公开(公告)号：US20130216847A1

公开(公告)日：2013-08-22

申请号：US13880966

申请日：2011-09-23

Applicant: Daniel Wolde-Giorgis ,  Andrea Feiock

Inventor： Daniel Wolde-Giorgis ,  Andrea Feiock

IPC: B23K35/24 ,  B32B7/12 ,  B23K1/00

CPC classification number: B23K35/24 ,  B22F1/0074 ,  B22F1/02 ,  B22F9/20 ,  B22F2998/00 ,  B23K1/0016 ,  B32B7/12 ,  B32B15/01 ,  C22C1/05 ,  C22C5/06 ,  C22C9/00 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/27332 ,  H01L2224/27334 ,  H01L2224/29194 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/29686 ,  H01L2224/2969 ,  H01L2224/83075 ,  H01L2224/8309 ,  H01L2224/8384 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/351 ,  H05K3/32 ,  H05K3/321 ,  H05K2201/0224 ,  H05K2203/1131 ,  H05K2203/1157 ,  H05K2203/121 ,  H05K2203/122 ,  Y10T403/477 ,  Y10T428/12063 ,  H01L2924/01007 ,  B22F3/001 ,  B22F3/10 ,  H01L2924/00

Abstract: The invention relates to a starter material for a sintering compound, said starter material comprising first particles of at least one metal having a first coating which is applied to the first particles and consists of an organic material, and second particles which contain an organic metal compound and/or a precious metal oxide, the organic metal compound and/or the precious metal oxide being converted during heat treatment of the starter material into the fundamental elemental metal and/or precious metal. The invention is characterized in that the second particles have a core of at least one metal and a second coating which is applied to the core and contains the organic metal compound and/or precious metal oxide. Furthermore, the first coating contains a reducing agent by means of which the organic metal compound and/or the precious metal oxide is/are reduced to the elemental metal and/or precious metal at a temperature below the sintering temperature of the elemental metal and/or precious metal.

Abstract translation: 本发明涉及一种用于烧结化合物的起始材料，所述起始材料包括至少一种金属的第一颗粒，其具有施加到第一颗粒上并由有机材料组成的第一涂层，以及含有有机金属化合物的第二颗粒 和/或贵金属氧化物，有机金属化合物和/或贵金属氧化物在起始材料的热处理期间转化为基本元素金属和/或贵金属。 本发明的特征在于，第二颗粒具有至少一种金属的芯和第二涂层，其被施加到芯上并且含有有机金属化合物和/或贵金属氧化物。 此外，第一涂层含有还原剂，通过该还原剂，有机金属化合物和/或贵金属氧化物在低于元素金属的烧结温度的温度下还原成元素金属和/或贵金属，和/ 或贵金属。

公开(公告)号：US20130004892A1

公开(公告)日：2013-01-03

申请号：US13616558

申请日：2012-09-14

Applicant: Thomas N. Tombs ,  Donald S. Rimal

Inventor： Thomas N. Tombs ,  Donald S. Rimal

IPC: G03G13/20

CPC classification number: H05K3/1266 ,  B65H85/00 ,  B65H2301/33312 ,  G03G15/1625 ,  G03G15/224 ,  G03G15/225 ,  G03G15/6585 ,  G03G15/6591 ,  G03G2215/00523 ,  H05K2201/0129 ,  H05K2201/0224 ,  H05K2203/0517 ,  H05K2203/0522 ,  H05K2203/0783 ,  H05K2203/1572

Abstract: The present invention provides a method producing printed electronic circuits using electrophotography.

Abstract translation: 本发明提供使用电子照相法制造印刷电子电路的方法。

公开(公告)号：US08309224B2

公开(公告)日：2012-11-13

申请号：US12515118

申请日：2008-04-11

Applicant: Yasushi Akutsu ,  Hidetsugu Namiki

Inventor： Yasushi Akutsu ,  Hidetsugu Namiki

IPC: B32B5/16

CPC classification number: H01R4/04 ,  C09J9/02 ,  H01B1/22 ,  H05K3/323 ,  H05K2201/0224 ,  Y10T428/2982 ,  Y10T428/2991 ,  Y10T428/2998

Abstract: There is disclosed a conductive particle used for an anisotropic conductive connection material for establishing conductive interconnection between e.g. a substrate and an electrical component. The conductive particle includes a base particle (2) exhibiting electrical conductivity at least on its surface and a continuous insulating resin film (3) formed by welding of fine particles (3a) of an insulating resin that composes the resin film. The surface of the base particle is coated with the continuous insulating resin film. There are formed voids at least between neighboring fine particles.

Abstract translation: 公开了用于在各向异性导电连接材料之间建立导电互连的导电颗粒。 基板和电气部件。 导电性粒子包括至少在其表面具有导电性的基体颗粒（2）和由构成树脂膜的绝缘树脂的细颗粒（3a）形成的连续绝缘树脂膜（3）。 基体颗粒的表面涂覆有连续的绝缘树脂膜。 至少在相邻的细颗粒之间形成空隙。

公开(公告)号：US08197717B2

公开(公告)日：2012-06-12

申请号：US12314853

申请日：2008-12-17

Applicant: Jung-Ho Park ,  Joon-Hyung Kim

Inventor： Jung-Ho Park ,  Joon-Hyung Kim

IPC: H01B1/20

CPC classification number: H01B1/22 ,  C08K3/08 ,  C08K3/22 ,  C08K9/08 ,  C09D7/62 ,  C09D11/322 ,  C09D11/36 ,  C09D11/52 ,  H05K1/097 ,  H05K2201/0224

Abstract: The present invention relates to a metal ink that comprises metal nano particles that are capped by a capping material; and an organic solvent that has a solubility parameter for swelling the capping material. In addition, the present invention relates to a method for producing a metal wire, which comprises the steps of jetting the metal ink by using an ink-jet nozzle, drying the metal ink, and firing the metal ink.

Abstract translation: 本发明涉及一种金属墨水，其包含被封盖材料覆盖的金属纳米颗粒; 以及具有使封盖材料膨胀的溶解度参数的有机溶剂。 另外，本发明涉及一种金属丝的制造方法，其特征在于，包括以下步骤：使用喷墨喷嘴喷射金属油墨，干燥金属油墨，并对金属油墨进行烧制。

公开(公告)号：US08187710B2

公开(公告)日：2012-05-29

申请号：US13009688

申请日：2011-01-19

Applicant: Takahiro Matsumoto ,  Toshiaki Yamada ,  Hirotaka Tsuruya

Inventor： Takahiro Matsumoto ,  Toshiaki Yamada ,  Hirotaka Tsuruya

IPC: B05D5/12 ,  B05D5/00 ,  B05D7/00

CPC classification number: H05K1/162 ,  B82Y30/00 ,  C01P2004/64 ,  C01P2006/12 ,  C01P2006/40 ,  C04B35/628 ,  C04B35/62821 ,  C04B2235/3293 ,  C09C1/00 ,  H01B1/08 ,  H01B3/006 ,  H01B3/02 ,  H01B3/10 ,  H01G4/206 ,  H05K2201/0215 ,  H05K2201/0224 ,  H05K2201/0257 ,  Y10T428/268 ,  Y10T428/2991 ,  Y10T428/2993 ,  Y10T428/2998

Abstract: There are disclosed insulated ultrafine powder comprising electroconductive ultrafine powder which is in the form of sphere, spheroid or acicular each having a minor axis in the range of 1 to 100 nm and an insulating film applied thereto; a process for producing the same which is capable of covering the surfaces of the insulated ultrafine powder with the insulating film having a thickness in the range of 0.3 to 100 nm without causing any clearance or vacancy; and a resin composite material which uses the same. A high dielectric constant of the material is assured by adding a small amount of insulated ultrafine powder wherein an insulating film is applied to the electroconductive ultrafine powder, while maintaining the processability and moldability that are the characteristics inherent in a resin material.

Abstract translation: 公开了包含导电性超细粉末的绝缘超细粉末，其为球状，球状或针状，各具有1〜100nm的短轴和施加于其上的绝缘膜; 其制造方法能够利用厚度在0.3〜100nm范围内的绝缘膜覆盖绝缘超细粉末的表面，而不会产生任何间隙或空位; 和使用该树脂复合材料的树脂复合材料。 通过在保持作为树脂材料中固有的特性的加工性和成型性的同时，通过添加少量绝缘超细粉末来确保材料的高介电常数，其中绝缘膜被施加到导电超细粉末。

公开(公告)号：US20120110843A1

公开(公告)日：2012-05-10

申请号：US13300917

申请日：2011-11-21

Applicant: Thomas N. Tombs ,  Donald S. Rimai

Inventor： Thomas N. Tombs ,  Donald S. Rimai

IPC: H05K3/02

CPC classification number: H05K3/102 ,  G03G15/224 ,  G03G15/6585 ,  G03G15/6591 ,  H05K3/1266 ,  H05K2201/0129 ,  H05K2201/0224 ,  H05K2201/0323 ,  H05K2203/0517 ,  H05K2203/0522 ,  H05K2203/125 ,  H05K2203/1572 ,  Y10T29/49156

Abstract: The present invention provides an article of manufacture using an electrophotographic printer to produce printed electronic circuits by printing a second conductive powder layer and a first thermoplastic layer in registration. The second conductive powder layer is permanently fixed to the first layer before removing conductive powder from portions of the substrate other than that coated with the thermoplastic patterned image.

Abstract translation: 本发明提供使用电子照相打印机通过印刷第二导电粉末层和配准的第一热塑性层来制造印刷电子电路的制品。 在除了涂覆有热塑性图案化图像的基板之外的基板的部分之前，将第二导电粉末层永久地固定到第一层。

公开(公告)号：US08173051B2

公开(公告)日：2012-05-08

申请号：US12558049

申请日：2009-09-11

Applicant: Takahiro Matsumoto ,  Toshiaki Yamada ,  Hirotaka Tsuruya

Inventor： Takahiro Matsumoto ,  Toshiaki Yamada ,  Hirotaka Tsuruya

IPC: H01B1/20 ,  H01B1/08

CPC classification number: H05K1/162 ,  B82Y30/00 ,  C01P2004/64 ,  C01P2006/12 ,  C01P2006/40 ,  C04B35/628 ,  C04B35/62821 ,  C04B2235/3293 ,  C09C1/00 ,  H01B1/08 ,  H01B3/006 ,  H01B3/02 ,  H01B3/10 ,  H01G4/206 ,  H05K2201/0215 ,  H05K2201/0224 ,  H05K2201/0257 ,  Y10T428/268 ,  Y10T428/2991 ,  Y10T428/2993 ,  Y10T428/2998

Abstract: There are disclosed insulated ultrafine powder comprising electroconductive ultrafine powder which is in the form of sphere, spheroid or acicular each having a minor axis in the range of 1 to 100 nm and an insulating film applied thereto; a process for producing the same which is capable of covering the surfaces of the insulated ultrafine powder with the insulating film having a thickness in the range of 0.3 to 100 nm without causing any clearance or vacancy; and a resin composite material which uses the same. A high dielectric constant of the material is assured by adding a small amount of insulated ultrafine powder wherein an insulating film is applied to the electroconductive ultrafine powder, while maintaining the processability and moldability that are the characteristics inherent in a resin material.

公开(公告)号：US20120104618A1

公开(公告)日：2012-05-03

申请号：US13348072

申请日：2012-01-11

Applicant: Yusuke Yasuda ,  Toshiaki Morita ,  Eiichi Ide ,  Hiroshi Hozoji ,  Toshiaki Ishii

Inventor： Yusuke Yasuda ,  Toshiaki Morita ,  Eiichi Ide ,  Hiroshi Hozoji ,  Toshiaki Ishii

IPC: H01L23/488

CPC classification number: H05K3/321 ,  B22F1/0014 ,  B22F1/0062 ,  B22F3/14 ,  B22F2003/145 ,  B23K35/22 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/40 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/29007 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29311 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29355 ,  H01L2224/2936 ,  H01L2224/29364 ,  H01L2224/29366 ,  H01L2224/29369 ,  H01L2224/29371 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/3754 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/84801 ,  H01L2224/85205 ,  H01L2224/8584 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/2076 ,  H05K2201/0224 ,  H05K2201/0257 ,  H05K2201/0266 ,  Y10T428/12028 ,  Y10T428/12181 ,  Y10T428/2991 ,  Y10T428/8305 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/83205 ,  H01L2924/00012

Abstract: A bonding material comprising metal particles coated with an organic substance having carbon atoms of 2 to 8, wherein the metal particles comprises first portion of 100 nm or less, and a second portion larger than 100 nm but not larger than 100 μm, each of the portions having at least peak of a particle distribution, based on a volumetric base. The disclosure is further concerned with a bonding method using the bonding material.

Abstract translation: 一种粘合材料，其包含涂覆有碳原子数为2〜8的有机物质的金属粒子，其中，所述金属粒子包含100nm以下的第一部分和大于100nm但不大于100μm的第二部分， 基于体积基数具有至少峰值分布的部分。 本公开还涉及使用接合材料的接合方法。

公开(公告)号：US20120097902A1

公开(公告)日：2012-04-26

申请号：US13266569

申请日：2010-04-22

Applicant: Motohiro Arifuku ,  Kouji Kobayashi ,  Tohru Fujinawa

Inventor： Motohiro Arifuku ,  Kouji Kobayashi ,  Tohru Fujinawa

IPC: H01B1/24 ,  H01B1/22 ,  H01B1/20 ,  B82Y99/00

CPC classification number: H01R4/04 ,  H01B1/22 ,  H01B1/24 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29369 ,  H01L2224/29393 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/12044 ,  H05K3/323 ,  H05K2201/0224 ,  H05K2201/0323 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: The anisotropic conductive particles of the invention have conductive fine particles 2 dispersed in an organic insulating material 3.

Abstract translation: 本发明的各向异性导电粒子具有分散在有机绝缘材料3中的导电性微粒子2。

公开(公告)号：US08124232B2

公开(公告)日：2012-02-28

申请号：US12738029

申请日：2008-10-21

Applicant: Shinji Abe

Inventor： Shinji Abe

IPC: B32B5/66

CPC classification number: H01B1/22 ,  C08K3/10 ,  C08K5/3445 ,  C09J9/02 ,  C09J163/00 ,  C23C18/1635 ,  C23C18/1651 ,  C23C18/1689 ,  C23C18/30 ,  C23C18/32 ,  C23C18/42 ,  H05K3/323 ,  H05K2201/0209 ,  H05K2201/0224 ,  Y10T428/2991 ,  Y10T428/2993 ,  Y10T428/2996 ,  Y10T428/2998

Abstract: It is an object of the present invention to provide a coated conductive powder particularly useful as the conductive filler of an anisotropic conductive adhesive used for electrically interconnecting circuit boards, circuit parts, and the like, and a conductive adhesive that can provide connection with high electrical reliability even for the connection of the electrodes of miniaturized electronic parts, such as IC chips, and circuit boards. The coated conductive powder of the present invention is a coated conductive powder obtained by coating the surfaces of conductive particles with an insulating substance, wherein the insulating substance is a powdery, thermally latent curing agent. Also, in the present invention, the particle surfaces of the coated conductive powder are further coated with insulating inorganic fine particles.

Abstract translation: 本发明的目的是提供一种特别用作用于将电路板，电路部件等电连接的各向异性导电粘合剂的导电填料特别有用的涂覆导电粉末，以及可提供与高电气连接的导电粘合剂 即使对于诸如IC芯片的小型化电子部件的电极和电路板的连接也是可靠的。 本发明的涂覆导电粉末是通过用绝缘物质涂覆导电颗粒的表面而获得的涂覆的导电粉末，其中绝缘物质是粉末状的热潜固化剂。 此外，在本发明中，涂覆的导电粉末的颗粒表面进一步涂覆绝缘无机细颗粒。