公开(公告)号：US09697950B2

公开(公告)日：2017-07-04

申请号：US14696382

申请日：2015-04-25

Applicant: DELTA ELECTRONICS, INC.

Inventor： Jian-Hong Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

IPC: H01F27/29 ,  H05K1/14 ,  H05K7/02 ,  H01F27/28 ,  H01F17/00 ,  H01F17/04 ,  H02M3/00 ,  H05K3/34

CPC classification number: H01F27/29 ,  H01F17/0013 ,  H01F17/0033 ,  H01F27/2804 ,  H01F2017/048 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19105 ,  H02M3/00 ,  H05K1/141 ,  H05K1/145 ,  H05K3/3442 ,  H05K7/026 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/1053 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

Abstract: An electrical component is disclosed, the electrical component comprising: a magnetic body having a top surface, a bottom surface, wherein at least one first conductive through hole is formed from the top surface to bottom surface of the magnetic body; and a coil disposed in the magnetic body, wherein a first end of the coil is electrically connected to one of the at least one first conductive through hole.

公开(公告)号：US09538660B2

公开(公告)日：2017-01-03

申请号：US14594084

申请日：2015-01-10

Applicant: CYNTEC CO., LTD.

Inventor： Da-Jung Chen ,  Chun-Tiao Liu ,  Bau-Ru Lu

IPC: H05K5/00 ,  H05K1/18 ,  H01L23/64 ,  H01L25/16 ,  H01F27/24 ,  H01F27/29 ,  H01F27/40 ,  H01F27/02 ,  H05K3/34 ,  H01L23/24 ,  H01L23/31 ,  H01L23/552 ,  H01L23/00

CPC classification number: H05K1/181 ,  H01F27/022 ,  H01F27/027 ,  H01F27/24 ,  H01F27/29 ,  H01F27/40 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/552 ,  H01L23/645 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K3/3421 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10924 ,  Y02P70/611 ,  Y10T29/49146 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the second external electrode electrically connected to the second conductive element are both disposed on the top surface of the body or a first surface formed by the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound.

Abstract translation: 本发明公开了一种电子封装结构。 本体具有其上具有空腔的顶表面，第一导电元件设置在空腔中，并且第二导电元件设置在主体中。 电连接到第一导电元件的第一外部电极和与第二导电元件电连接的第二外部电极都设置在主体的顶表面上或由封装化合物的顶表面形成的第一表面和暴露部分 的未被封装化合物覆盖的身体的顶表面。

公开(公告)号：US09536798B2

公开(公告)日：2017-01-03

申请号：US13401853

申请日：2012-02-22

Applicant: Bau-Ru Lu ,  Jeng-Jen Li ,  Kun-Hong Shih ,  Kaipeng Chiang

Inventor： Bau-Ru Lu ,  Jeng-Jen Li ,  Kun-Hong Shih ,  Kaipeng Chiang

IPC: H05K1/03 ,  H01L23/13 ,  H05K1/02 ,  H05K1/18 ,  H01L23/498 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L23/49537 ,  H01L21/563 ,  H01L23/13 ,  H01L23/49506 ,  H01L23/49534 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15321 ,  H05K1/021 ,  H05K1/186 ,  Y10T29/49124 ,  H01L2924/00

Abstract: The invention discloses a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a recess is formed in the device carrier and a conductive element is disposed on the substrate, wherein the substrate is disposed on the device carrier and the conductive element is located in the recess of the device carrier. The conductive pattern in the substrate is electrically connected to the device carrier and I/O terminals of the first conductive element. The invention also discloses a method for manufacturing a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a portion of the conductive pattern in the substrate can be modified.

Abstract translation: 本发明公开了一种由装置载体和可修改基底的组合制成的封装结构。 在一个实施例中，在器件载体中形成凹部，并且导电元件设置在衬底上，其中衬底设置在器件载体上，并且导电元件位于器件载体的凹部中。 衬底中的导电图案电连接到器件载体和第一导电元件的I / O端子。 本发明还公开了一种用于制造由器件载体和可修改基底的组合制成的封装结构的方法。 在一个实施例中，衬底中的导电图案的一部分可以被修改。

公开(公告)号：US09481037B2

公开(公告)日：2016-11-01

申请号：US14507849

申请日：2014-10-07

Applicant: CYNTEC CO., LTD.

Inventor： Wen-Hsiung Liao ,  Roger Hsieh ,  Hideo Ikuta ,  Yueh-Lang Chen

IPC: B22F3/12 ,  H01F27/24 ,  H01F17/04 ,  H01F27/255 ,  H01F41/02 ,  H01F27/28 ,  H05K1/18 ,  B22F5/00 ,  B22F7/08 ,  H01F1/22 ,  H01F27/29

CPC classification number: H01F27/255 ,  B22F3/12 ,  B22F3/16 ,  B22F5/00 ,  B22F7/08 ,  H01F1/22 ,  H01F17/04 ,  H01F27/24 ,  H01F27/2823 ,  H01F27/292 ,  H01F27/32 ,  H01F41/0246 ,  H01F2017/048 ,  H05K1/18

Abstract: A method for manufacturing an electronic device, the method comprising: providing a conducting wire; forming a mixture with the conducting wire buried therein, wherein the mixture comprises: a first magnetic powder and a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder, and the Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder by a first hardness difference; and performing a molding process on the conducting wire and the mixture, wherein by means of the first hardness difference of the first magnetic powder and the second magnetic powder, the mixture and the conducting wire buried therein are combined to form an integral magnetic body at a temperature lower than the melting point of the conducting wire.

Abstract translation: 一种电子设备的制造方法，所述方法包括：提供导线; 与埋入其中的导线形成混合物，其中所述混合物包括：第一磁粉和第二磁粉，其中所述第一磁粉的平均粒径大于所述第二磁粉的平均粒径， 第一磁粉的维克氏硬度大于第二磁粉的维氏硬度第一硬度差; 对所述导线和所述混合物进行成型处理，其中，通过所述第一磁性粉末和所述第二磁性粉末的所述第一硬度差，将所述混合物和埋入其中的所述导线组合在一起形成一体磁性体 温度低于导线的熔点。

公开(公告)号：US09455081B2

公开(公告)日：2016-09-27

申请号：US14061774

申请日：2013-10-24

Applicant: CYNTEC CO., LTD.

Inventor： Shih-Hsien Tseng

IPC: H01F5/00 ,  H01F27/28 ,  H01F41/04

CPC classification number: H01F27/2804 ,  H01F41/046 ,  Y10T29/4902 ,  Y10T29/49069 ,  Y10T29/49071 ,  Y10T29/49073 ,  Y10T29/49075

Abstract: A method of producing an inductor with high inductance includes forming a removable polymer layer on a temporary carrier; forming a structure including a first coil, a second coil, and a dielectric layer on the removable polymer layer; forming a first magnetic glue layer on the removable polymer layer and the structure; removing the temporary carrier; and forming a second magnetic glue layer below the structure and the first magnetic glue layer.

公开(公告)号：US09420705B2

公开(公告)日：2016-08-16

申请号：US13965737

申请日：2013-08-13

Applicant: CYNTEC CO., LTD.

Inventor： Yi-Geng Li ,  Chung-Hsiung Wang ,  Hung-Ming Lin

IPC: H05K3/40 ,  H01L23/498 ,  H01L33/62 ,  H05K1/02 ,  H01L33/48 ,  H01L23/15 ,  H05K1/11 ,  H05K1/16 ,  H05K1/18

CPC classification number: H05K3/4061 ,  H01L23/15 ,  H01L23/49827 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H05K1/0293 ,  H05K1/116 ,  H05K1/167 ,  H05K1/181 ,  H05K2201/10106 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A current conducting element including a substrate, a through hole, an electrode layer and a conductor structure is provided. The through hole is disposed through the substrate and has a first opening. The electrode layer is disposed on the substrate. A portion of the first opening is exposed from the electrode layer. The conductor structure is disposed in the through hole and contacted with the electrode layer. The electrode layer and the conductor structure form a current conducting path.

Abstract translation: 提供了包括基板，通孔，电极层和导体结构的电流传导元件。 通孔设置在基板上并具有第一开口。 电极层设置在基板上。 第一开口的一部分从电极层露出。 导体结构设置在通孔中并与电极层接触。 电极层和导体结构形成电流传导路径。

公开(公告)号：US09381573B2

公开(公告)日：2016-07-05

申请号：US14294164

申请日：2014-06-03

Applicant: CYNTEC CO., LTD.

Inventor： Wen-Hsiung Liao ,  Roger Hsieh ,  Hideo Ikuta ,  Yueh-Lang Chen

IPC: H01F27/24 ,  B22F3/12 ,  H01F17/04 ,  H01F27/255 ,  H01F41/02 ,  H01F27/28 ,  H05K1/18 ,  B22F5/00 ,  B22F7/08 ,  H01F1/22 ,  H01F27/29

CPC classification number: H01F27/255 ,  B22F3/12 ,  B22F3/16 ,  B22F5/00 ,  B22F7/08 ,  H01F1/22 ,  H01F17/04 ,  H01F27/24 ,  H01F27/2823 ,  H01F27/292 ,  H01F27/32 ,  H01F41/0246 ,  H01F2017/048 ,  H05K1/18

Abstract: An electronic device comprising a first magnetic powder; a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder, wherein the ratio of the mean particle diameter of the first magnetic powder to the mean particle diameter of the second magnetic powder is greater than 2, and the first magnetic powder mixes with the second magnetic powder; and a conducting wire buried in the mixture of the first magnetic powder and the second magnetic powder; wherein the mixture of the first magnetic powder and the second magnetic powder and the conducting wire buried therein are combined to form an integral magnetic body at a temperature lower than the melting point of conducting wire.

Abstract translation: 一种电子设备，包括第一磁粉; 第二磁性粉末，其中所述第一磁性粉末的平均粒径大于所述第二磁性粉末的平均粒径，其中所述第一磁性粉末的平均粒径与所述第二磁性粉末的平均粒径之比 粉末大于2，第一磁粉与第二磁粉混合; 以及埋入第一磁粉和第二磁粉的混合物中的导线; 其中第一磁粉和第二磁粉的混合物和埋在其中的导线组合在一起，在低于导线熔点的温度下形成整体磁体。

公开(公告)号：US09305687B2

公开(公告)日：2016-04-05

申请号：US14292325

申请日：2014-05-30

Applicant: CYNTEC CO., LTD.

Inventor： Hsing-Kai Cheng ,  Yu-Jen Lin ,  Yen-Ting Lin ,  Ta-Wen Lo

IPC: H01C7/13 ,  G01R1/20 ,  H01C1/148 ,  H01C7/00

CPC classification number: H01C7/13 ,  G01R1/203 ,  H01C1/148 ,  H01C7/003

Abstract: A resistor device includes a resistor plate having opposite first and second surfaces; a first metal layer including first and second portions which are disposed on the first surface of the resistor plate at opposite first and second sides, respectively; and a second metal layer including a first sensing pad, a second sensing pad, a first current pad and a second current pad, separate from one another, wherein the first sensing pad and the first current pad are disposed on the first portion of the first metal layer and the second sensing pad and the second current pad are disposed on the second portion of the first metal layer. A protective layer is preferably provided, overlying the resistor plate and the first metal layer uncovered by the second metal layer.

Abstract translation: 电阻器装置包括具有相反的第一和第二表面的电阻器板; 第一金属层，包括第一和第二部分，其分别在相反的第一和第二侧设置在电阻器板的第一表面上; 以及第二金属层，其包括彼此分离的第一感测焊盘，第二感测焊盘，第一电流焊盘和第二电流焊盘，其中所述第一感测焊盘和所述第一电流焊盘设置在所述第一 金属层和第二感测焊盘和第二电流焊盘设置在第一金属层的第二部分上。 优选地设置保护层，覆盖电阻器板和未被第二金属层覆盖的第一金属层。

公开(公告)号：US09230728B2

公开(公告)日：2016-01-05

申请号：US14251105

申请日：2014-04-11

Applicant: CYNTEC CO., LTD.

Inventor： Chun-Tiao Liu ,  Lan-Chin Hsieh ,  Tsung-Chan Wu ,  Chi-Hsun Lee ,  Chih-Siang Chuang

IPC: H01F27/02 ,  H01F27/24 ,  H01F27/29 ,  H01F17/04 ,  H01F27/255 ,  H01F27/28

CPC classification number: H01F27/022 ,  H01F1/14741 ,  H01F1/14766 ,  H01F1/14791 ,  H01F17/045 ,  H01F27/255 ,  H01F27/2828 ,  H01F27/29

Abstract: A magnetic device includes a T-shaped magnetic core, a wire coil and a magnetic body. The T-shaped magnetic core includes a base and a pillar, and is made of an annealed soft magnetic metal material, a core loss PCL (mW/cm3) of the T-shaped magnetic core satisfying: 0.64×f0.95×Bm2.20≦PCL≦7.26×f1.41×Bm1.08, where f (kHz) represents a frequency of a magnetic field applied to the T-shaped magnetic core, and Bm (kGauss) represents the operating magnetic flux density of the magnetic field at the frequency. The magnetic body fully covers the pillar, any part of the base that is located above the bottom surface of the base, and any part of the wire coil that is located directly above the top surface of the base.

Abstract translation: 磁性装置包括T形磁芯，线圈和磁性体。 T型磁芯包括基座和支柱，由退火的软磁金属材料制成，T形磁芯的铁心损耗PCL（mW / cm3）满足：0.64×f0.95×Bm2。 20＆nlE; PCL＆nlE; 7.26×f1.41×Bm1.08，其中f（kHz）表示施加到T形磁芯的磁场的频率，Bm（kGauss）表示磁场的工作磁通密度 在频率。 磁体完全覆盖支柱，位于基座底面上方的基座的任何部分以及位于基座顶表面正上方的线圈的任何部分。

公开(公告)号：US20150348801A1

公开(公告)日：2015-12-03

申请号：US14821812

申请日：2015-08-10

Applicant: BAU-RU LU ,  DA-JUNG CHEN ,  YI-CHENG LIN

Inventor： BAU-RU LU ,  DA-JUNG CHEN ,  YI-CHENG LIN

IPC: H01L21/48 ,  H01L25/16 ,  H01L25/00 ,  H01L23/495 ,  H01L21/768

CPC classification number: H01L21/4825 ,  H01L21/4821 ,  H01L21/76877 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49527 ,  H01L23/49534 ,  H01L23/49558 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/82 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/215 ,  H01L2224/24011 ,  H01L2224/24247 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/49123 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A method for forming a conductive structure is disclosed, the method comprising the steps of: forming a metallic frame having a plurality of metal parts separated from each other; forming an insulating layer on the top surface of the plurality of metal parts; and forming a conductive pattern layer on the insulating layer for making electrical connections with at least one portion of the plurality of metal parts.

Abstract translation: 公开了一种形成导电结构的方法，所述方法包括以下步骤：形成具有彼此分离的多个金属部件的金属框架; 在所述多个金属部件的顶表面上形成绝缘层; 以及在所述绝缘层上形成导电图案层，用于与所述多个金属部件的至少一部分进行电连接。