公开(公告)号：US20110069463A1

公开(公告)日：2011-03-24

申请号：US12854030

申请日：2010-08-10

Applicant: Kong-Chen Chen

Inventor： Kong-Chen Chen

IPC: H05K7/00 ,  H05K3/30

CPC classification number: H05K1/145 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/0234 ,  H05K3/325 ,  H05K2201/0314 ,  H05K2201/10015 ,  H05K2201/10022

Abstract: A manufacturing method for manufacturing an electronic device is disclosed. Conductive elastomers comprising of various configurations and resistivity are coupled to contact pads of an electronic device. The conductive elastomers are also coupled to substrate contacts on a substrate, allowing the conductive elastomers to function as electrical connection from device to substrate as well as to embed one or more passive components at the contact pads of the electronic device.

Abstract translation: 公开了一种用于制造电子设备的制造方法。 包括各种结构和电阻率的导电弹性体耦合到电子设备的接触垫。 导电弹性体还耦合到衬底上的衬底触点，允许导电弹性体用作从器件到衬底的电连接，以及在电子器件的接触焊盘处嵌入一个或多个无源部件。

公开(公告)号：US20100323767A1

公开(公告)日：2010-12-23

申请号：US12745659

申请日：2009-06-11

Applicant: Jinya Tanaka ,  Masakazu Koizumi

Inventor： Jinya Tanaka ,  Masakazu Koizumi

IPC: H04M1/03 ,  B32B7/00 ,  B32B15/06 ,  B32B37/02 ,  B23K31/02

CPC classification number: H05K3/4015 ,  B32B7/02 ,  B32B7/10 ,  B32B15/06 ,  B32B25/02 ,  B32B25/042 ,  B32B25/14 ,  B32B2250/248 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2255/24 ,  B32B2255/28 ,  B32B2264/105 ,  B32B2264/108 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2307/212 ,  B32B2307/50 ,  B32B2457/00 ,  B32B2457/08 ,  H01R12/714 ,  H01R13/2414 ,  H05K3/341 ,  H05K2201/0314 ,  Y10T156/10 ,  Y10T428/12549 ,  Y10T428/24174

Abstract: A conductive rubber component 10 includes a laminate 9 in which conductive rubber layers 1 and insulating rubber layers 2 are laminated alternately in parallel, the conductive rubber layers 1 and the insulating rubber layers 2 are integrated at their boundaries by a cross-linking reaction, the conductive rubber layers 1 have a thickness of 0.01 mm to 1.0 mm and electrical conductivity such that the volume resistivity is 10−5 Ω·cm or more and 10 K Ω·cm or less, and the insulating rubber layers have a thickness of 0.01 mm to 1.0 mm and electrical insulation properties such that the volume resistivity is 1 M Ω·cm or more and 1016 Ω·cm or less. A solderable metal coating 3 is integrated with at least one surface of the laminate 9 that is perpendicular to the electrical conduction direction by the deposition of at least one selected from atoms and molecules. This conductive rubber component can have good compression load properties and good compression set properties, achieve a stable electric connection for a long period of time due to the good compression set properties, be soldered to a printed wiring board or the like because of the presence of the integrated metal coating, suppress the occurrence of burrs, reduce costs, and improve the production efficiency.

Abstract translation: 导电橡胶部件10包括交替地交替地层叠有导电性橡胶层1和绝缘橡胶层2的层叠体9，导电性橡胶层1和绝缘橡胶层2通过交联反应在其边界处一体化， 导电橡胶层1的厚度为0.01mm〜1.0mm，导电性使得体积电阻率为10-5Ω·cm·cm以上且10KΩ·cm以上·绝缘橡胶层的厚度为 0.01〜1.0mm，电绝缘性能使得体积电阻率为1MΩ/ cm以上，1016Ω·cm以下。 通过沉积选自原子和分子中的至少一种，可焊接金属涂层3与垂直于电导方向的层压体9的至少一个表面整合。 该导电性橡胶成分可以具有良好的压缩载荷特性和良好的压缩永久变形特性，由于良好的压缩永久变形特性，可长时间地实现稳定的电连接，焊接到印刷线路板等，因为存在 综合金属涂层，抑制毛刺的发生，降低成本，提高生产效率。

公开(公告)号：US20100315789A1

公开(公告)日：2010-12-16

申请号：US12446337

申请日：2007-10-05

Applicant: Junya Sato

Inventor： Junya Sato

IPC: H05K7/00 ,  H05K1/00

CPC classification number: H05K3/368 ,  H01R12/52 ,  H01R12/613 ,  H01R13/2414 ,  H05K2201/0314 ,  H05K2201/09018 ,  H05K2201/10378 ,  H05K2201/2009

Abstract: Provided is a circuit board device in which printed wiring boards 11, 12 are connected to each other electrically using a anisotropic conductive member 15 disposed between the printed wiring boards 11, 12. The anisotropic conductive member 15 comprises: an insulating elastic resin material 16; fine metal wires 17 having a middle portion embedded within the insulating elastic resin material 16 so as to connect corresponding connecting terminals of the printed wiring boards 11, 12; and resin layers 18 exhibiting a flexural rigidity greater than that of the insulating elastic resin material. An assembly composed of the printed wiring boards 11, 12 and anisotropic conductive member 15 is curved. The resin layers are shape-retaining resins for maintaining the curvature of respective ones of principal surfaces of the anisotropic conductive member 15 made to conform to curvature of the printed wiring boards 11, 12.

Abstract translation: 提供了一种电路板装置，其中印刷线路板11,12使用布置在印刷线路板11,12之间的各向异性导电构件15彼此电连接。各向异性导电构件15包括：绝缘弹性树脂材料16; 精细金属线17，其具有嵌入在绝缘弹性树脂材料16内的中间部分，以连接印刷电路板11,12的相应的连接端子; 树脂层18的弯曲刚度大于绝缘弹性树脂材料的弯曲刚度。 由印刷电路板11,12和各向异性导电构件15组成的组件是弯曲的。 树脂层是形状保持树脂，用于保持使各向异性导电构件15的各个主表面的曲率相应于印刷线路板11,12的曲率。

公开(公告)号：US20100295177A1

公开(公告)日：2010-11-25

申请号：US12863941

申请日：2009-01-13

Applicant: Akira Ouchi

Inventor： Akira Ouchi

IPC: H01L23/48 ,  H01L21/50 ,  H05K1/11

CPC classification number: H05K3/3436 ,  H01L21/32 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49866 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/1147 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75252 ,  H01L2224/81011 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K3/321 ,  H05K3/4007 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/10992 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/05442 ,  H01L2224/81805 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: In an electronic component mounting structure, a semiconductor element (an electronic component) provided with an electrode pad and a board provide with an electrode pad corresponding to the electrode pad are connected via a conductive material portion. On a surface of the board, there is formed solder resist having an opening regulating an area of the electrode pad. The conductive material portion is formed to protrude from a surface of the solder resist. An elastic coefficient of the conductive material portion is lower than that of the solder resist. A solder bump and the conductive material portion are connected via a metal layer. The conductive material portion is formed to have an area larger than that of the opening of the solder resist. An edge of the conductive material portion is adhered to a portion of the surface of the solder resist. Thus, in a case of mounting an electronic component on a board by flip-chip connection, a reliability of connection can be secured.

Abstract translation: 在电子部件安装结构中，设置有电极焊盘的半导体元件（电子部件）和提供与电极焊盘对应的电极焊盘的基板经由导电材料部分连接。 在板的表面上形成有阻挡电极，该阻焊层具有调节电极焊盘区域的开口。 导电材料部分形成为从阻焊剂的表面突出。 导电材料部分的弹性系数低于阻焊剂的弹性系数。 焊料凸块和导电材料部分经由金属层连接。 导电材料部分形成为具有大于阻焊剂开口面积的面积。 导电材料部分的边缘粘附到阻焊剂表面的一部分上。 因此，在通过倒装芯片连接将电子部件安装在电路板上的情况下，可以确保连接的可靠性。

公开(公告)号：US20100277931A1

公开(公告)日：2010-11-04

申请号：US12435201

申请日：2009-05-04

Applicant: Stev B. Ham ,  Thomas J. Sweet ,  Eric W. Doerflinger

Inventor： Stev B. Ham ,  Thomas J. Sweet ,  Eric W. Doerflinger

IPC: F21V19/00 ,  H01L33/00 ,  H01J9/24

CPC classification number: H05K3/326 ,  F21S43/14 ,  H05K1/0284 ,  H05K1/095 ,  H05K3/04 ,  H05K3/101 ,  H05K3/1258 ,  H05K3/321 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2201/10106 ,  H05K2201/1059 ,  H05K2203/0113 ,  H05K2203/175

Abstract: A lamp unit is provided having polymer electrical conductors adhered to a non-conductive substrate in which adjacent conductors present a gap therebetween for securing a light radiating device within the gap the conductors of one embodiment having raised abutments formed in the conductors at the gap for capture of a light radiating device therebetween, such as an LED in said gap to hold the light device between the abutments to secure the light device in the lamp and power the light device.

Abstract translation: 提供一种灯单元，其具有粘附到非导电基底上的聚合物电导体，其中相邻的导体之间具有间隙，用于将光辐射装置固定在间隙内，一个实施例的导体在导体间隙处形成具有凸起的邻接位置用于捕获 其间的光辐射装置，例如在所述间隙中的LED，以将光装置保持在基台之间，以将灯装置固定在灯中并为灯装置供电。

公开(公告)号：US07717627B2

公开(公告)日：2010-05-18

申请号：US10852991

申请日：2004-05-25

Applicant: Donald A. Ice ,  Dev Kumar ,  Rudy Hofmeister

Inventor： Donald A. Ice ,  Dev Kumar ,  Rudy Hofmeister

IPC: G02B6/36

CPC classification number: H05K3/325 ,  G02B6/4201 ,  G02B6/4246 ,  G02B6/428 ,  G02B6/4284 ,  H05K2201/0314 ,  H05K2201/10121 ,  H05K2201/10446

Abstract: A transceiver module is provided that includes an optical subassembly having an extension with traces corresponding to traces defined on an associated transceiver substrate. A connector element including a flexible, non-electrically conductive substrate within which is disposed an array of conductors is placed between overlapping portions of the extension and the transceiver substrate so that upper ends of some of the conductors contact the traces of the extension, while lower ends of those same conductors contact the corresponding traces of the transceiver substrate. In this way, the connector element provides electrical communication between the optical subassembly and transceiver substrate, while also accommodating misalignment that may be present, or develop, in the transceiver module components.

Abstract translation: 提供了一种收发器模块，其包括光学子组件，其具有对应于在相关收发器基板上限定的走线的走线的延伸部分。 包括柔性非导电基底的连接器元件被放置在导体阵列的内部，放置在延伸部和收发器基底的重叠部分之间，使得一些导体的上端与延伸部的迹线接触，而较低的 这些相同导体的端部与收发器基板的相应迹线接触。 以这种方式，连接器元件提供光学子组件和收发器基板之间的电连通，同时还适应在收发器模块组件中可能存在或发展的未对准。

公开(公告)号：US20100091069A1

公开(公告)日：2010-04-15

申请号：US12642832

申请日：2009-12-20

Applicant: Kia Silverbrook ,  Norman Michael Berry ,  Garry Raymond Jackson ,  Akira Nakazawa

Inventor： Kia Silverbrook ,  Norman Michael Berry ,  Garry Raymond Jackson ,  Akira Nakazawa

IPC: B41J2/14

CPC classification number: H05K1/142 ,  B41J2/155 ,  B41J2002/14362 ,  B41J2002/14419 ,  B41J2002/14435 ,  B41J2002/14491 ,  B41J2202/19 ,  B41J2202/20 ,  H05K3/0064 ,  H05K2201/0314 ,  H05K2201/09845

Abstract: The invention provides for a printhead assembly that has a number of modular PCBs and a number of printhead integrated circuits (ICs). Each of the printhead IC's is respectively connected to one of the modular PCBs for operative control. Modular supports in the assembly define a raised portion and a recessed portion at an end thereof. Each PCB has electrical connecting strips which operatively overlie the respective recessed portions. At least one connecting member operatively connects respective PCBs to each other. Each connecting member has a series of parallel spaced conducting strips. The member is shaped and configured for fitment into a cavity defined by the raised and recessed portions of two abutting supports to connect the connecting strips of two PCBs via the conducting strips. The assembly also has a printer controller configured to synchronize operation of the respective PCBs during printing.

Abstract translation: 本发明提供一种具有多个模块化PCB和多个打印头集成电路（IC）的打印头组件。 每个打印头IC分别连接到模块化PCB之一用于操作控制。 组件中的模块化支撑件在其一端限定凸起部分和凹陷部分。 每个PCB具有可操作地覆盖相应凹部的电连接条。 至少一个连接构件可操作地将相应的PCB彼此连接。 每个连接构件具有一系列平行隔开的导电条。 该构件的形状和构造用于装配到由两个邻接支撑件的凸起和凹陷部分限定的空腔中，以经由导电条连接两个PCB的连接条。 组件还具有被配置为在打印期间使各个PCB的操作同步的打印机控制器。

公开(公告)号：US07671477B2

公开(公告)日：2010-03-02

申请号：US11566885

申请日：2006-12-05

Applicant: Hironobu Ikeda

Inventor： Hironobu Ikeda

IPC: H01L23/48 ,  H01L23/52

CPC classification number: H01L24/32 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/14 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2224/05571 ,  H01L2224/056 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/81011 ,  H01L2224/81101 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/351 ,  H01R12/57 ,  H01R13/2414 ,  H05K3/3436 ,  H05K2201/0314 ,  H05K2201/10378 ,  Y02P70/613 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2224/05099

Abstract: A device comprises a plurality of first electrodes which are arranged on a surface of a substrate at predetermined space, a component which has an elasticity and a longitudinal axis, a plurality of conductors which are applied to a surface of said component at predetermined space, and each of which are connected to a corresponding one of said first electrodes, and a plurality of second electrodes which are arranged on a surface of a electronic component at predetermined space, and each of which are connected to a corresponding one of said conductors.

Abstract translation: 一种器件包括：多个第一电极，其布置在基板的预定空间的表面上，具有弹性和纵向轴线的部件;多个导体，其以预定空间施加到所述部件的表面;以及 每个连接到所述第一电极中的相应一个，以及以预定空间布置在电子部件的表面上的多个第二电极，并且每个连接到相应的一个所述导体。

公开(公告)号：US20100024211A1

公开(公告)日：2010-02-04

申请号：US12584629

申请日：2009-09-08

Applicant: James J. Levante ,  Dennis Johnson ,  Tom Sahakian

Inventor： James J. Levante ,  Dennis Johnson ,  Tom Sahakian

IPC: H05K3/00

CPC classification number: H01R12/57 ,  H01R12/52 ,  H01R13/2414 ,  H05K3/326 ,  H05K3/42 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/09827 ,  H05K2201/10378 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49153 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49218 ,  Y10T29/49222

Abstract: A conductive elastomeric and mechanical pin and contact system for creation of a Elastromechanical Connector (1) that combines Mechanical Pins, an Insulator Array with Conductive Elastromeric Memory Material. This combination provides a low cost, high density, reliable, reusable electronic interconnect system. This system can be used in place of most connector systems in use today. It replaces any connector that uses pins and sockets and also supports the fine conductor pitch required in the semiconductor business like Ball Grid Array (BGA) Sockets and related devises. The inventive device includes mechanical pins (2), installed in an insulator (3), each mechanical pin is topped with conductive elastromeric compound (4). A mechanical pin is used for each connection point, the insulator positions the mechanical pins in an array pattern appropriate to the interconnection requirement. A conductive elastromeric compound is added to each metal pin to create the Z axis electrical coplanality to the mating unit. This connector will mate between printed circuit boards, packaged electronic assembles, BGAs or LGA type products, harnesses or cables without the need of solder or pins and sockets. Eliminating solder or pins and sockets reduces the pitch between connections. Mechanical pins are plated drawn, formed or machined conductive metal alloys. Insulator is molded or machined out of engineered plastic examples being, but not limited to, FR-4, Ultem®, Polyimide, Torlon®. Electrically conductive elastromeric compounds made up of flexible silicone and rubbers with conductive compounds added.

Abstract translation: 用于产生弹性机械连接器（1）的导电弹性体和机械销和接触系统，其结合机械销，绝缘体阵列与导电弹性记忆材料。 这种组合提供了低成本，高密度，可靠，可重复使用的电子互连系统。 该系统可用于代替目前使用的大多数连接器系统。 它替代了使用引脚和插座的任何连接器，并且还支持半导体业务中所需的精细导体间距，如球栅阵列（BGA）插座和相关设计。 本发明的装置包括安装在绝缘体（3）中的机械销（2），每个机械销顶部带有导电弹性体化合物（4）。 对于每个连接点使用机械销，绝缘体将机械销定位成适合于互连要求的阵列图案。 向每个金属销添加导电弹性体化合物以产生与配合单元的Z轴电气共同性。 该连接器将在印刷电路板，封装的电子组件，BGA或LGA型产品，线束或电缆之间配合，而不需要焊料或针脚和插座。 消除焊料或引脚和插座可减少连接间距。 机械销是电镀拉制，成型或加工的导电金属合金。 绝缘体由工程塑料实例模制或加工而成，但不限于FR-4，聚酰亚胺，Torlon（R）。 导电弹性体化合物由柔性硅胶和橡胶与导电化合物相加而成。

公开(公告)号：US20100018054A1

公开(公告)日：2010-01-28

申请号：US12586136

申请日：2009-09-16

Applicant: James J. Levante ,  Dennis Johnson ,  Tom Sahakian

Inventor： James J. Levante ,  Dennis Johnson ,  Tom Sahakian

IPC: H01R43/04

CPC classification number: H01R12/57 ,  H01R12/52 ,  H01R13/2414 ,  H05K3/326 ,  H05K3/42 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/09827 ,  H05K2201/10378 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49153 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49218 ,  Y10T29/49222

Abstract: A conductive elastomeric and mechanical pin and contact system for creation of a Elastromechanical Connector (1) that combines Mechanical Pins, an Insulator Array with Conductive Elastromeric Memory Material. This combination provides a low cost, high density, reliable, reusable electronic interconnect system. This system can be used in place of most connector systems in use today. It replaces any connector that uses pins and sockets and also supports the fine conductor pitch required in the semiconductor business like Ball Grid Array (BGA) Sockets and related devises. The inventive device includes mechanical pins (2), installed in an insulator (3), each mechanical pin is topped with conductive elastromeric compound (4). A mechanical pin is used for each connection point, the insulator positions the mechanical pins in an array pattern appropriate to the interconnection requirement. A conductive elastromeric compound is added to each metal pin to create the Z axis electrical coplanality to the mating unit. This connector will mate between printed circuit boards, packaged electronic assembles, BGAs or LGA type products, harnesses or cables without the need of solder or pins and sockets. Eliminating solder or pins and sockets reduces the pitch between connections. Mechanical pins are plated drawn, formed or machined conductive metal alloys. Insulator is molded or machined out of engineered plastic examples being, but not limited to, FR-4, Ultem®, Polyimide, Torlon®. Electrically conductive elastromeric compounds made up of flexible silicone and rubbers with conductive compounds added.

Abstract translation: 用于产生弹性机械连接器（1）的导电弹性体和机械销和接触系统，其结合机械销，绝缘体阵列与导电弹性记忆材料。 这种组合提供了低成本，高密度，可靠，可重复使用的电子互连系统。 该系统可用于代替目前使用的大多数连接器系统。 它替代了使用引脚和插座的任何连接器，并且还支持半导体业务中所需的精细导体间距，如球栅阵列（BGA）插座和相关设计。 本发明的装置包括安装在绝缘体（3）中的机械销（2），每个机械销顶部带有导电弹性体化合物（4）。 对于每个连接点使用机械销，绝缘体将机械销定位成适合于互连要求的阵列图案。 向每个金属销添加导电弹性体化合物以产生与配合单元的Z轴电气共同性。 该连接器将在印刷电路板，封装的电子组件，BGA或LGA型产品，线束或电缆之间配合，而不需要焊料或针脚和插座。 消除焊料或引脚和插座可减少连接间距。 机械销是电镀拉制，成型或加工的导电金属合金。 绝缘体由工程塑料实例模制或加工而成，但不限于FR-4，聚酰亚胺，Torlon（R）。 导电弹性体化合物由柔性硅胶和橡胶与导电化合物相加而成。