公开(公告)号：US20120073865A1

公开(公告)日：2012-03-29

申请号：US13311058

申请日：2011-12-05

Applicant: Myung Sam Kang ,  Byoung Youl Min ,  Je Gwang Yoo ,  Jung Hyun Park ,  Chang Sup Ryu ,  Jin Yong Ahn

Inventor： Myung Sam Kang ,  Byoung Youl Min ,  Je Gwang Yoo ,  Jung Hyun Park ,  Chang Sup Ryu ,  Jin Yong Ahn

IPC: H05K1/09 ,  H05K1/00

CPC classification number: H05K3/428 ,  H05K3/205 ,  H05K3/383 ,  H05K3/384 ,  H05K3/4602 ,  H05K3/4658 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2203/1536 ,  Y10T29/49155

Abstract: A carrier member for transmitting circuits, which is a component of a coreless printed circuit board having circuit patterns embedded therein, and which can be used to provide a high-density and highly reliable printed circuit board by forming protrusions only on the lower ends of the circuit patterns, a coreless printed circuit board using the carrier member, and methods of manufacturing the carrier member and the coreless printed circuit board.

Abstract translation: 用于发送电路的载体构件，其是具有嵌入其中的电路图案的无芯型印刷电路板的部件，并且其可用于通过仅在其下端形成突起来提供高密度和高可靠性的印刷电路板 电路图案，使用承载构件的无芯印刷电路板，以及制造载体构件和无芯非印刷电路板的方法。

公开(公告)号：US08061025B2

公开(公告)日：2011-11-22

申请号：US12926864

申请日：2010-12-14

Applicant: Seung Hyun Cho ,  Byoung Youl Min ,  Soon Jin Cho ,  Jin Won Choi

Inventor： Seung Hyun Cho ,  Byoung Youl Min ,  Soon Jin Cho ,  Jin Won Choi

IPC: H05K3/44 ,  H05K1/05

CPC classification number: H05K1/056 ,  B82Y10/00 ,  H01L21/486 ,  H01L21/4871 ,  H01L23/3677 ,  H01L23/373 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K7/20481 ,  H05K2201/026 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T428/24917

Abstract: A method of manufacturing a heat radiation substrate having a metal core, including injection-molding mixed powder of carbon nanotubes and metal in a die to fabricate a metal core having through holes; molding the entire metal core including the through holes with an insulating resin to fabricate a metal core substrate; processing the insulating resin provided in the through holes to form connection holes; and forming a circuit pattern on the metal core substrate in which the connection holes are formed.

Abstract translation: 一种制造具有金属芯的散热基板的方法，包括在模具中注入成型的碳纳米管和金属的混合粉末以制造具有通孔的金属芯; 用绝缘树脂模制包括通孔的整个金属芯，以制造金属芯基板; 处理设置在通孔中的绝缘树脂以形成连接孔; 在形成有连接孔的金属芯基板上形成电路图案。

公开(公告)号：US20100154210A1

公开(公告)日：2010-06-24

申请号：US12656781

申请日：2010-02-16

Applicant: Doo-Hwan Lee ,  Byoung-Youl Min ,  Myung-Sam Kang ,  Moon-Il Kim ,  Hyung-Tae Kim

Inventor： Doo-Hwan Lee ,  Byoung-Youl Min ,  Myung-Sam Kang ,  Moon-Il Kim ,  Hyung-Tae Kim

IPC: H05K3/30

CPC classification number: H05K1/185 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/8385 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2225/06524 ,  H01L2225/06589 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/056 ,  H05K3/4608 ,  H05K2201/10515 ,  Y10T29/4913 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00

Abstract: A method of manufacturing a printed circuit board having embedded electronic components. With the printed circuit board having embedded electronic components, including a core sheet, a first electronic component mounted on one side of the core sheet, a second electronic component mounted on the other side of the core sheet and overlapping the first electronic component, a first insulation layer stacked on one side of the core sheet and covering the first electronic component, a second insulation layer stacked on the other side of the core sheet and covering the second electronic component, and a circuit pattern formed on the surface of the first insulation layer or the second insulation layer, the density of the printed circuit board having embedded components is improved, as a plurality of electronic components are embedded simultaneously, and when a thin CCL substrate or a metal substrate is used as the core, a metal substrate in particular, the heat-releasing property and mechanical strength are improved, including increased bending strength in a thermal-stress environment, as electronic components are mounted on both sides of the core sheet.

Abstract translation: 一种具有嵌入式电子部件的印刷电路板的制造方法。 利用具有嵌入式电子部件的印刷电路板，包括芯片，安装在芯片的一侧的第一电子部件，安装在芯片的另一侧并与第一电子部件重叠的第二电子部件，第一电子部件 绝缘层，其堆叠在所述芯片的一侧并覆盖所述第一电子部件;堆叠在所述芯片的另一侧并覆盖所述第二电子部件的第二绝缘层，以及形成在所述第一绝缘层的表面上的电路图案 或第二绝缘层，随着多个电子部件被同时嵌入，具有嵌入部件的印刷电路板的密度得到改善，并且当使用薄CCL基板或金属基板作为芯时，特别是金属基板 ，提高了散热性能和机械强度，包括在热应力环境中增加弯曲强度 因为电子部件安装在芯片的两侧。

公开(公告)号：US20090297801A1

公开(公告)日：2009-12-03

申请号：US12003490

申请日：2007-12-26

Applicant: Seung Hyun Cho ,  Byoung Youl Min ,  Soon Jin Cho ,  Jin Won Choi

Inventor： Seung Hyun Cho ,  Byoung Youl Min ,  Soon Jin Cho ,  Jin Won Choi

IPC: B32B3/00 ,  B29C59/00

CPC classification number: H05K1/056 ,  B82Y10/00 ,  H01L21/486 ,  H01L21/4871 ,  H01L23/3677 ,  H01L23/373 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K7/20481 ,  H05K2201/026 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T428/24917

Abstract: Disclosed herein is a method of manufacturing a heat radiation substrate, including injection-molding mixed powder of carbon nanotubes and metal in a die to fabricate a metal core having through holes; molding the entire metal core including the through holes with an insulating resin to fabricate a metal core substrate; processing the insulating resin provided in the through holes to form connection holes; and forming a circuit pattern on the metal core substrate in which the connection holes are formed.

Abstract translation: 本发明公开了一种制造散热基板的方法，包括：在模具中注入碳纳米管和金属的混合粉末以制造具有通孔的金属芯; 用绝缘树脂模制包括通孔的整个金属芯，以制造金属芯基板; 处理设置在通孔中的绝缘树脂以形成连接孔; 在形成有连接孔的金属芯基板上形成电路图案。

公开(公告)号：US07570491B2

公开(公告)日：2009-08-04

申请号：US10728591

申请日：2003-12-04

Applicant: Seok-Kyu Lee ,  Byoung-Youl Min ,  Chang-Hyun Nam ,  Hyun-Ju Jin ,  Jang-Kyu Kang

Inventor： Seok-Kyu Lee ,  Byoung-Youl Min ,  Chang-Hyun Nam ,  Hyun-Ju Jin ,  Jang-Kyu Kang

IPC: H05K1/02 ,  H05K1/16

CPC classification number: H05K1/162 ,  H05K3/4652 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/09509 ,  H05K2203/1461

Abstract: Disclosed herein is a printed circuit board with embedded capacitors therein which comprises inner via holes filled with a high dielectric polymer capacitor paste composed of a composite of BaTiO3 and an epoxy resin, and a process for manufacturing the printed circuit board.

Abstract translation: 这里公开了一种其中具有嵌入式电容器的印刷电路板，其包括填充有由BaTiO 3和环氧树脂的复合材料组成的高介电聚合物电容器糊的内部通孔，以及用于制造印刷电路板的工艺。

公开(公告)号：US07485490B2

公开(公告)日：2009-02-03

申请号：US11286970

申请日：2005-11-22

Applicant: Kwang Seok Oh ,  Jong Wook Park ,  Young Kuk Park ,  Byoung Youl Min

Inventor： Kwang Seok Oh ,  Jong Wook Park ,  Young Kuk Park ,  Byoung Youl Min

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L24/85 ,  H01L23/13 ,  H01L23/16 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48472 ,  H01L2224/48479 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/73265 ,  H01L2224/85051 ,  H01L2224/85986 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85186 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4554 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: Disclosed is a stacking structure of semiconductor chips and semiconductor package using it, capable of achieving an electric insulation even if a conductive wire makes contact with a lower surface of an upper semiconductor chip, while reducing a total thickness thereof and preventing damage. The stacking structure has a substrate formed with a plurality of circuit patterns; a first semiconductor chip bonded to an upper surface of the substrate and having a first plane and a second plane formed with a plurality of input/output pads; a spacer bonded to the second plane of the first semiconductor chip; a second semiconductor chip having first and second planes, the second plane being formed with a plurality of input/output pads, the first plane being provided with an insulating member so as to allow the second semiconductor chip to be bonded to the spacer, a first conductive wire for connecting the input/output pads of the first semiconductor chip to the circuit patterns of the substrate; and a second conductive wire for connecting the input/output pads of the second semiconductor chip to the circuit patterns of the substrate.

Abstract translation: 公开了半导体芯片的堆叠结构和使用它的半导体封装，即使导线与上半导体芯片的下表面接触而能够实现电绝缘，同时减小其总厚度并防止损坏。 堆叠结构具有形成有多个电路图案的基板; 第一半导体芯片，其结合到所述基板的上表面并具有形成有多个输入/输出焊盘的第一平面和第二平面; 连接到第一半导体芯片的第二平面的间隔物; 具有第一和第二平面的第二半导体芯片，所述第二平面形成有多个输入/输出焊盘，所述第一平面设置有绝缘构件，以允许所述第二半导体芯片与所述间隔件接合， 导线，用于将第一半导体芯片的输入/输出焊盘连接到衬底的电路图案; 以及用于将第二半导体芯片的输入/输出焊盘连接到衬底的电路图案的第二导线。

公开(公告)号：US20050199681A1

公开(公告)日：2005-09-15

申请号：US11117315

申请日：2005-04-29

Applicant: Seok-Kyu Lee ,  Jang-Kyu Kang ,  Hyun-Ju Jin ,  Byoung-Youl Min

Inventor： Seok-Kyu Lee ,  Jang-Kyu Kang ,  Hyun-Ju Jin ,  Byoung-Youl Min

IPC: H05K3/46 ,  H05K1/16 ,  H05K3/00 ,  H05K3/42 ,  B23K1/00

CPC classification number: H05K1/162 ,  H05K3/0023 ,  H05K3/429 ,  H05K3/4652 ,  H05K3/4661 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2203/0568 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49155

Abstract: Disclosed herein are a printed circuit board with embedded capacitors therein and a process for manufacturing the printed circuit board. The embedded capacitors are formed by applying a photosensitive insulating resin to a printed circuit board inner layer, and applying a high dielectric polymer capacitor paste thereto.

Abstract translation: 这里公开了一种其中具有嵌入式电容器的印刷电路板和用于制造印刷电路板的工艺。 嵌入式电容器通过将印刷电路板内层施加感光绝缘树脂，并向其施加高介电聚合物电容器膏而形成。

公开(公告)号：US06380001B1

公开(公告)日：2002-04-30

申请号：US09439564

申请日：1999-11-12

Applicant: Byoung-Youl Min ,  Thomas J. Massingill

Inventor： Byoung-Youl Min ,  Thomas J. Massingill

IPC: H01L2144

CPC classification number: H01L24/31 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

Abstract: A package for a semiconductor device and a method for packaging a semiconductor device are disclosed. The semiconductor package uses a tape which allows for the production of packaged semiconductor devices having different contact patterns. The contact pattern is configured to the required pin contact pattern by varying the number and placement of balls on the bottom of the tape. In one embodiment, the tape includes bonding pads and an array of contact pads. Each bonding pad is connected to one of the contact pads, and an opening is disposed in the tape below each contact pad. A semiconductor device is connected to the tape and is electrically connected to the bonding pads. The semiconductor device is then sealed on the top and sides by a plastic top which attaches to the tape. Balls are then selectively attached to the tape such that they electrically connect to select contact pads so as to form a desired contact pattern. Packages having different contact patterns are easily formed by altering the number and position of balls deposited on the tape. Thus, a single tape may be used for forming packaged semiconductor devices having different contact patterns. Thus, significant cost savings is realized since different tapes need not be fabricated for each different contact pattern.

Abstract translation: 公开了一种用于半导体器件的封装以及用于封装半导体器件的方法。 半导体封装使用允许生产具有不同接触图案的封装半导体器件的带。 通过改变磁带底部的球的数量和位置，将接触图形配置成所需的针接触图案。 在一个实施例中，带包括接合焊盘和接触焊盘阵列。 每个接合焊盘连接到接触焊盘中的一个，并且在每个接触焊盘下面的带中设置一个开口。 半导体器件连接到带并且电连接到接合焊盘。 然后，半导体器件在顶部和侧面通过粘附到带的塑料顶部密封。 然后将球选择性地附接到带，使得它们电连接到选择接触垫，以形成期望的接触图案。 具有不同接触图案的包装通过改变沉积在带上的滚珠的数量和位置而容易地形成。 因此，可以使用单个带来形成具有不同接触图案的封装半导体器件。 因此，由于不需要为每个不同的接触图形制造不同的带，所以实现了显着的成本节省。

公开(公告)号：US20130042472A1

公开(公告)日：2013-02-21

申请号：US13617694

申请日：2012-09-14

Applicant: Doo-Hwan LEE ,  Byoung-Youl MIN ,  Myung-Sam KANG ,  Moon-II KIM ,  Hyung-Tae KIM

Inventor： Doo-Hwan LEE ,  Byoung-Youl MIN ,  Myung-Sam KANG ,  Moon-II KIM ,  Hyung-Tae KIM

IPC: H05K3/30

CPC classification number: H05K1/185 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/8385 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2225/06524 ,  H01L2225/06589 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/056 ,  H05K3/4608 ,  H05K2201/10515 ,  Y10T29/4913 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00

Abstract: A method of manufacturing a printed circuit board having embedded electronic components, the method including: mounting a first electronic component on one side of a core sheet and mounting a second electric component on the other side of the core sheet such that the second electronic component overlaps the first electronic component; stacking a first insulation layer on one side of the core sheet such that the first insulation layer covers the first electronic component and stacking a second insulation layer on the other side of the core sheet such that the second insulation layer covers the second electronic component; and forming a circuit pattern on a surface of the first insulation layer or the second insulation layer.

Abstract translation: 一种制造具有嵌入式电子部件的印刷电路板的方法，所述方法包括：将第一电子部件安装在芯片的一侧，并将第二电气部件安装在芯板的另一侧，使得第二电子部件重叠 第一个电子元件; 在芯片的一侧堆叠第一绝缘层，使得第一绝缘层覆盖第一电子部件，并且在芯片的另一侧堆叠第二绝缘层，使得第二绝缘层覆盖第二电子部件; 以及在所述第一绝缘层或所述第二绝缘层的表面上形成电路图案。

公开(公告)号：US20080314863A1

公开(公告)日：2008-12-25

申请号：US12203081

申请日：2008-09-02

Applicant: Young Woo Kim ,  Byoung Youl Min ,  Chang Myung Ryu ,  Woo Lim Chae ,  Han Kim

Inventor： Young Woo Kim ,  Byoung Youl Min ,  Chang Myung Ryu ,  Woo Lim Chae ,  Han Kim

IPC: C23F1/00

CPC classification number: H05K1/162 ,  H05K3/0047 ,  H05K3/427 ,  H05K2201/0187 ,  H05K2201/09645 ,  H05K2201/09836 ,  H05K2201/09981 ,  H05K2203/1476 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: Disclosed is a PCB including an embedded capacitor and a method of fabricating the same. The long embedded capacitor is formed through an insulating layer, making a high capacitance and various capacitance designs possible.

Abstract translation: 公开了一种包括嵌入式电容器的PCB及其制造方法。 长的嵌入式电容器通过绝缘层形成，使得高电容和各种电容设计成为可能。