Vapor based combinatorial processing
    12.
    发明授权
    Vapor based combinatorial processing 有权
    气相组合处理

    公开(公告)号:US08334015B2

    公开(公告)日:2012-12-18

    申请号:US12013759

    申请日:2008-01-14

    IPC分类号: C23C16/04

    摘要: A combinatorial processing chamber and method are provided. In the method a fluid volume flows over a surface of a substrate with differing portions of the fluid volume having different constituent components to concurrently expose segregated regions of the substrate to a mixture of the constituent components that differ from constituent components to which adjacent regions are exposed. Differently processed segregated regions are generated through the multiple flowings.

    摘要翻译: 提供组合处理室和方法。 在该方法中,流体体积在衬底的表面上流动,具有不同部分的流体体积具有不同构成组分,以同时将衬底的偏析区域暴露于与构成组分的混合物中,所述构成组分与相邻区域暴露于其中的构成组分不同 。 通过多个流动产生不同处理的分离区域。

    VAPOR BASED COMBINATORIAL PROCESSING
    13.
    发明申请
    VAPOR BASED COMBINATORIAL PROCESSING 有权
    基于蒸汽的组合加工

    公开(公告)号:US20120090545A1

    公开(公告)日:2012-04-19

    申请号:US13332813

    申请日:2011-12-21

    IPC分类号: C23C16/455

    摘要: A combinatorial processing chamber and method are provided. In the method a fluid volume flows over a surface of a substrate with differing portions of the fluid volume having different constituent components to concurrently expose segregated regions of the substrate to a mixture of the constituent components that differ from constituent components to which adjacent regions are exposed. Differently processed segregated regions are generated through the multiple flowings.

    摘要翻译: 提供组合处理室和方法。 在该方法中,流体体积在衬底的表面上流动,具有不同部分的流体体积具有不同构成组分,以同时将衬底的偏析区域暴露于与构成组分的混合物中,所述构成组分与相邻区域暴露于其中的构成组分不同 。 通过多个流动产生不同处理的分离区域。

    Pulsed bias having high pulse frequency for filling gaps with dielectric material
    15.
    发明授权
    Pulsed bias having high pulse frequency for filling gaps with dielectric material 有权
    具有高脉冲频率的脉冲偏压,用于填充与电介质材料的间隙

    公开(公告)号:US07514375B1

    公开(公告)日:2009-04-07

    申请号:US11500799

    申请日:2006-08-08

    IPC分类号: H01L21/31 H01L21/469

    摘要: During bottom filling of high aspect ratio gaps and trenches in an integrated circuit substrate using HDP-CVD, a pulsed HF bias is applied to the substrate. In some embodiments, pulsed HF bias is applied to the substrate during etching operations. The pulsed bias typically has a pulse frequency in a range of about from 500 Hz to 20 kHz and a duty cycle in a range of about from 0.1 to 0.95.

    摘要翻译: 在使用HDP-CVD的集成电路衬底中的高纵横比间隙和沟槽的底部填充期间,将脉冲HF偏压施加到衬底。 在一些实施例中,在蚀刻操作期间将脉冲HF偏压施加到衬底。 脉冲偏压通常具有在约500Hz至20kHz的范围内的脉冲频率和约0.1至0.95的范围内的占空比。