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    MULTILAYER WIRING BOARD
    1.
    发明申请
    MULTILAYER WIRING BOARD 有权
    多层接线板

    公开(公告)号：US20120211271A1

    公开(公告)日：2012-08-23

    申请号：US13399547

    申请日：2012-02-17

    申请人： Takuya HANDO ,  Masahiro INOUE ,  Hajime SAIKI ,  Atsuhiko SUGIMOTO ,  Hidetoshi WADA

    发明人： Takuya HANDO ,  Masahiro INOUE ,  Hajime SAIKI ,  Atsuhiko SUGIMOTO ,  Hidetoshi WADA

    IPC分类号： H05K1/02

    CPC分类号： H05K3/4007 ,  H01L21/6835 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/16 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2924/01084 ,  H05K3/0097 ,  H05K3/4682 ,  H05K2201/0367

    摘要： A multilayer wiring board including a build-up layer, formed from one or more conductor and resin insulation layers that are layered one on top of the other, having conductive pads formed on a surface of at least one resin insulation layer so as to project from the surface are provided. The conductive pads may each include a columnar portion situated at a lower part thereof and a convex portion situated at a higher part thereof, wherein a surface of the convex portion may assume a continual curved shape. A solder layer may be formed over an upper surface of the conductive pads. Certain embodiments make it possible to minimize or eliminate the concentration of stress on the conductive pads, and may inhibit the occurrence of defective connections to a semiconductor element and infliction of damage to the conductive pads.

    摘要翻译： 一种多层布线基板，包括由一层或多层导体和树脂绝缘层形成的堆积层，所述导体和树脂绝缘层层叠在另一层之上，具有形成在至少一层树脂绝缘层的表面上的导电焊盘，以便从 提供表面。 导电垫可以各自包括位于其下部的柱状部分和位于其较高部分的凸部，其中凸部的表面可以呈现连续的弯曲形状。 可以在导电焊盘的上表面上形成焊料层。 某些实施例使得可以最小化或消除导电焊盘上的应力集中，并且可以抑制对半导体元件的不良连接的发生以及对导电焊盘的损坏。

    Multilayered Wiring Substrate
    3.
    发明申请
    Multilayered Wiring Substrate 失效
    多层接线基板

    公开(公告)号：US20110156272A1

    公开(公告)日：2011-06-30

    申请号：US12976427

    申请日：2010-12-22

    申请人： Shinnosuke MAEDA ,  Tetsuo SUZUKI ,  Atsuhiko SUGIMOTO ,  Tatsuya ITO ,  Takuya HANDO ,  Satoshi HIRANO

    发明人： Shinnosuke MAEDA ,  Tetsuo SUZUKI ,  Atsuhiko SUGIMOTO ,  Tatsuya ITO ,  Takuya HANDO ,  Satoshi HIRANO

    IPC分类号： H01L23/48

    CPC分类号： H05K3/3452 ,  H01L23/49811 ,  H01L23/49822 ,  H01L2924/0002 ,  H05K1/113 ,  H05K3/205 ,  H05K3/383 ,  H05K3/4682 ,  H05K2201/068 ,  H05K2201/094 ,  H05K2201/09527 ,  H05K2201/099 ,  H05K2203/0346 ,  H05K2203/0369 ,  H01L2924/00

    摘要： A multilayered wiring substrate, comprising: a plurality of first main surface side connecting terminals arranged in a first main surface of a stack structure; and a plurality of second main surface side connecting terminals being arranged in a second main surface of the stack structure; wherein a plurality of conductor layers are alternately formed in a plurality of stacked resin insulation layers and are operably connected to each other through via conductors tapered such that diameters thereof are widened toward the first or the second main surface, wherein a plurality of openings are formed in an exposed outermost resin insulation layer in the second main surface, and terminal outer surfaces of the second main surface side connecting terminals arranged to match with the plurality of the openings are positioned inwardly from an outer main surface of the exposed outermost resin insulation layer, and edges of terminal inner surfaces are rounded.

    摘要翻译： 一种多层布线基板，包括：布置在堆叠结构的第一主表面中的多个第一主表面侧连接端子; 并且多个第二主表面侧连接端子布置在所述堆叠结构的第二主表面中; 其中多个导体层交替地形成在多个堆叠的树脂绝缘层中，并且通过锥形的通孔导体可操作地连接，使得其直径朝向第一或第二主表面加宽，其中形成多个开口 在第二主表面中暴露的最外层树脂绝缘层中，并且布置成与多个开口相匹配的第二主表面侧连接端子的端子外表面从暴露的最外层树脂绝缘层的外主表面位于内侧， 并且端子内表面的边缘是圆形的。

    MULTILAYER WIRING BOARD
    4.
    发明申请
    MULTILAYER WIRING BOARD 有权
    多层接线板

    公开(公告)号：US20120186863A1

    公开(公告)日：2012-07-26

    申请号：US13355916

    申请日：2012-01-23

    申请人： Masahiro INOUE ,  Hajime SAIKI ,  Atsuhiko SUGIMOTO ,  Takuya HANDO ,  Hidetoshi WADA

    发明人： Masahiro INOUE ,  Hajime SAIKI ,  Atsuhiko SUGIMOTO ,  Takuya HANDO ,  Hidetoshi WADA

    IPC分类号： H05K1/02

    CPC分类号： H05K1/111 ,  H01L23/12 ,  H01L23/32 ,  H01L24/00 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2224/81385 ,  H01L2224/81815 ,  H05K1/113 ,  H05K3/0097 ,  H05K3/244 ,  H05K3/3436 ,  H05K3/4007 ,  H05K3/4682 ,  H05K2201/09745 ,  Y02P70/611

    摘要： A multilayer wiring board including a build-up layer comprising a conductor layer and a resin insulation layer that are alternately layered, conductive pads formed on a surface of a resin insulation layer so as to project from the surface, and a solder layer formed over an upper surface of each of the conductive pads is provided. The upper surface of the conductive pads may have a recess, and the entire surface of the solder layer may be situated at an elevated position with respect to an outer periphery portion of the upper surface. Embodiments make it possible to feed and hold a sufficient amount of solder paste on the upper surface of conductive pads, thereby minimizing or eliminating the occurrence of defective connections to a semiconductor element and damage to the solder layer caused by an insufficient thickness of the solder layer.

    摘要翻译： 一种多层布线基板，包括：交替层叠导体层和树脂绝缘层的堆积层，形成在表面突出的树脂绝缘层的表面的导电性焊盘，以及形成在 提供每个导电焊盘的上表面。 导电焊盘的上表面可以具有凹部，并且焊料层的整个表面可以相对于上表面的外周部分位于升高位置。 实施例使得可以在导电焊盘的上表面上馈送和保持足够量的焊膏，从而最小化或消除与半导体元件的不良连接的发生以及由焊料层的厚度不足引起的焊料层的损坏 。

    Multilayer Wiring Substrate
    5.
    发明申请
    Multilayer Wiring Substrate 审中-公开
    多层接线基板

    公开(公告)号：US20110155438A1

    公开(公告)日：2011-06-30

    申请号：US12978750

    申请日：2010-12-27

    申请人： Tatsuya ITO ,  Tetsuo SUZUKI ,  Takuya HANDO ,  Shinnosuke MAEDA ,  Atsuhiko SUGIMOTO ,  Satoshi HIRANO

    发明人： Tatsuya ITO ,  Tetsuo SUZUKI ,  Takuya HANDO ,  Shinnosuke MAEDA ,  Atsuhiko SUGIMOTO ,  Satoshi HIRANO

    IPC分类号： H05K1/11

    CPC分类号： H05K3/4682 ,  H05K1/113 ,  H05K3/4007 ,  H05K2201/094 ,  H05K2201/09427 ,  H05K2201/09472

    摘要： A multilayer wiring substrate has a multilayer wiring laminate portion in which a plurality of resin insulation layers made primarily of the same resin insulation material, and a plurality of conductive layers are laminated alternately. A plurality of first-main-surface-side connection terminals are disposed on one side of the laminate structure where a first main surface thereof is present, and a plurality of second-main-surface-side connection terminals being disposed on an other side of the laminate structure where a second main surface thereof is present. The plurality of conductive layers are formed in the plurality of resin insulation layers and interconnected by means of via conductors whose diameters increase toward the first main surface or the second main surface. The plurality of first-main-surface-side connection terminals comprising at least two types of terminals for connection of different articles-to-be-connected. Top surfaces of the plurality of first-main-surface-side connection terminals differ in height according to types of the articles-to-be-connected.

    摘要翻译： 多层布线基板具有多层布线层叠部，其中主要由相同树脂绝缘材料制成的多个树脂绝缘层和多个导电层交替层叠。 多个第一主表面侧连接端子设置在层叠结构的存在第一主表面的一侧上，并且多个第二主表面侧连接端子设置在 其中存在第二主表面的层压结构。 多个导电层形成在多个树脂绝缘层中，并且通过直径朝向第一主表面或第二主表面增大的通孔导体互连。 多个第一主表面侧连接端子包括用于连接不同待连接物品的至少两种类型的端子。 多个第一主表面侧连接端子的顶表面根据要连接的物品的类型而不同。

    Wiring substrate and stiffener therefor
    7.
    发明授权
    Wiring substrate and stiffener therefor 失效
    接线基板和加强件

    公开(公告)号：US06391422B1

    公开(公告)日：2002-05-21

    申请号：US09579140

    申请日：2000-05-30

    申请人： Seiji Mori ,  Takuya Hando

    发明人： Seiji Mori ,  Takuya Hando

    IPC分类号： B32B302

    CPC分类号： H01L23/16 ,  H01L23/142 ,  H01L23/36 ,  H01L23/49816 ,  H01L23/49894 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  Y10S428/901 ,  Y10T428/24273 ,  Y10T428/31678 ,  Y10T428/31681

    摘要： A wiring substrate includes a wiring substrate body and a stiffener. The latter is formed from a rolled metallic sheet and is bonded to a first main surface of the wiring substrate body. The stiffener has a boundary profile, in a plan view, which is substantially identical to that of the wiring substrate body, and a first direction of the boundary profile of the stiffener or the wiring substrate body intersects the rolling direction of the stiffener at an angle. This construction reduces the amount of deformation of the wiring substrate produced by bonding of the stiffener to the wiring substrate body and/or caused by temperature variations experienced by the construction. Because of this reduction in deformation, the wiring substrate provides improved reliability with respect to connections made to an electronic component mounted thereon as well as improved reliability with respect to connections made to another printed wiring board.

    摘要翻译： 布线基板包括布线基板主体和加强件。 后者由轧制的金属板形成并且接合到布线基板主体的第一主表面。 加强件在平面图中具有与布线基板主体相同的边界轮廓，并且加强件或布线基板主体的边界轮廓的第一方向以一定角度与加强件的滚动方向相交 。 这种结构减小了通过将加强件接合到布线基板主体而产生的布线基板的变形量和/或由该结构所经历的温度变化引起的变形量。 由于这种变形的减小，布线基板相对于安装在其上的电子部件的连接提供了改进的可靠性以及相对于与另一印刷电路板的连接相比提高的可靠性。

    Multilayered wiring substrate
    9.
    发明授权
    Multilayered wiring substrate 失效
    多层布线基板

    公开(公告)号：US08581388B2

    公开(公告)日：2013-11-12

    申请号：US12976427

    申请日：2010-12-22

    申请人： Shinnosuke Maeda ,  Tetsuo Suzuki ,  Atsuhiko Sugimoto ,  Tatsuya Ito ,  Takuya Hando ,  Satoshi Hirano

    发明人： Shinnosuke Maeda ,  Tetsuo Suzuki ,  Atsuhiko Sugimoto ,  Tatsuya Ito ,  Takuya Hando ,  Satoshi Hirano

    IPC分类号： H01L23/053 ,  H01L21/4763

    CPC分类号： H05K3/3452 ,  H01L23/49811 ,  H01L23/49822 ,  H01L2924/0002 ,  H05K1/113 ,  H05K3/205 ,  H05K3/383 ,  H05K3/4682 ,  H05K2201/068 ,  H05K2201/094 ,  H05K2201/09527 ,  H05K2201/099 ,  H05K2203/0346 ,  H05K2203/0369 ,  H01L2924/00

    摘要： A multilayered wiring substrate, comprising: a plurality of first main surface side connecting terminals arranged in a first main surface of a stack structure; and a plurality of second main surface side connecting terminals being arranged in a second main surface of the stack structure; wherein a plurality of conductor layers are alternately formed in a plurality of stacked resin insulation layers and are operably connected to each other through via conductors tapered such that diameters thereof are widened toward the first or the second main surface, wherein a plurality of openings are formed in an exposed outermost resin insulation layer in the second main surface, and terminal outer surfaces of the second main surface side connecting terminals arranged to match with the plurality of the openings are positioned inwardly from an outer main surface of the exposed outermost resin insulation layer, and edges of terminal inner surfaces are rounded.

    摘要翻译： 一种多层布线基板，包括：布置在堆叠结构的第一主表面中的多个第一主表面侧连接端子; 并且多个第二主表面侧连接端子布置在所述堆叠结构的第二主表面中; 其中多个导体层交替地形成在多个堆叠的树脂绝缘层中，并且通过锥形的通孔导体可操作地连接，使得其直径朝向第一或第二主表面加宽，其中形成多个开口 在第二主表面中暴露的最外层树脂绝缘层中，并且布置成与多个开口相匹配的第二主表面侧连接端子的端子外表面从暴露的最外层树脂绝缘层的外主表面位于内侧， 并且端子内表面的边缘是圆形的。