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公开(公告)号：US20150304059A1
公开(公告)日：2015-10-22
申请号：US14682023
申请日：2015-04-08
发明人： Chengjie Zuo , Daeik Daniel Kim , David Francis Berdy , Changhan Hobie Yun , Je-Hsiung Jeffrey Lan , Robert Paul Mikulka , Mario Francisco Velez , Jonghae Kim , Matthew Michael Nowak , Ryan Scott C. Spring , Xiangdong Zhang
IPC分类号： H04J1/08
CPC分类号： H04J1/08 , H03H7/465 , H03H2240/00 , H03H2250/00 , H04B1/0057 , H04B1/006 , H04B1/0064
摘要： An apparatus is disclosed that includes a frequency multiplexer circuit coupled to an input node and configured to receive an input signal via the input node. The frequency multiplexer circuit comprises a first filter circuit, a second filter circuit, and a third filter circuit. The apparatus also includes a switching circuit that is configurable to couple at least two of a first output of the first filter circuit, a second output of the second filter circuit, or a third output of the third filter circuit to a single output port.
摘要翻译： 公开了一种装置，其包括耦合到输入节点并经配置以经由输入节点接收输入信号的频率复用器电路。 频率复用器电路包括第一滤波器电路，第二滤波器电路和第三滤波器电路。 该装置还包括可配置为将第一滤波器电路的第一输出，第二滤波器电路的第二输出或第三滤波器电路的第三输出中的至少两个耦合到单个输出端口的开关电路。
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公开(公告)号：US20150237732A1
公开(公告)日：2015-08-20
申请号：US14200684
申请日：2014-03-07
发明人： Mario Francisco Velez , Daeik Daniel Kim , Young Kyu Song , Xiaonan Zhang , Jonghae Kim , Changhan Hobie Yun , Chengjie Zuo
CPC分类号： H05K1/182 , H01F17/0006 , H01L21/4853 , H01L21/486 , H01L23/13 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L23/49894 , H01L28/10 , H01L2924/15159 , H01L2924/15311 , H01L2924/157 , H01L2924/15788 , H05K1/0306 , H05K1/115 , H05K1/165 , H05K3/4038 , H05K2201/10015 , H05K2201/10242 , H05K2201/10984 , Y10T29/49165
摘要： A low-profile passive-on-package is provided that includes a plurality of recesses that receive corresponding interconnects. Because of the receipt of the interconnects in the recesses, the passive-on-package has a height that is less than a sum of a thickness for the substrate and an interconnect height or diameter.
摘要翻译： 提供了一种低调无源封装，其包括接收相应互连的多个凹槽。 由于在凹槽中接收到互连，所以被动封装的高度小于衬底的厚度和互连高度或直径的总和。
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公开(公告)号：US09093295B2
公开(公告)日：2015-07-28
申请号：US14079503
申请日：2013-11-13
CPC分类号： H01L28/40 , H01G2/06 , H01G4/012 , H01G4/12 , H01G4/1227 , H01G4/30 , H01G4/306 , H01L21/4857 , H01L21/486 , H01L23/49822 , H01L23/49827 , H01L23/5223 , H01L23/642 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/16 , H01L27/0805 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/16225 , H01L2224/16235 , H01L2224/16237 , H01L2224/16267 , H01L2224/81815 , H01L2924/15311 , H01L2924/19041 , H01L2924/19103 , H01L2924/014
摘要： A multilayer capacitor is provided that includes a plurality of vias configured to receive interconnects from a die.
摘要翻译： 提供了一种层叠电容器，其包括多个通孔，其构造成从模具接收互连。
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公开(公告)号：US20150146340A1
公开(公告)日：2015-05-28
申请号：US14090589
申请日：2013-11-26
IPC分类号： H01G4/30
摘要： An apparatus includes a two-terminal MLCC. The two-terminal MLCC includes a conductive layer, where the conductive layer includes at least one slot. The apparatus may also include a second conductive layer that includes at least one slot and an insulating layer that separates the two conductive layers. In one example, a first (e.g., positive) terminal of the two-terminal MLCC is formed by a first set of plates, where each plate in the first set includes at least one slot. A second (e.g., negative) terminal of the two-terminal MLCC is formed by a second set of plates, where each plate in the second set also includes at least one slot. The first set of plates and the second set of plates are interleaved, and each pair of plates is separated by an insulating layer.
摘要翻译： 一种装置包括两端MLCC。 双端MLCC包括导电层，其中导电层包括至少一个槽。 该装置还可以包括第二导电层，其包括至少一个槽和分离两个导电层的绝缘层。 在一个示例中，双端子MLCC的第一（例如，正）端子由第一组板形成，其中第一组中的每个板包括至少一个槽。 双端子MLCC的第二（例如，负极）端子由第二组板形成，其中第二组中的每个板还包括至少一个槽。 第一组板和第二组板被交错，并且每对板由绝缘层分开。
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公开(公告)号：US20150130579A1
公开(公告)日：2015-05-14
申请号：US14078174
申请日：2013-11-12
CPC分类号： H01F27/2804 , H01F17/0013 , H01F17/02 , H01F41/06 , H01F2017/0073 , H01F2027/2809 , Y10T29/4902
摘要： An apparatus includes a multi spiral inductor that includes a first spiral and a second spiral. The first spiral includes a first turn, a second turn, and a third turn. The first turn is adjacent to and separated from the second turn by first spacing. The second turn is adjacent to and separated from the third turn by second spacing. The first spacing is different from the second spacing.
摘要翻译： 一种装置包括多螺旋电感器，其包括第一螺旋和第二螺旋。 第一个螺旋包括第一回合，第二回合和第三回合。 第一匝与第二匝相邻并且与第二匝分开。 第二匝与第三匝相邻并且与第三匝分开第二个间距。 第一间距与第二间距不同。
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96.发明申请公开(公告)号：US20150092314A1
公开(公告)日：2015-04-02
申请号：US14039192
申请日：2013-09-27
发明人： Daeik Daniel Kim , Young Kyu Song , Mario Francisco Velez , Jonghae Kim , Changhan Hobie Yun , Chengjie Zuo , Xiaonan Zhang , Ryan David Lane , Matthew Michael Nowak
CPC分类号： H01F27/29 , H01F17/0006 , H01F27/40 , H01F2017/002 , H01F2017/0073 , Y10T29/4902
摘要： A system includes a first connector coupled to a first surface of a substrate. The first connector enables the system to be electrically coupled to a first device external to the substrate. The system includes a second connector coupled to a second surface of the substrate. The system also includes a plurality of conductive vias extending through the substrate from the first surface to the second surface. The plurality of conductive vias surrounds the first connector and the second connector. The plurality of conductive vias is electrically coupled together to form a toroidal inductor. A first lead of the toroidal inductor is electrically coupled to the first connector. A second lead of the toroidal inductor is electrically coupled to the second connector.
摘要翻译： 系统包括耦合到衬底的第一表面的第一连接器。 第一连接器使得系统能够电耦合到衬底外部的第一器件。 该系统包括耦合到基板的第二表面的第二连接器。 该系统还包括从第一表面延伸穿过基底的多个导电通孔到第二表面。 多个导电通孔围绕第一连接器和第二连接器。 多个导电通孔电耦合在一起以形成环形电感器。 环形电感器的第一引线电耦合到第一连接器。 环形电感器的第二引线电耦合到第二连接器。
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公开(公告)号：US11728293B2
公开(公告)日：2023-08-15
申请号：US17166430
申请日：2021-02-03
发明人： Changhan Hobie Yun , Daniel Daeik Kim , Paragkumar Ajaybhai Thadesar , Nosun Park , Sameer Sunil Vadhavkar
CPC分类号： H01L23/66 , H01L23/645 , H01L28/10
摘要： Mobile phones and other mobile devices communicate wirelessly by transmitting and receiving RF signals. Transmitters and receivers in wireless devices process RF signals in certain frequency ranges or bands. Signals in other frequencies can be blocked or filtered out by, for example, a lumped-element circuit or a lumped-element filter consisting of passive electrical components such as inductors, capacitors, and resistors. A passive component device, or integrated passive device, is one example of a lumped-element filter fabricated with passive components on a die. In a mobile device, a passive component device and one or more integrated circuits or other chips used for signal processing are interconnected by being mounted on (i.e., coupled to) a metallization structure or package substrate in a chip module or multi-chip module. The demand for miniaturization of hand-held mobile devices drives a need for reducing the sizes of chip modules that are inside a mobile device.
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公开(公告)号：US11658403B2
公开(公告)日：2023-05-23
申请号：US17002594
申请日：2020-08-25
发明人： Changhan Hobie Yun , Daniel Daeik Kim , Paragkumar Ajaybhai Thadesar , Nosun Park , Sameer Sunil Vadhavkar
摘要： A substrate that includes at least one dielectric layer, a plurality of interconnects, and a curved antenna coupled to a surface of the substrate. The curved antenna is curved relative to the surface of the substrate such that at least part of the curved antenna is offset from the surface of the substrate. The substrate includes a first antenna dielectric layer coupled to the surface of the substrate, an antenna ground interconnect coupled to the first antenna dielectric layer, and a second antenna dielectric layer coupled to the antenna ground interconnect. The antenna ground interconnect configured to be coupled to ground. The curved antenna is coupled to the second antenna dielectric layer.
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公开(公告)号：US11626236B2
公开(公告)日：2023-04-11
申请号：US17195220
申请日：2021-03-08
发明人： Jonghae Kim , Changhan Hobie Yun , Je-Hsiung Lan , Ranadeep Dutta
摘要： An inductor includes a first metallization layer multi-turn trace. The inductor also includes a second metallization layer multi-turn trace coupled to the first metallization layer multi-turn trace through at least one first via. The inductor further includes a plurality of discrete third metallization layer trace segments coupled to the second metallization layer multi-turn trace through a plurality of second vias.
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公开(公告)号：US11515247B2
公开(公告)日：2022-11-29
申请号：US17149006
申请日：2021-01-14
发明人： Nosun Park , Changhan Hobie Yun , Daniel Daeik Kim , Sameer Sunil Vadhavkar , Paragkumar Ajaybhai Thadesar
IPC分类号： H01L23/52 , H01L23/522 , H01L21/70 , H01L27/01
摘要： A device includes a main capacitor composed of a first plate of a first back-end-of-line (BEOL) metallization layer, a main insulator layer on the first plate, and a second plate on the main insulator layer. The second plate is composed of a second BEOL metallization layer. The device includes a first tuning capacitor of a first portion of a first BEOL interconnect trace coupled to the first plate of the main capacitor through first BEOL sideline traces. The first tuning capacitor is composed of a first insulator layer on a surface and sidewalls of the first portion of the first BEOL interconnect trace. The first tuning capacitor includes a second BEOL interconnect trace on a surface and sidewalls of the first insulator layer. The device includes a first via capture pad coupled to the second BEOL interconnect trace of the first tuning capacitor.
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