Abstract:
PROBLEM TO BE SOLVED: To provide a printed circuit board which maintains flatness while suppressing the occurrence of radiation noise, and an electronic apparatus including the printed circuit board. SOLUTION: There is disclosed the printed circuit board which has a region where insulating layers and wiring layers having wiring pattern formed therein are alternately laminated and a noise reduction element is arranged on wiring between the wiring pattern of one wiring layer and a connector, wherein wiring patterns having a region overlapping wiring between the connector and the noise reduction element has no region overlapping the wiring patterns having no the region, when viewed from the front surface side of the printed circuit board. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an electronic circuit board capable of restraining a decrease in soldering quality by avoiding solder non-wetting and solder melting unsatisfactory even in soldering a surface mounting type element having a coil to a board by reflow heating without increasing a reflow heating time. SOLUTION: An electronic circuit board 12 has on its surface patterns 20, 21 with a larger area than a pattern area determined by a current capacity for securing a current value to be flown to a surface mounting type element 14. Lands 25, 28 to which connection terminals 15, 18 of the surface mounting type element 14 are soldered are provided as part of its large area patterns 20, 21. For this reason, when the electronic circuit board 12 is carried in a reflow surface, the temperature of the connection terminals 15, 18 of the surface mounting type element 14 and further the lands 25, 28 can be raised up to a temperature where solder is sufficiently melted owing to a heat collecting effect of the large area patterns 20, 21. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a printed circuit board which secures sufficient heat dissipation and is improved in connectivity with an electronic component, and a method of manufacturing the same. SOLUTION: A mounting region S is provided at a substantially center of one surface of an insulating layer 1. A metal layer 3 is provided on the other surface of the insulating layer 1. A slit 31 is formed to cross a region (an opposite region T) of the metal layer 3 that coincides with the mounting region S and to divide the metal layer 3. A plurality of regions (large regions) of the metal layer 3 divided by the slit 31 each include a partial region (small region) of the opposite region T. The area of each large region is set corresponding to the area of the small region included therein. Specifically, the small region having the area of A [%] with respect to the whole area of the opposite region T is included in the large region having the area of (A±δ) [%] with respect to the whole area of the metal layer 3. Here, δ is an acceptable error range, and the acceptable error range δ is not more than (A×0.3). COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an electronic device capable of reducing effect on other signals while quality of a differential signal is maintained, in an electronic device having a complex connector wherein digital signals and analog signals are transmitted. SOLUTION: The electronic device has a complex connector having a plurality of digital terminals and a plurality of analog terminals which have at least a pair of differential signal terminals, and a wiring board for connecting by lining up the plurality of digital terminals and the plurality of analog terminals. The analog terminals are arranged on the wiring board so as not to be arranged between the pair of differential signal terminals, and the analog terminals are arranged among the plurality of digital terminals other than the pair of differential signal terminals. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device improving junction strength of a solder ball, in a BGA-type semiconductor device, and to provide a method of manufacturing the device. SOLUTION: This semiconductor device 1 includes: a wiring substrate 2 including connection pads 3 provided on one surface 2a thereof and multiple lands 4, that are provided on the other surface 2b thereof and electrically connected to the corresponding connection pads 3; a semiconductor chip 9 mounted on the one surface 2a of the wiring substrate 2 and electrically connected to the connection pads 3; a solder resist 6 stacked on the other surface 2b of the wiring substrate 2 and having openings 6a to which the lands 4 are respectively exposed; and external terminals 8 connected respectively to the lands 4 through the openings 6a and is such that each opening 6a is arranged by being shifted with respect to the corresponding land 4, and a dummy wire 7 is arranged in a region which faces the land 4 in the periphery of each opening 6a. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an electromagnetic bandgap structure that reduces noise of specific frequency. SOLUTION: The electromagnetic bandgap structure includes a dielectric layer, a plurality of conductive plates, and stitching vias through which specified two conductive plates out of the conductive plates are electrically connected. The stitching vias include a first via penetrating the dielectric layer and having one end located on the same plane as one of the two conductive plates, a second via penetrating the dielectric layer and having one end located on the same plane as the other of the two conductive plates, a connection pattern having one end connected with the other end of the first via and the other end connected with the other end of the second via, and a first extension pattern located on the same plane as the one of the conductive plates and having one end connected with the one end of the first via and the other end connected with the one of the conductive plates. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a printed circuit board having an embedded chip capacitor that can solve a problem of mixed signals of a printed circuit board, mounted with a variety of electronic components and elements, including an analog circuit and a digital circuit board by using the chip capacitor embedded in the printed circuit board as an electromagnetic bandgap (EBG) structure. SOLUTION: The printed circuit board having the embedded chip capacitor can include a first conductive layer 310; a second conductive layer 320, placed away from the first conductive layer; the chip capacitor 340, placed between the first conductive layer and the second conductive layer and having a second electrode 342, connected to the second conductive layer 320; and a via 350, connecting the first conductive layer 310 to a first electrode 341 of the chip capacitor. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a connection structure of a wiring circuit board capable of improving connection reliability between a first terminal part and a second terminal part by a simple structure. SOLUTION: External-side terminal parts 6 are folded back at 180° into a curved shape, the respective external-side terminal parts 6 are brought into contact with rear ends of respective connection terminal parts 25, and solder balls 31 are arranged to contact both surfaces of the respective external-side terminal parts 6 and upper surfaces of the rear ends of the respective connection terminal parts 25, thereby the external-side connection terminal parts 6 of a suspension board 1 with a circuit are electrically connected to the connection terminal parts 25 of an external wiring circuit board 21. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an electromagnetic bandgap structure which doesn't make the total process longer because of dispensing with an inner layer drilling process, a plating process and filling process in the conventional manufacturing process of the printed circuit board although including the electromagnetic bandgap structure and can solve a mixed signal problem between an analog circuit and a digital circuit, and to provide a printed circuit board comprising this and a manufacturing method thereof. SOLUTION: The electromagnetic bandgap structure includes: a first metal layer; a first dielectric layer stacked on the first metal layer; a metal plate stacked on the first dielectric layer; a second dielectric layer stacked on the metal plate and the first dielectric layer; a second metal layer stacked on the second dielectric layer; and a via directed from the metal plate to the first metal layer and the second metal layer. The via is connected to the first metal layer but is not connected to the second metal layer. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To ensure proper connection of connection terminals. SOLUTION: The method of connecting wiring boards interconnects wiring boards 31a and 31b having band-like connection terminals 34a and 34b for connection with the other board. The method includes a step of positioning the wiring boards so that the connection terminals face each other while fluid 14 is inserted in between, and a step of heating fluid 14, cooling it and fixing the connection terminals. Fluid 14 is a material where air bubbles occur by heating. A plurality of connection terminals 34a and 34b are installed in the respective wiring boards 31a and 31b. A groove 20a crossing the band-like connection terminal is formed in at least one connection terminal of at least one wiring board. COPYRIGHT: (C)2009,JPO&INPIT