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公开(公告)号：US20180282891A1
公开(公告)日：2018-10-04
申请号：US15941316
申请日：2018-03-30
发明人： Tomota Nagaura , Masafumi Ishii
摘要： Copper sulfate which includes an Al with a concentration of 0.08 ppm by mass or less.
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2.发明申请Carrier-Attached Copper Foil, Laminate, Method For Manufacturing Printed-Wiring Board And Method For Manufacturing Electronic Device 审中-公开载体铜箔，层压板，制造印刷线路板的方法和制造电子装置的方法公开(公告)号：US20170032978A1
公开(公告)日：2017-02-02
申请号：US15218466
申请日：2016-07-25
发明人： Terumasa Moriyama , Tomota Nagaura
CPC分类号： H01L21/4857 , C25D1/04 , C25D3/18 , C25D3/38 , C25D3/562 , C25D3/58 , C25D5/022 , C25D5/10 , C25D9/08 , H01L21/486 , H01L23/49866 , H05K3/025 , H05K3/205 , H05K3/4007 , H05K3/421 , H05K2201/0154 , H05K2201/0355 , H05K2201/0367 , H05K2201/0376 , H05K2201/09509 , H05K2203/0152 , H05K2203/0156 , H05K2203/0307 , H05K2203/0723 , H05K2203/0726 , Y10T428/12431 , Y10T428/12438 , Y10T428/12472
摘要： A carrier-attached copper foil having good circuit formability is provided. The carrier-attached copper foil has a carrier, an intermediate layer and an ultra-thin copper layer in this order, the average grain size of crystal grains that form the ultra-thin copper layer is 1.05 to 6.5 μm, and a ten point average roughness Rz of a surface on a side of the ultra-thin copper layer is 0.1 to 2.0 μm.
摘要翻译： 提供具有良好电路成形性的载体附着铜箔。 载体附着铜箔依次具有载体，中间层和超薄铜层，形成超薄铜层的晶粒的平均粒径为1.05〜6.5μm，十点平均 超薄铜层侧表面的粗糙度Rz为0.1〜2.0μm。
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3.发明授权Copper foil with carrier, method of producing same, copper foil with carrier for printed wiring board, and printed wiring board 有权带有载体的铜箔，其制造方法，用于印刷线路板的载体的铜箔和印刷线路板公开(公告)号：US09578741B2
公开(公告)日：2017-02-21
申请号：US14388381
申请日：2013-03-26
IPC分类号： H05K3/38 , H05K3/18 , H05K3/02 , H05K3/06 , H05K1/03 , H05K1/09 , B32B15/20 , B32B3/30 , B32B15/01 , C22C9/00 , B32B15/08
CPC分类号： H05K1/09 , B32B3/30 , B32B15/01 , B32B15/08 , B32B15/20 , B32B2307/306 , B32B2307/714 , B32B2457/08 , C22C9/00 , C25D1/04 , C25D3/12 , C25D3/38 , C25D5/12 , C25D9/08 , H05K1/0313 , H05K3/022 , H05K3/025 , H05K3/06 , H05K3/181 , H05K3/188 , H05K3/381 , H05K3/383 , H05K3/388 , H05K2201/09009 , Y10T428/12549 , Y10T428/12569 , Y10T428/12611 , Y10T428/12792 , Y10T428/12847 , Y10T428/12903 , Y10T428/1291
摘要： Provided is a copper foil for a printed wiring board including a roughened layer on at least one surface thereof. In the roughened layer, the average diameter D1 at the particle bottom being apart from the bottom of each particle by 10% of the particle length is 0.2 to 1.0 μm, and the ratio L1/D1 of the particle length L1 to the average diameter D1 at the particle bottom is 15 or less. In the copper foil for printed wiring board, when a copper foil for printed wiring having a roughened layer is laminated to a resin and then the copper layer is removed by etching, the sum of areas of holes accounting for the resin roughened surface having unevenness is 20% or more. The present invention involves the development of a copper foil for a semiconductor package substrate that can avoid circuit erosion without causing deterioration in other properties of the copper foil. In particular, an object of the present invention is to provide a copper foil for a printed wiring board and a method of producing the copper foil, in which the adhesion strength between the copper foil and the resin can be enhanced by improvement of the roughened layer of the copper foil.
摘要翻译： 提供一种用于印刷电路板的铜箔，其在其至少一个表面上包括粗糙层。 在粗糙层中，粒子底部的平均粒径D1与粒子的底部相隔10％的粒子长度为0.2〜1.0μm，粒子长度L1与平均直径D1的比L1 / D1 在颗粒底部为15或更小。 在印刷电路板用铜箔中，当将具有粗糙层的印刷布线用铜箔层压到树脂上，然后通过蚀刻除去铜层时，占据具有凹凸的树脂粗糙面的孔面积之和为 20％以上。 本发明涉及开发用于半导体封装基板的铜箔，其可以避免电路侵蚀而不会导致铜箔的其它性能的劣化。 特别地，本发明的目的是提供一种用于印刷线路板的铜箔和铜箔的制造方法，其中可以通过改善粗糙层来提高铜箔和树脂之间的粘附强度 的铜箔。
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4.发明申请Carrier-Attached Copper Foil, Laminate, Method For Manufacturing Printed-Wiring Board And Method For Manufacturing Electronic Device 审中-公开载体铜箔，层压板，制造印刷线路板的方法和制造电子装置的方法公开(公告)号：US20170034926A1
公开(公告)日：2017-02-02
申请号：US15218449
申请日：2016-07-25
发明人： Terumasa Moriyama , Tomota Nagaura
CPC分类号： H05K3/4652 , H05K1/09 , H05K3/007 , H05K3/025 , H05K3/4007 , H05K3/4682 , Y10T428/12431 , Y10T428/12438
摘要： A carrier-attached copper foil having good circuit formability is provided. The carrier-attached copper foil has a carrier, an intermediate layer and an ultra-thin copper layer in this order, the number of crystal grains per unit cross-sectional area of the ultra-thin copper layer in the through-thickness direction is 0.1 to 5 grains/μm2, and a ten point average roughness Rz of a surface on a side of the ultra-thin copper layer is 0.1 to 2.0 μm.
摘要翻译： 提供具有良好电路成形性的载体附着铜箔。 载体附着铜箔依次具有载体，中间层和超薄铜层，超薄铜层的贯通厚度方向的单位截面积的晶粒数为0.1个 至5粒/μm2，超薄铜层侧表面的十点平均粗糙度Rz为0.1〜2.0μm。
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5.发明申请Copper Foil with Carrier, Method of Producing Same, Copper Foil with Carrier for Printed Wiring Board, and Printed Wiring Board 有权带有载体的铜箔，制造方法，用于印刷线路板的载体的铜箔和印刷线路板公开(公告)号：US20150047884A1
公开(公告)日：2015-02-19
申请号：US14388381
申请日：2013-03-26
CPC分类号： H05K1/09 , B32B3/30 , B32B15/01 , B32B15/08 , B32B15/20 , B32B2307/306 , B32B2307/714 , B32B2457/08 , C22C9/00 , C25D1/04 , C25D3/12 , C25D3/38 , C25D5/12 , C25D9/08 , H05K1/0313 , H05K3/022 , H05K3/025 , H05K3/06 , H05K3/181 , H05K3/188 , H05K3/381 , H05K3/383 , H05K3/388 , H05K2201/09009 , Y10T428/12549 , Y10T428/12569 , Y10T428/12611 , Y10T428/12792 , Y10T428/12847 , Y10T428/12903 , Y10T428/1291
摘要： Provided is a copper foil for a printed wiring board including a roughened layer on at least one surface thereof. In the roughened layer, the average diameter D1 at the particle bottom being apart from the bottom of each particle by 10% of the particle length is 0.2 to 1.0 μm, and the ratio L1/D1 of the particle length L1 to the average diameter D1 at the particle bottom is 15 or less. In the copper foil for printed wiring board, when a copper foil for printed wiring having a roughened layer is laminated to a resin and then the copper layer is removed by etching, the sum of areas of holes accounting for the resin roughened surface having unevenness is 20% or more. The present invention involves the development of a copper foil for a semiconductor package substrate that can avoid circuit erosion without causing deterioration in other properties of the copper foil. In particular, an object of the present invention is to provide a copper foil for a printed wiring board and a method of producing the copper foil, in which the adhesion strength between the copper foil and the resin can be enhanced by improvement of the roughened layer of the copper foil.
摘要翻译： 提供一种用于印刷电路板的铜箔，其在其至少一个表面上包括粗糙层。 在粗糙层中，粒子底部的平均粒径D1与粒子的底部相隔10％的粒子长度为0.2〜1.0μm，粒子长度L1与平均直径D1的比L1 / D1 在颗粒底部为15或更小。 在印刷电路板用铜箔中，当将具有粗糙层的印刷布线用铜箔层压到树脂上，然后通过蚀刻除去铜层时，占据具有凹凸的树脂粗糙面的孔面积之和为 20％以上。 本发明涉及开发用于半导体封装基板的铜箔，其可以避免电路侵蚀而不会导致铜箔的其它性能的劣化。 特别地，本发明的目的是提供一种用于印刷线路板的铜箔和铜箔的制造方法，其中可以通过改善粗糙层来提高铜箔和树脂之间的粘附强度 的铜箔。
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公开(公告)号：US10123433B2
公开(公告)日：2018-11-06
申请号：US15218449
申请日：2016-07-25
发明人： Terumasa Moriyama , Tomota Nagaura
摘要： A carrier-attached copper foil having good circuit formability is provided. The carrier-attached copper foil has a carrier, an intermediate layer and an ultra-thin copper layer in this order, the number of crystal grains per unit cross-sectional area of the ultra-thin copper layer in the through-thickness direction is 0.1 to 5 grains/μm2, and a ten point average roughness Rz of a surface on a side of the ultra-thin copper layer is 0.1 to 2.0 μm.
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公开(公告)号：US09826635B2
公开(公告)日：2017-11-21
申请号：US14556407
申请日：2014-12-01
发明人： Tomota Nagaura , Kazuhiko Sakaguchi
IPC分类号： B32B15/00 , H05K1/09 , B32B15/01 , C25D1/04 , C25D3/04 , C25D3/12 , C25D5/14 , C25D7/06 , C25D9/08 , C23C28/02 , C23C18/31 , C25D3/38 , C25D3/58 , C25D3/14 , C25D3/16 , C25D3/56 , C25D11/38 , C23C18/16 , H05K3/02
CPC分类号： H05K1/09 , B32B15/01 , C23C18/165 , C23C18/31 , C23C28/023 , C25D1/04 , C25D3/04 , C25D3/12 , C25D3/14 , C25D3/16 , C25D3/38 , C25D3/562 , C25D3/565 , C25D3/58 , C25D5/14 , C25D7/0614 , C25D9/08 , C25D11/38 , H05K3/025 , H05K2201/0317 , H05K2201/032 , H05K2201/0338 , H05K2201/0355 , H05K2203/0307 , Y10T428/12438 , Y10T428/12493 , Y10T428/12514 , Y10T428/12611 , Y10T428/12667 , Y10T428/12861 , Y10T428/12882 , Y10T428/1291 , Y10T428/12931 , Y10T428/12944 , Y10T428/12958 , Y10T428/24917
摘要： The present invention provides a carrier-attached copper foil, wherein an ultrathin copper foil is not peeled from the carrier prior to the lamination to an insulating substrate, but can be peeled from the carrier after the lamination to the insulating substrate. A carrier-attached copper foil comprising a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the intermediate layer, wherein the intermediate foil is configured with a Ni layer in contact with an interface of the copper foil carrier and a Cr layer in contact with an interface of the ultrathin copper layer, said Ni layer containing 1,000-40,000 μg/dm2 of Ni and said Cr layer containing 10-100 μg/dm2 of Cr is provided.
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公开(公告)号：US09788423B2
公开(公告)日：2017-10-10
申请号：US15139482
申请日：2016-04-27
IPC分类号： H05K1/09 , B32B15/01 , B32B3/30 , C22C9/00 , H05K3/38 , H05K1/03 , H05K3/06 , H05K3/18 , B32B15/08 , B32B15/20 , C25D1/04 , C25D5/12 , H05K3/02 , C25D3/12 , C25D3/38 , C25D9/08
CPC分类号： H05K1/09 , B32B3/30 , B32B15/01 , B32B15/08 , B32B15/20 , B32B2307/306 , B32B2307/714 , B32B2457/08 , C22C9/00 , C25D1/04 , C25D3/12 , C25D3/38 , C25D5/12 , C25D9/08 , H05K1/0313 , H05K3/022 , H05K3/025 , H05K3/06 , H05K3/181 , H05K3/188 , H05K3/381 , H05K3/383 , H05K3/388 , H05K2201/09009 , Y10T428/12549 , Y10T428/12569 , Y10T428/12611 , Y10T428/12792 , Y10T428/12847 , Y10T428/12903 , Y10T428/1291
摘要： Provided is a copper foil for a printed wiring board including a roughened layer on at least one surface thereof. In the roughened layer, the average diameter D1 at the particle bottom being apart from the bottom of each particle by 10% of the particle length is 0.2 to 1.0 μm, and the ratio L1/D1 of the particle length L1 to the average diameter D1 at the particle bottom is 15 or less. In the copper foil for printed wiring board, when a copper foil for printed wiring having a roughened layer is laminated to a resin and then the copper layer is removed by etching, the sum of areas of holes accounting for the resin roughened surface having unevenness is 20% or more. The present invention involves the development of a copper foil for a semiconductor package substrate that can avoid circuit erosion without causing deterioration in other properties of the copper foil. In particular, an object of the present invention is to provide a copper foil for a printed wiring board and a method of producing the copper foil, in which the adhesion strength between the copper foil and the resin can be enhanced by improvement of the roughened layer of the copper foil.
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公开(公告)号：US10519558B2
公开(公告)日：2019-12-31
申请号：US15954289
申请日：2018-04-16
发明人： Tomota Nagaura , Masafumi Ishii
IPC分类号： C25D3/38 , C25D7/12 , H01L21/288 , H01L21/48 , H01L21/768
摘要： Copper sulfate which includes a Fe with a concentration of 0.08 ppm by mass or less.
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公开(公告)号：US10332756B2
公开(公告)日：2019-06-25
申请号：US15218466
申请日：2016-07-25
发明人： Terumasa Moriyama , Tomota Nagaura
IPC分类号： B21C37/00 , H01L21/48 , C25D1/04 , H05K3/02 , H05K3/20 , H01L23/498 , H05K3/40 , H05K3/42 , C25D3/18 , C25D3/38 , C25D3/56 , C25D3/58 , C25D5/02 , C25D5/10 , C25D9/08
摘要： A carrier-attached copper foil having good circuit formability is provided. The carrier-attached copper foil has a carrier, an intermediate layer and an ultra-thin copper layer in this order, the average grain size of crystal grains that form the ultra-thin copper layer is 1.05 to 6.5 μm, and a ten point average roughness Rz of a surface on a side of the ultra-thin copper layer is 0.1 to 2.0 μm.
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