公开(公告)号：US06989587B2

公开(公告)日：2006-01-24

申请号：US10730119

申请日：2003-12-09

申请人： Mamoru Ito ,  Akira Muto ,  Tomio Yamada ,  Tsuneo Endoh ,  Satoru Konishi ,  Kazuaki Uehara ,  Tsutomu Ida ,  Koji Odaira ,  Hirokazu Nakajima

发明人： Mamoru Ito ,  Akira Muto ,  Tomio Yamada ,  Tsuneo Endoh ,  Satoru Konishi ,  Kazuaki Uehara ,  Tsutomu Ida ,  Koji Odaira ,  Hirokazu Nakajima

IPC分类号： H91L23/02

CPC分类号： H01L24/49 ,  H01L21/565 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K3/3426 ,  H05K2201/10166 ,  H05K2201/1084 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

摘要： There is provided a semiconductor device with enhanced reliability having a heat sink mounting a plurality of semiconductor chips, a plurality of inner leads connected electrically to the semiconductor chips, a molding body for resin molding the plurality of semiconductor chips and the plurality of inner leads, a plurality of wires for providing electrical connections between the respective electrodes of the semiconductor chips and the inner leads corresponding thereto, and wide outer leads connecting to the inner leads and exposed outside the molding body. A plurality of slits are formed in the respective portions of the outer leads located outside the molding body to extend lengthwise in directions in which the outer leads are extracted. This achieves a reduction in lead stress which is placed on the outer leads by thermal stress or the like after the mounting of a MOSFET and thereby enhances the reliability of the MOSFET.

摘要翻译： 提供了具有增强的可靠性的半导体器件，其具有安装多个半导体芯片的散热器，与半导体芯片电连接的多个内部引线，用于树脂模制多个半导体芯片和多个内部引线的成型体， 用于提供半导体芯片的各个电极和对应于其的内部引线之间的电连接的多根电线，以及连接到内部引线并暴露在模制体外部的宽的外部引线。 在位于模制体外部的外引线的各个部分中形成多个狭缝，以在外引线被抽取的方向上纵向延伸。 这实现了在安装MOSFET之后通过热应力等放置在外引线上的引线应力的降低，从而提高了MOSFET的可靠性。

公开(公告)号：US20050250254A1

公开(公告)日：2005-11-10

申请号：US11178423

申请日：2005-07-12

申请人： Akio Ishizu ,  Kazutoshi Takashima ,  Shiro Oba ,  Yoshihiko Kobayashi ,  Tsutomu Ida ,  Shigeru Haga ,  Susumu Takada ,  Iwamichi Koujiro ,  Norinaga Arai ,  Yuji Kakegawa

发明人： Akio Ishizu ,  Kazutoshi Takashima ,  Shiro Oba ,  Yoshihiko Kobayashi ,  Tsutomu Ida ,  Shigeru Haga ,  Susumu Takada ,  Iwamichi Koujiro ,  Norinaga Arai ,  Yuji Kakegawa

IPC分类号： G01R31/26 ,  H01L21/50 ,  H01L21/58 ,  H01L21/66 ,  H01L21/98 ,  H01L23/04 ,  H01L23/10 ,  H01L23/13 ,  H01L23/498 ,  H01L23/50 ,  H01L23/544 ,  H01L25/16

CPC分类号： H01L22/20 ,  H01L21/50 ,  H01L23/04 ,  H01L23/10 ,  H01L23/13 ,  H01L23/49805 ,  H01L23/50 ,  H01L23/544 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/16 ,  H01L25/165 ,  H01L25/50 ,  H01L2223/54406 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15313 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48247

摘要： A method of manufacturing a semiconductor device able to reduce the number of manufacturing steps and attain the rationalization of a manufacturing line is disclosed. The semiconductor device is a high-frequency module assembled by mounting chip parts (22) and semiconductor pellets (21) onto each of wiring substrates (2) formed on a matrix substrate (27) after inspection. A defect mark (2e) is affixed to a wiring substrate (2) as a block judged to be defective in the inspection of the matrix substrate (27), then in a series of subsequent assembling steps the defect mark (e) is recognized and the assembling work for the wiring substrate (2) with the defect mark (2e) thereon is omitted to attain the rationalization of a manufacturing line.

公开(公告)号：US5844484A

公开(公告)日：1998-12-01

申请号：US432141

申请日：1995-04-28

申请人： Hiroyuki Fujiuchi ,  Masaaki Takeshita ,  Keinji Uchida ,  Tsutomu Ida ,  Mitsuhiko Nakajima

发明人： Hiroyuki Fujiuchi ,  Masaaki Takeshita ,  Keinji Uchida ,  Tsutomu Ida ,  Mitsuhiko Nakajima

IPC分类号： G08B7/06 ,  G08B13/14 ,  G08B13/187

CPC分类号： G08B13/1454 ,  G08B13/1463 ,  G08B13/1472 ,  G08B7/06

摘要： The present invention relates to a theft preventive apparatus used as attached to a commodity or the like exhibited in a shop, for outputting an alarm when detached therefrom. Conventionally, an alarm output device for outputting alarm information comprises a speaker for giving an alarm sound. However, it is impossible, where a plurality of theft prevention apparatus are arranged close to one another, to determine instantly which theft prevention apparatus is giving the alarm sound. The theft preventive apparatus of this invention comprises a box (2) attachable to an object of theft prevention (E) and including detecting means (P) for detecting a preliminary stealing act, and alarm output means (Q) for outputting alarm information based on detection information from the detecting means (P), said box (2) housing light emitting means (20) for emitting light based on the detection information from the detecting means (P) outwardly of said box (2). Even if a plurality of theft preventive apparatus are arranged close to one another, an instant determination may be made as to which one of theft prevention apparatus is outputting alarm information, by observing which theft preventive apparatus is emitting light.

摘要翻译： PCT No.PCT / JP94 / 01407 Sec。 371日期：1995年4月28日 102（e）日期1995年4月28日PCT 1994年8月25日PCT公布。 第WO95 / 06924号公报 日期：1995年3月9日本发明涉及一种在店内展示的商品等上使用的防盗装置，用于在分离时输出报警。 通常，用于输出报警信息的报警输出装置包括用于发出报警声的扬声器。 然而，在多个防盗装置彼此靠近配置的情况下，不可能立即确定哪个防盗装置正在发出报警声。 本发明的防盗装置包括一个可防盗防盗装置（E）的盒子（2），包括用于检测预防盗窃动作的检测装置（P），以及用于输出警报信息的警报输出装置 根据来自检测装置（P）的检测信息，所述盒（2）根据来自检测装置（P）的检测信息来容纳用于发射光的发光装置（20）。 即使多个防盗装置彼此靠近地布置，可以通过观察哪个防盗装置发光来确定防盗装置中哪一个正在输出警报信息。

公开(公告)号：US20070105283A1

公开(公告)日：2007-05-10

申请号：US11647162

申请日：2006-12-29

申请人： Yoshihiko Kobayashi ,  Susumu Sato ,  Koki Tanimoto ,  Tomio Yamada ,  Hirokazu Nakajima ,  Tomoaki Kudaishi ,  Yoshinori Shiokawa ,  Toshiharu Niitsu ,  Tsutomu Ida

发明人： Yoshihiko Kobayashi ,  Susumu Sato ,  Koki Tanimoto ,  Tomio Yamada ,  Hirokazu Nakajima ,  Tomoaki Kudaishi ,  Yoshinori Shiokawa ,  Toshiharu Niitsu ,  Tsutomu Ida

IPC分类号： H01L21/00

CPC分类号： H05K3/0052 ,  H01L21/481 ,  H01L2224/48227 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0306 ,  H05K3/284 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2203/302 ,  H01L2924/00012

摘要： In a dividing method according to the present invention, a wiring board formed of ceramic is forced up (upper swing) by a lower clamp claw of a clamper, and some of a protruded wiring board portion protruding from a conveying chute is pressed against a support body to perform a first division under bending stress. Thereafter, the upward-located clamper is rotatably swung (lower swing) downward to allow an upper clamp claw to press down the protruded wiring board portion, thereby performing a reverse division at the first division section again as a second division. Since the second division allows a tensile force to act on a remaining and thin non-divided resin portion, the non-divided resin portion is torn off. Thus, the perfect division is enabled. Fractionalizing is done by a one-row division and an individual division so that each semiconductor device is formed.

摘要翻译： 在根据本发明的分割方法中，由陶瓷制成的布线基板由夹持器的下夹爪推动（上摆），并且从输送槽突出的一些突出的布线板部分被压靠在支撑件 身体在弯曲应力下进行第一次分裂。 此后，向上定位的夹持器向下可旋转地摆动（下摆动），以允许上夹爪向下按压突出的布线板部分，从而在第一分割部分再次进行相反分割，作为第二分割。 由于第二分割允许张力作用在剩余的薄的未分割树脂部分上，所以未分割树脂部分被撕开。 因此，完美的划分得以实现。 通过单行分割和单独分割来进行分数化，从而形成每个半导体器件。

公开(公告)号：US06709890B2

公开(公告)日：2004-03-23

申请号：US09783605

申请日：2001-02-15

申请人： Tsutomu Ida ,  Akio Ishizu ,  Masakazu Hashizume ,  Isao Hagiwara ,  Yoshinori Shiokawa

发明人： Tsutomu Ida ,  Akio Ishizu ,  Masakazu Hashizume ,  Isao Hagiwara ,  Yoshinori Shiokawa

IPC分类号： H01L2144

CPC分类号： H01L24/81 ,  B23K1/0016 ,  B23K2101/40 ,  H01L23/04 ,  H01L23/13 ,  H01L23/36 ,  H01L23/66 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/75 ,  H01L24/83 ,  H01L24/93 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/75 ,  H01L2224/753 ,  H01L2224/75305 ,  H01L2224/758 ,  H01L2224/7598 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83801 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10329 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15313 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/351 ,  H05K1/181 ,  H05K3/341 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/01031 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/92247 ,  H01L2224/05599

摘要： In a method of manufacturing a high frequency module to be assembled by providing, on a wiring board, a chip part and a semiconductor pellet to be bare chip mounted and then mounting the chip part and the semiconductor pellet through soldering, the wiring board is separated from a heat block with the semiconductor pellet pressurized against the wiring board in a main heating portion heating and melting a reflow solder, thereby cooling a soldering portion. Consequently, the generation of a void in the soldering portion can be prevented and the connecting reliability of the soldering portion can be enhanced. In addition, a degree of mounting horizontality of the semiconductor pellet on the wiring board can be enhanced.

摘要翻译： 在通过在布线基板上设置裸芯片安装的芯片部件和半导体芯片，然后通过焊接来安装芯片部件和半导体芯片来制造要组装的高频模块的方法中，布线板被分离 从加热和熔化回流焊料的主加热部分中的半导体芯片加热到布线板的散热块，从而冷却焊接部分。 因此，可以防止在焊接部分中产生空隙，并且可以提高焊接部分的连接可靠性。 此外，可以提高半导体芯片在布线板上的安装水平度。