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    CHIP STACK STRUCTURES THAT IMPLEMENT TWO-PHASE COOLING WITH RADIAL FLOW
    13.
    发明申请
    CHIP STACK STRUCTURES THAT IMPLEMENT TWO-PHASE COOLING WITH RADIAL FLOW 有权
    实现具有径向流动的两相冷却的芯片堆叠结构

    公开(公告)号：US20140071628A1

    公开(公告)日：2014-03-13

    申请号：US14015063

    申请日：2013-08-30

    申请人： International Business Machines Corporation

    发明人： Thomas J. Brunschwiler ,  Evan G. Colgan ,  John U. Knickerbocker ,  Bruno Michael ,  Chin Lee Ong ,  Cornelia K. Tsang

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20381 ,  H01L23/367 ,  H01L23/427 ,  H01L23/49816 ,  H01L25/0657 ,  H01L25/50 ,  H01L29/0657 ,  H01L2224/13025 ,  H01L2224/14181 ,  H01L2224/16146 ,  H01L2224/81141 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2225/06589 ,  H01L2225/06593 ,  H05K7/20309 ,  H05K7/20327

    摘要： A package structure to implement two-phase cooling includes a chip stack disposed on a substrate, and a package lid that encloses the chip stack. The chip stack includes a plurality of conjoined chips, a central inlet manifold formed through a central region of the chip stack, and a peripheral outlet manifold. The central input manifold includes inlet nozzles to feed liquid coolant into flow cavities formed between adjacent conjoined chips. The peripheral outlet manifold outputs heated liquid and vapor from the flow cavities. The package lid includes a central coolant supply inlet aligned to the central inlet manifold, and a peripheral liquid-vapor outlet to output heated liquid and vapor that exits from the peripheral outlet manifold. Guiding walls may be included in the flow cavities to guide a flow of liquid and vapor, and the guiding walls can be arranged to form radial flow channels that are feed by different inlet nozzles of the central inlet manifold.

    摘要翻译： 用于实现两相冷却的封装结构包括设置在基板上的芯片堆叠和封装芯片堆叠的封装盖。 芯片堆叠包括多个联合芯片，通过芯片堆叠的中心区域形成的中心入口歧管和外围出口歧管。 中央输入歧管包括入口喷嘴，用于将液体冷却剂供入形成在相邻联结芯片之间的流动空腔中。 外围出口歧管从流动腔输出加热的液体和蒸气。 包装盖包括与中心入口歧管对准的中心冷却剂供给入口和外围液体蒸气出口，以输出从外围出口歧管排出的加热的液体和蒸气。 引导壁可以包括在流动腔中以引导液体和蒸气的流动，并且引导壁可以被布置成形成由中央入口歧管的不同入口喷嘴供给的径向流动通道。

    CHIP MODULE WITH STIFFENING FRAME AND ORTHOGONAL HEAT SPREADER
    17.
    发明申请
    CHIP MODULE WITH STIFFENING FRAME AND ORTHOGONAL HEAT SPREADER 审中-公开

    公开(公告)号：US20180061733A1

    公开(公告)日：2018-03-01

    申请号：US15803365

    申请日：2017-11-03

    申请人： International Business Machines Corporation

    发明人： Evan G. Colgan ,  Yi Pan ,  Hilton T. Toy ,  Jeffrey A. Zitz

    IPC分类号： H01L23/367 ,  H01L23/16 ,  H05K3/34 ,  H01L23/00

    摘要： An integrated circuit (IC) chip module includes a carrier, a stiffening frame, an IC chip, and a first directional heat spreader. A second directional heat spreader may further be arranged orthogonal to the first directional heat spreader. The carrier has a top surface and a bottom surface configured to be electrically connected to a motherboard. The stiffening frame includes an opening that accepts the IC chip and may be attached to the top surface of the carrier. The IC chip is concentrically arranged within the opening of the stiffening frame. The first directional heat spreader is attached to the stiffening frame and to the IC chip and generally removes heat in a first opposing bivector direction. When included in the IC chip module, the second directional heat spreader is attached to the stiffening frame and to the first directional heat spreader and generally removes heat in a second opposing bivector direction orthogonal to the first opposing bivector direction.