公开(公告)号：US07748110B2

公开(公告)日：2010-07-06

申请号：US11826758

申请日：2007-07-18

申请人： Toshiyuki Asahi ,  Seiji Karashima ,  Takashi Ichiryu ,  Seiichi Nakatani ,  Tousaku Nishiyama ,  Koichi Hirano ,  Osamu Shibata ,  Takeshi Nakayama ,  Yoshiyuki Saito

发明人： Toshiyuki Asahi ,  Seiji Karashima ,  Takashi Ichiryu ,  Seiichi Nakatani ,  Tousaku Nishiyama ,  Koichi Hirano ,  Osamu Shibata ,  Takeshi Nakayama ,  Yoshiyuki Saito

IPC分类号： H05K3/36

CPC分类号： H05K3/403 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01R12/52 ,  H01R13/2414 ,  H05K1/0218 ,  H05K1/0284 ,  H05K1/141 ,  H05K1/145 ,  H05K1/182 ,  H05K3/20 ,  H05K3/3442 ,  H05K3/361 ,  H05K3/366 ,  H05K3/368 ,  H05K2201/043 ,  H05K2201/048 ,  H05K2201/049 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/09036 ,  H05K2201/10515 ,  H05K2201/10689 ,  H05K2203/302 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49208 ,  H01L2924/00

摘要： A connection member can be produced without a via-forming step. The connection member includes an insulating substrate which has an upper surface, a lower surface opposed to the upper surface, and a side surface which connects these surfaces; and at least one wiring which extends from the upper surface to the lower surface through the side surface.

摘要翻译： 可以在没有通孔形成步骤的情况下制造连接构件。 连接构件包括绝缘基板，其具有上表面，与上表面相对的下表面和连接这些表面的侧表面; 以及至少一个通过侧面从上表面延伸到下表面的布线。

公开(公告)号：US20070243664A1

公开(公告)日：2007-10-18

申请号：US11579299

申请日：2006-03-07

申请人： Koichi Hirano ,  Seiji Karashima ,  Takashi Ichiryu ,  Yoshihiro Tomita ,  Seiichi Nakatani

发明人： Koichi Hirano ,  Seiji Karashima ,  Takashi Ichiryu ,  Yoshihiro Tomita ,  Seiichi Nakatani

IPC分类号： H05K3/34 ,  H01L21/00 ,  H01L21/44 ,  H05K3/00

CPC分类号： H01L21/563 ,  B23K35/0244 ,  H01L21/67144 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1131 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/133 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83815 ,  H01L2224/83886 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/18161 ,  H01L2924/30105 ,  H05K3/323 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/10977 ,  H05K2203/1361 ,  Y02P70/613 ,  Y10T29/53178 ,  H01L2224/05599

摘要： [Problem] To provide a flip-chip mounting method and a bump formation method applicable to flip-chip mounting of a next generation LSI and having high productivity and high reliability. [Means for Solving Problem] A semiconductor chip 20 having a plurality of electrode terminals 12 is held to oppose a circuit board 21 having a plurality of connection terminals 11 with a given gap provided therebetween, and the semiconductor chip 20 and the circuit board 21 in this state are dipped in a dipping bath 40 containing a melted resin 14 including melted solder particles for a given period of time. In this dipping process, the melted solder particles self-assemble between the connection terminals 11 of the circuit board 21 and the electrode terminals 12 of the semiconductor chip 20, so as to form connectors 22 between these terminals. Thereafter, the semiconductor chip 20 and the circuit board 21 are taken out of the dipping bath 40, and the melted resin 14 having permeated into the gap between the semiconductor chip 20 and the circuit board 21 is cured, so as to complete a flip-chip mounting body.

摘要翻译： [问题]提供一种适用于下一代LSI的倒装安装并具有高生产率和高可靠性的倒装芯片安装方法和凸块形成方法。 解决问题的手段具有多个电极端子12的半导体芯片20被保持为具有多个连接端子11的电路板21，其间设置有给定的间隙，并且半导体芯片20和电路板21 将该状态浸渍在包含熔融的焊料颗粒的熔融树脂14的浸渍浴40中一段给定的时间。 在该浸渍过程中，熔融的焊料颗粒自组装在电路板21的连接端子11和半导体芯片20的电极端子12之间，从而在这些端子之间形成连接器22。 此后，半导体芯片20和电路板21从浸渍浴40中取出，并且已经渗透到半导体芯片20和电路板21之间的间隙中的熔融树脂14固化， 芯片安装体。

公开(公告)号：US20070183837A1

公开(公告)日：2007-08-09

申请号：US10589973

申请日：2005-02-16

申请人： Koichi Hirano

发明人： Koichi Hirano

IPC分类号： B43K7/00 ,  B43K7/10

CPC分类号： B43K1/08 ,  B43K7/00 ,  B43K7/10

摘要： A ball-point pen, wherein a cover member (6) is fitted to a joint member (3) connecting a writing tip (1) rotatably supporting a writing ball (2) at the tip thereof to an ink storage tube. When the cover member (6) is fitted to the joint member (3) along the outer peripheral surface thereof, a part of the cover member does not come within 0.2 mm (within the range of the chain double-dashed line) from around the writing tip. Thus, even if the accuracies of parts and assembly machines are dispersed, a problem with an existing ball-point pen wherein a cover member is brought into contact with a writing tip and the writing tip is damaged in an assembly step can be avoided.

摘要翻译： 一种圆珠笔，其中盖构件（6）装配到将可旋转地支撑着书写球（2）的书写笔尖（1）的前端连接到墨水储存管的接合构件（3）上。 当盖构件（6）沿着其外周面装配到接头构件（3）时，盖构件的一部分不会从其周围的0.2mm（在双点划线的范围内） 写作技巧 因此，即使部件和组装机的精度分散，也可以避免在组装步骤中使盖部件与书写尖端接触并且笔尖被损坏的现有圆珠笔的问题。

公开(公告)号：US20070069022A1

公开(公告)日：2007-03-29

申请号：US11520786

申请日：2006-09-14

申请人： Shigeru Hatakeyama ,  Shigeru Yamazaki ,  Hiroki Murayama ,  Koichi Hirano

发明人： Shigeru Hatakeyama ,  Shigeru Yamazaki ,  Hiroki Murayama ,  Koichi Hirano

IPC分类号： G06K7/08

CPC分类号： H01Q1/2208 ,  G06K7/10178 ,  G06K7/10336

摘要： A plurality of electromagnetic wave areas is provided to form a data channel between a wireless IC chip and a main antenna. The plurality of electromagnetic wave areas is placed along a traveling direction of the wireless IC chip, and comprises an electromagnetic wave area at a first stage in which an electromagnetic wave is radiated from front of a traveling direction of the wireless IC chip, an electromagnetic wave area at a middle stage in which an electromagnetic wave is radiated in a direction intersecting with a traveling direction of the wireless IC chip, and an electromagnetic wave area at a last stage in which an electromagnetic wave is radiated from a rear of a traveling direction of the wireless IC chip.

摘要翻译： 提供多个电磁波区域以在无线IC芯片和主天线之间形成数据通道。 多个电磁波区域沿着无线IC芯片的行进方向配置，在从无线IC芯片的行进方向的前方照射电磁波的第一阶段的电磁波区域，电磁波 在与无线IC芯片的行进方向相交的方向上照射电磁波的中间阶段的电磁波区域，以及电磁波区域，其中电磁波从行进方向的后方辐射， 无线IC芯片。

公开(公告)号：US20070066257A1

公开(公告)日：2007-03-22

申请号：US11520801

申请日：2006-09-14

申请人： Shigeru Hatakeyama ,  Shigeru Yamazaki ,  Hiroki Murayama ,  Koichi Hirano

发明人： Shigeru Hatakeyama ,  Shigeru Yamazaki ,  Hiroki Murayama ,  Koichi Hirano

IPC分类号： H04Q5/22

CPC分类号： H01Q1/2216 ,  G06K7/10178 ,  G06K7/10336 ,  H01Q19/30

摘要： A wireless communication system includes: wireless IC chips used for identifying objects; a transceiver for transmitting and receiving information to/from the wireless IC chips by radio waves; and a radio wave direction unit for directing the traveling directions of the radio waves from the transceiver toward the wireless IC chips. The radio wave direction unit is arranged such that the radio wave reflecting surface can be developed to face a collection space where the wireless IC chips are collected. A part of the radio waves radiated from the transceiver travels stereoscopically toward the collection space S by an action of the radio wave reflecting surface.

摘要翻译： 无线通信系统包括：用于识别对象的无线IC芯片; 用于通过无线电波发送和从无线IC芯片接收信息的收发器; 以及用于将来自收发器的无线电波的行进方向指向无线IC芯片的无线电波方向单元。 无线电波方向单元布置成使得无线电波反射表面可以被显影以面对收集无线IC芯片的收集空间。 从收发器辐射的无线电波的一部分通过无线电波反射表面的作用立体地朝收集空间S移动。

公开(公告)号：US20070035013A1

公开(公告)日：2007-02-15

申请号：US10555097

申请日：2004-05-07

申请人： Hiroyuki Handa ,  Seiichi Nakatani ,  Koichi Hirano ,  Osamu Inoue ,  Akihiro Ishikawa ,  Tsunenori Yoshida

发明人： Hiroyuki Handa ,  Seiichi Nakatani ,  Koichi Hirano ,  Osamu Inoue ,  Akihiro Ishikawa ,  Tsunenori Yoshida

IPC分类号： H01L23/34

CPC分类号： H01L25/16 ,  H01L23/5389 ,  H01L2224/73204 ,  H01L2924/16152 ,  H01L2924/19105 ,  H05K1/0204 ,  H05K1/185 ,  H05K3/4614 ,  H05K2201/0209 ,  H05K2201/10416

摘要： In a module including circuit elements, a plurality of wires, which are generally two-dimensionally formed, are multi-layered via electrically insulating material, which comprises a mixture including at least filler and electrically insulating resin. One or more circuit elements are electrically connected to the wires, and at least a part of those circuit elements is embedded in the electrically insulating material. The module further includes a heat sink member that has a higher thermal conductivity than the electrically insulating material, and that, when viewed from the direction of multi-layering the wires, overlaps with a circuit element, which is one of those circuit elements, exhibiting the highest temperature rise at least in the module.

摘要翻译： 在包括电路元件的模块中，通常通过二维形成的多根电线通过电绝缘材料是多层的，其包括至少包括填料和电绝缘树脂的混合物。 一个或多个电路元件电连接到导线，并且这些电路元件的至少一部分嵌入电绝缘材料中。 该模块还包括具有比电绝缘材料更高的热导率的散热构件，并且当从多层的方向观察时，导线与作为那些电路元件之一的电路元件重叠， 模块中至少有最高的升温。

公开(公告)号：US07059042B2

公开(公告)日：2006-06-13

申请号：US10998277

申请日：2004-11-24

申请人： Koichi Hirano ,  Seiichi Nakatani ,  Mitsuhiro Matsuo ,  Yoshihisa Yamashita

发明人： Koichi Hirano ,  Seiichi Nakatani ,  Mitsuhiro Matsuo ,  Yoshihisa Yamashita

IPC分类号： H05K3/30 ,  H05K7/02 ,  H01L2/44

CPC分类号： H05K7/205 ,  H01L23/3737 ,  H01L23/4334 ,  H01L23/49861 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/451 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/19041 ,  H05K1/0204 ,  H05K1/056 ,  H05K3/0061 ,  H05K3/202 ,  H05K3/4084 ,  H05K7/20463 ,  H05K2201/0209 ,  H05K2201/0382 ,  H05K2201/09054 ,  H05K2201/0969 ,  H05K2201/10416 ,  H05K2203/1189 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49158 ,  Y10T29/49171 ,  Y10T29/49172 ,  H01L2924/00 ,  H01L2224/05599

摘要： A sheet-like thermally conductive resin composition containing 70 to 95 wt. % inorganic filler and 5 to 30 wt. % thermosetting resin composition, a lead frame as a wiring pattern, and an electrically conductive heat sink with a metal pole placed therein are superposed, heated and compressed, and thus are combined to form one body. Consequently, a thermally conductive circuit board with a flat surface is obtained in which a grounding pattern is grounded to the heat sink inside the insulating layer. Thus, the grounding pattern and the heat sink can be connected electrically with each other in an arbitrary position inside the insulating layer of the thermally conductive circuit board. Accordingly, there are provided a thermally conductive circuit board with high heat dissipation, high conductivity and high ground-connection reliability, a method of manufacturing the same, and a power module allowing its size to be reduced and its density to be increased.

摘要翻译： 一种片状导热性树脂组合物，其含有70〜95重量％ ％无机填料和5〜30wt。 热固性树脂组合物，作为布线图案的引线框架和放置有金属极的导电散热器叠加，加热和压缩，从而组合形成一体。 因此，获得了具有平坦表面的导热电路板，其中接地图被接地到绝缘层内的散热片。 因此，接地图案和散热器可以在导热电路板的绝缘层内的任意位置彼此电连接。 因此，提供了具有高散热，高导电性和高接地连接可靠性的导热电路板，其制造方法以及允许其尺寸减小并且其密度增加的功率模块。

公开(公告)号：US06791034B2

公开(公告)日：2004-09-14

申请号：US10238688

申请日：2002-09-10

申请人： Masaki Suzumura ,  Kazuo Okada ,  Koichi Hirano ,  Takaaki Okawa ,  Shinya Tanaka

发明人： Masaki Suzumura ,  Kazuo Okada ,  Koichi Hirano ,  Takaaki Okawa ,  Shinya Tanaka

IPC分类号： H05K100

CPC分类号： H05K3/0061 ,  H01L23/49861 ,  H01L23/5387 ,  H01L2924/0002 ,  H05K3/041 ,  H05K3/202 ,  H05K3/28 ,  H05K2201/0209 ,  H05K2203/066 ,  H01L2924/00

摘要： A lead frame of a circuit board is punched in a direction opposite to a heat sink plate. Even if burrs are produced due to the punching, the burrs do not penetrate a sheet or short-circuit to the heat sink plate. A resist film tightly contacts on the periphery of a land of the lead frame of the circuit board, and a plated layer tightly contacts on the land. This prevents electronic components from defective mounting on the land.

摘要翻译： 电路板的引线框架在与散热板相反的方向上冲压。 即使由于冲孔产生毛刺，毛刺也不会渗透到薄片或与散热板短路。 抗蚀剂膜在电路板的引线框架的焊盘的周围紧密接触，并且电镀层紧密地接触在焊盘上。 这样可以防止电子元件在地面上的安装不良。

公开(公告)号：US06707671B2

公开(公告)日：2004-03-16

申请号：US10160353

申请日：2002-05-30

申请人： Yoshihisa Yamashita ,  Koichi Hirano ,  Seiichi Nakatani

发明人： Yoshihisa Yamashita ,  Koichi Hirano ,  Seiichi Nakatani

IPC分类号： H05K720

CPC分类号： H01L23/3737 ,  H01L23/42 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/73253 ,  H01L2924/01322 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0203 ,  H05K3/284 ,  H01L2924/00

摘要： In a power module, a wiring substrate to which a heat generating component is connected electrically and a heat sink are connected through the medium of a thermally conductive and electrically insulating member. The thermally conductive and electrically insulating member is a curable composition containing (A) a thermosetting resin, (B) a thermoplastic resin, (C) a latent curing agent, and (D) an inorganic filler. The thermally conductive and electrically insulating member is bonded to the heat generating component in such a manner as to be deformed complementarily to unevenness in shape and height of the heat generating component. Heat generated from the heat generating component is radiated by means of the heat sink. Thus, a power module that allows heat generated from an electronic component to be radiated evenly and efficiently and achieves high-density mounting, and a method of manufacturing the power module are provided.

公开(公告)号：US5611279A

公开(公告)日：1997-03-18

申请号：US454252

申请日：1995-06-02

申请人： Yoichi Ando ,  Fumitoshi Nakamura ,  Haruhito Shiraishi ,  Hajime Toda ,  Susumu Suzuki ,  Koichi Hirano ,  Hisami Tamano

发明人： Yoichi Ando ,  Fumitoshi Nakamura ,  Haruhito Shiraishi ,  Hajime Toda ,  Susumu Suzuki ,  Koichi Hirano ,  Hisami Tamano

IPC分类号： B41C1/055 ,  B41K1/50

CPC分类号： B41C1/055

摘要： A stamp and a process of producing a stamp includes a stamp that is made from a sponge having open cells to allow repeated impressing operations without supplying stamp ink for a long time. The process includes fitting a heat-fusing ink sheet or a heat-generating plate, which contains a heat-generating material, over the surface of a stamp-piece that has open cells therein. A liquid substance soaks a manuscript having characters, patterns, etc., which are represented by non-applied areas of recording material. The manuscript is placed over the top in such a manner that an image may appear to be a mirror image. The manuscript is irradiated from above with light to cause light to pass through the non-applied areas of recording material to increase the temperature of the heat-generating material at sites corresponding to the non-applied areas of recording material. The generated heat of the heat-generating material corresponding to the non-applied portion of recording material fuses that part of the surface of the stamp-piece, thereby forming non-oozing areas of stamp ink while the stamp surface portion corresponding to the applied areas of recording material is not fused, thus forming oozing areas of stamp ink.

摘要翻译： PCT No.PCT / JP94 / 01640 Sec。 371日期：1995年6月2日 102（e）1995年6月2日PCT 1994年9月30日PCT PCT。 出版物WO94 / 01640 日期1994年9月30日印章和制作邮票的过程包括由具有开放细胞的海绵制成的邮票，以允许重复打印操作，而长时间不提供印墨。 该方法包括在其中具有开孔的印模件的表面上装配热熔油墨片或包含发热材料的发热板。 液体物质浸透由不适用的记录材料区域表示的具有字符，图案等的原稿。 手稿放置在顶部，使得图像可能看起来是镜像。 从上面用光照射原稿，使光线通过记录材料的非涂敷区域，以增加与不施加记录材料区域对应的位置处的发热材料的温度。 对应于记录材料的未施加部分的发热材料的产生的热量使得印模件的表面的一部分熔化，从而在对应于涂覆区域的印模表面部分形成印墨油墨的非渗出区域 的记录材料不熔化，从而形成印墨的渗出区域。