公开(公告)号：US08310036B2

公开(公告)日：2012-11-13

申请号：US12784841

申请日：2010-05-21

申请人： Belgacem Haba ,  Kenneth Allen Honer ,  David B. Tuckerman ,  Vage Oganesian

发明人： Belgacem Haba ,  Kenneth Allen Honer ,  David B. Tuckerman ,  Vage Oganesian

IPC分类号： H01L21/00

CPC分类号： H01L23/3128 ,  H01L23/481 ,  H01L24/10 ,  H01L24/13 ,  H01L27/14618 ,  H01L27/14683 ,  H01L29/0657 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3025 ,  H04N5/2257 ,  H01L2924/00 ,  H01L2924/00014

摘要： A microelectronic unit is provided in which front and rear surfaces of a semiconductor element may define a thin region which has a first thickness and a thicker region having a thickness at least about twice the first thickness. A semiconductor device may be present at the front surface, with a plurality of first conductive contacts at the front surface connected to the device. A plurality of conductive vias may extend from the rear surface through the thin region of the semiconductor element to the first conductive contacts. A plurality of second conductive contacts can be exposed at an exterior of the semiconductor element. A plurality of conductive traces may connect the second conductive contacts to the conductive vias.

摘要翻译： 提供了一种微电子单元，其中半导体元件的前表面和后表面可以限定具有第一厚度的薄区域和具有至少大约第二厚度的两倍的厚度的较厚区域。 半导体器件可以存在于前表面处，在前表面处连接有多个第一导电触点以连接到器件。 多个导电通孔可以从后表面延伸穿过半导体元件的薄区域到第一导电触点。 多个第二导电触头可以在半导体元件的外部暴露。 多个导电迹线可以将第二导电触点连接到导电通孔。

公开(公告)号：US07858445B2

公开(公告)日：2010-12-28

申请号：US12283710

申请日：2008-09-15

申请人： Kenneth Allen Honer ,  Giles Humpston ,  David B. Tuckerman ,  Michael J. Nystrom

发明人： Kenneth Allen Honer ,  Giles Humpston ,  David B. Tuckerman ,  Michael J. Nystrom

IPC分类号： H01L21/50

CPC分类号： B81B7/0006 ,  B81C1/00269 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

摘要： A microelectronic device includes a chip having a front surface and a rear surface, the front surface having an active region and a plurality of contacts exposed at the front surface outside of the active region. The device further includes a lid overlying the front surface. The lid has edges bounding the lid, at least one of the edges including one or more outer portions and one or more recesses extending laterally inwardly from the outer portions, with the contacts being aligned with the recesses and exposed through them.

摘要翻译： 微电子器件包括具有前表面和后表面的芯片，前表面具有有源区域和暴露在有源区域外部的前表面处的多个触点。 该装置还包括盖在前表面上的盖。 盖具有边缘边缘，边缘中的至少一个包括一个或多个外部部分和一个或多个从外部部分横向向内延伸的凹部，触头与凹部对准并暴露在其中。

公开(公告)号：US20100225006A1

公开(公告)日：2010-09-09

申请号：US12784841

申请日：2010-05-21

申请人： Belgacem Haba ,  Kenneth Allen Honer ,  David B. Tuckerman ,  Vage Oganesian

发明人： Belgacem Haba ,  Kenneth Allen Honer ,  David B. Tuckerman ,  Vage Oganesian

IPC分类号： H01L23/48 ,  H01L21/44

CPC分类号： H01L23/3128 ,  H01L23/481 ,  H01L24/10 ,  H01L24/13 ,  H01L27/14618 ,  H01L27/14683 ,  H01L29/0657 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3025 ,  H04N5/2257 ,  H01L2924/00 ,  H01L2924/00014

摘要： A microelectronic unit is provided in which front and rear surfaces of a semiconductor element may define a thin region which has a first thickness and a thicker region having a thickness at least about twice the first thickness. A semiconductor device may be present at the front surface, with a plurality of first conductive contacts at the front surface connected to the device. A plurality of conductive vias may extend from the rear surface through the thin region of the semiconductor element to the first conductive contacts. A plurality of second conductive contacts can be exposed at an exterior of the semiconductor element. A plurality of conductive traces may connect the second conductive contacts to the conductive vias.

摘要翻译： 提供了一种微电子单元，其中半导体元件的前表面和后表面可以限定具有第一厚度的薄区域和具有至少大约第二厚度的两倍的厚度的较厚区域。 半导体器件可以存在于前表面处，在前表面处连接有多个第一导电触点以连接到器件。 多个导电通孔可以从后表面延伸穿过半导体元件的薄区域到第一导电触点。 多个第二导电触头可以在半导体元件的外部暴露。 多个导电迹线可以将第二导电触点连接到导电通孔。

公开(公告)号：US20090008795A1

公开(公告)日：2009-01-08

申请号：US11825121

申请日：2007-07-02

申请人： Kenneth Allen Honer ,  Jae M. Park

发明人： Kenneth Allen Honer ,  Jae M. Park

IPC分类号： H01L23/48 ,  H01L21/00

CPC分类号： H01L23/3121 ,  H01L23/49548 ,  H01L23/49558 ,  H01L23/49805 ,  H01L23/49861 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/81 ,  H01L24/85 ,  H01L24/97 ,  H01L25/105 ,  H01L25/50 ,  H01L2221/68377 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/81191 ,  H01L2224/81805 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2225/1029 ,  H01L2225/1064 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15313 ,  H01L2924/1627 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2224/78 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A method of manufacturing a microelectronic package. The method includes the steps of attaching at least one microelectronic element to a tape having upper terminals projecting upwardly from an upper surface of a dielectric layer, so that top surfaces of the terminals are disposed coplanar with or above a top surface of the microelectronic element after the attaching step, electrically connecting the microelectronic element to at least some of the upper terminals; and further includes the step of applying an encapsulant to cover at least a portion of the upper surface of the dielectric layer, leaving the upper terminals surfaces of the terminals exposed.

摘要翻译： 一种制造微电子封装的方法。 该方法包括以下步骤：将至少一个微电子元件附接到具有从电介质层的上表面向上突出的上端子的带，使得端子的顶表面设置为与微电子元件的顶表面共面或上方，在 所述附接步骤将所述微电子元件电连接到所述上端子中的至少一些; 并且还包括施加密封剂以覆盖电介质层的上表面的至少一部分的步骤，使端子的上端子表面露出。

公开(公告)号：US20080156518A1

公开(公告)日：2008-07-03

申请号：US11649354

申请日：2007-01-03

申请人： Kenneth Allen Honer ,  Christopher Paul Wade ,  Seiichi Tobe ,  Chung-Chuan Tseng ,  Ellis Chau ,  Kyong-Mo Bang

发明人： Kenneth Allen Honer ,  Christopher Paul Wade ,  Seiichi Tobe ,  Chung-Chuan Tseng ,  Ellis Chau ,  Kyong-Mo Bang

IPC分类号： H05K13/00 ,  H01S4/00 ,  H05K1/00

CPC分类号： H05K3/0052 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/078 ,  H01L2924/10156 ,  H01L2924/10158 ,  H01L2924/19107 ,  H05K2203/0165 ,  H05K2203/0228 ,  H05K2203/167 ,  Y10T29/49002 ,  Y10T29/49169 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A substrate including plural microelectronic device carriers has metallic alignment elements. The alignment elements desirably are disposed in a predetermined positional relationship to terminals on the carriers. The alignment elements are engaged with a carrier frame and a cutting device is aligned with the carrier frame. The cutting device cuts the carriers so that borders of the carriers are in a precise relationship with the terminals.

摘要翻译： 包括多个微电子器件载体的衬底具有金属对准元件。 对准元件期望地与载体上的端子以预定的位置关系设置。 对准元件与载体框架接合，并且切割装置与载体框架对准。 切割装置切割载体，使得载体的边界与端子具有精确的关系。

公开(公告)号：US08508036B2

公开(公告)日：2013-08-13

申请号：US11803006

申请日：2007-05-11

申请人： Kenneth Allen Honer ,  Philip Damberg

发明人： Kenneth Allen Honer ,  Philip Damberg

IPC分类号： H01L23/10

CPC分类号： H01L21/768 ,  H01L21/56 ,  H01L23/055 ,  H01L23/49816 ,  H01L23/49838 ,  H01L2924/0002 ,  Y10T29/49165 ,  H01L2924/00

摘要： A microelectronic package including a dielectric layer having top and bottom surfaces, the dielectric layer having terminals exposed at the bottom surface; a metallic wall bonded to the dielectric layer and projecting upwardly from the top surface of the dielectric layer and surrounding a region of the top surface; a metallic lid bonded to the wall and extending over the region of the top surface so that the lid, the wall and the dielectric layer cooperatively define an enclosed space; and a microelectronic element disposed within the space and electrically connected to the terminals.

摘要翻译： 一种微电子封装，包括具有顶表面和底表面的电介质层，所述电介质层具有在底表面处露出的端子; 金属壁结合到电介质层并从电介质层的顶表面向上突出并围绕顶表面的区域; 金属盖结合到壁上并在顶表面的区域上延伸，使得盖，壁和介电层协同地限定封闭空间; 以及设置在所述空间内并电连接到所述端子的微电子元件。

公开(公告)号：US20100242269A1

公开(公告)日：2010-09-30

申请号：US12813009

申请日：2010-06-10

申请人： Giles Humpston ,  Kenneth Allen Honer ,  David B. Tuckerman

发明人： Giles Humpston ,  Kenneth Allen Honer ,  David B. Tuckerman

IPC分类号： B08B7/00 ,  H05K13/00

CPC分类号： H01L27/14618 ,  G02B7/02 ,  H01L27/14625 ,  H01L27/14685 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2924/0002 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  Y10T29/49117 ,  H01L2924/00

摘要： An electronic camera module incorporates a sensor unit (20) having a semiconductor chip (22) such as a CCD imager and a cover (34) overlying the front surface of the chip. An optical unit (50) includes one or more optical elements such as lenses (58). The optical unit has engagement features (64) which abut alignment features on the sensor unit as, for example, portions (44) of the cover outer surface (38), so as to maintain a precise relationship between the optical unit and sensor unit.

摘要翻译： 电子照相机模块包括具有诸如CCD成像器的半导体芯片（22）的传感器单元（20）和覆盖在芯片的前表面上的盖（34）。 光学单元（50）包括一个或多个光学元件，例如透镜（58）。 光学单元具有接合特征（64），其接合传感器单元上​​的对准特征，例如覆盖外表面（38）的部分（44），以保持光学单元和传感器单元之间的精确关系。

公开(公告)号：US07449779B2

公开(公告)日：2008-11-11

申请号：US11322617

申请日：2005-12-30

申请人： Kenneth Allen Honer ,  Giles Humpston ,  David B. Tuckerman ,  Michael J. Nystrom

发明人： Kenneth Allen Honer ,  Giles Humpston ,  David B. Tuckerman ,  Michael J. Nystrom

IPC分类号： H01L23/48

CPC分类号： B81B7/0006 ,  B81C1/00269 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

摘要： A microelectronic device includes a chip having a front surface and a rear surface, the front surface having an active region and a plurality of contacts exposed at the front surface outside of the active region. The device further includes a lid overlying the front surface. The lid has edges bounding the lid, at least one of the edges including one or more outer portions and one or more recesses extending laterally inwardly from the outer portions, with the contacts being aligned with the recesses and exposed through them.

摘要翻译： 微电子器件包括具有前表面和后表面的芯片，前表面具有有源区域和暴露在有源区域外部的前表面处的多个触点。 该装置还包括盖在前表面上的盖。 盖具有边缘边缘，边缘中的至少一个包括一个或多个外部部分和一个或多个从外部部分横向向内延伸的凹部，触头与凹部对准并暴露在其中。

公开(公告)号：US07356923B2

公开(公告)日：2008-04-15

申请号：US11293440

申请日：2005-12-02

申请人： Kenneth Allen Honer

发明人： Kenneth Allen Honer

IPC分类号： H01K3/10 ,  H01B13/00 ,  B23K26/00

CPC分类号： H05K3/4623 ,  H05K3/4038 ,  H05K3/4688 ,  H05K3/4691 ,  H05K2201/0305 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/061 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A rigid-flexible printed wire assembly which employs a blind via for interconnection is disclosed. Preferably, the assembly includes a rigid section having a through hole formed therethrough and a flexible section having an inner metal layer. Laser ablation is preferably utilized to form a blind via in the flexible section, while utilizing the through hole of the rigid section as a guide.

摘要翻译： 公开了一种使用盲通孔进行互连的刚性柔性印刷线组件。 优选地，组件包括具有穿过其形成的通孔的刚性部分和具有内部金属层的柔性部分。 激光烧蚀优选用于在柔性部分中形成盲通孔，同时利用刚性部分的通孔作为引导件。

公开(公告)号：US08405196B2

公开(公告)日：2013-03-26

申请号：US12072508

申请日：2008-02-26

申请人： Belgacem Haba ,  Kenneth Allen Honer ,  David B. Tuckerman ,  Vage Oganesian

发明人： Belgacem Haba ,  Kenneth Allen Honer ,  David B. Tuckerman ,  Vage Oganesian

IPC分类号： H01L21/00

CPC分类号： H01L23/3128 ,  H01L23/481 ,  H01L24/10 ,  H01L24/13 ,  H01L27/14618 ,  H01L27/14683 ,  H01L29/0657 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3025 ,  H04N5/2257 ,  H01L2924/00 ,  H01L2924/00014

摘要： A microelectronic unit is provided in which front and rear surfaces of a semiconductor element may define a thin region which has a first thickness and a thicker region having a thickness at least about twice the first thickness. A semiconductor device may be present at the front surface, with a plurality of first conductive contacts at the front surface connected to the device. A plurality of conductive vias may extend from the rear surface through the thin region of the semiconductor element to the first conductive contacts. A plurality of second conductive contacts can be exposed at an exterior of the semiconductor element. A plurality of conductive traces may connect the second conductive contacts to the conductive vias.

摘要翻译： 提供了一种微电子单元，其中半导体元件的前表面和后表面可以限定具有第一厚度的薄区域和具有至少大约第二厚度的两倍的厚度的较厚区域。 半导体器件可以存在于前表面处，在前表面处连接有多个第一导电触点以连接到器件。 多个导电通孔可以从后表面延伸穿过半导体元件的薄区域到第一导电触点。 多个第二导电触头可以在半导体元件的外部暴露。 多个导电迹线可以将第二导电触点连接到导电通孔。