公开(公告)号：US12095046B2

公开(公告)日：2024-09-17

申请号：US18146116

申请日：2022-12-23

Applicant: Black & Decker Inc.

Inventor： Moriah Counts ,  Vy Ho ,  Alexander R. Barton ,  Nathan J. Cruise

IPC: H01M10/42 ,  H01M50/213 ,  H05K1/18 ,  H05K3/34 ,  H01M50/271

CPC classification number: H01M10/425 ,  H01M50/213 ,  H05K1/184 ,  H05K3/3447 ,  H01M2010/4271 ,  H01M50/271 ,  H01M2220/30 ,  H05K2201/10037 ,  H05K2201/10757

Abstract: A battery pack comprises a set of battery cells, a battery cell holder holding the battery cells, at least one battery strap having a first end connected to a terminal of one of the battery cells and a second end extending from the battery cell holder, a printed circuit board having a first side and a second side, components mounted on the second side of the printed circuit board, a trace on the second side of the printed circuit board extending from one components to a contact connected to the trace and mated with the second end of the at least one battery strap. Multiple vias extend from the first side to the second side, and the contact comprises a first portion having a through hole and a leg integrally formed with and approximately perpendicular to the first portion, the leg extending from the first side of the PCB to the second side of the PCB through a first via, the trace extending from the first via, the leg soldered to the second side of the PCB and the via and the through hole aligned with a second via adjacent to the first via, the through hole sized and configured to receive a PCB end of the strap, the PCB end of the strap soldered to the contact.

公开(公告)号：US12080634B2

公开(公告)日：2024-09-03

申请号：US17756556

申请日：2020-11-25

Applicant: THE NOCO COMPANY

Inventor： James P. McBride ,  James Richard Stanfield

IPC: H05K1/18 ,  H01L23/495 ,  H01M10/42 ,  H01M50/519 ,  H05K1/14 ,  H05K3/34 ,  H01L25/11

CPC classification number: H01L23/49555 ,  H01L23/49562 ,  H01M10/4257 ,  H01M50/519 ,  H05K1/141 ,  H05K1/181 ,  H05K3/3426 ,  H01L25/115 ,  H01M2010/4271 ,  H05K2201/10166 ,  H05K2201/10522 ,  H05K2201/10628 ,  H05K2201/10659 ,  H05K2201/10757 ,  H05K2201/10818 ,  H05K2203/049

Abstract: Provided is a MOSFET device for use with a printed circuit board (PCB) of a battery management system (BMS), the device including a semiconductor body; a metal conductor extending outwardly from a side of the semiconductor body; a plurality of power pins extending outwardly from at least one side of the semiconductor body, the power pins having tips bent downwardly; a gate pin extending outwardly from at least one side of the semiconductor body, wherein the tip of the gate pin is raised or elevated relative to the tips of the power pins so as to avoid electrical contact with the one of the spaced apart copper plates, and wherein the tip of the gate pin is connected to a circuit of the battery management system (BMS).

公开(公告)号：US20240215167A1

公开(公告)日：2024-06-27

申请号：US18145066

申请日：2022-12-22

Applicant: Garrett Transportation I Inc

Inventor： Valeriy Fedorikhin

IPC: H05K1/18 ,  H05K3/34

CPC classification number: H05K1/18 ,  H05K3/3447 ,  H01L25/115 ,  H05K2201/10166 ,  H05K2201/10606 ,  H05K2201/10757 ,  H05K2201/10901

Abstract: An electric vehicle thermal management system for compressing a low pressure refrigerant with a centrifugal compressor to generate a high pressure refrigerant, determining a battery cooling condition, routing one of the low pressure refrigerant and the high pressure refrigerant to the heat exchanger in response to the battery cooling condition, regulating a transfer of heat between the refrigerant loop and the battery cooling loop in response to a temperature of the battery coolant within the battery cooling loop and the battery cooling condition, and regulating the transfer of heat between the battery coolant loop and a cabin coolant loop in response to the HVAC setting and a cabin coolant temperature within the cabin coolant loop.

公开(公告)号：US11961642B2

公开(公告)日：2024-04-16

申请号：US17426491

申请日：2020-08-10

Applicant: LG Energy Solution, Ltd.

Inventor： Dong-Wan Ko

IPC: H01C1/01 ,  H01C1/14 ,  H05K1/18

CPC classification number: H01C1/01 ,  H01C1/14 ,  H05K1/181 ,  H05K2201/09063 ,  H05K2201/10022 ,  H05K2201/10409 ,  H05K2201/10446 ,  H05K2201/10757

Abstract: A shunt resistor module, which includes a shunt resistor having a resistor unit having a predetermined resistance, plate-shaped terminal units respectively configured to extend at both sides of the resistor unit, and a voltage measurement lead pin configured to protrude perpendicular to the terminal unit and having an end portion bent to be parallel to the terminal unit, and a PCB substrate having an assembly guide portion formed to be cut inward by a predetermined depth from an outermost side thereof. The voltage measurement lead pin is fit into the assembly guide portion so that the resistor unit and the terminal unit are placed on a front surface of the PCB substrate and the end portion of the voltage measurement lead pin is caught at a rear surface of the PCB substrate.

公开(公告)号：US11857166B2

公开(公告)日：2024-01-02

申请号：US17028336

申请日：2020-09-22

Applicant: OLYMPUS CORPORATION

Inventor： Hiroyuki Motohara

IPC: H05K1/14 ,  A61B1/05 ,  H05K1/11

CPC classification number: A61B1/051 ,  H05K1/115 ,  H05K1/147 ,  H05K2201/10015 ,  H05K2201/10151 ,  H05K2201/10757

Abstract: An imaging unit includes: a semiconductor package including an optical system, an imaging sensor, and connection terminals; a rigid substrate including first connection lands respectively connected to the connection terminals; and an electronic component mount region including second connection lands on which a capacitor is mounted, and an inner lead mount region including third connection lands; and a flexible printed board including inner leads extended from one end of the flexible printed board in a bent manner and respectively connected to the third connection leads in the inner lead mount region; and cable connection leads arranged on another end of the flexible printed board and respectively connected to the inner leads. The rigid substrate and the flexible printed board are arranged in a projection plane in an optical axis direction of the semiconductor package. The third connection lands are arranged along one side of the rigid substrate.

公开(公告)号：US11659664B2

公开(公告)日：2023-05-23

申请号：US17471570

申请日：2021-09-10

Applicant: SEIKO EPSON CORPORATION

Inventor： Masataka Kazuno ,  Tetsuya Otsuki ,  Hitoshi Ueno

IPC: H05K1/18 ,  G01P3/44 ,  G01P15/18 ,  G01P15/125

CPC classification number: H05K1/181 ,  G01P3/44 ,  G01P15/125 ,  G01P15/18 ,  H05K2201/10151 ,  H05K2201/10628 ,  H05K2201/10757

Abstract: An electronic device includes: a substrate having an upper surface and a lower surface; a first electronic component mounted on the upper surface of the substrate; a second electronic component mounted on the lower surface of the substrate; and a mold portion covering the second electronic component without covering the first electronic component. The first electronic component is bonded to the upper surface on the first relative surface via a conductive first bonding member. The second electronic component is bonded to the lower surface via a second bonding member on a second relative surface relative to the lower surface.

公开(公告)号：US20180359856A1

公开(公告)日：2018-12-13

申请号：US15780967

申请日：2017-02-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Woo Su ROH ,  Sang Won HA

IPC: H05K1/14 ,  H05K1/18 ,  G02F1/1333

CPC classification number: H05K1/14 ,  G02F1/1333 ,  H01R12/7023 ,  H01R12/721 ,  H01R12/79 ,  H01R13/64 ,  H01R24/60 ,  H05K1/147 ,  H05K1/182 ,  H05K3/325 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2201/10757

Abstract: Disclosed herein are an improved structure for connecting printed circuit boards and display apparatus having the structure, by which two printed circuit boards may be directly connected by a harness without extra parts, jacks. A structure for connecting printed circuit boards (PCBs), electrically connecting a first PCB and a second PCB with printed circuits provided thereon, the structure includes fixing holes formed in the first PCB and the second PCB, and a harness fixed to the fixing holes at both ends to electrically connect the first PCB and the second PCB, wherein the harness includes housings arranged in a pair to be fixed to the first PCB and the second PCB and having projections to be inserted and fixed to the fixing holes, contact terminals arranged in the housings to come into contact with the printed circuits, and a cable connected to the contact terminals to electrically connect the pair of housings.

公开(公告)号：US20180188290A1

公开(公告)日：2018-07-05

申请号：US15741213

申请日：2016-07-04

Applicant: OKINS ELECTRONICS CO.,LTD

Inventor： Sung Gye PARK ,  Jin Kook JUN

IPC: G01R3/00 ,  G01R1/04 ,  G01R31/28 ,  H05K3/10 ,  H05K3/28 ,  H05K1/11 ,  H05K1/02 ,  H05K3/40

CPC classification number: G01R3/00 ,  G01R1/0433 ,  G01R31/2863 ,  G01R31/2896 ,  H05K1/0268 ,  H05K1/028 ,  H05K1/111 ,  H05K3/103 ,  H05K3/28 ,  H05K3/285 ,  H05K3/3484 ,  H05K3/4007 ,  H05K3/4015 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2201/09827 ,  H05K2201/10234 ,  H05K2201/10265 ,  H05K2201/10287 ,  H05K2201/10757 ,  H05K2201/10795 ,  H05K2201/10856 ,  H05K2203/041 ,  H05K2203/1327 ,  H05K2203/166

Abstract: A method of manufacturing a test socket includes preparing a printed circuit board (PCB) on which a bonding pad is disposed, bonding a conductive wire on the bonding pad, mounting, on an upper surface of the PCB, a space through which the bonding pad is exposed, mounting, on an upper surface of the space, a base through which the bonding pad is exposed, mounting, on an upper surface of the base, a jig which covers the bonding pad, and injecting a liquid silicone rubber into a jig assembly by using the jig assembly as a mold, the jig assembly including the PCB, the space, the base, and the jig.

公开(公告)号：US20180042104A1

公开(公告)日：2018-02-08

申请号：US15785563

申请日：2017-10-17

Applicant: OMRON Corporation

Inventor： Shingo NAGAOKA ,  Hiroyuki ONISHI ,  Takeo NISHIKAWA ,  Kentaro HAMANA

IPC: H05K1/02 ,  H01L23/433 ,  H05K1/18

CPC classification number: H05K1/0216 ,  H01L23/36 ,  H01L23/4332 ,  H01L23/5222 ,  H02M1/44 ,  H02M3/155 ,  H02M7/48 ,  H05K1/0209 ,  H05K1/181 ,  H05K2201/0311 ,  H05K2201/066 ,  H05K2201/0792 ,  H05K2201/10166 ,  H05K2201/10265 ,  H05K2201/10356 ,  H05K2201/10628 ,  H05K2201/10757

Abstract: Provided is a power converter which is applied to a power converter equipped with a switching element provided on a line, and a radiator connected to a predetermined potential such as a ground potential. A noise eliminator in which a conductive member is covered with insulator is provided between the switching element (semiconductor switch) and the radiator (heatsink). A flexible connecting line connected to a conductive member of the noise eliminator is connected to an on-board line disposed on a circuit board.

公开(公告)号：US20170354037A1

公开(公告)日：2017-12-07

申请号：US15535639

申请日：2015-12-08

Applicant: AutoNetworks Technologies, Ltd. ,  Sumitomo Wiring Systems, Ltd. ,  Sumitomo Electric Industries, Ltd.

Inventor： Tou Chin ,  Yu Muronoi

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34

CPC classification number: H05K1/181 ,  H05K1/0203 ,  H05K1/0263 ,  H05K1/111 ,  H05K3/325 ,  H05K3/3421 ,  H05K3/4015 ,  H05K3/4046 ,  H05K2201/066 ,  H05K2201/068 ,  H05K2201/09063 ,  H05K2201/10166 ,  H05K2201/1031 ,  H05K2201/10628 ,  H05K2201/10757 ,  Y02P70/611 ,  Y02P70/613

Abstract: Provided are a circuit assembly in which it is possible to eliminate or reduce a level difference between a mounting surface of a substrate and portions to which terminals that are electrically connected to a conductive member are connected, and that can be easily produced, and a method for manufacturing the same. A circuit assembly includes a substrate provided with openings and an electronic component mounted on one side of the substrate, a conductive member that is a plate-shaped member fixed to another side of the substrate, the conductive member constituting a conductive path, and a relay member that is fixed to a surface on the substrate side of the conductive member and made of an electrically conductive material, the relay member being accommodated in the openings formed in the substrate, at least one terminal of the electronic component being connected to the relay member.