公开(公告)号：US20040051171A1

公开(公告)日：2004-03-18

申请号：US10649005

申请日：2003-08-26

Inventor： Kee Yean Ng ,  Gurbir Singh

IPC: H01L023/48

CPC classification number: H01L33/486 ,  H01C1/14 ,  H01L23/3107 ,  H01L23/49551 ,  H01L23/49805 ,  H01L24/48 ,  H01L24/73 ,  H01L33/62 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/12041 ,  H01L2924/181 ,  H05K3/3442 ,  H05K2201/09154 ,  H05K2201/09472 ,  H05K2201/09745 ,  H05K2201/10106 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A surface mountable electronic device includes a body with a first surface for mounting the device. The first surface has recessed portions therein. Electrical contacts are provided in the first surface. The electrical contacts include first portions that form at least a portion of at least one inner surface of said recessed portions.

Abstract translation: 可表面安装的电子设备包括具有用于安装设备的第一表面的主体。 第一表面在其中具有凹部。 电触头设置在第一表面。 电触点包括形成所述凹部的至少一个内表面的至少一部分的第一部分。

公开(公告)号：US20040020688A1

公开(公告)日：2004-02-05

申请号：US10210091

申请日：2002-08-02

Applicant: United Test Center Inc.

Inventor： Chung-Che Tsai ,  Wei-Heng Shan

IPC: H05K001/09 ,  H05K001/11

CPC classification number: H05K3/3452 ,  H01L23/49816 ,  H01L2924/0002 ,  H05K3/244 ,  H05K2201/09745 ,  H05K2201/09827 ,  H05K2201/099 ,  H05K2203/0594 ,  H01L2924/00

Abstract: The present invention is to provide a printed circuit board, which comprises a substrate, a conductive pattern disposed on a surface of said substrate and a solder mask coated on the surface of said substrate and covered over the conductive pattern. The conductive pattern has a bonding pad. The solder mask has an opening corresponding in location to the bonding pad such that a portion of the bonding pad is exposed outside. A space is left between said solder mask and said bonding pad and is communicated with the opening. Whereby, a solder ball can be received in the opening and the space and electrically connected to the bonding pad, such that the solder ball is held on the printed circuit board securely.

Abstract translation: 本发明提供一种印刷电路板，其包括基板，设置在所述基板的表面上的导电图案和涂覆在所述基板的表面上且覆盖在导电图案上的焊接掩模。 导电图案具有接合焊盘。 焊接掩模具有与焊盘的位置对应的开口，使得焊盘的一部分暴露在外部。 所述焊接掩模和所述接合焊盘之间留有空间，并与开口连通。 由此，可以在开口和空间中容纳焊球并电连接到焊盘，使得焊球牢固地保持在印刷电路板上。

公开(公告)号：US20040014270A1

公开(公告)日：2004-01-22

申请号：US10421920

申请日：2003-04-24

Applicant: SANYO ELECTRIC CO., LTD.

Inventor： Masahiko Mizutani ,  Sadamichi Takakusaki ,  Motoichi Nezu ,  Kazutoshi Motegi

IPC: H01L021/8238

CPC classification number: H05K3/0052 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/14 ,  H01L2924/19105 ,  H05K1/056 ,  H05K3/284 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/09745 ,  H05K2203/0228 ,  H05K2203/1572 ,  H05K2203/302 ,  H01L2924/00014 ,  H01L2924/00

Abstract: In preferred embodiments, a compact a hybrid integrated circuit device 1 can be provided. A conductive pattern 12 is formed on the top surface of a circuit substrate 10, on the top surface of which an insulating layer 11 has been provided. Conductive pattern 12 is formed over the entirety of the top surface of the circuit substrate. Specifically, conductive pattern 12 is also formed at parts within 2 mm from the peripheral ends of circuit substrate 10. Also, a heat sink 13 A or other circuit element 13 with some height can be positioned near a peripheral end part of circuit substrate 10. By arranging hybrid integrated circuit device 1, the degree of integration of hybrid integrated circuit is improved. Thus, in a case where the same circuit as a prior-art example is formed, the size of the entire hybrid integrated circuit device can be made small.

Abstract translation: 在优选实施例中，可以提供一种紧凑的混合集成电路装置1。 导电图案12形成在电路基板10的顶表面上，其顶表面上设置有绝缘层11。 导电图案12形成在电路基板的整个顶表面上。 具体地，导电图案12也形成在距离电路基板10的外周端2mm以内的部分。此外，具有一定高度的散热器13A或其他电路元件13可以位于电路基板10的周边端部附近。 通过设置混合集成电路装置1，提高了混合集成电路的集成度。 因此，在形成与现有技术例子相同的电路的情况下，可以使整个混合集成电路器件的尺寸变小。

公开(公告)号：US06662440B1

公开(公告)日：2003-12-16

申请号：US09400613

申请日：1999-09-20

Applicant: Tongbi Jiang ,  Edward A. Schrock

Inventor： Tongbi Jiang ,  Edward A. Schrock

IPC: H05K334

CPC classification number: H01L24/83 ,  H01L24/31 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/095 ,  H05K3/1216 ,  H05K3/4007 ,  H05K2201/035 ,  H05K2201/0367 ,  H05K2201/09745 ,  H05K2203/167 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49181 ,  Y10T29/49204 ,  H01L2924/00

Abstract: A Z-axis electrical contact may be formed using a resinous deposit containing conductive particles which may align along surface regions to form an electrical conduction path over the resinous material. If the resinous material is thermoplastic, the material may be heated to mechanically bond to contact surfaces. Advantageously, the resinous material may be formed by forcing a resinous matrix containing conductive particles through an annular opening in a stencil. The resulting member allows surfaces to be contacted which may be irregular or may be covered by native oxide layers.

Abstract translation: 可以使用含有导电颗粒的树脂沉积物形成Z轴电接触，所述导电颗粒可以沿着表面区域排列以在树脂材料上形成电传导路径。 如果树脂材料是热塑性的，则材料可以被加热以机械地结合到接触表面。 有利地，树脂材料可以通过强制含有导电颗粒的树脂基质通过模板中的环形开口形成。 所得到的构件允许接触表面，其可以是不规则的或可以被天然氧化物层覆盖。

公开(公告)号：US20030213767A1

公开(公告)日：2003-11-20

申请号：US10426326

申请日：2003-04-29

Inventor： Robert Edward Belke JR. ,  Vivek A. Jairazbhoy ,  Thomas B. Krautheim ,  William F. Quitty JR.

IPC: H01B013/00

CPC classification number: H05K3/44 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/0361 ,  H05K2201/09554 ,  H05K2201/09745 ,  H05K2201/0979 ,  H05K2201/09854 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49156

Abstract: A multi-layer electronic circuit board design 10 having selectively formed apertures or cavities 26 which have improved solder-wetting characteristics.

Abstract translation: 具有选择性地形成的具有改善的焊料润湿特性的孔或腔26的多层电子电路板设计10。

公开(公告)号：US20030188887A1

公开(公告)日：2003-10-09

申请号：US10459343

申请日：2003-06-11

Inventor： Tatsumi Tsuchiya ,  Yuhsuke Matsumoto ,  Takaaki Murokawa ,  Naoki Fujii ,  Takuya Satoh ,  Yasuhiro Mita ,  Hiroyasu Tsuchida ,  Yoshio Uematsu

IPC: H05K001/11

CPC classification number: G11B5/4853 ,  G11B5/484 ,  G11B5/486 ,  H01L2224/742 ,  H05K1/189 ,  H05K3/3442 ,  H05K3/3494 ,  H05K2201/0397 ,  H05K2201/09663 ,  H05K2201/09745 ,  H05K2203/041 ,  H05K2203/107 ,  H05K2203/159 ,  Y02P70/613 ,  Y10T29/49025 ,  Y10T29/4903 ,  Y10T29/49032 ,  Y10T29/49046 ,  Y10T29/49144 ,  Y10T29/49179

Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.

Abstract translation: 一体化引线悬架包括放置在设置在悬架的弯曲部上的引线布线焊盘之间的焊球和设置在头部万向节部分的滑块上的焊盘。 引线接线板和接合焊盘通过熔化焊球进行焊接。 结果，在引线布线焊盘的表面的中心线附近，使用重力提供了通过表面凸起部分放置焊球的凹部。 以这种方式，当通过焊球连接接合焊盘和引线接线焊盘时，焊球的位置不会偏离中心线。

公开(公告)号：US06621207B2

公开(公告)日：2003-09-16

申请号：US10014398

申请日：2001-12-14

Applicant: Yoshimi Uda ,  Kazuya Ishiwata ,  Shinsaku Kubo ,  Yasuyuki Watanabe

Inventor： Yoshimi Uda ,  Kazuya Ishiwata ,  Shinsaku Kubo ,  Yasuyuki Watanabe

IPC: H01J162

CPC classification number: H05K1/0271 ,  H01J29/02 ,  H01J31/127 ,  H01J2329/0489 ,  H01J2329/861 ,  H05K1/092 ,  H05K3/248 ,  H05K2201/035 ,  H05K2201/09745 ,  H05K2203/0514 ,  Y10T29/49147 ,  Y10T29/49174 ,  Y10T29/53204 ,  Y10T29/53209

Abstract: As a substrate having a fine line and capable of suppressing crack generation in the substrate and peeling of the fine line, the invention discloses a configuration in which plural recesses are arranged on the fine line, and particularly a configuration in which the interval of the plural recesses does not exceed 200 &mgr;m. There is also disclosed a configuration in which the plural recesses are arranged along a direction crossing the longitudinal direction of the fine line.

公开(公告)号：US20030148070A1

公开(公告)日：2003-08-07

申请号：US09508572

申请日：2000-06-30

Inventor： ULRICH GOEBEL ,  ELMAR HUBER ,  ALBERT-ANDREAS HOEBEL

IPC: B32B003/00

CPC classification number: H05K1/0203 ,  H01L23/15 ,  H01L23/3733 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01058 ,  H01L2924/01068 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/3025 ,  H05K1/0306 ,  H05K1/053 ,  H05K2201/0116 ,  H05K2201/09745 ,  H05K2201/1056 ,  Y10T428/24479 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention relates to a substrate board (2) for micro hybrid integrated circuits (7) having a ceramic body (3). According to the present invention, provision is made that the ceramic body (3) is a porous body, whose cavities are filled with aluminum. Due to the relatively small difference in thermal expansion coefficients of the substrate board (2) and the micro hybrid integrated circuit (7), a very good thermal bond of the micro hybrid integrated circuits (7) to the substrate board (2) is possible.

Abstract translation: 本发明涉及一种具有陶瓷体（3）的微混合集成电路（7）的基板（2）。 根据本发明，提供陶瓷体（3）是多孔体，其空腔填充有铝。 由于基板（2）和微混合集成电路（7）的热膨胀系数的差异相对较小，微混合集成电路（7）与基板（2）的非常好的热粘合是可能的 。

公开(公告)号：US20030127499A1

公开(公告)日：2003-07-10

申请号：US10040740

申请日：2002-01-07

Applicant: International Business Machines Corporation

Inventor： Mark V. Pierson ,  Ajit K. Trivedi

IPC: B23K035/12

CPC classification number: H05K3/3436 ,  B23K26/0006 ,  B23K26/361 ,  B23K2101/42 ,  B23K2103/16 ,  H01L23/49816 ,  H01L24/81 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/81026 ,  H01L2224/81136 ,  H01L2224/81193 ,  H01L2224/814 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H05K3/3457 ,  H05K2201/09745 ,  H05K2201/10992 ,  H05K2203/0278 ,  H05K2203/048 ,  Y02P70/613 ,  H01L2924/00

Abstract: Self-aligning combination of a substrate with a chip is provided, using reverse patterns of raised recesses and raised shapes on the respective substrate and chip surfaces. High-force contact bump production is avoided. Reliable contact between a chip and substrate is achieved, with minimized skewing after chip placement.

Abstract translation: 提供了基板与芯片的自对准组合，在相应的基板和芯片表面上使用凸起凹槽和凸起形状的反向图案。 避免了大力接触凸块生产。 实现芯片和基板之间的可靠接触，并且在芯片放置之后使偏移最小化。

公开(公告)号：US06472608B2

公开(公告)日：2002-10-29

申请号：US09780819

申请日：2001-02-09

Applicant: Sadao Nakayama

Inventor： Sadao Nakayama

IPC: H05K103

CPC classification number: H05K1/111 ,  H01L23/49816 ,  H01L2924/0002 ,  H05K3/3452 ,  H05K3/3457 ,  H05K2201/0373 ,  H05K2201/09745 ,  H05K2203/0594 ,  H05K2203/1178 ,  Y02P70/611 ,  H01L2924/00

Abstract: The present invention provides a semiconductor device of the BGA configuration comprising: a wiring layer 2 arranged on a circuit substrate 1 via an insulation layer; a land metal portion 2 formed on the wiring layer 2; a solder resist 4 layered so as to cover the land metal excluding a center portion thereof and the entire surface of the circuit substrate 1; and a solder ball 5 arranged on the land metal portion defined and surrounded by the solder resist 4; wherein the land metal portion 3 has a solder ball contact surface having a groove (or a line-shaped protrusion) 7 extending continuously.

Abstract translation: 本发明提供了一种BGA结构的半导体器件，包括：经由绝缘层布置在电路基板1上的布线层2; 形成在布线层2上的接地金属部2; 以除了其中心部分和电路基板1的整个表面的方式覆盖焊盘金属的阻焊层4; 以及布置在由阻焊剂4限定和包围的焊盘金属部分上的焊球5; 其中，所述焊盘金属部3具有连续延伸的槽（或线状突起）7的焊球接触面。