摘要:
A semiconductor module comprises independently operable segments 1 (semiconductor elements) on a SiC substrate. Each segment 1 comprises a source electrode pad 2 and a gate electrode pad 3 both provided to the principal surface side of the SiC substrate, and a drain electrode pad provided on the back surface side of the SiC substrate. The semiconductor module further comprises an isolation region such as a trench or a Schottky diode for electrically isolating the adjacent segments 1 from each other. Only electrode pads 2 and 3 of each of the segments 1 determined as conforming items by a test are connected to electrode terminals 41 and 43, respectively.
摘要:
In a semiconductor device of the present invention, the top surface of an n-type silicon carbide layer formed on a silicon carbide substrate is miscut from the (0001) plane in the direction. A gate electrode, a source electrode and other elements are arranged such that in a channel region, the dominating current flows along a miscut direction.In the present invention, a gate insulating film is formed and then heat treatment is performed in an atmosphere containing a group-V element. In this way, the interface state density at the interface between the silicon carbide layer and the gate insulating film is reduced. As a result, the electron mobility becomes higher in a miscut direction A than in the direction perpendicular to the miscut direction A.
摘要:
In a semiconductor device of the present invention, the top surface of an n-type silicon carbide layer formed on a silicon carbide substrate is miscut from the (0001) plane in the direction. A gate electrode, a source electrode and other elements are arranged such that in a channel region, the dominating current flows along a miscut direction. In the present invention, a gate insulating film is formed and then heat treatment is performed in an atmosphere containing a group-V element. In this way, the interface state density at the interface between the silicon carbide layer and the gate insulating film is reduced. As a result, the electron mobility becomes higher in a miscut direction A than in the direction perpendicular to the miscut direction A.
摘要:
A polyether ester elastic fiber comprising a polyether ester elastomer containing polybutylene terephthalate as a hard segment and polyoxyethylene glycol as a soft segment and copolymerized with a specific metal organic sulfonate, having a coefficient of moisture absorption of not less than 5% at 35° C. and at a RH of 95% and a coefficient of water absorption extension of not less than 10%. The above-mentioned polyether ester elastic fiber has a good moisture-absorbing property, and is reversibly largely expanded or contracted by the absorption or release of water. Therefore, a fabric giving excellent comfortableness can be obtained from said elastic fibers, and can be recycled.
摘要:
A storage-type SiC-MISFET includes a SiC substrate, an n-type drift layer, a p-type well region, an n-type source region, a SiC channel layer which contains an n-type impurity and is to be a storage-type channel layer, a p-type heavily doped contact layer, a gate insulation film, a gate electrode and the like. In the storage-type SiC-MISFET, a partially heavily doped layer is formed by partially implanting ions of a p-type impurity into an upper surface portion of the n-type drift layer and containing an impurity of the same conductive type as that of the impurity implanted into the well region at a higher concentration than that in the well region.
摘要:
A DMOS device (or IGBT) includes an SiC substrate 2, an n-SiC layer 3 (drift region) formed in an epitaxial layer, a gate insulating film 6, a gate electrode 7a, a source electrode 7b formed to surround the gate electrode 7a, a drain electrode 7c formed on the lower surface of the SiC substrate 2, a p-SiC layer 4, an n+ SiC layer 3 formed to be present from under edges of the source electrode 7b to under associated edges of the gate electrode 7a. In addition, the device includes an n-type doped layer 10a containing a high concentration of nitrogen and an undoped layer 10b, which are stacked in a region in the surface portion of the epitaxial layer except the region where the n+ SiC layer 5 is formed. By utilizing a quantum effect, the device can have its on-resistance decreased, and can also have its breakdown voltage increased when in its off state.
摘要:
In a chamber, a substrate is mounted on a susceptor and then heated to an elevated temperature. Source and diluting gases are supplied into the chamber through source and diluting gas supply pipes provided with respective flow meters. In addition, a doping gas is also supplied through an additive gas supply pipe, which is provided with a pulse valve, and a gas inlet pipe into the chamber by repeatedly opening and closing the pulse valve. In this manner, a doped layer is grown epitaxially on the substrate. In this case, a pulsed flow of the doping gas is directly supplied through the pulse valve onto the substrate from the outlet port of a pressure reducer for a doping gas cylinder. As a result, a steeply rising dopant concentration profile appears in a transition region between the substrate and the doped layer, and the surface of the doped layer is planarized.
摘要:
An impurity doped SiC substrate 1 and SiC thin film 2 are irradiated with a laser light 5 having a wavelength longer than such a wavelength that a band edge absorption of a semiconductor is caused. The wavelength of the laser light 5 may be such a wavelength that an absorption is caused by a vibration by the bond of an impurity element and an element constituting the semiconductor, for example, a wavelength of 9 &mgr;m to 11 &mgr;m. Specifically, in the case where Al is doped in SiC, the wavelength of the laser light 5 may be within the range of 9.5 &mgr;m to 10 &mgr;m.
摘要:
An electron emission cathode includes: an n-type semiconductor film including diamond particles partially projecting from a surface of the n-type semiconductor film; and an anode opposing the n-type semiconductor film with a vacuum interposed therebetween. Electrons are emitted by applying a voltage between the anode and the n-type semiconductor film.
摘要:
A novel method is provided for treating metallic or ceramic surfaces (hot plates, metallic molds and the like) at a high temperature of 200.degree. C. or above, wherein organic treating agents (finishes, release agents and the like) will not form a tar or sludge. According to this method, the continuous operation can be conducted due to neither staining on the metallic surfaces nor stop of the machine for a heater cleaning. Examples of the organic treating agents to be used include a polyalkylene glycol thermally decomposable at 150.degree. C. or above in air and a fluorine-containing compound, preferably the nonionic type, having a fluoroalkyl group in the molecule.