 ,  H01L2924/00015 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/15174 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15738 ,  H01L2924/1576 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/45099

摘要： An element for use in electrical connection comprises a holding member (125) having an insulator (111) and metallic powder dispersed in said insulator and a conductive member (107) laid in said holding member said conductive member has an end which is exposed on the surface of one side of said holding member and another end which is exposed on the surface of the other side of said holding member.

公开(公告)号：EP0268230A3

公开(公告)日：1988-08-31

申请号：EP87116794

申请日：1987-11-13

申请人： AIR PRODUCTS AND CHEMICALS, INC.

发明人： Bertin, Robert ,  Miller, Michael B. ,  Moon, Burl M. ,  Post, Robert C.

IPC分类号： B23K20/00 ,  C23C16/32

CPC分类号： H01L24/85 ,  B23K20/007 ,  C23C16/01 ,  H01L24/45 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/19042 ,  Y10T428/131 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/20754

摘要： A capillary for use in ball bonding tools designed to bond metal leads to the bonding pads on a microchip and pads or leads on a chip support is formed by chemically vapor depositing a substantially smooth silicon carbide coating having high electrical resistivity onto a substrate which is then removed by etching or combustion.

公开(公告)号：EP0183016A1

公开(公告)日：1986-06-04

申请号：EP85112553.4

申请日：1985-10-03

申请人： SUMITOMO ELECTRIC INDUSTRIES LIMITED

发明人： Itoh, Yoshiaki c/o Itami Works ,  Odani, Yusuke c/o Itami Works ,  Akechi, Kiyoaki c/o Itami Works ,  Kuroishi, Nobuhito c/o Itami Works

IPC分类号： C22C21/02 ,  C22C28/00 ,  H01L23/36

CPC分类号： H01L24/32 ,  C22C1/0416 ,  H01L23/3733 ,  H01L23/433 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/351 ,  Y10S165/905 ,  H01L2924/01014 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/01027 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05599

摘要： A material for use in the manufacture of semiconductor devices, a process for manufacturing the material, and a heat radiator structure for a semiconductor device. The material is a binary Al-Si alloy containing 30-60% by weight of Si.
This material can be produced by powder metallurgy techniques, such as by preparing a dispersion of Si powder in Al by mechanical alloying or by applying gas atomization, after which the powder is formed by hot extrusion, e.g. into radiation fins.
The heat radiator structure consists of the radiation fins, made from the Al-Si alloy, glued to the substrate.

摘要翻译： 用于制造半导体器件的材料，用于制造材料的方法以及用于半导体器件的散热器结构。 该材料是含有30-60重量％Si的二元Al-Si合金。 ...这种材料可以通过粉末冶金技术制造，例如通过机械合金化制备Al中的Si粉末的分散体或通过施加气体雾化，然后通过热挤出形成粉末，例如， 进入散热片。 ...散热器结构由Al-Si合金制成的辐射翅片组成，粘合到基底上。

公开(公告)号：EP0073383A2

公开(公告)日：1983-03-09

申请号：EP82107381.4

申请日：1982-08-13

申请人： Hitachi, Ltd.

发明人： Ooue, Michio ,  Wakui, Yoko ,  Hachino, Hiroaki

IPC分类号： H01L21/60 ,  H01L23/48

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/05155 ,  H01L2224/05171 ,  H01L2224/05639 ,  H01L2224/13099 ,  H01L2224/81801 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/1301 ,  H01L2924/00 ,  H01L2924/00014

摘要： Disclosed is a semiconductor device wherein among elements forming brazing material for bonding an electrode (21, 22) on a semiconductor substrate (2) to an external electrode (11, 12), the amounts of elements reacting with the material of electrode (21, 22) or external electrode (11, 12) and forming a compound harder and more brittle than the electrode material are smaller on the portion contacting the electrode (21,22) or external electrode (11, 12) than at other portions. A fabrication method of such device is also disclosed, involving the steps of laminating and depositing an at least two-layered metallic layer (140, 150) on the surface of the electrode (21, 22) on the substrate (2) or the surface of the external electrode (11, 12), bringing the electrodes (21, 22; 11, 12) into intimate contact with each other while opposing one another, and bonding them together by force of pressure applied to both electrodes (21, 22; 11, 12) while being heated close to an eutectic temperature of an alloy consisting of the metals of the uppermost and subsequent layers (140, 150), immediately therebelow, of the metallic layer (140, 150).

公开(公告)号：EP2530754B1

公开(公告)日：2016-12-21

申请号：EP12158521.0

申请日：2012-03-08

申请人： LG Innotek Co., Ltd.

发明人： Won, Sunghee ,  Chun, Youngsu

IPC分类号： H01L33/62 ,  H01L23/00 ,  H01L33/48 ,  H01L33/60 ,  H01L25/075 ,  F21K99/00 ,  F21Y113/00

CPC分类号： H01L33/62 ,  F21K9/27 ,  F21Y2113/13 ,  F21Y2115/10 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0753 ,  H01L2224/05609 ,  H01L2224/05623 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/05671 ,  H01L2224/05676 ,  H01L2224/05679 ,  H01L2224/0568 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/4848 ,  H01L2224/48499 ,  H01L2224/48997 ,  H01L2224/4911 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48455

摘要： A light emitting device package (100) is disclosed. The light emitting device package (100) includes a light emitting device (130) disposed on a first lead frame (121), the light emitting device (130) having an electrode pad (150) on an upper surface thereof, a first wire (170) to electrically interconnect a second lead frame (122) spaced apart from the first lead frame (121) and the electrode pad (150), and a first bonding ball (190) disposed on the second lead frame (122), the first bonding ball (190) spaced apart from a first contact point (180), which is in contact with the first wire (170) and the second lead frame (122), wherein the first bonding ball (190) is disposed between the first wire (170) and the second lead frame (122) to electrically interconnect the first wire (170) and the second lead frame (122). In the light emitting device package (100), the wire (170) is fixed using the bonding ball (190) upon wire bonding, thereby preventing the wire (170) from separating from the lead frame (122) at the bonded portion therebetween. Also, the wire (170) is electrically connected to the lead frame (122) via the bonding ball (190), thereby improving reliability of wire bonding.

公开(公告)号：EP1934995B1

公开(公告)日：2014-04-02

申请号：EP06769579.1

申请日：2006-06-22

申请人： Impact Coatings AB (Publ.)

发明人： LEWIN, Erik ,  JANSSON, Ulf ,  WILHELMSSON, Ola

IPC分类号： H01H1/027 ,  H01R13/03 ,  H01H1/36 ,  H01H9/00 ,  H01L23/00

CPC分类号： H01H1/027 ,  H01H1/36 ,  H01H9/0016 ,  H01H2300/036 ,  H01L24/72 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01R13/03

公开(公告)号：EP2517239A1

公开(公告)日：2012-10-31

申请号：EP10796036.1

申请日：2010-12-21

申请人： United Monolithic Semiconductors GmbH

发明人： JONSSON, Günter ,  STIEGLAUER, Hermann

IPC分类号： H01L23/48 ,  H01L23/00

CPC分类号： H01L23/481 ,  H01L21/76898 ,  H01L23/4827 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/0231 ,  H01L2224/02371 ,  H01L2224/0239 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/04026 ,  H01L2224/05008 ,  H01L2224/05009 ,  H01L2224/0508 ,  H01L2224/051 ,  H01L2224/05144 ,  H01L2224/05166 ,  H01L2224/05187 ,  H01L2224/05548 ,  H01L2224/05561 ,  H01L2224/05644 ,  H01L2224/291 ,  H01L2224/32221 ,  H01L2224/83101 ,  H01L2224/834 ,  H01L2224/83815 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/04941 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05552

摘要： The invention relates to an electronic component having a GaAs semiconductor substrate (HS), semiconductor components (BE) being implemented on the front side thereof, and the back side thereof having a multilayer backside metallization (RM), wherein an advantageous construction of the layer sequence of the backside metallization is proposed, the backside metallization in particular comprising an Au layer as a bonding layer.

公开(公告)号：EP2388815A1

公开(公告)日：2011-11-23

申请号：EP10162430.2

申请日：2010-05-10

申请人： NXP B.V.

发明人： Heeres, Rob Mathijs

IPC分类号： H01L23/64 ,  H01L23/66 ,  H03F1/56 ,  H01L23/00

CPC分类号： H01L23/66 ,  H01L23/645 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2223/6644 ,  H01L2223/6655 ,  H01L2224/48091 ,  H01L2224/48195 ,  H01L2224/4911 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/0106 ,  H01L2924/01075 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H03F1/565 ,  H01L2924/00 ,  H01L2224/45099

摘要： There is disclosed a transistor package (PK1; PK2; PK3), comprising a transistor (TR) with a transistor output (TO), and an output terminal (OT). The transistor output is connected to the output terminal (OT) via an output bondwire (Ld); and is also connected to a series arrangement of an inductor (Li1, Li2) and a capacitor (Cb). The inductor is for resonating with the capacitive output impedance of the transistor output, and the capacitor is for for blocking DC currents. The inductor is formed by first (Li1) and second (Li2) bondwires in series, the first bondwire (Li1) being placed to positively couple with the output bondwire (Ld; Ld1), and the second bondwire (Li2) being placed to negatively couple with the output bondwire (Ld; Ld1).

摘要翻译： 公开了一种晶体管封装（PK1; PK2; PK3），其包括具有晶体管输出（TO）的晶体管（TR）和输出端子（OT）。 晶体管输出通过输出接合线（Ld）连接到输出端（OT）; 并且还连接到电感器（Li1，Li2）和电容器（Cb）的串联布置。 电感用于与晶体管输出的电容输出阻抗谐振，电容用于阻断直流电流。 电感由串联的第一（Li1）和第二（Li2）键合线形成，第一接合线（Li1）与输出接合线（Ld; Ld1）正向耦合，第二接合线（Li2）置于负极 与输出接线（Ld; Ld1）耦合。