利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

508 条记录 (耗时 0.038 秒)

    CIRCUIT BOARD AND CIRCUIT BOARD MANUFACTURING METHOD
    2.
    发明申请
    CIRCUIT BOARD AND CIRCUIT BOARD MANUFACTURING METHOD 审中-公开
    电路板和电路板制造方法

    公开(公告)号：US20150173185A1

    公开(公告)日：2015-06-18

    申请号：US14635429

    申请日：2015-03-02

    申请人： Murata Manufacturing Co., Ltd.

    发明人： Satoshi Ito ,  Yoichi Moriya ,  Tetsuo Kanamori ,  Yukihiro Yagi ,  Yuki Yamamoto

    IPC分类号： H05K1/02 ,  H05K3/46 ,  H05K3/06 ,  H05K1/11

    CPC分类号： H05K1/0298 ,  H05K1/115 ,  H05K3/06 ,  H05K3/38 ,  H05K3/4038 ,  H05K3/4661 ,  H05K2201/0338 ,  H05K2201/0355 ,  H05K2201/09563 ,  H05K2203/0369 ,  H05K2203/0554 ,  H05K2203/063 ,  H05K2203/1105 ,  H05K2203/1461

    摘要： A circuit board structure and a manufacturing method for a circuit board that ensures an electrical connection between a metal foil and a projection without using a conductive adhesive and is less likely to cause a decrease in the reliability of the connection due to the interlayer separation or the like is provided. A circuit board includes an insulating layer, a lower main surface wiring pattern and an upper main surface wiring pattern disposed on either side of the insulating layer, and an interlayer connection conductor passing through the insulating layer in a thickness direction and electrically connecting to the lower main surface wiring pattern and the upper main surface wiring pattern. The interlayer connection conductor is formed integrally with the lower main surface wiring pattern, and is bonded to the upper main surface wiring pattern via an intermetallic compound.

    摘要翻译： 一种用于电路板的电路板结构和制造方法，其确保金属箔和突起之间的电连接而不使用导电粘合剂，并且不太可能导致由于层间隔离引起的连接的可靠性降低 喜欢被提供。 电路板包括绝缘层，下主表面布线图案和布置在绝缘层两侧的上主表面布线图案，以及层间连接导体，其沿​​厚度方向穿过绝缘层并电连接到下层 主表面布线图案和上表面布线图案。 层间连接导体与下主表面布线图形一体地形成，并且通过金属间化合物结合到上主表面布线图案。

    Printed wiring board and method for manufacturing the same
    3.
    发明授权
    Printed wiring board and method for manufacturing the same 有权
    印刷电路板及其制造方法

    公开(公告)号：US08925192B2

    公开(公告)日：2015-01-06

    申请号：US12757163

    申请日：2010-04-09

    申请人： Kota Noda ,  Tsutomu Yamauchi

    发明人： Kota Noda ,  Tsutomu Yamauchi

    IPC分类号： H01K3/10 ,  H05K1/11 ,  H05K3/00 ,  H05K3/46 ,  H05K1/02 ,  H05K3/42

    CPC分类号： H05K1/115 ,  H05K1/0269 ,  H05K3/0032 ,  H05K3/0038 ,  H05K3/423 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/09563 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/09918 ,  H05K2203/0554 ,  H05K2203/1572 ,  H05K2203/166 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： A method for manufacturing printed wiring board includes irradiating laser on first surface of substrate such that first opening portion having first opening on the first surface and inner diameter decreasing toward the second surface is formed, irradiating laser on second surface of the substrate such that second opening portion having second opening on the second surface and inner diameter decreasing toward the first surface is formed and that the second portion joins the first portion and forms a penetrating hole penetrating through the substrate, forming a first circuit on the first surface, forming a second circuit on the second surface, and filling the hole with plating such that a through-hole conductor which electrically connects the first and second circuits is formed. The first opening has diameter same as or greater than diameter of the second opening, and the first portion has depth less than depth of the second portion.

    摘要翻译： 一种制造印刷电路板的方法，包括：在基板的第一表面上照射激光，使得形成在第一表面上具有第一开口的第一开口部分和朝向第二表面减小的内径;在基板的第二表面上照射激光使得第二开口 形成在第二表面上具有第二开口的部分和朝向第一表面减小的内径，并且第二部分接合第一部分并形成穿透基板的穿透孔，在第一表面上形成第一电路，形成第二电路 在第二表面上，并且用电镀填充孔，从而形成电连接第一和第二电路的通孔导体。 第一开口具有与第二开口的直径相同或更大的直径，并且第一部分的深度小于第二部分的深度。

    Printed wiring board and method for manufacturing the same
    5.
    发明授权
    Printed wiring board and method for manufacturing the same 有权
    印刷电路板及其制造方法

    公开(公告)号：US08698009B2

    公开(公告)日：2014-04-15

    申请号：US13435450

    申请日：2012-03-30

    申请人： Kota Noda ,  Tsutomu Yamauchi

    发明人： Kota Noda ,  Tsutomu Yamauchi

    IPC分类号： H05K1/11

    CPC分类号： H05K1/115 ,  H05K1/0269 ,  H05K3/0032 ,  H05K3/0038 ,  H05K3/423 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/09563 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/09918 ,  H05K2203/0554 ,  H05K2203/1572 ,  H05K2203/166 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： A wiring board having a penetrating hole formed by forming holes with different shapes from both surfaces of a substrate. In such a penetrating hole, the depth of a first opening portion formed in the first-surface side of the substrate is shallower than the depth of a second opening portion formed in the second-surface side, and the diameter of a first opening is greater than the diameter of a second opening. Even if the gravity line of the first opening portion and the gravity line of the second opening portion are shifted from each other, the region of the second opening portion inserted into the inner space of the first opening portion may be made larger.

    摘要翻译： 一种布线板，具有通过从基板的两个表面形成具有不同形状的孔而形成的贯通孔。 在这样的贯通孔中，形成在基板的第一表面侧的第一开口部的深度比形成在第二表面侧的第二开口部的深度浅，第一开口的直径更大 比第二开口的直径。 即使第一开口部分的重力线和第二开口部分的重力线彼此偏移，可以使插入第一开口部分的内部空间的第二开口部分的区域更大。

    WIRING SUBSTRATE
    6.
    发明申请
    WIRING SUBSTRATE 审中-公开
    接线基板

    公开(公告)号：US20140097009A1

    公开(公告)日：2014-04-10

    申请号：US14038190

    申请日：2013-09-26

    申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

    发明人： Kentaro KANEKO ,  Kazuhiro KOBAYASHI

    IPC分类号： H05K1/02

    CPC分类号： H05K1/0296 ,  H01L23/49822 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H05K3/0035 ,  H05K3/0055 ,  H05K3/421 ,  H05K3/4682 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2203/0346 ,  H05K2203/0554 ,  H01L2924/00012

    摘要： A wiring substrate includes a first wiring layer, a first insulating layer, a second wiring layer, and a first wiring pattern. The second wiring layer includes a first metal foil that is thinner than the first wiring layer. A first via in the first insulating layer connects the first and second wiring layers. The first via is arranged to fill a first through hole and a first recess. The first through hole extends through the first insulating layer and has a first open end with a first opening diameter and a second open end with a smaller second opening diameter. The first recess is in communication with the first through hole. The first recess has a larger diameter than the second opening diameter. The first metal foil includes a first opening communicating with the first through hole and having a larger opening diameter larger than the first opening diameter.

    摘要翻译： 布线基板包括第一布线层，第一绝缘层，第二布线层和第一布线图案。 第二布线层包括比第一布线层薄的第一金属箔。 第一绝缘层中的第一通孔连接第一和第二布线层。 第一通孔布置成填充第一通孔和第一凹槽。 第一通孔延伸穿过第一绝缘层，并且具有第一开口直径的第一开口端和具有较小的第二开口直径的第二开口端。 第一凹槽与第一通孔连通。 第一凹部具有比第二开口直径更大的直径。 第一金属箔包括与第一通孔连通并且具有比第一开口直径大的开口直径的第一开口。

    Multilayer printed wiring board for semiconductor devices and method for manufacturing the board
    7.
    发明授权
    Multilayer printed wiring board for semiconductor devices and method for manufacturing the board 有权
    用于半导体器件的多层印刷线路板及其制造方法

    公开(公告)号：US08624121B2

    公开(公告)日：2014-01-07

    申请号：US13114693

    申请日：2011-05-24

    申请人： Ayao Niki

    发明人： Ayao Niki

    IPC分类号： H05K1/00

    CPC分类号： H05K1/115 ,  H05K3/421 ,  H05K3/4644 ,  H05K2201/0352 ,  H05K2201/0394 ,  H05K2201/09527 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2203/0554 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49162

    摘要： A multilayer printed wiring board includes one or more resin layers having via-holes and a core layer having via-holes. The via-holes formed in the one or more resin layers are open in the direction opposite to the direction in which the via-holes formed in the core layer are open. A method for manufacturing a multilayer printed wiring board includes a step of preparing a single- or double-sided copper-clad laminate; a step of forming lands by processing the copper-clad laminate; a step of forming a resin layer on the upper surface of the copper-clad laminate, forming openings for via-holes in the resin layer, and then forming the via-holes; and a step of forming openings for via-holes in the lower surface of the copper-clad laminate and then forming the via-holes.

    摘要翻译： 多层印刷线路板包括一个或多个具有通孔的树脂层和具有通孔的芯层。 在一个或多个树脂层中形成的通孔在与芯层中形成的通路孔打开的方向相反的方向上开口。 一种制造多层印刷线路板的方法包括制备单面或双面覆铜层压板的步骤; 通过加工覆铜层压板来形成焊盘的步骤; 在覆铜层压板的上表面上形成树脂层的步骤，在树脂层中形成通孔的开口，然后形成通孔; 以及在覆铜层压板的下表面中形成用于通孔的开口，然后形成通孔的步骤。

    Methods of manufacturing wire, TFT, and flat panel display device
    8.
    发明授权
    Methods of manufacturing wire, TFT, and flat panel display device 有权
    制造线，TFT和平板显示装置的方法

    公开(公告)号：US08513070B2

    公开(公告)日：2013-08-20

    申请号：US13200379

    申请日：2011-09-23

    申请人： Dong-Wook Park ,  Jong-Hyun Park

    发明人： Dong-Wook Park ,  Jong-Hyun Park

    IPC分类号： H01L21/84 ,  H01L21/00 ,  H01L21/461 ,  H01L21/311

    CPC分类号： H01L27/124 ,  H01L27/1259 ,  H01L29/42384 ,  H01L29/78645 ,  H05K3/062 ,  H05K3/064 ,  H05K2201/0361 ,  H05K2203/0554 ,  H05K2203/0597 ,  Y10T29/49156

    摘要： A method of manufacturing a wire may include forming a wire pattern, which at least includes a first conductive layer, a second conductive layer, and a third conductive layer arranged in the order stated on a substrate. At least the second conductive layer may have higher etch selectivity than the first and third conductive layers. Side holes may be formed by removing portions of the second conductive layer at ends of the wire pattern, and fine wires may be formed by injecting a masking material into the side holes and patterning the wire pattern by using the masking material as a mask.

    摘要翻译： 线的制造方法可以包括形成至少包括第一导电层，第二导电层和在基板上按顺序排列的第三导电层的布线图案。 至少第二导电层可具有比第一和第三导电层更高的蚀刻选择性。 可以通过在线图案的端部去除第二导电层的部分来形成侧孔，并且可以通过将掩模材料注入侧孔中并且通过使用掩模材料作为掩模来图案化线图案来形成细线。