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36 条记录 (耗时 0.029 秒)

    Small form factor transmitting device
    2.
    发明授权
    Small form factor transmitting device 有权

    公开(公告)号：US10141717B2

    公开(公告)日：2018-11-27

    申请号：US15855927

    申请日：2017-12-27

    申请人： INPHI CORPORATION ,  Luxnet Corporation

    发明人： Radhakrishnan L. Nagarajan ,  Peng-Chih Li ,  Pi-Cheng Law

    IPC分类号： H04B10/50 ,  G02B6/42 ,  H01S5/00 ,  H01S5/022 ,  H01S5/024 ,  H01S5/068 ,  H01S5/06 ,  H01S5/125

    摘要： A packaged transmitter device includes a base member comprising a planar part mounted with a thermoelectric cooler, a transmitter, and a coupling lens assembly, and an assembling part connected to one side of the planar part. The device further includes a circuit board bended to have a first end region and a second end region being raised to a higher level. The first end region disposed on a top surface of the planar part includes multiple electrical connection patches respectively connected to the thermoelectric and the transmitter. The second end region includes an electrical port for external connection. Additionally, the device includes a cover member disposed over the planar part. Furthermore, the device includes a cylindrical member installed to the assembling part for enclosing an isolator aligned to the coupling lens assembly along its axis and connected to a fiber to couple optical signal from the transmitter to the fiber.

    PACKAGE STRUCTURE OF OPTICAL TRANSCEIVER COMPONENT
    5.
    发明申请
    PACKAGE STRUCTURE OF OPTICAL TRANSCEIVER COMPONENT 有权
    光收发器组件的包装结构

    公开(公告)号：US20140239315A1

    公开(公告)日：2014-08-28

    申请号：US14183328

    申请日：2014-02-18

    申请人： LUXNET CORPORATION

    发明人： Yun-Cheng HUANG ,  Chien-Wen LU ,  Chung Hsin FU ,  Chi-Min TING ,  Tsing-Chow WANG

    IPC分类号： H01L33/48

    CPC分类号： H01L25/167 ,  H01L24/48 ,  H01L24/85 ,  H01L25/0753 ,  H01L27/14685 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/173 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

    摘要： The invention provides a package structure of optical transceiver component, comprising: a metal base; a plurality of pins, at least one optical emitting diode and/or at least one optical receiving diode; wherein the pins are provided and passed through the metal base and insulated with the metal base by using an insulating material; the optical emitting diode and the optical receiving diode are each mounted on the metal base through a sub-mount, respectively. The optical emitting diode/optical receiving diode is connected to the pins neighboring therewith by a wire directly or through the sub-mount, when set the top surface of the pins be a reference level, at least one of the top surfaces of the optical emitting diode, the optical receiving diode, and sub-mount is flush with the reference level.

    摘要翻译： 本发明提供一种光收发器部件的封装结构，包括：金属基座; 多个引脚，至少一个发光二极管和/或至少一个光接收二极管; 其中所述销被提供并通过所述金属基底并且通过使用绝缘材料与所述金属基底绝缘; 光发射二极管和光接收二极管分别通过子座安装在金属基座上。 当将发射二极管/光接收二极管的顶表面设置为基准电平时，光发射二极管/光接收二极管通过电线直接或穿过子座连接到与其相邻的引脚，发光的顶表面中的至少一个 二极管，光接收二极管和子座与基准电平齐平。

    Electrode stack structure capable of preventing moisture from entering photodiode
    6.
    发明授权
    Electrode stack structure capable of preventing moisture from entering photodiode 有权

    公开(公告)号：US10283652B1

    公开(公告)日：2019-05-07

    申请号：US16012252

    申请日：2018-06-19

    申请人： LuxNet Corporation

    发明人： Kuo-Hao Lee ,  Tsung-Chi Hsu ,  Ming-Chih Lai

    IPC分类号： H01L31/02 ,  H01L31/0203 ,  H01L31/0216 ,  H01L27/12 ,  H01L31/0224

    摘要： The present invention provides an electrode stack structure capable of preventing moisture from entering a photodiode, comprising: a semiconductor layer; an inner electrode layer provided on the semiconductor layer; a dielectric layer coating a sidewall of the semiconductor layer; an intermediate metal layer provided on, bonded to, and in electrical conduction with the inner electrode layer, wherein the intermediate metal layer has a bottom side extending over and covering a portion of the dielectric layer to provide airtightness; and an anti-reflection layer coating on an outer side of the semiconductor layer, an outer side of the intermediate metal layer, and an outer side of the dielectric layer, with a groove formed in the anti-reflection layer by leaving a predetermined area of a top side of the intermediate metal layer uncoated or by removing a portion of the anti-reflection layer that coats the predetermined area of the top side of the intermediate metal layer, and an outer electrode layer plated on the predetermined area of the top side of the intermediate metal layer.

    Optical transmitter with a heat dissipation structure
    8.
    发明授权
    Optical transmitter with a heat dissipation structure 有权

    公开(公告)号：US09991674B2

    公开(公告)日：2018-06-05

    申请号：US15354261

    申请日：2016-11-17

    申请人： LuxNet Corporation

    发明人： Pi-Cheng Law ,  Po-Chao Huang ,  Hsing-Yen Lin ,  Chung-Hsin Fu ,  Hua-Hsin Su

    IPC分类号： H01S5/024 ,  H01S5/022

    CPC分类号： H01S5/02469 ,  H01S5/0064 ,  H01S5/02208 ,  H01S5/02212 ,  H01S5/02276 ,  H01S5/02284 ,  H01S5/02288 ,  H01S5/02296 ,  H01S5/02438 ,  H01S5/02492

    摘要： An optical transmitter with a heat dissipation structure is provided. The heat dissipation structure comprises a substrate and an optical transmitter unit. The substrate comprises a base body, a heat dissipation well disposed on the base body, and a thermal conductive block inserted into and fixed to the heat dissipation well. The thermal conductive block has on one side thereof a heat guiding plane. The optical transmitter unit comprises a heat dissipating substrate directly disposed on the heat guiding plane, and a laser diode directly disposed on the heat dissipating substrate. The laser diode features an active region whose height is lowered to shorten a heat conduction path wherein heat is transferred from the active region through the heat dissipating substrate to the heat guiding plane. The heat already transferred to the heat guiding plane is transferred horizontally by the thermal conductive block to the base body which encloses the heat dissipation well.

    Optical transmitter package structure
    9.
    发明授权
    Optical transmitter package structure 有权
    光发射机封装结构

    公开(公告)号：US09400359B1

    公开(公告)日：2016-07-26

    申请号：US14707743

    申请日：2015-05-08

    申请人： LuxNet Corporation

    发明人： Chung Hsin Fu ,  Ya Chuan Lin ,  Shu Chun Chang ,  Yun Cheng Huang ,  Hua Hsin Su

    IPC分类号： G02B6/42

    CPC分类号： G02B6/4244 ,  G02B6/4204 ,  G02B6/4208 ,  G02B6/428 ,  G02B6/4284 ,  G02B6/4296

    摘要： An optical transmitter package structure, comprising: a base, a circuit substrate, and a cylindrical light-coupling mechanism. The optical transmitter package structure of the present invention has following advantageous effects: once the packaging process of the optical transmitter of the present invention is completed, the resulting structure is compact and airtight. Consequently, the optical transmitter is well protected against moisture during use and has a long service life; the optical transmitter of the present invention has a sturdy overall structure which is resistant to damage by improper operation during assembly.

    摘要翻译： 一种光发射器封装结构，包括：基座，电路基板和圆柱形光耦合机构。 本发明的光发射机封装结构具有以下有益效果：一旦本发明的光发射机的封装过程完成，所得结构紧凑且气密。 因此，光发射机在使用过程中受到良好的防潮保护，使用寿命长; 本发明的光发射机具有坚固的整体结构，其在组装期间不利于不正确的操作而受到损坏。