Abstract:
Provided is an adhesive sheet comprising a support substrate, an adhesive agent layer (X), a continuous void-containing layer composed of a composition containing an adhesive agent and silica particles, and an adhesive agent layer (Y) that are laminated in this order, wherein the adhesive sheet that has a content by mass of the silica particles in the continuous void-containing layer of 25 to 60%; and when affixed to a surface of various plastic molded articles, the adhesive sheet prevents swelling or lifting, in other words, blistering after a lapse of time, to allow the surface of its support substrate to be smooth and to have an excellent appearance, wherein the adhesive sheet can exhibit excellent blister resistance regardless of the type of adhesive agent, and is furthermore easy to manufacture.
Abstract:
Provided are an encapsulation film, an organic electronic device including the same, and a method of manufacturing the organic electronic device. Therefore, provided is the pressure-sensitive adhesive composition, which can form a structure capable of effectively blocking moisture or water entering the organic electronic device from the outside, and have excellent processability in a process of manufacturing a panel and excellent heat retention under a high-temperature and high-humidity condition.
Abstract:
Provided is a pressure sensitive adhesive sheet containing a resin layer on a substrate or a release material, at least a surface (α) of the resin layer being opposite to the side thereof on which the substrate or the release material is provided having pressure sensitive adhesiveness, wherein, when a smooth surface of a light transmissive adherend having a smooth surface is attached to the surface (α), one or more concave portion (G) not kept in contact with the smooth surface exist on the surface (α), and the shapes of the one or more concave portions (G) have irregular shapes. The pressure sensitive adhesive sheet has excellent air escape property capable of readily removing air accumulation that may be formed on attaching to an adherend, and has good pressure sensitive adhesion characteristics.
Abstract:
A decorative laminate includes a laminate substrate coated with an adhesive layer. The adhesive layer is a layer of a physically setting, solvent-free adhesive material including an acrylic polymer. The adhesive layer is self-adhesive at room temperature. The adhesive-coated laminate substrate has a peeling-off force of at least 0.2 N/mm2, after application on a carrier. A method for the production of the adhesive-coated laminate substrate, its use as a coating material, and a composite of the adhesive-coated laminate substrate and a carrier material are also provided.
Abstract:
Provided is an OLED device that includes an adhesive film having a network and a method for fabricating the same.The OLED device includes: a protective layer covering an organic light-emitting element on a substrate; a metal layer on the protective layer; and an adhesive film between the metal layer and the protective layer to attach the metal layer to the protective layer. The adhesive film includes a first adhesive layer composed of first polymers having a network structure, and a second adhesive layer composed of second polymers having a network structure and moisture absorbent. The network structure of the first polymers is bonded with the network structure of the second polymers at an interface between the first adhesive layer and the second adhesive layer.
Abstract:
This disclosure relates generally to optically clear adhesives and methods of their production. The disclosed adhesives may contain features of both optically clear adhesive films and optically clear adhesive liquids. The disclosed optically clear adhesives may be useful in the assembly processes for a variety of applications, including in the assembly of optical display elements.
Abstract:
The present invention provides an adhesive sheet used in manufacture of a semiconductor device, containing a filler having an average particle size of 0.3 μm or less and an acrylic resin, wherein the content of the filler is in the range of 20 to 45% by weight with respect to the entire adhesive sheet, and the content of the acrylic resin is in the range of 40 to 70% by weight with respect to entire resin components.
Abstract:
Provided are an adhesive film, an encapsulated product of an organic electronic device using the same, and a method of encapsulating an organic electronic device. Particularly, the adhesive film encapsulating the organic electronic device to cover an entire surface of the organic electronic device includes an adhesive layer including a curable resin and a moisture adsorbent. The adhesive layer has a viscosity in a temperature range of 30 to 130° C. of 101 to 106 Pa·s and a viscosity at room temperature of 106 Pa·s or more in an uncured state, and when the adhesive layer has a multilayered structure, a difference in melting viscosity between layers is less than 30 Pa·s. In addition, the method of encapsulating an organic electronic device using the adhesive film is provided.
Abstract:
Provided are an encapsulation film, an organic electronic device including the same, and a method of manufacturing the organic electronic device. Therefore, provided is the encapsulation film, which may form a structure capable of effectively blocking moisture or water entering the organic electronic device from the outside, and have excellent processability in a process of manufacturing a panel and excellent heat retention under a high-temperature and high-humidity condition.
Abstract:
The present invention relates to an adhesive film and to a touch panel. According to the present invention, even when the adhesive film is applied to a touch panel, for example, a capacitive touch panel, and directly attached to a conductive layer, the adhesive film effectively prevents the resistance of the conductive layer from being raised and exhibits good heat resistance. In addition, according to the present invention, an adhesive film having superior durability, optical characteristics, cuttability, workability, wettability and resistance to warping is provided.