专利检索 ap:("Ekkehard Miersch" OR "Simon Muff" OR "Jens Pohl") AND inv:"Jens Pohl" 第 12 页

111.

发明授权
Growth/differentiation factors of the TGF-.beta. family 失效
标题翻译： TGF-β家族的生长/分化因子

公开(公告)号：US6120760A

公开(公告)日：2000-09-19

申请号：US289222

申请日：1994-08-12

申请人： Gertrud Hotten , Helge Neidhardt , Rolf Bechtold , Jens Pohl

发明人： Gertrud Hotten , Helge Neidhardt , Rolf Bechtold , Jens Pohl

IPC分类号： A61K38/00 , C07K14/495 , C07K14/51 , C12N15/19 , A61K38/19

CPC分类号： C07K14/51 , C07K14/495 , A61K38/00

摘要： The invention provides DNA sequences encoding novel members of the TGF-.beta. family of proteins. The TGF-.beta. family comprises proteins which function as growth and/or differentiation factors and which are useful in medical applications. Accordingly, the invention also describes the isolation of the above-mentioned DNA sequences, the expression of the encoded proteins, the production of the proteins and pharmaceutical compositions containing the proteins.

摘要翻译： 本发明提供了编码TGF-β蛋白家族的新成员的DNA序列。 TGF-β家族包含起到生长和/或分化因子的作用，可用于医学应用的蛋白质。因此，本发明还描述了分离上述DNA序列，编码蛋白质的表达，蛋白质的产生和含有蛋白质的药物组合物。

112.

发明授权
Integrated semiconductor circuit housing 有权
标题翻译：集成半导体电路外壳

公开(公告)号：US6057595A

公开(公告)日：2000-05-02

申请号：US221774

申请日：1998-12-28

申请人： Jens Pohl , Bruno Golz , Harald Widner

发明人： Jens Pohl , Bruno Golz , Harald Widner

IPC分类号： H01L23/28 , H01L23/495 , H01L23/50 , H01L23/48

CPC分类号： H01L23/49551 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73215 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01079

摘要： The integrated semiconductor circuit has a semiconductor chip, a housing that accommodates the semiconductor chip, and a lead frame that connects the contact areas of the semiconductor chip and forms external terminals of the integrated semiconductor circuit. The conductors of the lead frame are sunk, in the regions of the housing in which the distance between the edge of the housing and the semiconductor chip is relatively large, to the central plane of the housing, with the result that the conductors of the lead frame have depressions in those regions.

摘要翻译： 集成半导体电路具有半导体芯片，容纳半导体芯片的壳体和连接半导体芯片的接触区域并形成集成半导体电路的外部端子的引线框架。引线框架的导体在壳体的边缘与半导体芯片之间的距离相对较大的壳体的区域中沉没到壳体的中心平面，导致引线的导体这些地区的框架有凹凸。

113.

发明授权
Chip card module 有权
标题翻译：芯片卡模块

公开(公告)号：US08991711B2

公开(公告)日：2015-03-31

申请号：US13552660

申请日：2012-07-19

申请人： Frank Pueschner , Jens Pohl , Juergen Hoegerl , Wolfgang Schindler

发明人： Frank Pueschner , Jens Pohl , Juergen Hoegerl , Wolfgang Schindler

IPC分类号： G06K19/06 , H01L21/48 , H01L23/498 , H01L23/31 , H01L23/00

CPC分类号： H01L21/4853 , H01L21/4857 , H01L23/3121 , H01L23/49811 , H01L23/49838 , H01L23/4985 , H01L23/49855 , H01L23/49866 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/16238 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48229 , H01L2224/48465 , H01L2224/48472 , H01L2224/49171 , H01L2224/49175 , H01L2224/73204 , H01L2224/73265 , H01L2924/00 , H01L2924/00014 , H01L2924/181 , H01L2924/00012

摘要： In various aspects of the disclosure, a chip card module is provided. The chip card module may include a flexible substrate having a metallization on a first and second major surface, or side, thereof. An integrated circuit affixed to the second side is oriented with chip pads facing away from the substrate. Wire bonds may connect the chip pads to the metallizations.

摘要翻译： 在本公开的各个方面中，提供了芯片卡模块。芯片卡模块可以包括在其第一和第二主表面或侧面上具有金属化的柔性基板。固定到第二侧的集成电路被定向成具有面向离开衬底的芯片焊盘。引线键可以将芯片焊盘连接到金属化。

114.

发明授权
Semiconductor device including adhesive covered element 有权
标题翻译：包括粘合剂覆盖元件的半导体器件

公开(公告)号：US08659154B2

公开(公告)日：2014-02-25

申请号：US12048602

申请日：2008-03-14

申请人： Thorsten Meyer , Jens Pohl

发明人： Thorsten Meyer , Jens Pohl

IPC分类号： H01L23/48

CPC分类号： H01L21/56 , H01L21/561 , H01L21/563 , H01L21/568 , H01L21/6836 , H01L21/78 , H01L23/28 , H01L23/31 , H01L23/3107 , H01L23/3121 , H01L23/3128 , H01L23/3135 , H01L23/3192 , H01L23/488 , H01L23/49861 , H01L23/50 , H01L23/5389 , H01L24/11 , H01L24/14 , H01L24/19 , H01L24/96 , H01L24/97 , H01L2221/68327 , H01L2224/05001 , H01L2224/05026 , H01L2224/05548 , H01L2224/12105 , H01L2224/24195 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01029 , H01L2924/01082 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/30107 , H01L2224/82 , H01L2924/00 , H01L2224/05099

摘要： A semiconductor device includes a chip, at least one element electrically coupled to the chip, an adhesive at least partially covering the at least one element, and a mold material at least partially covering the chip and the adhesive.

摘要翻译： 半导体器件包括芯片，至少一个元件，电耦合到芯片，至少部分覆盖至少一个元件的粘合剂，以及至少部分地覆盖芯片和粘合剂的模具材料。

115.

发明授权
Device fabricated using an electroplating process 有权
标题翻译：使用电镀工艺制造的器件

公开(公告)号：US08334202B2

公开(公告)日：2012-12-18

申请号：US12611609

申请日：2009-11-03

申请人： Jens Pohl , Hans-Joachim Barth , Gottfried Beer , Rainer Steiner , Werner Robl , Mathias Vaupel

发明人： Jens Pohl , Hans-Joachim Barth , Gottfried Beer , Rainer Steiner , Werner Robl , Mathias Vaupel

IPC分类号： H01L23/48

CPC分类号： H01L23/5389 , H01L21/486 , H01L21/76873 , H01L21/76879 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L24/82 , H01L24/97 , H01L2221/1089 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1461 , H01L2924/181 , H01L2224/82 , H01L2924/00

摘要： A method for fabricating a device includes providing a substrate including at least one contact and applying a dielectric layer over the substrate. The method includes applying a first seed layer over the dielectric layer, applying an inert layer over the seed layer, and structuring the inert layer, the first seed layer, and the dielectric layer to expose at least a portion of the contact. The method includes applying a second seed layer over exposed portions of the structured dielectric layer and the contact such that the second seed layer makes electrical contact with the structured first seed layer. The method includes electroplating a metal on the second seed layer.

摘要翻译： 一种用于制造器件的方法包括提供包括至少一个接触的衬底并在衬底上施加电介质层。该方法包括在电介质层上施加第一种子层，在种子层上施加惰性层，以及构造惰性层，第一种子层和电介质层以暴露至少一部分接触。该方法包括在结构化介电层和触点的暴露部分上施加第二种子层，使得第二籽晶层与结构化的第一籽晶层电接触。该方法包括在第二种子层上电镀金属。

116.

发明授权
Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device 有权
标题翻译：半导体芯片封装，半导体芯片组装及其制造方法

公开(公告)号：US08202763B2

公开(公告)日：2012-06-19

申请号：US12899642

申请日：2010-10-07

申请人： Thorsten Meyer , Markus Brunnbauer , Jens Pohl

发明人： Thorsten Meyer , Markus Brunnbauer , Jens Pohl

IPC分类号： H01L21/00

CPC分类号： H01L21/565 , H01L21/561 , H01L21/568 , H01L24/19 , H01L24/82 , H01L24/96 , H01L24/97 , H01L25/0652 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/24146 , H01L2224/32145 , H01L2224/73267 , H01L2224/83101 , H01L2224/92244 , H01L2224/97 , H01L2225/06524 , H01L2225/06548 , H01L2225/06565 , H01L2225/06568 , H01L2225/06586 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/1461 , H01L2924/15311 , H01L2924/181 , H01L2924/19042 , H01L2924/19043 , H05K1/185 , H05K2201/09118 , H05K2201/10515 , H05K2201/10674 , H05K2203/016 , H05K2203/1316 , H05K2203/1469 , H01L2224/82 , H01L2924/00

摘要： A method for fabricating a device, a semiconductor chip package, and a semiconductor chip assembly is disclosed. One embodiment includes applying at least one semiconductor chip on a first form element. At least one element is applied on a second form element. A material is applied on the at least one semiconductor chip and on the at least one element.

摘要翻译： 公开了一种制造器件，半导体芯片封装和半导体芯片组件的方法。一个实施例包括在第一成形元件上施加至少一个半导体芯片。至少一个元素被应用在第二个表单元素上。在至少一个半导体芯片上和该至少一个元件上施加材料。

117.

发明授权
Semiconductor device with arrangement of parallel conductor lines being insulated, between and orthogonal to external contact pads 有权
标题翻译：具有平行导体线布置的半导体器件在外部接触焊盘之间并且与外部接触焊盘正交之间绝缘

公开(公告)号：US08080880B2

公开(公告)日：2011-12-20

申请号：US12408110

申请日：2009-03-20

申请人： Markus Brunnbauer , Jens Pohl , Thorsten Meyer

发明人： Markus Brunnbauer , Jens Pohl , Thorsten Meyer

IPC分类号： H01L29/40

CPC分类号： H01L24/11 , H01L21/561 , H01L21/568 , H01L23/3107 , H01L23/49816 , H01L23/525 , H01L23/528 , H01L23/5389 , H01L24/05 , H01L24/13 , H01L24/19 , H01L24/96 , H01L2224/02375 , H01L2224/02381 , H01L2224/0401 , H01L2224/04105 , H01L2224/05569 , H01L2224/05572 , H01L2224/1132 , H01L2224/12105 , H01L2224/13111 , H01L2224/19 , H01L2224/2105 , H01L2224/22 , H01L2224/94 , H01L2224/96 , H01L2924/00013 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H01L2924/1461 , H01L2924/01028 , H01L2224/13099 , H01L2224/05099 , H01L2224/13599 , H01L2224/05599 , H01L2224/29099 , H01L2924/00014 , H01L2224/29599 , H01L2224/03 , H01L2224/11 , H01L2924/01083 , H01L2924/00 , H01L2224/05552

摘要： A semiconductor device and manufacturing method. One embodiment provides a device including a semiconductor chip. A first conductor line is placed over the semiconductor chip. An external contact pad is placed over the first conductor line. At least a portion of the first conductor line lies within a projection of the external contact pad on the semiconductor chip.

摘要翻译： 半导体器件及其制造方法。一个实施例提供了包括半导体芯片的装置。第一导线被放置在半导体芯片上。外部接触垫放置在第一导体线上。第一导体线的至少一部分位于半导体芯片上的外部接触焊盘的突出部内。

118.

发明授权
Integrated circuit with re-route layer and stacked die assembly 有权
标题翻译：集成电路与重新路由层和堆叠模具组装

公开(公告)号：US07948071B2

公开(公告)日：2011-05-24

申请号：US12116079

申请日：2008-05-06

申请人： Jochen Thomas , Peter Weitz , Jurgen Grafe , Harry Hedler , Jens Pohl

发明人： Jochen Thomas , Peter Weitz , Jurgen Grafe , Harry Hedler , Jens Pohl

IPC分类号： H01L23/02

CPC分类号： H01L25/0657 , H01L24/73 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/06527 , H01L2225/06575 , H01L2924/01019 , H01L2924/01057 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/19041 , H01L2924/30107 , H01L2924/00 , H01L2924/00012

摘要： An apparatus and a method of manufacture for a stacked-die assembly. A first die is placed on a substrate such that the backside of the die, i.e., the side opposite the side with the bond pads, is coupled to the substrate, preferably by an adhesive. Wire leads electrically couple the bond pads of the first die to contacts on the substrate. A second die is placed on the first die, and wire leads electrically couple the bond pads of the second die to contacts on the substrate. Preferably, a spacer is placed between the first die and the second die. Additional dies may be stacked on the second die.

摘要翻译： 堆叠式模具组件的装置和制造方法。第一管芯被放置在衬底上，使得管芯的背面，即与接合焊盘的侧面相反的一侧，优选地通过粘合剂耦合到衬底。引线将第一管芯的接合焊盘电耦合到衬底上的接触点。第二管芯被放置在第一管芯上，引线将第二管芯的接合焊盘电耦合到衬底上的接触点。优选地，间隔件被放置在第一管芯和第二管芯之间。另外的模具可以堆叠在第二模具上。