公开(公告)号：US20040170795A1

公开(公告)日：2004-09-02

申请号：US10715718

申请日：2003-11-17

Applicant: AlliedSignal Inc.

Inventor： David R. Haas ,  Chengzeng Xu ,  Mavyn McAuliffe ,  Scott Zimmerman ,  Laura Miller ,  Meifang Qin ,  Baopei Xu ,  Richard J. Pommer

IPC: B32B027/02 ,  B32B017/02 ,  B32B009/00 ,  B32B033/00

CPC classification number: B32B15/08 ,  B32B7/06 ,  B32B17/04 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2457/08 ,  H05K3/0032 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4626 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/10378 ,  Y10T428/1476 ,  Y10T442/2861 ,  Y10T442/2992 ,  Y10T442/697

Abstract: This invention concerns lasable bond-ply materials comprising a nonwoven reinforcing material and at least one resin material. The present invention also includes methods for using the bond-ply of this invention to manufacture high density multilayer printed wiring boards.

公开(公告)号：US20030068520A1

公开(公告)日：2003-04-10

申请号：US09871896

申请日：2001-06-04

Applicant: Matsushita Electric Works, Ltd.

Inventor： Naoto Ikegawa ,  Naoyuki Kondo ,  Kimiaki Nakata

IPC: B05D001/02

CPC classification number: H05K1/0366 ,  H05K3/381 ,  H05K3/388 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2203/095 ,  Y10T428/12569 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/258 ,  Y10T428/29 ,  Y10T428/2913 ,  Y10T428/2916 ,  Y10T428/31678 ,  Y10T428/31681

Abstract: A laminate includes a metal layer which is formed on and covers a surface of an insulating substrate activated by a plasma treatment by any method selected from a sputtering method, a vacuum depositing method and an ion plating method. The substrate is obtained by molding a resin composition containing 20 to 150 parts by mass of a fibrous filler having an average fiber diameter of 0.1 to 5 nullm and an average fiber length of 10 to 50 nullm relative to 100 parts by mass of a base resin comprising a thermoplastic resin and a thermosetting resin.

公开(公告)号：US20020098319A1

公开(公告)日：2002-07-25

申请号：US09987396

申请日：2001-11-14

Applicant: SONY CHEMICALS CORP.

Inventor： Motohide Takeichi ,  Junji Shinozaki

IPC: H05K007/00 ,  H05K005/00 ,  G06F001/16 ,  B32B003/06 ,  H01R013/64 ,  H01R024/00

CPC classification number: H05K3/323 ,  H01L21/563 ,  H01L23/295 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/3511 ,  H05K1/189 ,  H05K2201/0209 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0251 ,  H05K2201/10674 ,  Y10T428/24008 ,  H01L2924/00 ,  H01L2224/0401

Abstract: The present invention is a connection material which enables a flexible circuit board to be connected to a bare IC chip without causing a shoulder touch effect. The connection material contains an insulating adhesive and a flaky or fibrous insulating filler dispersed therein is used for connecting a film-like flexible circuit board and a bare IC chip. The aspect ratio of the flaky or fibrous insulating filler is no less than 20.

Abstract translation: 本发明是一种连接材料，其能够使柔性电路板连接到裸IC芯片而不产生肩部接触效果。 连接材料包含绝缘粘合剂，其中分散在其中的片状或纤维绝缘填料用于连接薄膜状柔性电路板和裸IC芯片。 片状或纤维状绝缘填料的纵横比不小于20。

公开(公告)号：US20020045042A1

公开(公告)日：2002-04-18

申请号：US09897907

申请日：2001-07-05

Applicant: Matsushita Electric Works, Ltd.

Inventor： Naoto Ikegawa ,  Naoyuki Kondo ,  Kimiaki Nakata

IPC: B32B015/08 ,  B32B005/16

CPC classification number: H05K1/0366 ,  H05K3/381 ,  H05K3/388 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2203/095 ,  Y10T428/252 ,  Y10T428/259 ,  Y10T428/31681

Abstract: A laminate includes a metal layer which is formed on and covers a surface of an insulating substrate activated by a plasma treatment by any method selected from a sputtering method, a vacuum depositing method and an ion plating method. The substrate is obtained by molding a resin composition containing 20 to 150 parts by mass of a fibrous filler having an average fiber diameter of 0.1 to 5 nullm and an average fiber length of 10 to 50 nullm relative to 100 parts by mass of a base resin comprising a thermoplastic resin and a thermosetting resin.

Abstract translation: 层压体包括通过溅射法，真空蒸镀法，离子镀法等任一种方法形成在绝缘基板的表面并覆盖由等离子体处理而起作用的金属层。 通过将相对于100质量份的基础树脂相对于100质量份的含有20〜150质量份平均纤维直径为0.1〜5μm，平均纤维长度为10〜50μm的纤维状填料， 包括热塑性树脂和热固性树脂。

公开(公告)号：US06245696B1

公开(公告)日：2001-06-12

申请号：US09344749

申请日：1999-06-25

Applicant: David R. Haas ,  Chengzeng Xu ,  Mavyn McAuliffe ,  Scott Zimmerman ,  Laura Miller ,  Meifang Qin ,  Baopei Xu ,  Richard J. Pommer

Inventor： David R. Haas ,  Chengzeng Xu ,  Mavyn McAuliffe ,  Scott Zimmerman ,  Laura Miller ,  Meifang Qin ,  Baopei Xu ,  Richard J. Pommer

IPC: B32B1704

CPC classification number: H05K3/4626 ,  B29C70/885 ,  B32B7/06 ,  B32B15/08 ,  B32B17/04 ,  H05K3/0032 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0195 ,  H05K2201/0212 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/10378 ,  Y10S428/901 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T428/1476 ,  Y10T428/24917 ,  Y10T428/2839 ,  Y10T442/2861 ,  Y10T442/2992 ,  Y10T442/60 ,  Y10T442/615 ,  Y10T442/616 ,  Y10T442/623 ,  Y10T442/674 ,  Y10T442/697

Abstract: This invention concerns lasable bond-ply materials comprising a nonwoven reinforcing material and at least one resin material. The present invention also includes methods for using the bond-ply of this invention to manufacture high density multilayer printed wiring boards.

Abstract translation: 本发明涉及包括非织造增强材料和至少一种树脂材料的可激光粘合层材料。 本发明还包括使用本发明的粘合层来制造高密度多层印刷线路板的方法。

公开(公告)号：US6071836A

公开(公告)日：2000-06-06

申请号：US176788

申请日：1998-10-22

Applicant: Michael E. St. Lawrence ,  Doris I. Hand

Inventor： Michael E. St. Lawrence ,  Doris I. Hand

IPC: C08J5/24 ,  H05K1/02 ,  H05K1/03 ,  H05K1/16 ,  B32B7/00

CPC classification number: C08J5/24 ,  H05K1/032 ,  H05K1/0373 ,  C08J2309/00 ,  H05K1/0203 ,  H05K1/0366 ,  H05K1/162 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/029 ,  H05K2201/0293

Abstract: An electrical substrate material is presented comprising a thermosetting matrix of polybutadiene or polyisoprene in an amount of about 15 to about 50 volume %; a fabric reinforcement in an amount of 0 to about 40 volume %; a particulate filler, preferably ceramic, in an amount of from 0 to about 60 volume %; microballoons in an amount from 0 to about 60 volume %; and optionally a flame retardant. A peroxide cure initiator and/or crosslinking agent may optionally be added. The presence of a very high surface area particulate filler, preferably fumed silica, is also preferred, in that its presence results in a prepreg which has very little tackiness and can therefore be easily handled by operators. This low tackiness feature allows for the use of conventional automated layup processing, including foil cladding, using one or more known roll laminators. While the prepreg of this invention is tack-free enough to be handled relatively easily by hand, it is also tacky enough to be tacked to itself using a roll laminator (e.g., nip roller) at room temperature. The composition of this invention is particularly well suited for making electrical circuit substrates for microwave and digital circuits, typically in the form of the thermosetting composition being laminated onto one or both opposed surfaces to a metal conductive foil such as copper.

Abstract translation: 呈现的电气基材材料包含约15至约50体积％的量的聚丁二烯或聚异戊二烯的热固性基质; 织物增强物的量为0至约40体积％; 量为0至约60体积％的颗粒填料，优选陶瓷; 量为0至约60体积％的微球; 和任选的阻燃剂。 可以任选加入过氧化物固化引发剂和/或交联剂。 存在非常高的表面积的颗粒填料，优选热解法二氧化硅也是优选的，因为其存在导致预浸料，其具有非常小的粘性，因此可以容易地由操作者处理。 这种低粘性特征允许使用一种或多种已知的辊式层压机来使用常规的自动铺层处理，包括箔包层。 虽然本发明的预浸料无粘性足以用手相对容易地处理，但是它也是粘性足以在室温下使用辊式层压机（例如夹辊）粘合到其自身上。 本发明的组合物特别适用于制造用于微波和数字电路的电路基板，通常将热固性组合物的形式层压在诸如铜的金属导电箔的一个或两个相对的表面上。

公开(公告)号：US5858887A

公开(公告)日：1999-01-12

申请号：US690929

申请日：1996-08-01

Applicant: Michael E. St. Lawrence ,  Doris I. Hand

Inventor： Michael E. St. Lawrence ,  Doris I. Hand

IPC: C08J5/08 ,  C08J5/10 ,  C08J5/24 ,  C08K3/00 ,  C08K3/10 ,  C08K3/22 ,  C08K3/24 ,  C08K3/34 ,  C08K3/38 ,  C08K3/40 ,  C08K5/00 ,  C08K5/02 ,  C08K5/06 ,  C08K5/3417 ,  C08K7/00 ,  C08K7/02 ,  C08K7/14 ,  C08K7/16 ,  C08K7/20 ,  C08L9/00 ,  C08L21/00 ,  C08L27/18 ,  C08L47/00 ,  C08L53/00 ,  C08L53/02 ,  C08L77/10 ,  H01B3/30 ,  H05K1/02 ,  H05K1/03 ,  H05K1/16 ,  B32B7/00

CPC classification number: C08J5/24 ,  C08K3/22 ,  C08K3/34 ,  C08K3/40 ,  C08K5/0066 ,  C08K7/14 ,  C08L9/00 ,  H05K1/032 ,  H05K1/0366 ,  H05K1/0373 ,  C08J2309/00 ,  C08L15/00 ,  C08L23/04 ,  C08L53/00 ,  C08L7/00 ,  C08L9/02 ,  C08L9/06 ,  H05K1/0203 ,  H05K1/162 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/029 ,  H05K2201/0293 ,  Y10T442/2934 ,  Y10T442/2992 ,  Y10T442/3423 ,  Y10T442/3431 ,  Y10T442/3455

Abstract: An electrical substrate material is presented comprising a thermosetting matrix of polybutadiene or polyisoprene in an amount of 25 to 50 volume %; a woven glass fabric in an amount of 10 to 40 volume %; a particulate, preferably ceramic filler, in an amount of from 5 to 60 volume %; and a flame retardant. Importantly, the composition comprises only a single resin, i.e., polybutadiene or polyisoprene. A peroxide cure initiator and/or crosslinking agent may optionally be added. The presence of a very high surface area particulate filler, preferably fumed silica, is also preferred, in that its presence results in a prepreg which has very little tackiness and can therefore be easily handled by operators. This low tackiness feature allows for the use of conventional automated layup processing, including foil cladding, using one or more known roll laminators. While the prepreg of this invention is tack-free enough to be handled relatively easily by hand, it is also tacky enough to be tacked to itself using a roll laminator (e.g., nip roller) at room temperature. The composition of this invention is particularly well suited for making electrical circuit substrates for microwave and digital circuits, typically in the form of the thermosetting composition being laminated onto one or both opposed surfaces to a metal conductive foil such as copper.

Abstract translation: 提供的电气基材材料包含25至50体积％的聚丁二烯或聚异戊二烯的热固性基质; 10〜40体积％的编织玻璃织物; 一种颗粒状，优选陶瓷填料，其量为5-60体积％; 和阻燃剂。 重要的是，组合物仅包含单一树脂，即聚丁二烯或聚异戊二烯。 可以任选加入过氧化物固化引发剂和/或交联剂。 存在非常高的表面积的颗粒填料，优选热解法二氧化硅也是优选的，因为其存在导致预浸料，其具有非常小的粘性，因此可以容易地由操作者处理。 这种低粘性特征允许使用一种或多种已知的辊式层压机来使用常规的自动铺层处理，包括箔包层。 虽然本发明的预浸料无粘性足以用手相对容易地处理，但是它也是粘性足以在室温下使用辊式层压机（例如夹辊）粘合到其自身上。 本发明的组合物特别适用于制造用于微波和数字电路的电路基板，通常将热固性组合物的形式层压在诸如铜的金属导电箔的一个或两个相对的表面上。

公开(公告)号：US5127158A

公开(公告)日：1992-07-07

申请号：US575295

申请日：1990-08-30

Applicant: Akikazu Nakano

Inventor： Akikazu Nakano

IPC: H05K1/03 ,  H05K3/02

CPC classification number: H05K1/0373 ,  H05K1/0366 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0239 ,  H05K2201/0248 ,  H05K2201/0251 ,  H05K2201/09118 ,  H05K3/022 ,  Y10T29/4916

Abstract: A process for producing a printed circuit board includes steps, sequentially conducted of dispersing in water or organic solvent:(A) 95 to 20% by weight of a styrene polymer having a syndiotactic structure, (B) 5 to 80% by weight of a fibrous filler having a fiber length of 1 to 50 mm, and (C) 0.1 to 30 parts by weight of at least one of a binder and a binding fiber in proportion to 100 parts by weight of the total amount of the components (A) and (B), to make a slurry having a concentration of 0.5 to 100 g/l; separating the solids from the slurry and drying and molding them. Thereafter the solids are either subjected to melting with heating and pressure forming into the molded article, or they are impregnated with a thermoplastic resin which is then cured. Finally, a metal layer is provided on the molded article.

公开(公告)号：US4886699A

公开(公告)日：1989-12-12

申请号：US113533

申请日：1987-10-26

Applicant: James R. Carroll ,  Leon W. McGinnis ,  Terry L. Miller ,  Michael B. Norris

Inventor： James R. Carroll ,  Leon W. McGinnis ,  Terry L. Miller ,  Michael B. Norris

IPC: B32B17/04 ,  B32B5/26 ,  C08J5/08 ,  H05K1/03 ,  H05K1/16

CPC classification number: B32B5/26 ,  H05K1/036 ,  H05K1/167 ,  H05K2201/015 ,  H05K2201/0251 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/252 ,  Y10T428/254 ,  Y10T428/26 ,  Y10T428/31544 ,  Y10T442/3439

Abstract: A fluoropolymeric circuit laminate consisting of one or more layers of fluoropolymer impregnated woven glass cloth sandwiched between one or more layers of "random" microfiberglass reinforced fluoropolymer is presented. This composite of fluoropolymer, woven glass fabric and random glass microfibers may be clad on one or both outer surfaces with a suitable conductive material such as copper or certain known resistive foils. The fluoropolymer impregnated woven glass layer or layers will be nested between microfiberglass reinforced fluoropolymer layers to provide the outer surfaces of the circuit with smooth surfaces for fine line circuitry. The circuit laminate of the present invention exhibits good dimensional stability, smooth surfaces for fine line circuitry, good electrical properties, and strong foil and interlaminar adhesion properties.

公开(公告)号：US4675235A

公开(公告)日：1987-06-23

申请号：US817470

申请日：1986-01-09

Applicant: Shy-Hsien Wu

Inventor： Shy-Hsien Wu

IPC: B32B19/04 ,  H05K1/03 ,  B32B5/16

CPC classification number: B32B19/04 ,  H05K1/0366 ,  H05K2201/0245 ,  H05K2201/0251 ,  H05K2201/0293 ,  Y10T428/251 ,  Y10T428/2911 ,  Y10T428/31511 ,  Y10T428/31703

Abstract: Laminated synthetic mica articles are disclosed that have particular applicability as substrates in electronic components. The articles comprise a core of stacked and consolidated, synthetic mica sheets that are impregnated with resin, and a copper foil sealed to a face on the article. Adherence of the copper foil is enhanced by use of a micaceous facing layer and bonding sheet, both being resin-impregnated and the resin cure being advanced beyond the normal B-stage level before assembly. Insulation resistance is enhanced by providing an advanced resin coating on the copper foil before assembly. Use of a bismaleimide triazine and epoxy mixed resin is also disclosed whereby a transformation temperature (Tg) of about 200.degree. C. is obtained.

Abstract translation: 公开了具有作为电子部件中的基板的特殊适用性的复合合成云母制品。 制品包括用树脂浸渍的堆叠和固结的合成云母片的芯，以及密封在物品上的面的铜箔。 通过使用云母面层和粘合片，在组装之前树脂浸渍和树脂固化超过正常的B阶段水平，提高了铜箔的粘附性。 通过在组装之前在铜箔上提供先进的树脂涂层来提高绝缘电阻。 还公开了双马来酰亚胺三嗪和环氧树脂混合树脂的使用，由此获得约200℃的转变温度（Tg）。