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公开(公告)号：US09674949B1
公开(公告)日：2017-06-06
申请号：US14266700
申请日：2014-04-30
Applicant: FLEXTRONICS AP, LLC
Inventor： Weifeng Liu , Zhen Feng , Anwar Mohammed
CPC classification number: H05K1/0283 , H05K1/028 , H05K1/09 , H05K1/11 , H05K1/118 , H05K1/145 , H05K2201/0137 , H05K2201/0162 , H05K2201/032 , H05K2201/05 , H05K2201/10287
Abstract: A stretchable wire assembly includes a metal wire coupled between two elastic substrates. The two elastic substrates are selectively coupled together, and the metal wire is attached to one or both elastic substrates at select locations. The form of the metal wire is such that when the elastic substrates are in a relaxed, or non-stretched, state the metal wire forms a tortuous path, such as a waveform, along the coupled elastic substrates. The tortuous path of the metal wire provides slack such that as the elastic substrates are stretched the slack is taken up. Once released, the elastic substrates move from the stretched position to the relaxed, non-stretched position, and slack is reintroduced into the metal wire in the form of the original tortuous path.
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公开(公告)号：US09661743B1
公开(公告)日：2017-05-23
申请号：US14565247
申请日：2014-12-09
Applicant: Multek Technologies Ltd.
Inventor： Mark Bergman , Joan K. Vrtis
CPC classification number: H01M6/40 , A41D1/002 , A41D1/005 , D05B17/00 , H01M2/08 , H01M6/12 , H01M10/0436 , H01R4/00 , H01R4/02 , H01R4/029 , H01R43/005 , H01R43/02 , H01R43/0235 , H05K1/0271 , H05K1/0296 , H05K1/0298 , H05K1/0306 , H05K1/0366 , H05K1/0373 , H05K1/038 , H05K1/0393 , H05K1/09 , H05K1/11 , H05K1/111 , H05K1/112 , H05K1/115 , H05K1/18 , H05K1/181 , H05K1/189 , H05K3/284 , H05K3/30 , H05K3/305 , H05K3/32 , H05K3/4015 , H05K3/42 , H05K3/4644 , H05K7/02 , H05K9/009 , H05K13/04 , H05K2201/0154 , H05K2201/0158 , H05K2201/0162 , H05K2201/0287 , H05K2201/05 , H05K2201/09418 , H05K2201/09818
Abstract: A flexible circuit board includes a center “rigid” section, such as a printed circuit stack, and an adjoining flexible multi-layer body that are fabricated from a common interconnect layer. A transition material is included at the interface between the center rigid section and the flexible multi-layer body to minimize ripping and cracking of the interconnect layer. The transition material can also be added at stress areas not related to the interface. The transition material is attached at the interface and stress areas of the flexible circuit board in order to strengthen the flexible circuit board in general and in particular the transition material included therein. The transition material layer is formed and deposited at one or more locations on or within the flexible circuit board in order to minimize, reduce, if not prevent cracking and ripping of the flexible circuit board as it is bent, flexed and/or twisted.
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公开(公告)号：US20170135225A1
公开(公告)日：2017-05-11
申请号：US15343759
申请日：2016-11-04
Applicant: GiMer Medical Co., Ltd.
Inventor： Chi-Heng CHANG , Chan-Yi CHENG , Chen-Tun WU
CPC classification number: H05K3/285 , A61B5/14503 , A61B5/14532 , A61B5/686 , A61B2503/40 , A61B2562/12 , A61B2562/18 , A61N1/3605 , A61N1/362 , A61N1/375 , H05K1/0326 , H05K3/0011 , H05K3/28 , H05K2201/0162 , H05K2201/0195 , H05K2201/09063 , H05K2203/1327 , H05K2203/1338 , H05K2203/1377
Abstract: A waterproof structure for an implanted electronic device is capable of preventing the liquid or moist from entering and damaging the circuit board of the electronic device. The waterproof structure includes a shell, a first material layer, a second material layer, and a third material layer. The first material layer covers at least a part of the implanted electronic device. The second material layer covers the first material layer. The internal space of the shell is configured for accommodating the implanted electronic device. The shell is made of PEEK (polyether ether ketone). The third material layer is disposed between the second material layer and the shell.
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公开(公告)号：US09618691B2
公开(公告)日：2017-04-11
申请号：US15091879
申请日：2016-04-06
Applicant: Funai Electric Co., Ltd.
Inventor： Akira Yokawa , Yuki Kita , Akihiro Fujikawa , Yasuyuki Fukumoto , Yasuhiro Mori , Yuto Suzuki , Hirofumi Horiuchi , Hirohiko Tsuji , Takahito Yamanaka , Hideo Yonezawa
IPC: F21V8/00 , G02F1/1335 , H05K7/20 , G06F1/20 , H05K1/02 , G02F1/1333
CPC classification number: G02B6/0088 , G02B6/0068 , G02B6/0073 , G02B6/0085 , G02F1/133615 , G02F2001/133314 , G02F2001/133317 , G02F2001/133328 , G02F2001/133628 , G06F1/20 , H05K1/0209 , H05K7/20963 , H05K2201/0162 , H05K2201/09909
Abstract: This display includes a light source portion, a first heat radiation member for radiating heat generated by the light source portion, a rear housing covering the first heat radiation member in a state in contact with the first heat radiation member, and a cover member covering a rear surface of the rear housing so that the rear surface of the rear housing is partially exposed outward. The first heat radiation member is arranged on a region corresponding to a region of the rear housing exposed outward from the cover member as viewed from the side of the rear surface.
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公开(公告)号：US09585254B2
公开(公告)日：2017-02-28
申请号：US15015870
申请日：2016-02-04
Applicant: ROHM CO., LTD.
Inventor： Isamu Nishimura , Hideaki Yanagida , Michihiko Mifuji , Yasuhiro Fuwa
CPC classification number: H05K1/183 , H01L23/13 , H01L23/147 , H01L23/49827 , H01L2224/16225 , H01L2924/15156 , H01L2924/181 , H05K1/0306 , H05K1/111 , H05K1/112 , H05K1/186 , H05K2201/0162 , H05K2201/0376 , H05K2201/09036 , H01L2924/00012
Abstract: An electronic device includes a semiconductor substrate, an electronic element mounted on the substrate, a conductive layer electrically connected to the electronic element, a sealing resin and a columnar conductor. The substrate has a recess formed in its obverse surface. The electronic element is mounted on the bottom surface of the recess. The conductive layer has an obverse-surface contacting region located on the obverse surface of the substrate. The sealing resin is disposed in at least a part of the recess for covering at least a part of the obverse surface of the substrate. The columnar conductor is electrically connected to the obverse-surface contacting region of the conductive layer and exposed from the sealing resin at a side opposite to the obverse surface of the substrate.
Abstract translation: 电子设备包括半导体衬底，安装在衬底上的电子元件，与电子元件电连接的导电层，密封树脂和柱状导体。 基板具有在其正面形成的凹部。 电子元件安装在凹槽的底面上。 导电层具有位于基板的正面上的正面接触区域。 密封树脂设置在用于覆盖基板的正面的至少一部分的凹部的至少一部分中。 柱状导体与导电层的正面接触区域电连接，并且在密封树脂的与基板的正面相反的一侧露出。
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Patent Agency Ranking
96.发明申请Method for Pore Sealing of Porous Materials Using Polyimide Langmuir-Blodgett Film 审中-公开使用聚酰亚胺Langmuir-Blodgett膜进行孔隙密封的方法公开(公告)号：US20170021604A1
公开(公告)日：2017-01-26
申请号：US15285445
申请日：2016-10-04
Applicant: IMEC , St. Petersburg Electrotechnical University
Inventor： Victor Luchinin , Svetlana Goloudina , Vyacheslav Pasyuta , Alexey Ivanov , Mikhail Baklanov , Mikhail Krishtab
CPC classification number: C08J5/18 , B05D1/20 , B05D1/204 , B05D1/208 , B05D2505/50 , B32B18/00 , B32B27/04 , B32B27/281 , B32B37/15 , B32B2260/046 , B32B2305/026 , B32B2305/07 , B32B2307/00 , B32B2307/204 , B32B2379/08 , B32B2457/00 , B82Y30/00 , B82Y40/00 , C08G73/1067 , C08J2379/08 , C08J2483/02 , C09D179/08 , H01L21/02285 , H01L21/02318 , H01L23/5329 , H05K1/03 , H05K3/143 , H05K2201/01 , H05K2201/0104 , H05K2201/0116 , H05K2201/0154 , H05K2201/0162 , Y10T428/249979 , Y10T428/249991 , C08K5/175
Abstract: Method for pore sealing a porous substrate, comprising: forming a continuous monolayer of a polyimide precursor on a liquid surface, transferring said polyimide precursor monolayer onto the porous substrate with the Langmuir-Blodgett technique, and imidization of the transferred polyimide precursor monolayers, thereby forming a polyimide sealing layer on the porous substrate. Porous substrate having at least one surface on which a sealing layer is provided to seal pores of the substrate, wherein the sealing layer is a polyimide having a thickness of a few monolayers and wherein there is no penetration of the polyimide into the pores.
Abstract translation: 用于孔密封多孔基材的方法，包括：在液体表面上形成聚酰亚胺前体的连续单层，使用Langmuir-Blodgett技术将所述聚酰亚胺前体单层转移到多孔基材上，并将转移的聚酰亚胺前体单层酰亚胺化，从而形成 多孔基材上的聚酰亚胺密封层。 具有至少一个表面的多孔基材，其上设有密封层以密封基材的孔，其中密封层是具有几个单层厚度的聚酰亚胺，并且其中聚酰亚胺不渗透到孔中。
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公开(公告)号：US20160323998A1
公开(公告)日：2016-11-03
申请号：US14698635
申请日：2015-04-28
Applicant: Fameson Technology Co., Ltd.
Inventor： Rong-Seng CHANG
IPC: H05K1/03
CPC classification number: H05K1/0373 , H05K3/424 , H05K2201/012 , H05K2201/0133 , H05K2201/015 , H05K2201/0154 , H05K2201/0162 , H05K2201/0209 , H05K2201/0266 , H05K2201/0792 , H05K2201/093
Abstract: The present invention proposes substrate material favoring via hole electroplating to overcome the conventional problem that the polymer-based printed circuit board is hard to conduct electricity and likely to have poor electroplating quality. The present invention adds a conductive material to a polymeric material and controls the proportions and structure thereof to form a substrate material so as to improve the affinity of the substrate material to the metal electroplated inside the via hole with the resistance of the substrate material remaining in an allowable range. Thereby is increased yield and efficiency and saved time and cost in fabricating printed circuit boards. Further, the present invention reduces the proportion of the polymeric material with the mechanical strength remaining in an allowable range so as to decrease the overall expansion rate and obtain a fire-proof effect. Therefore, the substrate material can be used to fabricate precision products.
Abstract translation: 本发明提出了有利于通孔电镀的基板材料，以克服聚合物基印刷电路板难以导电并且可能具有差的电镀质量的常规问题。 本发明将导电材料添加到聚合物材料中并控制其比例和结构以形成基底材料，以便提高衬底材料对通孔内部电镀的金属的亲和性，其中衬底材料的电阻保持在 允许范围。 从而提高了产量和效率，并节省了制造印刷电路板的时间和成本。 此外，本发明将机械强度保持在容许范围内的聚合物材料的比例降低，从而降低整体膨胀率并获得防火效果。 因此，基板材料可用于制造精密产品。
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98.发明申请ULTRA LOW LOSS DIELECTRIC THERMOSETTING RESIN COMPOSITIONS AND HIGH PERFORMANCE LAMINATES MANUFACTURED THEREFROM 审中-公开超低损耗电介质热固性树脂组合物及其制造的高性能层压板公开(公告)号：US20160249451A1
公开(公告)日：2016-08-25
申请号：US15144503
申请日：2016-05-02
Applicant: NOVOSET, LLC
Inventor： Sajal Das , Patrick Shipman
CPC classification number: H05K1/0326 , B32B15/06 , B32B15/20 , B32B25/02 , B32B2307/204 , B32B2457/08 , C08F279/02 , C08F283/12 , C08J5/24 , C08J2351/00 , C08J2351/08 , H05K1/0346 , H05K1/0366 , H05K2201/015 , H05K2201/0158 , H05K2201/0162
Abstract: A ultra low loss dielectric thermosetting resin composition has at least one cyanate ester component (A) and at least one reactive intermediate component (B) that is capable of copolymerization with said component (A). The invention is a cyanate ester resin of the form: Tn-[W—(Z)f/(H)1-f—W]n−1—[W—(Z)f/(H)1-f—(OCN)f/(R)1-f]n+2, wherein T is a 1,3,5-substituted-triazine moiety (C3N3); W is a linking atom between triazine and either component A or component B; Z is component (A): H is component (B); OCN is a cyanate ester end group; R is a reactive end group of component B; n is an integer greater than or equal to 1; and f is a weight or mole fraction of component A. The composition exhibits excellent dielectric properties and yields a high performance laminate for use in high layer count, multilayer printed circuit board (PCB), prepregs, resin coated copper (RCC), film adhesives, high frequency radomes, radio frequency (RF) laminates and various composites.
Abstract translation: 超低损耗介电热固性树脂组合物具有至少一种能与所述组分（A）共聚的氰酸酯组分（A）和至少一种反应性中间组分（B）。 本发明是以下形式的氰酸酯树脂：Tn- [W-（Z）f /（H）1-f-W] n-1- [W-（Z）f /（H）1-f-（ OCN）f /（R）1-f] n + 2，其中T是1,3,5-取代三嗪部分（C 3 N 3）; W是三嗪与组分A或组分B之间的连接原子; Z是组分（A）：H是组分（B）; OCN是氰酸酯端基; R是组分B的反应性端基; n是大于或等于1的整数; 并且f是组分A的重量或摩尔分数。组合物显示出优异的介电性能并产生用于高层计数，多层印刷电路板（PCB），预浸料，树脂涂层铜（RCC），膜粘合剂 ，高频雷达，射频（RF）层压板和各种复合材料。
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公开(公告)号：US20160223740A1
公开(公告)日：2016-08-04
申请号：US15091879
申请日：2016-04-06
Applicant: Funai Electric Co., Ltd.
Inventor： Akira YOKAWA , Yuki KITA , Akihiro FUJIKAWA , Yasuyuki FUKUMOTO , Yasuhiro MORI , Yuto SUZUKI , Hirofumi HORIUCHI , Hirohiko TSUJI , Takahito YAMANAKA , Hideo YONEZAWA
IPC: F21V8/00
CPC classification number: G02B6/0088 , G02B6/0068 , G02B6/0073 , G02B6/0085 , G02F1/133615 , G02F2001/133314 , G02F2001/133317 , G02F2001/133328 , G02F2001/133628 , G06F1/20 , H05K1/0209 , H05K7/20963 , H05K2201/0162 , H05K2201/09909
Abstract: This display includes a light source portion, a first heat radiation member for radiating heat generated by the light source portion, a rear housing covering the first heat radiation member in a state in contact with the first heat radiation member, and a cover member covering a rear surface of the rear housing so that the rear surface of the rear housing is partially exposed outward. The first heat radiation member is arranged on a region corresponding to a region of the rear housing exposed outward from the cover member as viewed from the side of the rear surface.
Abstract translation: 该显示器包括光源部分，用于辐射由光源部分产生的热量的第一散热构件，以与第一散热构件接触的状态覆盖第一散热构件的后壳体，以及覆盖 后壳体的后表面使得后壳体的后表面部分地向外露出。 第一散热构件布置在从后表面侧观察到的从盖构件向外露出的区域对应的区域上。
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公开(公告)号：US20160128182A1
公开(公告)日：2016-05-05
申请号：US14930866
申请日：2015-11-03
Inventor： Kyung-wan PARK , Shi-yun CHO , Hyo-young LEE , Hyun-jung KIM , Mee-ree KIM , Ik-joon KIM
CPC classification number: H05K1/0283 , B32B3/08 , B32B7/045 , B32B27/08 , B32B27/281 , B32B27/283 , B32B27/32 , B32B27/34 , B32B27/36 , B32B27/365 , B32B27/40 , B32B2250/24 , B32B2255/10 , B32B2255/24 , B32B2262/103 , B32B2270/00 , B32B2307/202 , B32B2307/51 , B32B2307/546 , B32B2457/08 , H05K1/097 , H05K3/389 , H05K2201/0133 , H05K2201/0145 , H05K2201/0154 , H05K2201/0162 , H05K2201/026
Abstract: A flexible printed circuit board (PCB) has stretchability and durability. The flexible PCB includes: a first polymer substrate having flexibility, stretchability, or elasticity; a second polymer substrate having flexibility, stretchability, or elasticity; a conductive track disposed between the first and second polymer substrates and including metal nanowires; and a cured silane coupling agent which bonds the conductive track to at least one of the first and second polymer substrates.
Abstract translation: 柔性印刷电路板（PCB）具有拉伸性和耐久性。 柔性PCB包括：具有柔软性，拉伸性或弹性的第一聚合物基材; 具有柔软性，拉伸性或弹性的第二聚合物基材; 导电轨道，设置在所述第一和第二聚合物基底之间并且包括金属纳米线; 以及固化的硅烷偶联剂，其将导电轨道结合到第一和第二聚合物基底中的至少一个。
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