公开(公告)号：US09754713B2

公开(公告)日：2017-09-05

申请号：US14793752

申请日：2015-07-08

Applicant: CYNTEC CO., LTD.

Inventor： Tsung-Chan Wu ,  Roger Hsieh ,  Yi-Min Huang ,  Lan-Chin Hsieh ,  Yu-Ching Kuo ,  Chia-Hui Lai

IPC: H01F27/02 ,  H01F27/06 ,  H01F27/29 ,  H01F5/00 ,  H01F27/28 ,  H01F3/08 ,  H01F17/04 ,  H01F27/255

CPC classification number: H01F27/24 ,  H01F3/08 ,  H01F17/045 ,  H01F27/022 ,  H01F27/255 ,  H01F27/2823 ,  H01F27/2828 ,  H01F2017/048

Abstract: A choke includes a single-piece core made of a same material, the single-piece core having a first board, a second board, and a pillar located between the first and second boards, a winding space located among the first board, the second board and the pillar, wherein the pillar has a non-circular and non-rectangular cross section having a first axis and a second axis substantially perpendicularly intersecting with each other at a center of the cross section of the pillar, and wherein a circumference of the cross section of the pillar includes two arc edges, four first substantially straight edges substantially parallel to the first axis, and two second substantially straight edges substantially parallel to the second axis, each of the first substantially straight edges being a joint of and in direct contact with one of the arc edges and one of the second substantially straight edges.

公开(公告)号：US09735091B2

公开(公告)日：2017-08-15

申请号：US14576199

申请日：2014-12-19

Applicant: CYNTEC CO., LTD.

Inventor： Han-Hsiang Lee ,  Yi-Cheng Lin ,  Da-Jung Chen

IPC: H01L23/02 ,  H01L23/495 ,  H01L23/31 ,  H01L23/552 ,  H01L25/07 ,  H01L25/16 ,  H01L23/00

CPC classification number: H01L23/49568 ,  H01L23/3107 ,  H01L23/49537 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49589 ,  H01L23/552 ,  H01L24/73 ,  H01L25/072 ,  H01L25/165 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/48247 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The invention discloses a package structure for better heat-dissipation or EMI performance. A first conductive element and a second conductive element are both disposed between the top lead frame and the bottom lead frame. The first terminal of the first conductive element is electrically connected to the bottom lead frame, and the second terminal of the first conductive element is electrically connected to the top lead frame. The third terminal of the second conductive element is electrically connected to the bottom lead frame, and the fourth terminal of the second conductive element is electrically connected to the top lead frame. In one embodiment, a heat dissipation device is disposed on the top lead frame. In one embodiment, the molding compound is provided such that the outer leads of the top lead frame are exposed outside the molding compound.

公开(公告)号：US09734944B2

公开(公告)日：2017-08-15

申请号：US14532021

申请日：2014-11-04

Applicant: CYNTEC CO., LTD.

Inventor： Bau-Ru Lu ,  Kai-Peng Chiang ,  Da-Jung Chen ,  Tsung-Chan Wu

IPC: H01L27/08 ,  H01F27/30 ,  H01L23/31 ,  H01L23/495 ,  H01L23/64 ,  H01F27/29 ,  H01L23/00

CPC classification number: H01F27/306 ,  H01F27/29 ,  H01F2027/297 ,  H01L23/3121 ,  H01L23/495 ,  H01L23/49575 ,  H01L23/645 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  Y10T29/4913 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An inductive component is disclosed. The inductive component comprises a magnetic body and a coil in the magnetic body, wherein a first protrusion and a second protrusion are formed on the bottom surface of the magnetic body, wherein the first protrusion comprises a first electrode disposed on the peak surface of the first protrusion, and the second protrusion comprises a second electrode disposed on the peak surface of the second protrusion, wherein the first electrode and the second electrode are electrically connected to a first end and a second end of the coil, and a space is formed by the first protrusion, the second protrusion and the bottom surface of the magnetic body for accommodating electronic devices.

公开(公告)号：US20170162514A1

公开(公告)日：2017-06-08

申请号：US14959768

申请日：2015-12-04

Applicant: CYNTEC CO., LTD.

Inventor： Joseph D. S. DENG ,  Chia-Hsien SHEN ,  Shu-Wei CHANG ,  Kuan-Chih HUANG

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/498 ,  H01L21/48 ,  H01L23/66 ,  H01L23/31

CPC classification number: H01L23/552 ,  H01L21/4853 ,  H01L21/561 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/66 ,  H01L24/97 ,  H01L25/16 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/15192 ,  H01L2924/1531 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2224/81

Abstract: A semiconductor package includes a substrate, a plurality of pin pads, a radio frequency (RF) pad, a semiconductor component, at least one surface mount device (SMD) component, a mold compound, a printed circuit board (PCB) antenna and a conductive solder. The RF pad is used to receive or transmit an RF signal on the top side of the substrate. The SMD component is mounted on the RF pad. The mold compound on the top side of the substrate covers the semiconductor component and the SMD component. The PCB antenna is located on the mold compound. Wherein, the conductive solder and the SMD component are stacked between the RF pad and a feeding structure of the PCB antenna.

公开(公告)号：US09668359B2

公开(公告)日：2017-05-30

申请号：US14614401

申请日：2015-02-04

Applicant: CYNTEC CO., LTD.

Inventor： Bau-Ru Lu

IPC: H05K7/10 ,  H05K7/12 ,  H05K3/36 ,  H05K1/11

CPC classification number: H05K3/366 ,  H05K1/117 ,  H05K2201/09063 ,  H05K2201/09172 ,  H05K2201/10295 ,  H05K2201/1034

Abstract: A circuit module for connecting to a circuit board is disclosed, the circuit module for connecting to a circuit board, wherein the circuit module comprises a substrate having a top surface, a bottom surface and a lateral surface connecting the top surface and bottom surface, wherein at least one electrical component is disposed on the top or bottom surface and a plurality of surface-mount pads are disposed on the lateral surface of the substrate for electrically connecting to corresponding pads on the circuit board.

公开(公告)号：US09601412B2

公开(公告)日：2017-03-21

申请号：US13612852

申请日：2012-09-13

Applicant: Da-Jung Chen ,  Chun-Tiao Liu ,  Chau-Chun Wen

Inventor： Da-Jung Chen ,  Chun-Tiao Liu ,  Chau-Chun Wen

IPC: H01L23/495 ,  H01L23/552 ,  H01L23/00 ,  H01L25/10

CPC classification number: H01L25/162 ,  H01L23/04 ,  H01L23/495 ,  H01L23/49517 ,  H01L23/49555 ,  H01L23/49558 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49811 ,  H01L23/49861 ,  H01L23/552 ,  H01L23/645 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/16245 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The present invention discloses a three-dimensional package structure. The first conductive element comprises a top surface, a bottom surface and a lateral surface. The conductive pattern disposed on the top surface of the first conductive element. A second conductive element is disposed on the conductive pattern. The first conductive element is electrically connected to the conductive pattern, and the second conductive element is electrically connected to the conductive pattern. In one embodiment, the shielding layer is a portion of the patterned conductive layer.

公开(公告)号：US09386686B2

公开(公告)日：2016-07-05

申请号：US13450229

申请日：2012-04-18

Applicant: Chi-Feng Huang ,  Bau-Ru Lu ,  Da-Jung Chen ,  Jeng-Jen Li

Inventor： Chi-Feng Huang ,  Bau-Ru Lu ,  Da-Jung Chen ,  Jeng-Jen Li

IPC: H05K7/20 ,  H05K1/02 ,  H05K3/44 ,  H05K1/18

CPC classification number: H05K1/0204 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48248 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/181 ,  H05K1/184 ,  H05K3/445 ,  H05K2201/10515 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An electronic package structure is provided which comprises a metal core PCB, an energy storage device and at least one electronic component. The at least one electronic component is disposed between the metal core PCB and the energy storage device. The metal core PCB defines at least a through hole. A thermal passage is disposed in the through hole. An insulating layer is disposed in the through hole and located between the metal layer of the metal core PCB and the thermal passage to prevent the electric coupling between the thermal passage and the metal layer. The energy storage device comprises at least a connecting pin in thermal contact with the thermal passage.

Abstract translation: 提供一种电子封装结构，其包括金属芯PCB，能量存储装置和至少一个电子元件。 至少一个电子部件设置在金属芯PCB和能量存储装置之间。 金属芯PCB至少定义一个通孔。 热通道设置在通孔中。 绝缘层设置在通孔中并且位于金属芯PCB的金属层和热通道之间，以防止热通道和金属层之间的电耦合。 能量存储装置至少包括与热通道热接触的连接销。

公开(公告)号：US09226387B2

公开(公告)日：2015-12-29

申请号：US13935713

申请日：2013-07-05

Applicant: CYNTEC CO., LTD

Inventor： Chih-Tse Chen ,  Joseph D. S. Deng ,  Shih-Hsien Tseng

IPC: H02B5/00 ,  H05K7/00 ,  H05K1/02 ,  H05K9/00 ,  H05K1/00 ,  H05K5/00 ,  H01H9/28 ,  H01H27/00 ,  H01H47/00 ,  H01H63/00 ,  H02B7/00 ,  H02B1/26 ,  H02B1/00

CPC classification number: H05K1/0216 ,  H05K1/00 ,  H05K1/0233 ,  H05K1/0243 ,  H05K1/025 ,  H05K1/111 ,  H05K1/181 ,  H05K5/00 ,  H05K5/0026 ,  H05K7/00 ,  H05K9/0022 ,  H05K2201/08 ,  H05K2201/1003

Abstract: A network communication device is disclosed. The network communication device includes a circuit board, a network connector, a network chip and a plurality of network magnetic assemblies. The network connector, the network chip and the network magnetic assemblies are disposed on the circuit board. The network magnetic assemblies are electrically connected with the network connector and the network chip, respectively. Each of the network magnetic assemblies includes an Ethernet transformer and at least one inductor. The Ethernet transformer is electrically connected in series with the inductor via a conductive trace of the circuit board. The spaced distance or a path length of the conductive trace between the Ethernet transformer and the inductor of the at least one network magnetic assembly is less than a first specific length.

Abstract translation: 公开了一种网络通信设备。 网络通信设备包括电路板，网络连接器，网络芯片和多个网络磁性组件。 网络连接器，网络芯片和网络磁性组件设置在电路板上。 网络磁性组件分别与网络连接器和网络芯片电连接。 每个网络磁性组件包括以太网变压器和至少一个电感器。 以太网变压器通过电路板的导电迹线与电感器串联电连接。 以太网变压器和至少一个网络磁性组件的电感器之间的导电迹线的间隔距离或路径长度小于第一特定长度。

公开(公告)号：US09136050B2

公开(公告)日：2015-09-15

申请号：US13902997

申请日：2013-05-28

Applicant: Roger Hsieh ,  Cheng-Chang Lee ,  Chun-Tiao Liu ,  Yi-Min Huang ,  Chih-Siang Chuang

Inventor： Roger Hsieh ,  Cheng-Chang Lee ,  Chun-Tiao Liu ,  Yi-Min Huang ,  Chih-Siang Chuang

IPC: H01F5/00 ,  H05K3/30 ,  H01F17/04 ,  H01F27/02 ,  H01F27/29

CPC classification number: H01F27/29 ,  H01F5/00 ,  H01F5/003 ,  H01F7/06 ,  H01F17/04 ,  H01F27/00 ,  H01F27/022 ,  H01F27/255 ,  H01F27/2828 ,  H01F27/292 ,  H01F41/0206 ,  H01F41/10 ,  H05K3/301 ,  Y10T29/302 ,  Y10T29/49073 ,  Y10T29/49075

Abstract: A magnetic device comprises a lead frame, a first core body and a coil. The lead frame has a first portion and a second portion spaced apart from the first portion. A first core body is disposed on the lead frame, wherein the first core body comprises a first through opening and a second through opening. A coil is disposed on the first core body, wherein the coil has a first terminal and a second terminal, wherein the first portion is electrically connected with the first terminal via the first through opening, and the second portion is electrically connected with the second terminal via the second through opening, respectively.

Abstract translation: 磁性装置包括引线框架，第一芯体和线圈。 引线框架具有与第一部分间隔开的第一部分和第二部分。 第一芯体设置在引线框架上，其中第一芯体包括第一通孔和第二通孔。 线圈设置在第一芯体上，其中线圈具有第一端子和第二端子，其中第一部分经由第一通孔与第一端子电连接，并且第二部分与第二端子电连接 分别通过第二通孔。

公开(公告)号：US09129769B2

公开(公告)日：2015-09-08

申请号：US12875771

申请日：2010-09-03

Applicant: Chung-Hsiung Wang ,  Hung-Ming Lin ,  Wen-Shiang Luo ,  Chun-Tiao Liu ,  Kuo-Shu Chen

Inventor： Chung-Hsiung Wang ,  Hung-Ming Lin ,  Wen-Shiang Luo ,  Chun-Tiao Liu ,  Kuo-Shu Chen

IPC: H01H85/48 ,  H01H85/02 ,  H01H85/00 ,  H01H85/041 ,  H01H69/02 ,  H01H85/046 ,  H01H85/048 ,  H01H85/11 ,  H01H85/46

CPC classification number: H01H85/48 ,  H01H69/022 ,  H01H85/0047 ,  H01H85/0241 ,  H01H85/0411 ,  H01H85/046 ,  H01H85/048 ,  H01H85/11 ,  H01H2085/0283 ,  H01H2085/466

Abstract: A protective device including a substrate, a conductive section and a bridge element is provided. The conductive section is supported by the substrate, wherein the conductive section comprises a metal element electrically connected between first and second electrodes. The metal element serves as a sacrificial structure having a melting point lower than that of the first and second electrodes. The bridge element spans across the metal element in a direction across direction of current flow in the metal element, wherein the bridge element facilitates breaking of the metal element upon melting.

Abstract translation: 提供了包括基板，导电部分和桥接元件的保护装置。 导电部分由衬底支撑，其中导电部分包括电连接在第一和第二电极之间的金属元件。 金属元件用作熔点低于第一和第二电极的熔点的牺牲结构。 桥接元件跨过金属元件横跨金属元件中的电流流动方向穿过金属元件，其中桥接元件有助于熔化时金属元件的断裂。