Printed circuit board and electronic apparatus
    91.
    发明专利
    Printed circuit board and electronic apparatus 审中-公开
    印刷电路板和电子设备

    公开(公告)号:JP2010080744A

    公开(公告)日:2010-04-08

    申请号:JP2008248568

    申请日:2008-09-26

    Abstract: PROBLEM TO BE SOLVED: To provide a printed circuit board which maintains flatness while suppressing the occurrence of radiation noise, and an electronic apparatus including the printed circuit board.
    SOLUTION: There is disclosed the printed circuit board which has a region where insulating layers and wiring layers having wiring pattern formed therein are alternately laminated and a noise reduction element is arranged on wiring between the wiring pattern of one wiring layer and a connector, wherein wiring patterns having a region overlapping wiring between the connector and the noise reduction element has no region overlapping the wiring patterns having no the region, when viewed from the front surface side of the printed circuit board.
    COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题:提供一种在抑制辐射噪声的发生的同时保持平坦度的印刷电路板,以及包括印刷电路板的电子设备。 解决方案:公开了一种印刷电路板,其具有交替层叠具有形成有布线图案的绝缘层和布线层的区域,并且在一个布线层的布线图案和连接器之间的布线上布置降噪元件 其中,当从印刷电路板的表面侧观察时,具有在连接器和降噪元件之间重叠布线的区域的布线图案没有与没有区域的布线图案重叠。 版权所有(C)2010,JPO&INPIT

    Electronic circuit board and electronic control device
    92.
    发明专利
    Electronic circuit board and electronic control device 有权
    电子电路板和电子控制装置

    公开(公告)号:JP2010045324A

    公开(公告)日:2010-02-25

    申请号:JP2009009145

    申请日:2009-01-19

    Inventor: UEDA KOJI

    Abstract: PROBLEM TO BE SOLVED: To provide an electronic circuit board capable of restraining a decrease in soldering quality by avoiding solder non-wetting and solder melting unsatisfactory even in soldering a surface mounting type element having a coil to a board by reflow heating without increasing a reflow heating time. SOLUTION: An electronic circuit board 12 has on its surface patterns 20, 21 with a larger area than a pattern area determined by a current capacity for securing a current value to be flown to a surface mounting type element 14. Lands 25, 28 to which connection terminals 15, 18 of the surface mounting type element 14 are soldered are provided as part of its large area patterns 20, 21. For this reason, when the electronic circuit board 12 is carried in a reflow surface, the temperature of the connection terminals 15, 18 of the surface mounting type element 14 and further the lands 25, 28 can be raised up to a temperature where solder is sufficiently melted owing to a heat collecting effect of the large area patterns 20, 21. COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题:提供一种电子电路板,其能够通过避免焊料不润湿和焊料熔化不能令人满意地抑制焊接质量的降低,即使在将具有线圈的表面安装型元件通过回流加热焊接到板上时也不会令人满意,而没有 增加回流加热时间。 解决方案:电子电路板12在其表面图案20,21上具有比由用于确保要流向表面安装型元件14的电流值的电流容量确定的图案区域更大的面积。 作为其大面积图案20,21的一部分,设置了表面安装型元件14的连接端子15,18的28,由此,当电路基板12承载回流面时, 表面安装型元件14的连接端子15,18和另外的焊盘25,28可以升高到由于大面积图案20,21的集热效应使焊料充分熔化的温度。 版权所有(C)2010,JPO&INPIT

    Printed circuit board and method of manufacturing same
    93.
    发明专利
    Printed circuit board and method of manufacturing same 有权
    印刷电路板及其制造方法

    公开(公告)号:JP2009272559A

    公开(公告)日:2009-11-19

    申请号:JP2008123810

    申请日:2008-05-09

    Abstract: PROBLEM TO BE SOLVED: To provide a printed circuit board which secures sufficient heat dissipation and is improved in connectivity with an electronic component, and a method of manufacturing the same.
    SOLUTION: A mounting region S is provided at a substantially center of one surface of an insulating layer 1. A metal layer 3 is provided on the other surface of the insulating layer 1. A slit 31 is formed to cross a region (an opposite region T) of the metal layer 3 that coincides with the mounting region S and to divide the metal layer 3. A plurality of regions (large regions) of the metal layer 3 divided by the slit 31 each include a partial region (small region) of the opposite region T. The area of each large region is set corresponding to the area of the small region included therein. Specifically, the small region having the area of A [%] with respect to the whole area of the opposite region T is included in the large region having the area of (A±δ) [%] with respect to the whole area of the metal layer 3. Here, δ is an acceptable error range, and the acceptable error range δ is not more than (A×0.3).
    COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题:提供确保足够的散热并提高与电子部件的连接性的印刷电路板及其制造方法。 解决方案:安装区域S设置在绝缘层1的一个表面的大致中心处。金属层3设置在绝缘层1的另一个表面上。狭缝31形成为跨越绝缘层1的区域 与安装区域S重合的金属层3的相对区域T)并且分割金属层3.由狭缝31划分的金属层3的多个区域(大区域)各自包括部分区域(小的区域) 区域)。每个大区域的面积被设置为对应于其中包括的小区域的面积。 具体而言,相对于相对区域T的整个面积,具有A [%]面积的小区域被包含在相对于区域T的整个面积为(A±δ)[%]的面积的大区域中 金属层3.这里,δ是可接受的误差范围,可接受的误差范围δ不大于(A×0.3)。 版权所有(C)2010,JPO&INPIT

    Electronic device
    94.
    发明专利
    Electronic device 有权
    电子设备

    公开(公告)号:JP2009212009A

    公开(公告)日:2009-09-17

    申请号:JP2008055464

    申请日:2008-03-05

    Inventor: MOMOSE HIDEAKI

    Abstract: PROBLEM TO BE SOLVED: To provide an electronic device capable of reducing effect on other signals while quality of a differential signal is maintained, in an electronic device having a complex connector wherein digital signals and analog signals are transmitted.
    SOLUTION: The electronic device has a complex connector having a plurality of digital terminals and a plurality of analog terminals which have at least a pair of differential signal terminals, and a wiring board for connecting by lining up the plurality of digital terminals and the plurality of analog terminals. The analog terminals are arranged on the wiring board so as not to be arranged between the pair of differential signal terminals, and the analog terminals are arranged among the plurality of digital terminals other than the pair of differential signal terminals.
    COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题:提供一种能够在维持差分信号的质量的同时降低对其他信号的影响的电子设备,在具有传输数字信号和模拟信号的复杂连接器的电子设备中。 解决方案:电子设备具有复数连接器,具有多个数字端子和多个具有至少一对差分信号端子的模拟端子,以及布线板,用于通过排列多个数字端子和 多个模拟端子。 模拟端子布置在布线板上,以便不布置在一对差分信号端子之间,并且模拟端子布置在除了该对差分信号端子之外的多个数字端子中。 版权所有(C)2009,JPO&INPIT

    Electromagnetic bandgap structure and printed circuit board
    96.
    发明专利
    Electromagnetic bandgap structure and printed circuit board 有权
    电磁带结构和印刷电路板

    公开(公告)号:JP2009141326A

    公开(公告)日:2009-06-25

    申请号:JP2008241772

    申请日:2008-09-19

    Abstract: PROBLEM TO BE SOLVED: To provide an electromagnetic bandgap structure that reduces noise of specific frequency. SOLUTION: The electromagnetic bandgap structure includes a dielectric layer, a plurality of conductive plates, and stitching vias through which specified two conductive plates out of the conductive plates are electrically connected. The stitching vias include a first via penetrating the dielectric layer and having one end located on the same plane as one of the two conductive plates, a second via penetrating the dielectric layer and having one end located on the same plane as the other of the two conductive plates, a connection pattern having one end connected with the other end of the first via and the other end connected with the other end of the second via, and a first extension pattern located on the same plane as the one of the conductive plates and having one end connected with the one end of the first via and the other end connected with the one of the conductive plates. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题:提供降低特定频率的噪声的电磁带隙结构。 解决方案:电磁带隙结构包括电介质层,多个导电板和缝合通孔,导电板中的特定的两个导电板通过该导电板电连接。 缝合通孔包括穿过电介质层并且具有位于与两个导电板中的一个相同的平面上的第一通孔,穿过介电层的第二通孔,并且其一端位于与两个导电板中的另一个相同的平面上 导电板,连接图案,其一端与第一通孔的另一端连接,另一端与第二通孔的另一端连接,第一延伸图案位于与导电板之一相同的平面上, 其一端与第一通孔的一端连接,另一端与导电板之一连接。 版权所有(C)2009,JPO&INPIT

    Printed circuit board with embedded chip capacitor and chip capacitor embedment method
    97.
    发明专利
    Printed circuit board with embedded chip capacitor and chip capacitor embedment method 有权
    具有嵌入式芯片电容器和芯片电容器嵌入方法的印刷电路板

    公开(公告)号:JP2009088468A

    公开(公告)日:2009-04-23

    申请号:JP2008034473

    申请日:2008-02-15

    Abstract: PROBLEM TO BE SOLVED: To provide a printed circuit board having an embedded chip capacitor that can solve a problem of mixed signals of a printed circuit board, mounted with a variety of electronic components and elements, including an analog circuit and a digital circuit board by using the chip capacitor embedded in the printed circuit board as an electromagnetic bandgap (EBG) structure. SOLUTION: The printed circuit board having the embedded chip capacitor can include a first conductive layer 310; a second conductive layer 320, placed away from the first conductive layer; the chip capacitor 340, placed between the first conductive layer and the second conductive layer and having a second electrode 342, connected to the second conductive layer 320; and a via 350, connecting the first conductive layer 310 to a first electrode 341 of the chip capacitor. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题:提供一种具有嵌入式芯片电容器的印刷电路板,其可以解决安装有各种电子元件和元件的印刷电路板的混合信号的问题,包括模拟电路和数字 电路板通过使用嵌入在印刷电路板中的芯片电容器作为电磁带隙(EBG)结构。 具有嵌入式芯片电容器的印刷电路板可以包括第一导电层310; 远离第一导电层放置的第二导电层320; 芯片电容器340,放置在第一导电层和第二导电层之间,并具有连接到第二导电层320的第二电极342; 以及将第一导电层310连接到片状电容器的第一电极341的通孔350。 版权所有(C)2009,JPO&INPIT

    Connection structure of wiring circuit board
    98.
    发明专利
    Connection structure of wiring circuit board 有权
    接线电路板连接结构

    公开(公告)号:JP2009054793A

    公开(公告)日:2009-03-12

    申请号:JP2007219994

    申请日:2007-08-27

    Inventor: MOTOGAMI MITSURU

    Abstract: PROBLEM TO BE SOLVED: To provide a connection structure of a wiring circuit board capable of improving connection reliability between a first terminal part and a second terminal part by a simple structure.
    SOLUTION: External-side terminal parts 6 are folded back at 180° into a curved shape, the respective external-side terminal parts 6 are brought into contact with rear ends of respective connection terminal parts 25, and solder balls 31 are arranged to contact both surfaces of the respective external-side terminal parts 6 and upper surfaces of the rear ends of the respective connection terminal parts 25, thereby the external-side connection terminal parts 6 of a suspension board 1 with a circuit are electrically connected to the connection terminal parts 25 of an external wiring circuit board 21.
    COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 解决的问题:提供能够通过简单的结构提高第一端子部和第二端子部之间的连接可靠性的布线电路板的连接结构。 解决方案:外侧端子部6以180°折回成弯曲形状,各外侧端子部6与各连接端子部25的后端接触,配置焊球31 接触各个外部端子部分6的两个表面和各个连接端子部分25的后端的上表面,由此具有电路的悬挂板1的外侧连接端子部分6电连接到 外部布线电路板21的连接端子部25。版权所有(C)2009,JPO&INPIT

    Electromagnetic bandgap structure, printed circuit board comprising this and manufacturing method thereof
    99.
    发明专利
    Electromagnetic bandgap structure, printed circuit board comprising this and manufacturing method thereof 有权
    电磁带结构,印刷电路板及其制造方法

    公开(公告)号:JP2009021594A

    公开(公告)日:2009-01-29

    申请号:JP2008177624

    申请日:2008-07-08

    Abstract: PROBLEM TO BE SOLVED: To provide an electromagnetic bandgap structure which doesn't make the total process longer because of dispensing with an inner layer drilling process, a plating process and filling process in the conventional manufacturing process of the printed circuit board although including the electromagnetic bandgap structure and can solve a mixed signal problem between an analog circuit and a digital circuit, and to provide a printed circuit board comprising this and a manufacturing method thereof. SOLUTION: The electromagnetic bandgap structure includes: a first metal layer; a first dielectric layer stacked on the first metal layer; a metal plate stacked on the first dielectric layer; a second dielectric layer stacked on the metal plate and the first dielectric layer; a second metal layer stacked on the second dielectric layer; and a via directed from the metal plate to the first metal layer and the second metal layer. The via is connected to the first metal layer but is not connected to the second metal layer. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题:提供一种电磁带隙结构,其不会使总工艺更长,因为在印刷电路板的常规制造过程中分配内层钻孔工艺,电镀工艺和填充工艺,尽管 包括电磁带隙结构,并且可以解决模拟电路和数字电路之间的混合信号问题,并且提供一种包括其的印刷电路板及其制造方法。 解决方案:电磁带隙结构包括:第一金属层; 层叠在所述第一金属层上的第一电介质层; 堆叠在所述第一电介质层上的金属板; 层叠在所述金属板和所述第一电介质层上的第二电介质层; 层叠在所述第二电介质层上的第二金属层; 以及从金属板引导到第一金属层和第二金属层的通孔。 通孔连接到第一金属层,但不连接到第二金属层。 版权所有(C)2009,JPO&INPIT

    Method of connecting wiring board, and wiring board
    100.
    发明专利
    Method of connecting wiring board, and wiring board 有权
    连接接线板和接线板的方法

    公开(公告)号:JP2008288325A

    公开(公告)日:2008-11-27

    申请号:JP2007130744

    申请日:2007-05-16

    Abstract: PROBLEM TO BE SOLVED: To ensure proper connection of connection terminals. SOLUTION: The method of connecting wiring boards interconnects wiring boards 31a and 31b having band-like connection terminals 34a and 34b for connection with the other board. The method includes a step of positioning the wiring boards so that the connection terminals face each other while fluid 14 is inserted in between, and a step of heating fluid 14, cooling it and fixing the connection terminals. Fluid 14 is a material where air bubbles occur by heating. A plurality of connection terminals 34a and 34b are installed in the respective wiring boards 31a and 31b. A groove 20a crossing the band-like connection terminal is formed in at least one connection terminal of at least one wiring board. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题:确保连接端子的正确连接。 解决方案:连接布线板的方法将具有带状连接端子34a和34b的布线板31a和31b互连,以与另一个板连接。 该方法包括将流体14插入其间的连接端子彼此面对的步骤,以及加热流体14,冷却并固定连接端子的步骤。 流体14是通过加热发生气泡的材料。 多个连接端子34a和34b安装在各个布线板31a和31b中。 在至少一个布线板的至少一个连接端子中形成有与带状连接端子交叉的槽20a。 版权所有(C)2009,JPO&INPIT

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