公开(公告)号：US07026548B2

公开(公告)日：2006-04-11

申请号：US11180493

申请日：2005-07-13

申请人： Todd O. Bolken ,  Cary J. Baerlocher ,  Steven W. Heppler ,  Chad A. Cobbley

发明人： Todd O. Bolken ,  Cary J. Baerlocher ,  Steven W. Heppler ,  Chad A. Cobbley

IPC分类号： H01L23/28

CPC分类号： H01L23/28 ,  B33Y80/00 ,  H01L21/4803 ,  H01L21/481 ,  H01L21/50 ,  H01L23/055 ,  H01L23/10 ,  H01L23/48 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/49 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/484 ,  H01L2224/48997 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/00011 ,  H01L2224/45099 ,  H01L2924/00

摘要： Various embodiments for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of the present invention include an interposer, a housing structure formed on the interposer for surrounding an image sensor chip, and a transparent cover. The housing structure may cover substantially all of the interposer chip surface. In another embodiment, the housing structure also covers substantially all of the interposer edge surfaces. The housing structure may also cover substantially all of the interposer attachment surface. An image sensor chip is electrically connected to the interposer with sealed wire bond connections or with sealed flip-chip connections. The housing structure may include runners that enable simultaneous sealing of the interior of the image sensor package and of the transparent cover.

摘要翻译： 公开了用于防潮图像传感器封装结构和组装方法的各种实施例。 本发明的图像传感器封装包括插入件，形成在用于包围图像传感器芯片的插入件上的外壳结构和透明盖。 壳体结构可以覆盖基本上所有的插入器芯片表面。 在另一个实施例中，壳体结构还覆盖基本上所有插入器边缘表面。 壳体结构还可以覆盖基本上所有的插入件附接表面。 图像传感器芯片通过密封的引线接合连接或密封的倒装芯片连接电连接到插入器。 壳体结构可以包括能够同时密封图像传感器封装和透明盖的内部的流道。

公开(公告)号：US06953699B2

公开(公告)日：2005-10-11

申请号：US10900602

申请日：2004-07-27

申请人： Chad A. Cobbley ,  John VanNortwick ,  Bret K. Street ,  Tongbi Jiang

发明人： Chad A. Cobbley ,  John VanNortwick ,  Bret K. Street ,  Tongbi Jiang

IPC分类号： G01R1/04 ,  G01R31/26

CPC分类号： G01R1/0483 ,  Y10T29/4913 ,  Y10T29/49144

摘要： Flip-chip semiconductor assemblies, each including integrated circuit (IC) dice and an associated substrate, are electrically tested before encapsulation using an in-line or in-situ test socket or probes at a die-attach station. Those assemblies using “wet” quick-cure epoxies for die attachment may be tested prior to the epoxy being cured by pressing the integrated circuit (IC) dice against interconnection points on the substrate for electrical connection, while those assemblies using “dry” epoxies may be cured prior to testing. In either case, any failures in the dice or in the interconnections between the dice and the substrates can be easily fixed, and the need for the use of known-good-die (KGD) rework procedures during repair is eliminated.

公开(公告)号：US06853064B2

公开(公告)日：2005-02-08

申请号：US10436584

申请日：2003-05-12

申请人： Todd O. Bolken ,  Chad A. Cobbley

发明人： Todd O. Bolken ,  Chad A. Cobbley

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L25/065 ,  H01L23/48 ,  H01L23/28

CPC分类号： H01L25/0657 ,  B33Y70/00 ,  B33Y80/00 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/3135 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/85424 ,  H01L2224/8547 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06524 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor component includes a substrate and multiple stacked, encapsulated semiconductor dice on the substrate. A first die is back bonded to the substrate and encapsulated in a first encapsulant, and a second die is back bonded to the first encapsulant. The first encapsulant has a planar surface for attaching the second die, and can also include locking features for the second die. The component also includes a second encapsulant encapsulating the second die and forming a protective body for the component. A method for fabricating the component includes the steps of attaching the first die to the substrate, forming the first encapsulant on the first die, attaching the second die to the first encapsulant, and forming the second encapsulant on the second die.

摘要翻译： 半导体部件包括衬底和在衬底上的多个堆叠的，封装的半导体晶片。 将第一管芯重新结合到衬底并封装在第一密封剂中，并且将第二管芯重新结合到第一密封剂上。 第一密封剂具有用于附接第二模具的平坦表面，并且还可以包括用于第二模具的锁定特征。 该组件还包括封装第二模具的第二密封剂并且形成用于该部件的保护体。 一种制造该部件的方法包括以下步骤：将第一管芯附接到基板上，在第一管芯上形成第一密封剂，将第二管芯附接到第一密封剂，以及在第二管芯上形成第二密封剂。

公开(公告)号：US06844216B2

公开(公告)日：2005-01-18

申请号：US10358630

申请日：2003-02-04

申请人： Chad A. Cobbley ,  Michael B. Ball ,  Marjorie L. Waddel

发明人： Chad A. Cobbley ,  Michael B. Ball ,  Marjorie L. Waddel

IPC分类号： B23K3/06 ,  H05K3/34 ,  H01L24/44 ,  B23K35/12 ,  H05K3/30

CPC分类号： H05K3/3478 ,  B23K3/0623 ,  B23K2101/40 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2924/00014 ,  H05K3/3489 ,  H05K2203/041 ,  H05K2203/082 ,  Y10T29/49146 ,  H01L2224/05599

摘要： A method of attaching solder balls to a BGA package using a ball pickup tool. An array of solder balls is formed on a first substrate for interconnecting with conductive sites on another substrate. The ball pickup tool picks up balls with a vacuum suction from a fluidized ball reservoir and utilizes a puff of gas to release the solder ball(s) carried thereon to conductive sites of a substrate for bonding thereto. In another embodiment, the bond pads of a substrate are coated with a flux or adhesive and lowered into a fluidized ball reservoir for direct attachment of solder balls.

摘要翻译： 使用球形拾取工具将焊球附接到BGA封装的方法。 在第一衬底上形成一组焊球，用于与另一衬底上的导电部位相互连接。 球形拾取工具从流化球储存器中抽真空吸取球，并利用气泡将其上承载的焊球释放到衬底的导电部位以与其结合。 在另一个实施例中，衬底的接合焊盘涂覆有焊剂或粘合剂，并且下降到流化的球储存器中以直接附着焊球。

公开(公告)号：US06646354B2

公开(公告)日：2003-11-11

申请号：US09065944

申请日：1998-04-24

申请人： Chad A. Cobbley ,  Tongbi Jiang ,  Edward A. Schrock

发明人： Chad A. Cobbley ,  Tongbi Jiang ,  Edward A. Schrock

IPC分类号： H01L2348

CPC分类号： H01L24/83 ,  H01L24/27 ,  H01L24/29 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/83194 ,  H01L2224/83855 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512

摘要： An adhesive composition and methods incorporating the adhesive composition in semiconductor applications are provided. The adhesive composition is an instant setting adhesive composition that does not require external energy input such as heat or radiation such for application of the adhesive composition on a surface. The instant setting composition possesses sufficient thixotropic characteristics such that applying the instant setting adhesive composition to a surface can be accomplished by a variety of application techniques and in a variety of patterns. Once applied to the surface, the instant setting adhesive composition sets to retain the discrete pattern as applied, in a relatively short period of time, typically from about 0.10 to about 120 seconds at an ambient temperature, typically from 20° C. to 30° C. Advantageously, the instant setting adhesive composition can be screen printed on a semiconductor wafer prior to singulation because streets between the dice are essentially free of the instant setting adhesive composition.

摘要翻译： 提供在半导体应用中粘合组合物的粘合剂组合物和方法。 粘合剂组合物是瞬间固化粘合剂组合物，其不需要诸如热或辐射的外部能量输入，以便将粘合剂组合物施加在表面上。 本发明的凝固组合物具有足够的触变特性，使得将即刻固化粘合剂组合物施加到表面可以通过各种应用技术和各种图案来实现。 一旦施加到表面上，即刻固化粘合剂组合物在相对较短的时间段内保持离散的图案，通常在约0.10至约120秒的环境温度，通常为20℃至30℃ 有利地，即刻固化粘合剂组合物可以在切割之前丝网印刷在半导体晶片上，因为骰子之间的街道基本上不含瞬时固化粘合剂组合物。

公开(公告)号：US06599365B1

公开(公告)日：2003-07-29

申请号：US09513628

申请日：2000-02-28

申请人： Tongbi Jiang ,  Chad A. Cobbley ,  John VanNortwick

发明人： Tongbi Jiang ,  Chad A. Cobbley ,  John VanNortwick

IPC分类号： B05C1111

CPC分类号： B41C1/14 ,  B41N1/242 ,  H01L2224/4826 ,  H05K3/1225 ,  Y10S438/945

摘要： A method and apparatus for improved stencil/screen print quality is disclosed. The stencil or screen assists in application of a printable material onto a substrate, such as an adhesive to a semiconductor die of a semiconductor wafer during a lead-on-chip (LOC) packaging process. In one embodiment, the stencil includes a coating applied to at least one surface of a pattern of the stencil or screen to retard running of the printable material onto the surface. In another embodiment, the stencil or screen includes a second coating applied to at least one other surface of the pattern to promote spreading of the printable material onto the substrate.

公开(公告)号：US06472901B2

公开(公告)日：2002-10-29

申请号：US09944507

申请日：2001-08-30

申请人： Chad A. Cobbley ,  John VanNortwick ,  Bret K. Street ,  Tongbi Jiang

发明人： Chad A. Cobbley ,  John VanNortwick ,  Bret K. Street ,  Tongbi Jiang

IPC分类号： G01R3126

CPC分类号： G01R1/0483 ,  Y10T29/4913 ,  Y10T29/49144

摘要： Flip-chip semiconductor assemblies, each including integrated circuit (IC) dice and an associated substrate, are electrically tested before encapsulation using an in-line or in-situ test socket or probes at a die-attach station. Those assemblies using “wet” quick-cure epoxies for die-attachment may be tested prior to the epoxy being cured by pressing the integrated circuit (IC) dice against interconnection bumps on the substrate for electrical connection, while those assemblies using “dry” epoxies may be cured prior to testing. In either case, any failures in the dice or in the interconnections between the dice and the substrates can be easily fixed, and the need for the use of “known good dice” (KGD) rework procedures during repair is eliminated.

公开(公告)号：US06440777B2

公开(公告)日：2002-08-27

申请号：US09826178

申请日：2001-04-04

申请人： Chad A. Cobbley ,  Tongbi Jiang ,  John Vannortwick

发明人： Chad A. Cobbley ,  Tongbi Jiang ,  John Vannortwick

IPC分类号： H01L2144

CPC分类号： H01L24/16 ,  H01L21/563 ,  H01L23/4951 ,  H01L24/11 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/484 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01031 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/305 ,  H05K2201/0129 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/0783 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： A method of applying a dispersion (which may be in the form of a paste) of particles of a thermoplastic polymer in a liquid medium (i.e., liquid carrier) onto semiconductor wafers, dies, lead frames, and printed circuit boards, for example, to form bonding layers, pads, and bumps, etc.

摘要翻译： 例如，在液体介质（即，液体载体）中将热塑性聚合物颗粒的分散体（其可以是糊状的形式）施加到半导体晶片，管芯，引线框架和印刷电路板上的方法， 形成结合层，焊盘和凸块等

公开(公告)号：US06343019B1

公开(公告)日：2002-01-29

申请号：US09545250

申请日：2000-04-07

申请人： Tongbi Jiang ,  Chad A. Cobbley

发明人： Tongbi Jiang ,  Chad A. Cobbley

IPC分类号： H05K702

CPC分类号： H01L23/3121 ,  H01L23/13 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06551 ,  H01L2225/06558 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15156 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： An apparatus and method wherein an outer die is mounted on an inner die to form a stack which is mounted on a first surface of a substrate, such as a circuit board, the stack may be mounted filly or partially recessed in a recess which is formed in a first surface of the substrate which is dimensioned for receiving at least a portion of a die therein, and where an aperture may be formed in the recess extending through the substrate to a second side thereof for wire bonding the inner die to the substrate.

摘要翻译： 一种装置和方法，其中外模具安装在内模上以形成安装在诸如电路板的基板的第一表面上的堆叠，所述堆叠可以被嵌入或部分地凹入到形成的凹部中 在基板的第一表面中，其尺寸用于容纳其中的至少一部分模具，并且其中可以在所述凹部中形成开口以延伸穿过所述基板到其第二侧，用于将所述内模线接合到所述基板。

公开(公告)号：US06331453B1

公开(公告)日：2001-12-18

申请号：US09465350

申请日：1999-12-16

申请人： Todd O. Bolken ,  David L. Peters ,  Patrick W. Tandy ,  Chad A. Cobbley

发明人： Todd O. Bolken ,  David L. Peters ,  Patrick W. Tandy ,  Chad A. Cobbley

IPC分类号： H01L2144

CPC分类号： H01L21/565 ,  H01L23/3107 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A method for fabricating a semiconductor package is performed using a mold tooling fixture having a mold cavity and a pair of flash control cavities on either side of the mold cavity. The semiconductor package includes a substrate and a semiconductor die attached to the substrate. The substrate includes a pattern of conductors wire bonded to the die, and an array of solder balls bonded to ball bonding pads on the conductors. In addition, the substrate includes a die encapsulant encapsulating the die, and a wire bond encapsulant encapsulating the wire bonds. During molding of the wire bond encapsulant, the flash control cavities collect flash, and provide pressure relief for venting the mold cavity. In addition, the flash control cavities restrict the flash to a selected area of the package substrate, such that the ball bonding pads and solder balls are not contaminated.

摘要翻译： 使用具有模腔和在模腔两侧的一对闪光控制腔的模具工具来进行制造半导体封装的方法。 半导体封装包括衬底和附着于衬底的半导体管芯。 衬底包括导线接合到管芯的导体图案，以及焊接在导体上的焊球的焊球阵列。 此外，衬底包括封装管芯的管芯密封剂和封装引线接合的引线键合密封剂。 在线焊密封剂的模制期间，闪光控制腔收集闪光，并为排气模腔提供压力释放。 此外，闪光控制腔将闪光灯限制到封装衬底的选定区域，使得焊球焊盘和焊球不被污染。