公开(公告)号：US20170052040A1

公开(公告)日：2017-02-23

申请号：US14981185

申请日：2015-12-28

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En LUAN

IPC: G01D5/26 ,  H05K3/32 ,  H05K3/30 ,  H05K1/18 ,  H05K3/28

CPC classification number: H05K3/32 ,  G01D11/245 ,  H01L2224/73265 ,  H01L2924/181 ,  H05K1/181 ,  H05K3/284 ,  H05K3/303 ,  H05K2201/0108 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2203/1327 ,  H01L2924/00012

Abstract: A proximity sensor is provided according to the embodiments of the present disclosure, comprising: a sensor chip; a light-emitting device; a substrate, the sensor chip and the light-emitting device being located on the substrate; a transparent molding material covering a light-emitting surface of the light-emitting device; and a non-transparent molding material separating the transparent molding material from the sensor chip.

Abstract translation: 根据本公开的实施例提供接近传感器，包括：传感器芯片; 发光装置; 衬底，传感器芯片和发光器件位于衬底上; 覆盖发光装置的发光面的透明成型材料; 以及将透明模塑材料与传感器芯片分开的不透明模塑材料。

公开(公告)号：US20160190097A1

公开(公告)日：2016-06-30

申请号：US14817502

申请日：2015-08-04

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En LUAN

IPC: H01L25/065 ,  H01L23/31 ,  H01L25/00 ,  H01L21/56 ,  H01L21/78 ,  H01L23/00 ,  H01L23/498 ,  H01L21/48

CPC classification number: H01L24/92 ,  H01L21/4853 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/29 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/3171 ,  H01L23/49513 ,  H01L23/49575 ,  H01L23/49838 ,  H01L23/49861 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/94 ,  H01L24/96 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/0569 ,  H01L2224/2741 ,  H01L2224/27416 ,  H01L2224/29082 ,  H01L2224/2919 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/85207 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/181 ,  H01L2224/27 ,  H01L2224/03 ,  H01L2924/00012 ,  H01L2224/43 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2224/85399

Abstract: Embodiments of the present disclosure provide a semiconductor device, a semiconductor package, and a method for manufacturing a semiconductor device. The semiconductor device comprises: a semiconductor die; an electrical isolation layer formed on a surface of the semiconductor die; a substrate; and a non-conductive adhesive layer disposed between the electrical isolation layer and the substrate, so as to adhere the electrical isolation layer to the substrate.

Abstract translation: 本公开的实施例提供半导体器件，半导体封装以及半导体器件的制造方法。 半导体器件包括：半导体管芯; 形成在所述半导体管芯的表面上的电隔离层; 底物; 以及设置在电隔离层和基板之间的非导电粘合剂层，以将电隔离层粘附到基板上。

公开(公告)号：US20240282881A1

公开(公告)日：2024-08-22

申请号：US18649789

申请日：2024-04-29

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En LUAN

IPC: H01L31/12 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/18

CPC classification number: H01L31/12 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/186

Abstract: The present disclosure is directed to a sensor die with an embedded light sensor and an embedded light emitter as well as methods of manufacturing the same. The light emitter in the senor die is surrounded by a resin. The sensor die is incorporated into semiconductor device packages as well as methods of manufacturing the same. The semiconductor device packages include a first optically transmissive structure on the light sensor of the sensor die and a second optically transmissive structure on the light emitter of the sensor die. The first optically transmissive structure and the second optically transmissive structure cover and protect the light sensor and the light emitter, respectively. A molding compound is on a surface of a sensor die and covers sidewalls of the first and second optically transmissive structures on the sensor die.

公开(公告)号：US20240128203A1

公开(公告)日：2024-04-18

申请号：US18369441

申请日：2023-09-18

Applicant: STMicroelectronics PTE LTD

Inventor： Jing-En LUAN

IPC: H01L23/00 ,  H01L21/3065 ,  H01L21/768 ,  H01L21/78 ,  H01L23/36 ,  H01L23/48

CPC classification number: H01L23/562 ,  H01L21/3065 ,  H01L21/76898 ,  H01L21/78 ,  H01L23/36 ,  H01L23/481 ,  H01L24/03 ,  H01L24/16 ,  H01L2224/0346 ,  H01L2224/16145 ,  H01L2224/16227

Abstract: A method of manufacturing a chip-sized package includes providing a wafer having a die area formed therein adjacent a front face thereof, with the die area having pads formed thereon. Vias in the wafer are formed to extend between a back face of the wafer and a back side of some of the pads of the die area. Solder pads connected to the vias are formed, and a thermal pad is formed on the back side of the wafer opposite to the die area. Cavities are formed in the back face of the wafer to define pillars extending outwardly from a planar portion of the die area, some of the pillars having the solder pads at a distal end thereof, at least one of the pillars having the thermal pad at a distal end thereof. The wafer is singulated to form a chip-sized package including an integrated circuit die.

公开(公告)号：US20230071048A1

公开(公告)日：2023-03-09

申请号：US18055138

申请日：2022-11-14

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En LUAN ,  Jerome TEYSSEYRE

IPC: G01S17/04 ,  H01L25/16 ,  G01S7/481 ,  H01L31/173

Abstract: A proximity sensor includes a printed circuit board substrate, a semiconductor die, electrical connectors, a lens, a light emitting assembly, and an encapsulating layer. The semiconductor die is positioned over the printed circuit board substrate with its upper surface facing away from the printed circuit board substrate. Each of the electrical connectors is in electrical communication with a contact pad of the semiconductor die and a respective contact pad of the printed circuit board substrate. The lens is positioned over a sensor area of the semiconductor die. The light emitting assembly includes a light emitting device having a light emitting area, a lens positioned over the light emitting area, and contact pads facing the printed circuit board substrate. The encapsulating layer is positioned on the printed circuit board substrate, at least one of the electrical connectors, the semiconductor die, the lens, and the light emitting assembly.

公开(公告)号：US20170123064A1

公开(公告)日：2017-05-04

申请号：US14981196

申请日：2015-12-28

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En LUAN

IPC: G01S17/02 ,  G01J1/04 ,  G01J1/42

CPC classification number: G01S17/026 ,  G01J1/0204 ,  G01J1/0209 ,  G01J1/0271 ,  G01J1/0488 ,  G01J1/06 ,  G01J1/42 ,  G01S7/4813 ,  H01L31/167 ,  H01L2224/73265

Abstract: The embodiments of the present disclosure provide a proximity sensor, an electronic apparatus and a method for manufacturing a proximity sensor. The proximity sensor comprises a substrate, a sensor chip, a light-emitting device, a non-transparent isolation structure and a non-transparent molding material, wherein the sensor chip is located on the substrate and electrically coupled to the substrate; the light-emitting device is located on the sensor chip and electrically coupled to the sensor chip; the non-transparent isolation structure is located on the sensor chip and isolates the light-emitting device from a sensor region of the sensor chip; and the non-transparent molding material at least partially covers the substrate, the sensor chip and the non-transparent isolation structure, such that a portion of the proximity sensor which is located right above the sensor region and the light-emitting device is not covered by the non-transparent molding material.

公开(公告)号：US20160104737A1

公开(公告)日：2016-04-14

申请号：US14740468

申请日：2015-06-16

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En LUAN

IPC: H01L27/146

CPC classification number: H01L27/14636 ,  H01L27/14618 ,  H01L27/1462 ,  H01L27/14625 ,  H01L27/14685 ,  H01L2224/48095 ,  H01L2224/73265

Abstract: An image sensor device may include an interconnect layer having an opening extending therethrough, an image sensor IC within the opening and having an image sensing surface, and an IR filter aligned with the image sensing surface. The image sensor device may include an encapsulation material laterally surrounding the image sensor IC and filling the opening, and a flexible interconnect layer coupled to the interconnect layer opposite the image sensing surface.

Abstract translation: 图像传感器装置可以包括具有延伸穿过其中的开口的互连层，在开口内的图像传感器IC，并且具有图像感测表面，以及与图像感测表面对准的IR滤光器。 图像传感器装置可以包括横向围绕图像传感器IC并填充开口的封装材料，以及耦合到与图像感测表面相对的互连层的柔性互连层。

公开(公告)号：US20160104656A1

公开(公告)日：2016-04-14

申请号：US14741535

申请日：2015-06-17

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En LUAN

IPC: H01L23/373 ,  H01L21/48 ,  H01L23/31 ,  H01L23/498 ,  H01L23/367

CPC classification number: H01L23/562 ,  H01L21/4846 ,  H01L21/4853 ,  H01L21/4871 ,  H01L21/4882 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/78 ,  H01L23/18 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/373 ,  H01L23/3737 ,  H01L23/498 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16235 ,  H01L2224/18 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2924/3511

Abstract: An electronic device may include an integrated circuit (IC), electrically conductive connectors coupled to the IC, and a heat sink layer adjacent the IC and opposite the electrically conductive connectors. The electronic device may include an encapsulation material surrounding the IC and the electrically conductive connectors, a redistribution layer having electrically conductive traces coupled to the electrically conductive connectors, a stiffener between the heat sink layer and the redistribution layer, and a fan-out component between the heat sink layer and the redistribution layer and being in the encapsulation material.

Abstract translation: 电子设备可以包括集成电路（IC），耦合到IC的导电连接器以及与IC相邻并与导电连接器相对的散热层。 电子设备可以包括围绕IC和导电连接器的封装材料，具有耦合到导电连接器的导电迹线的再分布层，散热层和再分布层之间的加强件，以及在散热层之间的扇出部分， 散热层和再分配层，并且在封装材料中。

公开(公告)号：US20250079189A1

公开(公告)日：2025-03-06

申请号：US18951814

申请日：2024-11-19

Applicant: STMicroelectronics Pte Ltd

Inventor： Jing-En LUAN

IPC: H01L21/48 ,  H01L23/00 ,  H01L23/498 ,  H01L25/00 ,  H01L25/065 ,  H01L25/18 ,  H01S5/02218 ,  H01S5/02315 ,  H01S5/02345

Abstract: A molded carrier is formed by a unitary body made of a laser direct structuring (LDS) material and includes a blind opening with a bottom surface. The unitary body includes: a floor body portion defining a back side and the bottom surface of the blind opening and an outer peripheral wall body portion defining a sidewall surface of the blind opening. LDS activation followed by electro-plating is used to produce: a die attach pad and bonding pad at the bottom surface; land grid array (LGA) pads at the back side; and vias extending through the floor body portion to make electrical connections between the die attach pad and one LGA pad and between the bonding pad and another LGA pad. An integrated circuit chip is mounted to the die attach pad and wire bonded to the bonding pad. A wafer-scale manufacturing process is used to form the molded carrier.

公开(公告)号：US20240036169A1

公开(公告)日：2024-02-01

申请号：US18486071

申请日：2023-10-12

Applicant: STMicroelectronics PTE LTD

Inventor： Jing-En LUAN

IPC: G01S7/481

CPC classification number: G01S7/4813

Abstract: The present disclosure is directed to an optical sensor package with a first assembly and a second assembly with an encapsulant extending between and coupling the first assembly and the second assembly. The first assembly includes a first substrate, a first die on the first substrate, a transparent material on the first die, and an infrared filter on the transparent material. The second assembly includes a second substrate, a second die on the second substrate, a transparent material on the second die, and an infrared filter on the transparent material. Apertures are formed through the encapsulant aligned with the first die and the second die. The first die is configured to transmit light through one aperture, wherein the light reflects off an object to be detected and is received at the second die through another one of the apertures.