公开(公告)号：US20160108230A1

公开(公告)日：2016-04-21

申请号：US14894868

申请日：2013-05-30

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Junqi TANG ,  Yongjing XU

IPC: C08L63/04 ,  C08L61/14 ,  H05K1/03 ,  B32B15/14 ,  B32B15/20 ,  C08L65/00 ,  C08J5/24

CPC classification number: C08L63/04 ,  B32B15/14 ,  B32B15/20 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/204 ,  B32B2307/3065 ,  B32B2307/7246 ,  B32B2457/08 ,  C08J5/24 ,  C08J2361/14 ,  C08J2363/00 ,  C08J2363/04 ,  C08J2365/00 ,  C08J2461/14 ,  C08J2463/04 ,  C08L61/14 ,  C08L65/00 ,  C08L2201/02 ,  C08L2201/08 ,  C08L2201/22 ,  C08L2203/20 ,  C08L2205/025 ,  C08L2205/03 ,  H05K1/0353 ,  H05K1/0366 ,  H05K2201/0209

Abstract: The present invention relates to a cyanate resin composition, and a prepreg, a laminate, a metal foil clad laminate and a printed circuit board prepared by using same. The cyanate resin composition comprises a cyanate resin (A), an epoxy resin (B) with a structure of formula (I) and a maleimide compound (C). The cyanate resin composition of the present invention, and the prepreg, the laminate and the metal foil clad laminate prepared by using the cyanate resin composition have good moisture resistance, heat resistance, flame retardancy and reliability, and are suitable for being used as a substrate material for manufacturing a high-density printed circuit board.

Abstract translation: 本发明涉及氰酸酯树脂组合物，预浸料，层压体，覆盖金属箔的层压板和使用它们制成的印刷电路板。 氰酸酯树脂组合物包含氰酸酯树脂（A），具有式（I）结构的环氧树脂（B）和马来酰亚胺化合物（C）。 本发明的氰酸酯树脂组合物和通过使用氰酸酯树脂组合物制备的预浸料，层压体和金属箔覆层压板具有良好的耐湿性，耐热性，阻燃性和可靠性，并且适合用作基材 用于制造高密度印刷电路板的材料。

公开(公告)号：US11685830B2

公开(公告)日：2023-06-27

申请号：US17052789

申请日：2019-08-14

Applicant: LG CHEM, LTD.

Inventor： Je Sun Yoo ,  Ki Young Nam ,  Jae Young Sim ,  Seon Hyeong Bae ,  Jae Yeon Bae ,  In Seok Kim

IPC: C08L71/12 ,  C08L25/06 ,  C08L55/02

CPC classification number: C08L71/123 ,  C08L25/06 ,  C08L55/02 ,  C08L2201/02 ,  C08L2201/22 ,  C08L2205/03

Abstract: The present invention relates to a flame retardant resin composition having excellent flame retardancy and improved thermal deformation properties, and a flame retardant resin molded article manufactured therefrom, and provides a flame retardant resin composition including a) a base resin including a polyarylene ether-based polymer; an aromatic vinyl-based polymer and a copolymer of vinylcyan monomer-conjugated diene monomer-aromatic vinyl monomer; b) an organophosphorus-based flame retardant; c) a hypophosphite compound; and d) a sulfur-containing compound including at least two sulfur atoms, wherein b) the organophosphorus-based flame retardant, c) the hypophosphite compound and d) the sulfur-containing compound are included in a weight ratio of 15 to 24:2 to 4:2 to 5.

公开(公告)号：US10072378B2

公开(公告)日：2018-09-11

申请号：US15036154

申请日：2014-11-12

Applicant: INVISTA TECHNOLOGIES S.À.R.L.

Inventor： Markus Baumann

IPC: D06M15/643 ,  C08L83/04 ,  B05D1/02 ,  C09D183/08 ,  D06M23/04 ,  D06M23/06 ,  C08G77/26

CPC classification number: D06M15/643 ,  B05D1/02 ,  C08G77/26 ,  C08L83/04 ,  C08L2201/22 ,  C08L2205/025 ,  C09D183/08 ,  D06M15/6436 ,  D06M23/04 ,  D06M23/06 ,  D06M2200/01 ,  D06M2200/12 ,  C08K5/544

Abstract: The present invention pertains to a fluorine-free composition for treating textile articles being water repellant, sol resistant and stain resistant, especially carpets comprising a first composition comprising an aqueous silicone emulsion, an aqueous dispersion of a silane quaternary ammonium salt and water and a second composition comprising a soil repellency component that is an aqueous dispersion of colloidal organosiloxane copolymers.

公开(公告)号：US09963590B2

公开(公告)日：2018-05-08

申请号：US15027374

申请日：2014-06-10

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Jiang You

IPC: C08L63/00 ,  C08G59/50 ,  C08J5/24 ,  C08L79/02 ,  H05K1/03 ,  B32B27/38 ,  B32B27/42 ,  C08K3/22 ,  C08K3/34 ,  C08K3/40 ,  C08K5/00 ,  C08L63/04 ,  C08G14/06 ,  C08L61/06 ,  C08L61/34 ,  C08G59/32 ,  C08G59/62 ,  C08G59/68

CPC classification number: C08L63/00 ,  B32B27/38 ,  B32B27/42 ,  B32B2260/021 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2307/204 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2307/714 ,  B32B2307/726 ,  B32B2307/7265 ,  B32B2307/734 ,  B32B2457/08 ,  C08G14/06 ,  C08G59/3218 ,  C08G59/5073 ,  C08G59/621 ,  C08G59/686 ,  C08J5/24 ,  C08J2363/00 ,  C08J2379/02 ,  C08J2379/04 ,  C08J2461/06 ,  C08J2463/00 ,  C08J2479/02 ,  C08J2479/04 ,  C08K3/22 ,  C08K3/34 ,  C08K3/40 ,  C08K5/0066 ,  C08K5/49 ,  C08L61/04 ,  C08L61/06 ,  C08L61/34 ,  C08L63/04 ,  C08L79/02 ,  C08L79/04 ,  C08L79/06 ,  C08L2201/02 ,  C08L2201/22 ,  C08L2203/20 ,  C08L2205/03 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/015

Abstract: The technology discloses a halogen-free resin composition and a prepreg and a laminate used for a printed circuit. The resin composition comprises: alkyl phenol epoxy resin; benzoxazine resin, alkyl phenol novolac curing agent, and phosphorus-containing flame retardant. The alkyl phenol epoxy resin has many alkyl branched chains in its molecular structure, making the composition have excellent dielectric properties, a higher glass transition temperature, low water absorption, and good heat resistance. Mixing benzoxazine resin into the composition can further reduce dielectric constant, dielectric loss value and water absorption of the cured product. With an alkyl phenol novolac curing agent, the molecular structure will have many alkyls, excellent dielectric properties and low water absorption. A prepreg and a laminate used for printed circuit prepared using the resin composition have low dielectric constants, dielectric loss factors, and water absorption, high dimensional stability, high thermal resistance and good flame retardancy, processability and chemical resistance.

公开(公告)号：US20170298218A1

公开(公告)日：2017-10-19

申请号：US15318787

申请日：2016-09-08

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Hui LI ,  Kehong FANG ,  Yongjing XU

IPC: C08L63/00 ,  C08G59/50 ,  C08G59/62 ,  C08J5/04 ,  C08G59/42 ,  H01B3/40 ,  C08L63/08 ,  C08J5/24 ,  H05K1/03

CPC classification number: C08L63/00 ,  B32B5/022 ,  B32B5/024 ,  B32B5/26 ,  B32B7/04 ,  B32B15/06 ,  B32B15/092 ,  B32B15/14 ,  B32B15/20 ,  B32B25/02 ,  B32B25/042 ,  B32B27/08 ,  B32B27/20 ,  B32B27/26 ,  B32B27/28 ,  B32B27/281 ,  B32B27/285 ,  B32B27/302 ,  B32B27/32 ,  B32B27/325 ,  B32B27/34 ,  B32B27/36 ,  B32B27/38 ,  B32B27/42 ,  B32B2250/05 ,  B32B2255/02 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2264/0214 ,  B32B2264/0257 ,  B32B2264/10 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2264/107 ,  B32B2264/12 ,  B32B2270/00 ,  B32B2307/204 ,  B32B2307/21 ,  B32B2307/302 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2307/308 ,  B32B2307/4026 ,  B32B2307/724 ,  B32B2307/748 ,  B32B2457/08 ,  C08G14/06 ,  C08G59/40 ,  C08G59/42 ,  C08G59/4238 ,  C08G59/4284 ,  C08G59/5046 ,  C08G59/621 ,  C08G73/0233 ,  C08G73/06 ,  C08J5/043 ,  C08J5/24 ,  C08J2363/00 ,  C08J2363/02 ,  C08J2363/08 ,  C08K3/01 ,  C08K5/0025 ,  C08K13/02 ,  C08L35/06 ,  C08L61/34 ,  C08L63/08 ,  C08L79/04 ,  C08L2201/02 ,  C08L2201/22 ,  C08L2203/20 ,  C08L2205/02 ,  C08L2205/05 ,  H01B3/40 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0242

Abstract: The present invention relates to a halogen-free epoxy resin composition, a prepreg, a laminate and a printed circuit board containing the same. The halogen-free epoxy resin composition comprises an epoxy resin and a curing agent. Taking the total equivalent amount of the epoxy groups in the epoxy resin as 1, the active groups in the curing agent which react with the epoxy groups have an equivalent amount of 0.5-0.95. By controlling the equivalent ratio of the epoxy groups in the epoxy resin to the active groups in the curing agent to be 0.5-0.95, the present invention ensures the Df value stability of prepregs under different curing temperature conditions while maintaining a low dielectric constant and a low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.

公开(公告)号：US20170198135A1

公开(公告)日：2017-07-13

申请号：US15313669

申请日：2014-12-02

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Hui LI ,  Kehong FANG

IPC: C08L63/08 ,  H05K1/03 ,  C08J5/24 ,  C08J5/04 ,  C08L63/00 ,  C08G59/58

CPC classification number: C08L63/08 ,  B32B15/092 ,  C08G59/42 ,  C08G59/58 ,  C08J5/043 ,  C08J5/24 ,  C08J2363/02 ,  C08J2363/08 ,  C08J2425/02 ,  C08J2435/00 ,  C08J2471/12 ,  C08K3/36 ,  C08K5/0066 ,  C08K5/3445 ,  C08K5/49 ,  C08L35/06 ,  C08L63/00 ,  C08L63/04 ,  C08L71/12 ,  C08L2201/02 ,  C08L2201/22 ,  C08L2203/20 ,  C08L2205/02 ,  C08L2205/03 ,  C08L2205/05 ,  C08L2312/00 ,  H05K1/0373 ,  H05K2201/012 ,  C08F212/12 ,  C08F222/06

Abstract: The present invention relates to a halogen-free resin composition and a prepreg and a laminated board prepared therefrom. The halogen-free resin composition contains the following components in parts by weight: 50-100 parts of an epoxy resin; 20-70 parts of benzoxazine; 5-40 parts of a polyphenyl ether; 5-40 parts of allyl benzene-maleic anhydride; 10-60 parts of a halogen-free flame retardant; 0.2-5 parts of a curing accelerator, and 20-100 parts of a filler. The prepreg and laminated board prepared from the halogen-free resin composition have comprehensive performances such as a low dielectric constant, a low dielectric loss, an excellent flame retardance, heat resistance, cohesiveness and moisture resistance, etc., and are suitable for use in a halogen-free high multilayer circuit board.

公开(公告)号：US20160340507A1

公开(公告)日：2016-11-24

申请号：US15022946

申请日：2015-01-26

Applicant: SABIC GLOBAL TECHNOLOGIES B.V.

Inventor： Tianhua Ding ,  Dake Shen ,  Hongtao Shi ,  Lin Chen

IPC: C08L69/00

CPC classification number: C08L69/00 ,  C08L67/02 ,  C08L2201/02 ,  C08L2201/22 ,  C08L2205/025 ,  C08L2205/03 ,  C08L2205/035 ,  C08L27/18 ,  C08L83/10 ,  C08L85/02

Abstract: This disclosure relates to halogen-free flame retardant polycarbonate/thermoplastic polyester molding compositions with improved mechanical properties and increased polyester loading level. More particularly, the disclosure relates to halogen-free polycarbonate/thermoplastic polyester resin alloys with polymeric phosphorus flame retardant additive and siloxane impact modifier. Also included are methods for preparing such compositions and articles there from.

Abstract translation: 本公开涉及具有改进的机械性能和增加的聚酯负载水平的无卤阻燃聚碳酸酯/热塑性聚酯模塑组合物。 更具体地，本公开涉及具有聚合磷阻燃添加剂和硅氧烷抗冲改性剂的无卤聚碳酸酯/热塑性聚酯树脂合金。 还包括从其制备这样的组合物和制品的方法。

公开(公告)号：US20160244602A1

公开(公告)日：2016-08-25

申请号：US15027374

申请日：2014-06-10

Applicant: Shengyi Technology Co., Ltd.

Inventor： Jiang YOU

IPC: C08L63/00 ,  H05K1/03 ,  C08G59/50 ,  C08L79/02 ,  C08J5/24

CPC classification number: C08L63/00 ,  B32B27/38 ,  B32B27/42 ,  B32B2260/021 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2307/204 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2307/714 ,  B32B2307/726 ,  B32B2307/7265 ,  B32B2307/734 ,  B32B2457/08 ,  C08G14/06 ,  C08G59/3218 ,  C08G59/5073 ,  C08G59/621 ,  C08G59/686 ,  C08J5/24 ,  C08J2363/00 ,  C08J2379/02 ,  C08J2379/04 ,  C08J2461/06 ,  C08J2463/00 ,  C08J2479/02 ,  C08J2479/04 ,  C08K3/22 ,  C08K3/34 ,  C08K3/40 ,  C08K5/0066 ,  C08K5/49 ,  C08L61/04 ,  C08L61/06 ,  C08L61/34 ,  C08L63/04 ,  C08L79/02 ,  C08L79/04 ,  C08L79/06 ,  C08L2201/02 ,  C08L2201/22 ,  C08L2203/20 ,  C08L2205/03 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/015

Abstract: The technology discloses a halogen-free resin composition and a prepreg and a laminate used for a printed circuit. The resin composition comprises: alkyl phenol epoxy resin; benzoxazine resin, alkyl phenol novolac curing agent, and phosphorus-containing flame retardant. The alkyl phenol epoxy resin has many alkyl branched chains in its molecular structure, making the composition have excellent dielectric properties, a higher glass transition temperature, low water absorption, and good heat resistance. Mixing benzoxazine resin into the composition can further reduce dielectric constant, dielectric loss value and water absorption of the cured product. With an alkyl phenol novolac curing agent, the molecular structure will have many alkyls, excellent dielectric properties and low water absorption. A prepreg and a laminate used for printed circuit prepared using the resin composition have low dielectric constants, dielectric loss factors, and water absorption, high dimensional stability, high thermal resistance and good flame retardancy, processability and chemical resistance.

Abstract translation: 该技术公开了一种无卤树脂组合物和用于印刷电路的预浸料和层压材料。 树脂组合物包括：烷基酚环氧树脂; 苯并恶嗪树脂，烷基苯酚酚醛清漆固化剂和含磷阻燃剂。 烷基酚环氧树脂在其分子结构中具有许多烷基支链，使得组合物具有优异的介电性能，较高的玻璃化转变温度，低吸水率和良好的耐热性。 将苯并恶嗪树脂混合到组合物中可以进一步降低固化产物的介电常数，介电损耗值和吸水率。 使用烷基苯酚酚醛清漆固化剂，分子结构将具有许多烷基，介电性能优异和吸水率低。 用于使用该树脂组合物制备的印刷电路板的预浸料和层压材料具有低介电常数，介电损耗因子和吸水率，高尺寸稳定性，高耐热性，良好的阻燃性，加工性和耐化学性。

公开(公告)号：US20110198105A1

公开(公告)日：2011-08-18

申请号：US12837896

申请日：2010-07-16

Applicant: Daisuke SHANAI ,  Akinari NAKAYAMA

Inventor： Daisuke SHANAI ,  Akinari NAKAYAMA

IPC: H01B7/295 ,  C08L43/02 ,  C08K3/26 ,  C08K3/22

CPC classification number: H01B7/295 ,  C08F255/02 ,  C08K3/016 ,  C08K3/22 ,  C08K3/26 ,  C08L43/02 ,  C08L51/06 ,  C08L2201/22 ,  C08F230/02

Abstract: An electric wire and cable made of a non-halogen flame retardant resin composition has a modified polyolefin resin composition comprising a polyolefin resin grafted with a phosphate compound having a vinyl group, and an acid acceptor doped to the modified polyolefin resin.

Abstract translation: 由非卤素阻燃树脂组合物制成的电线电缆具有改性聚烯烃树脂组合物，其包含接枝有具有乙烯基的磷酸酯化合物的聚烯烃树脂和掺杂到改性聚烯烃树脂上的酸受体。

公开(公告)号：US20240209199A1

公开(公告)日：2024-06-27

申请号：US18145430

申请日：2022-12-22

Applicant: TE Connectivity Solutions GmbH

Inventor： Jessica H.B. HEMOND

IPC: C08L33/08 ,  B33Y10/00 ,  C08K3/34 ,  C08K3/38

CPC classification number: C08L33/08 ,  B33Y10/00 ,  C08K3/346 ,  C08K3/38 ,  C08K2003/387 ,  C08L2201/02 ,  C08L2201/22 ,  C08L2203/20

Abstract: An electrical connector having a housing formed of a non-halogenated flame retardant polymer composition is described. The non-halogenated flame retardant polymer composition is formulated to meet flammability performance requirements while maintaining a balance of flexibility and stiffness to allow for the connector to operate properly.