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公开(公告)号：US07971352B2
公开(公告)日：2011-07-05
申请号：US12213465
申请日：2008-06-19
申请人： Shuhichi Okabe , Jin-Yong An , Seok-Kyu Lee , Soon-Oh Jung , Jong-Kuk Hong , Hae-Nam Seo
发明人： Shuhichi Okabe , Jin-Yong An , Seok-Kyu Lee , Soon-Oh Jung , Jong-Kuk Hong , Hae-Nam Seo
CPC分类号： H05K3/4682 , H05K3/108 , H05K3/205 , H05K3/3473 , H05K2201/0367 , H05K2203/0376 , H05K2203/043 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49144 , Y10T29/49149
摘要： A method of manufacturing a printed circuit board having solder balls. The method may include: stacking a second carrier, in which at least one hole is formed, over one side of a first carrier; forming at least one solder bump by filling the hole with a conductive material; forming a circuit pattern layer, which is electrically connected with the solder bump, on the second carrier; and exposing the solder bump by removing the first carrier and the second carrier. Using this method, uniform hemispherical solder balls with fine pitch can be formed as a part of the manufacturing process, without having to attach the solder balls separately. Carriers may be used to serve as supports during the manufacturing process, whereby deformations can be prevented in the board.
摘要翻译： 一种制造具有焊球的印刷电路板的方法。 该方法可以包括：在第一载体的一侧堆叠形成有至少一个孔的第二载体; 通过用导电材料填充孔而形成至少一个焊料凸块; 在所述第二载体上形成与所述焊料凸块电连接的电路图案层; 以及通过去除所述第一载体和所述第二载体来暴露所述焊料凸块。 使用这种方法，可以形成具有细间距的均匀的半球形焊球作为制造过程的一部分，而不必分别附接焊球。 可以在制造过程中使用载体作为支撑体，从而可以防止板的变形。
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公开(公告)号：US20090151160A1
公开(公告)日：2009-06-18
申请号：US12213465
申请日：2008-06-19
申请人： Shuhichi Okabe , Jin-Yong An , Seok-Kyu Lee , Soon-Oh Jung , Jong-Kuk Hong , Hae-Nam Seo
发明人： Shuhichi Okabe , Jin-Yong An , Seok-Kyu Lee , Soon-Oh Jung , Jong-Kuk Hong , Hae-Nam Seo
CPC分类号： H05K3/4682 , H05K3/108 , H05K3/205 , H05K3/3473 , H05K2201/0367 , H05K2203/0376 , H05K2203/043 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49144 , Y10T29/49149
摘要： A method of manufacturing a printed circuit board having solder balls. The method may include: stacking a second carrier, in which at least one hole is formed, over one side of a first carrier; forming at least one solder bump by filling the hole with a conductive material; forming a circuit pattern layer, which is electrically connected with the solder bump, on the second carrier; and exposing the solder bump by removing the first carrier and the second carrier. Using this method, uniform hemispherical solder balls with fine pitch can be formed as a part of the manufacturing process, without having to attach the solder balls separately. Carriers may be used to serve as supports during the manufacturing process, whereby deformations can be prevented in the board.
摘要翻译： 一种制造具有焊球的印刷电路板的方法。 该方法可以包括：在第一载体的一侧堆叠形成有至少一个孔的第二载体; 通过用导电材料填充孔而形成至少一个焊料凸块; 在所述第二载体上形成与所述焊料凸块电连接的电路图案层; 以及通过去除所述第一载体和所述第二载体来暴露所述焊料凸块。 使用这种方法，可以形成具有细间距的均匀的半球形焊球作为制造过程的一部分，而不必分别附接焊球。 可以在制造过程中使用载体作为支撑体，从而可以防止板的变形。
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公开(公告)号：US20090084494A1
公开(公告)日：2009-04-02
申请号：US12007475
申请日：2008-01-10
申请人： Jin-Yong An , Joon-Sung Kim , Jong-Kuk Hong , Chang-Sup Ryu
发明人： Jin-Yong An , Joon-Sung Kim , Jong-Kuk Hong , Chang-Sup Ryu
IPC分类号： B29C65/00
CPC分类号： H01L21/6835 , H01L21/4857 , H01L2221/68318 , H01L2221/68345 , H05K3/0052 , H05K3/0058 , H05K3/025 , H05K3/20 , H05K3/4682 , H05K2201/09481 , H05K2201/09563 , H05K2203/0152 , H05K2203/0228 , H05K2203/0384 , Y10T156/1052
摘要： A substrate manufacturing method is disclosed. A substrate manufacturing method, comprising: providing a support body on which a first separation layer is formed; forming a second separation layer on the first separation layer; forming an adhesion layer which covers the first separation layer and the second separation layer; forming a circuit stack body on the adhesion layer; cutting the circuit stack body, the adhesion layer and the second separation layer to a pre-determined shape; and forming a circuit stack unit by separating the second layer from the first layer, provides easy separation of the circuit stack pattern, which formed on the support body, from the support body and reduced manufacturing cost by reducing number of process and required materials for manufacturing coreless thin substrate.
摘要翻译： 公开了一种基板制造方法。 一种基板制造方法，包括：提供其上形成有第一分离层的支撑体; 在所述第一分离层上形成第二分离层; 形成覆盖所述第一分离层和所述第二分离层的粘合层; 在所述粘合层上形成电路堆叠体; 将电路堆叠体，粘合层和第二分离层切割成预定形状; 并且通过将第二层与第一层分开来形成电路堆叠单元，使形成在支撑体上的电路堆叠图形容易地从支撑体分离，并通过减少工艺数量和所需的制造材料来减少制造成本 无芯薄基板。
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4.发明申请Printed circuit board having embedded resistors and method of manufacturing the same 审中-公开具有嵌入式电阻器的印刷电路板及其制造方法公开(公告)号：US20080110669A1
公开(公告)日：2008-05-15
申请号：US11976760
申请日：2007-10-26
申请人： Hwa Sun Park , Tae Eui Kim , Jong Kuk Hong , Sang Jin Baek , Hong Won Kim , Jin Soo Jeong
发明人： Hwa Sun Park , Tae Eui Kim , Jong Kuk Hong , Sang Jin Baek , Hong Won Kim , Jin Soo Jeong
CPC分类号： H05K1/167 , H05K1/095 , H05K3/4069 , H05K3/4644 , H05K2201/09481 , Y10T29/435 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： Disclosed herein is a Printed Circuit Board (PCB) having embedded resistors and a method of manufacturing the same, in which contact pads are formed by filling via holes formed on electrode pads with oxidation-resistant conductive material, and resistors are formed on the contact pads. Accordingly, erosion that occurs between the electrode pads and the resistors can be prevented using the contact pads made of oxidation-resistant conductive material, and connections between circuits also can be realized. Furthermore, resistors are formed on a flat plane without any difference in height, attributable to the electrode pads, and thus differences between the resistance values of the built-in resistors can be greatly reduced.
摘要翻译： 本文公开了具有嵌入式电阻器的印刷电路板（PCB）及其制造方法，其中通过在电极焊盘上形成的具有抗氧化导电材料的孔填充形成接触焊盘，并且在接触焊盘上形成电阻器 。 因此，可以使用由抗氧化导电材料制成的接触垫来防止在电极焊盘和电阻器之间发生的侵蚀，并且还可以实现电路之间的连接。 此外，电阻器形成在平面上，由于电极焊盘而在高度上没有任何差异，因此可以大大降低内置电阻器的电阻值之间的差异。
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5.发明申请Printed circuit board including embedded capacitor having high dielectric constant and method of fabricating same 失效印刷电路板包括具有高介电常数的嵌入式电容器及其制造方法公开(公告)号：US20060044734A1
公开(公告)日：2006-03-02
申请号：US10999442
申请日：2004-11-29
申请人： Jin-Yong Ahn , Chang-Sup Ryu , Suk-Hyeon Cho , Seok-Kyu Lee , Jong-Kuk Hong , Ho-Sik Jun
发明人： Jin-Yong Ahn , Chang-Sup Ryu , Suk-Hyeon Cho , Seok-Kyu Lee , Jong-Kuk Hong , Ho-Sik Jun
IPC分类号： H01G4/20
CPC分类号： H05K1/162 , H01G4/1209 , H01G4/1218 , H01G4/248 , H01G4/33 , H05K3/4652 , H05K2201/0175 , H05K2201/0179 , H05K2201/0195 , H05K2201/09509 , H05K2201/09763 , H05K2201/09881 , H05K2203/0568 , H05K2203/1366 , Y10T29/42
摘要： Disclosed is a PCB including embedded capacitors and a method of fabricating the same. A dielectric layer is formed using a ceramic material having a high capacitance, thereby assuring that the capacitors each have a high dielectric constant corresponding to the capacitance of a decoupling chip capacitor.
摘要翻译： 公开了一种包括嵌入式电容器的PCB及其制造方法。 使用具有高电容的陶瓷材料形成电介质层，从而确保电容器各自具有对应于去耦芯片电容器的电容的高介电常数。
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公开(公告)号：US20050175385A1
公开(公告)日：2005-08-11
申请号：US10770806
申请日：2004-02-03
申请人： Suk-Hyun Cho , Jang-Kyu Kang , Byung-Kook Sun , Jong-Kuk Hong , Seok-Kyu Lee , Jin-Yong Ahn
发明人： Suk-Hyun Cho , Jang-Kyu Kang , Byung-Kook Sun , Jong-Kuk Hong , Seok-Kyu Lee , Jin-Yong Ahn
IPC分类号： H05K3/30 , B23K26/00 , H01L23/12 , H05K1/09 , H05K1/16 , H05K3/06 , H05K3/10 , B23K26/16 , B41J31/00
CPC分类号： H05K1/167 , B23K26/351 , B23K2101/42 , H05K1/095 , H05K3/064 , H05K3/108 , H05K2201/0347 , H05K2203/1461 , Y10T29/49082 , Y10T29/49098 , Y10T29/49101 , Y10T29/49126 , Y10T29/4913 , Y10T29/49151 , Y10T29/49156
摘要： Disclosed is a method of producing a printed circuit board (PCB) with an embedded resistor, in which a resistor with a desired shape and volume is precisely formed using a resistor paste so that resistance values according to a position of the PCB are uniform, thereby a laser trimming process is omitted or minimally utilized. The method has advantages in that a production time of the PCB is shortened and productivity is improved because an operation condition is rapidly set without being greatly affected by the position precision of a printing device. Other advantages of the method are that the resistor paste with a relatively uniform thickness is secured through a screen printing process, thereby easily forming the resistor and improving resistance tolerance.
摘要翻译： 公开了一种制造具有嵌入式电阻器的印刷电路板（PCB）的方法，其中使用电阻浆料精确地形成具有期望形状和体积的电阻器，使得根据PCB的位置的电阻值是均匀的，从而 激光修整过程被省略或最小程度地利用。 该方法的优点在于，由于操作条件快速设定而不受打印装置的位置精度的极大影响，PCB的生产时间缩短并提高了生产率。 该方法的其他优点是通过丝网印刷工艺确保具有相对均匀厚度的电阻浆料，从而容易地形成电阻器并提高电阻公差。
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公开(公告)号：US08051559B2
公开(公告)日：2011-11-08
申请号：US12232820
申请日：2008-09-24
申请人： Ki-Hwan Kim , Jong-Kuk Hong , Jin-Yong An
发明人： Ki-Hwan Kim , Jong-Kuk Hong , Jin-Yong An
CPC分类号： H05K3/4682 , H05K3/0097 , H05K3/205 , H05K3/28 , H05K2203/0152 , H05K2203/1536 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： A method of manufacturing a multi-layer board is disclosed. The method may include forming a detachable separation layer over a support; forming a first solder resist layer over the separation layer; stacking a metal foil over the first solder resist layer; forming a circuit pattern over the metal foil; forming an insulation part over the first solder resist layer such that the circuit pattern is covered; forming a second solder resist layer over the insulation part; and separating a circuit stack unit, which includes the first solder resist layer, the metal foil, the circuit pattern, the insulation part, and the second solder resist layer, from the support by disconnecting the separation layer and the support. This method uses a simple process to reduce manufacture costs and shorten manufacture times.
摘要翻译： 公开了制造多层板的方法。 该方法可以包括在载体上形成可分离的分离层; 在所述分离层上形成第一阻焊层; 在第一阻焊层上堆叠金属箔; 在金属箔上形成电路图案; 在所述第一阻焊层上形成绝缘部分，使得所述电路图案被覆盖; 在所述绝缘部分上形成第二阻焊层; 以及通过断开分离层和支撑体从支撑件分离包括第一阻焊层，金属箔，电路图案，绝缘部分和第二阻焊层的电路堆叠单元。 该方法采用简单的方法降低制造成本，缩短制造时间。
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公开(公告)号：US20110097553A1
公开(公告)日：2011-04-28
申请号：US12631624
申请日：2009-12-04
申请人： Jong Kuk Hong , Soon Jin Cho , Sun Uk Hwang
发明人： Jong Kuk Hong , Soon Jin Cho , Sun Uk Hwang
CPC分类号： H05K3/0032 , H05K1/036 , H05K1/0366 , H05K3/045 , H05K3/107 , H05K2201/0209 , H05K2201/029 , Y10T428/2462
摘要： Disclosed is a trench substrate, which includes a first insulating layer having trenches formed therein, a second insulating layer disposed on a lower surface of the first insulating layer and having laser processability inferior to that of the first insulating layer, and a negative pattern formed in the trenches, and in which the second insulating layer having laser processability inferior to that of the first insulating layer functions as a stopper, so that the trenches having the same shape are formed in the first insulating layer, thus enabling the formation of a fine and uniform circuit pattern. A method of fabricating the trench substrate is also provided.
摘要翻译： 公开了一种沟槽衬底，其包括其中形成有沟槽的第一绝缘层，设置在第一绝缘层的下表面上并且具有劣于第一绝缘层的激光加工性的第二绝缘层，以及形成在 沟槽，其中具有劣于第一绝缘层的激光加工性的第二绝缘层用作止动件，使得具有相同形状的沟槽形成在第一绝缘层中，从而能够形成微细的和 均匀的电路图案。 还提供了制造沟槽衬底的方法。
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公开(公告)号：US20090236125A1
公开(公告)日：2009-09-24
申请号：US12232820
申请日：2008-09-24
申请人： Ki-Hwan Kim , Jong-Kuk Hong , Jin-Yong An
发明人： Ki-Hwan Kim , Jong-Kuk Hong , Jin-Yong An
CPC分类号： H05K3/4682 , H05K3/0097 , H05K3/205 , H05K3/28 , H05K2203/0152 , H05K2203/1536 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： A method of manufacturing a multi-layer board is disclosed. The method may include forming a detachable separation layer over a support; forming a first solder resist layer over the separation layer; stacking a metal foil over the first solder resist layer; forming a circuit pattern over the metal foil; forming an insulation part over the first solder resist layer such that the circuit pattern is covered; forming a second solder resist layer over the insulation part; and separating a circuit stack unit, which includes the first solder resist layer, the metal foil, the circuit pattern, the insulation part, and the second solder resist layer, from the support by disconnecting the separation layer and the support. This method uses a simple process to reduce manufacture costs and shorten manufacture times.
摘要翻译： 公开了制造多层板的方法。 该方法可以包括在载体上形成可分离的分离层; 在所述分离层上形成第一阻焊层; 在第一阻焊层上堆叠金属箔; 在金属箔上形成电路图案; 在所述第一阻焊层上形成绝缘部分，使得所述电路图案被覆盖; 在所述绝缘部分上形成第二阻焊层; 以及通过断开分离层和支撑体从支撑件分离包括第一阻焊层，金属箔，电路图案，绝缘部分和第二阻焊层的电路堆叠单元。 该方法采用简单的方法降低制造成本，缩短制造时间。
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公开(公告)号：US20090073670A1
公开(公告)日：2009-03-19
申请号：US12076358
申请日：2008-03-17
申请人： Jong-Kuk Hong , Jin-Yong An , Jae-Joon Lee
发明人： Jong-Kuk Hong , Jin-Yong An , Jae-Joon Lee
CPC分类号： H05K1/0271 , H05K1/09 , H05K3/205 , H05K3/207 , H05K3/4602 , H05K3/4644 , H05K2201/0352 , H05K2201/09781 , H05K2203/0152 , Y10T29/49126 , Y10T29/49165
摘要： A multilayered printed circuit board and a fabricating method thereof are disclosed. A method that includes repeating processes of forming at least one circuit pattern, and at least one insulation layer that covers the circuit pattern, over a carrier and interconnecting circuit patterns on different layers with vias; stacking a metal stiffener over the insulation layer; repeating processes of forming at least one insulation layer and at least one circuit pattern over the stiffener and interconnecting circuit patterns on different layers with vias; and removing the carrier, can be used to reduce warpage in the board and improve workability.
摘要翻译： 公开了一种多层印刷电路板及其制造方法。 一种方法，其包括在载体上形成至少一个电路图案的重复处理和覆盖电路图案的至少一个绝缘层，并且在具有通孔的不同层上互连电路图案; 在绝缘层上堆叠金属加强件; 在加强件上形成至少一个绝缘层和至少一个电路图案的重复工艺，并且在具有通孔的不同层上互连电路图案; 并拆卸载体，可用于减少电路板翘曲，提高可加工性。
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