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    MICRO DEVICE TRANSFER HEAD ARRAY
    91.
    发明申请
    MICRO DEVICE TRANSFER HEAD ARRAY 有权
    微型设备传输头阵列

    公开(公告)号：US20150216042A1

    公开(公告)日：2015-07-30

    申请号：US14681707

    申请日：2015-04-08

    Applicant: LuxVue Technology Corporation

    Inventor： Dariusz Golda ,  Andreas Bibl

    IPC: H05K1/02 ,  H05K1/09 ,  H05K1/03 ,  H01L21/683 ,  H05K1/11

    CPC classification number: H01L21/6833 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/481 ,  H01L2221/68368 ,  H01L2924/00 ,  H01L2924/0002 ,  H05K1/0284 ,  H05K1/03 ,  H05K1/09 ,  H05K1/115 ,  H05K2201/09036

    Abstract: A micro device transfer head array and method of forming a micro device transfer array from an SOI substrate are described. In an embodiment, the micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include a silicon interconnect and an array of silicon electrodes electrically connected with the silicon interconnect. Each silicon electrode includes a mesa structure protruding above the silicon interconnect. A dielectric layer covers a top surface of each mesa structure.

    Abstract translation: 描述了从SOI衬底形成微器件传输阵列的微器件转移头阵列和方法。 在一个实施例中，微器件传送头阵列包括基底衬底和基底衬底上的图案化硅层。 图案化硅层可以包括硅互连和与硅互连电连接的硅电极阵列。 每个硅电极包括突出在硅互连上方的台面结构。 介电层覆盖每个台面结构的顶面。

    OFFSETTING SHIELDING AND ENHANCING COUPLING IN METALLIZED SMART CARDS
    94.
    发明申请
    OFFSETTING SHIELDING AND ENHANCING COUPLING IN METALLIZED SMART CARDS 审中-公开
    在金属化智能卡中取消屏蔽和增强耦合

    公开(公告)号：US20150178615A1

    公开(公告)日：2015-06-25

    申请号：US14552504

    申请日：2014-11-25

    Applicant: David Finn

    Inventor： David Finn

    IPC: G06K19/077 ,  H01F38/14

    CPC classification number: G06K19/07794 ,  G06K19/07771 ,  G06K19/07783 ,  H01F38/14 ,  H01F2038/143 ,  H01Q1/2225 ,  H01Q1/2283 ,  H01Q7/00 ,  H05K1/0239 ,  H05K1/165 ,  H05K3/103 ,  H05K2201/09036 ,  H05K2201/10098 ,  H05K2201/10287 ,  H05K2203/0285 ,  Y10T29/49016 ,  Y10T29/49018

    Abstract: A dual-interface smart card having a booster antenna with coupler coil in its card body, and a metallized face plate having a window opening for the antenna module. Performance may be improved by one or more of making the window opening substantially larger than the antenna module, providing perforations through the face plate, disposing ferrite material between the face plate and the booster antenna. Additionally, by one or more of modifying contact pads on the antenna module, disposing a compensating loop under the booster antenna, offsetting the antenna module with respect to the coupler coil, arranging the booster antenna as a quasi-dipole, providing the module antenna with capacitive stubs, and disposing a ferrite element in the antenna module between the module antenna and the contact pads.

    Abstract translation: 一种双接口智能卡，其具有在其卡体中具有耦合线圈的增强天线，以及具有用于天线模块的窗口的金属化面板。 可以通过将窗户开口大大地大于天线模块的一个或多个来提高性能，从而提供通过面板的穿孔，在面板和增强天线之间设置铁氧体材料。 另外，通过一个或多个修改天线模块上的接触焊盘，在增强天线之下设置补偿环路，相对于耦合线圈偏移天线模块，将增强天线布置为准偶极子，为模块天线提供 并且在天线模块中在模块天线和接触垫之间设置铁氧体元件。

    ELECTRONIC PACKAGED DEVICE AND MANUFACTURING METHOD THEREOF
    95.
    发明申请
    ELECTRONIC PACKAGED DEVICE AND MANUFACTURING METHOD THEREOF 有权
    电子包装设备及其制造方法

    公开(公告)号：US20150173258A1

    公开(公告)日：2015-06-18

    申请号：US14286965

    申请日：2014-05-23

    Applicant: UNIVERSAL SCIENTIFIC INDUSTRIAL ( SHANGHAI ) CO., LTD.

    Inventor： JEN-CHUN CHEN ,  PAI-SHENG SHIH

    IPC: H05K13/04 ,  H05K9/00

    CPC classification number: H05K9/0022 ,  H01L21/568 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2924/1815 ,  H01L2924/3025 ,  H05K1/181 ,  H05K9/0037 ,  H05K9/0039 ,  H05K9/0064 ,  H05K13/046 ,  H05K2201/09036 ,  H05K2201/10371 ,  Y10T29/49155

    Abstract: A manufacturing method of electronic packaged device includes the following. A plurality of electronic components is disposed on a substrate carrier. An encapsulating member is disposed on the substrate carrier and covers the electronic components. The substrate carrier is separated from the encapsulating member. A plurality of first trenches is arranged on a first surface of the encapsulating member. Conductive material is disposed onto the first surface and into the first trenches to form a conductive layer. The conductive layer is patterned on the first surface to form a circuit layer. The circuit layer includes at least one grounding pad. A plurality of second trenches is arranged on a second surface of the encapsulating member. At least one shielding structure is formed in the first trenches and the second trenches. An electromagnetic shielding layer is connected to the grounding pad.

    Abstract translation: 电子封装装置的制造方法包括以下。 多个电子元件设置在基板载体上。 封装构件设置在基板载体上并覆盖电子部件。 衬底载体与封装构件分离。 多个第一沟槽布置在封装构件的第一表面上。 导电材料设置在第一表面上并进入第一沟槽中以形成导电层。 在第一表面上形成导电层以形成电路层。 电路层包括至少一个接地垫。 多个第二沟槽布置在封装构件的第二表面上。 在第一沟槽和第二沟槽中形成至少一个屏蔽结构。 电磁屏蔽层连接到接地垫。

    Method of forming a micro device transfer head with silicon electrode
    98.
    发明授权
    Method of forming a micro device transfer head with silicon electrode 有权
    用硅电极形成微器件转印头的方法

    公开(公告)号：US09034754B2

    公开(公告)日：2015-05-19

    申请号：US13481615

    申请日：2012-05-25

    Applicant: Dariusz Golda ,  Andreas Bibl

    Inventor： Dariusz Golda ,  Andreas Bibl

    IPC: H01L21/4763 ,  H01L21/768 ,  H01L23/48

    CPC classification number: H01L21/6833 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/481 ,  H01L2221/68368 ,  H01L2924/00 ,  H01L2924/0002 ,  H05K1/0284 ,  H05K1/03 ,  H05K1/09 ,  H05K1/115 ,  H05K2201/09036

    Abstract: A micro device transfer head array and method of forming a micro device transfer array from an SOI substrate are described. In an embodiment, the micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include a silicon interconnect and an array of silicon electrodes electrically connected with the silicon interconnect. Each silicon electrode includes a mesa structure protruding above the silicon interconnect. A dielectric layer covers a top surface of each mesa structure.

    Abstract translation: 描述了从SOI衬底形成微器件传输阵列的微器件转移头阵列和方法。 在一个实施例中，微器件传送头阵列包括基底衬底和基底衬底上的图案化硅层。 图案化硅层可以包括硅互连和与硅互连电连接的硅电极阵列。 每个硅电极包括突出在硅互连上方的台面结构。 介电层覆盖每个台面结构的顶面。

    AC-DC CONVERTER
    99.
    发明申请
    AC-DC CONVERTER 审中-公开
    AC-DC转换器

    公开(公告)号：US20150131354A1

    公开(公告)日：2015-05-14

    申请号：US14444393

    申请日：2014-07-28

    Applicant: Kabushiki Kaisha Toshiba

    Inventor： Yuji Nakajima ,  Shigeyasu Iwata

    IPC: H02M7/00 ,  H02M7/04

    CPC classification number: H02M7/003 ,  H02M7/04 ,  H05K1/0256 ,  H05K1/144 ,  H05K1/165 ,  H05K3/4682 ,  H05K7/1432 ,  H05K2201/086 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/09163 ,  H05K2201/09672 ,  H05K2201/09972 ,  H05K2201/10303

    Abstract: According to one embodiment, an AC-DC converter includes a first printed wiring board, a planar transformer, a plurality of primary members, and a plurality of secondary members. The planar transformer has a primary coil, a secondary coil, a second printed wiring board and a core. The primary members are mounted on the first printed wiring board, and are electrically connected to the primary coil. The secondary members are mounted on the second printed wiring board, and are electrically connected to the secondary coil.

    Abstract translation: 根据一个实施例，AC-DC转换器包括第一印刷线路板，平面变压器，多个主要部件和多个次要部件。 平面变压器具有初级线圈，次级线圈，第二印刷线路板和芯。 主要部件安装在第一印刷线路板上，并与初级线圈电连接。 次要部件安装在第二印刷线路板上，并且与次级线圈电连接。

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