公开(公告)号：US20070262443A1

公开(公告)日：2007-11-15

申请号：US11575751

申请日：2005-09-07

Applicant: Christian Val ,  Olivier Lignier ,  Regis Bocage

Inventor： Christian Val ,  Olivier Lignier ,  Regis Bocage

IPC: H01L23/34

CPC classification number: H01L23/3128 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2224/49113 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0201 ,  H05K1/111 ,  H05K1/112 ,  H05K3/4641 ,  H05K2201/09718 ,  H05K2201/09745 ,  H05K2201/09781 ,  H05K2203/165 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present invention relates to an electronic device incorporating a heat distributor. It applies more particularly to devices of the plastic package type, with one or more levels of components. According to the invention, the electronic device, for example of the package type, is provided for its external connection with pads distributed over a connection surface. It includes a thermally conducting plate lying parallel to said connection surface and having a nonuniform structure making it possible, when the device is exposed to a given external temperature, to supply a controlled amount of heat to each external connection pad according to its position on the connection surface. If the device is a package comprising a support of the printed circuit type, the conducting plate will advantageously form an internal layer of said support.

Abstract translation: 本发明涉及一种并入热分配器的电子设备。 它更具体地应用于塑料封装类型的器件，具有一个或多个级别的部件。 根据本发明，提供了例如封装类型的电子设备，用于其与分布在连接表面上的焊盘的外部连接。 它包括平行于所述连接表面并且具有不均匀结构的导热板，使得当设备暴露于给定的外部温度时，可以根据其在位置上的位置向每个外部连接垫提供受控量的热量 连接面。 如果设备是包括印刷电路类型的支撑体的封装，导电板将有利地形成所述支撑件的内层。

公开(公告)号：US07292055B2

公开(公告)日：2007-11-06

申请号：US11110901

申请日：2005-04-21

Applicant: Frank D. Egitto ,  How T. Lin

Inventor： Frank D. Egitto ,  How T. Lin

IPC: G01R31/02

CPC classification number: H05K3/4007 ,  G01R1/06711 ,  G01R1/0735 ,  H05K1/0393 ,  H05K3/365 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09627 ,  H05K2201/09745 ,  H05K2201/10378

Abstract: An interposer including at least two dielectric layers bonded to each other, sandwiching a plurality of conductors there-between. The conductors each electrically couple a respective pair of opposed electrical contacts formed within and protruding from openings with the dielectric layers.

Abstract translation: 一种插入器，包括彼此结合的至少两个介电层，在其间夹有多个导体。 这些导体各自电连接形成在电介质层的开口内并在其中突出的相应的一对相对的电触点。

公开(公告)号：US20070249191A1

公开(公告)日：2007-10-25

申请号：US11789094

申请日：2007-04-23

Applicant: Zheng Yan

Inventor： Zheng Yan

IPC: H05K1/00

CPC classification number: H05K1/117 ,  H05K3/323 ,  H05K3/3405 ,  H05K2201/0373 ,  H05K2201/09381 ,  H05K2201/0969 ,  H05K2201/09745

Abstract: An exemplary printed circuit board (200) has a substrate (210); a circuit (230) on the substrate; and a plurality of pins (220) peripherally located on the substrate, electrically connected to the circuit. The printed circuit board further has a plurality of accommodating spaces (223) formed at the plurality of pins.

Abstract translation: 示例性印刷电路板（200）具有基板（210）; 基板上的电路（230）; 以及外围地位于所述基板上的多个引脚（220），电连接到所述电路。 印刷电路板还具有形成在多个销上的多个容纳空间（223）。

公开(公告)号：US07273806B2

公开(公告)日：2007-09-25

申请号：US10905013

申请日：2004-12-09

Applicant: Robert A. Groves ,  Peter A. Gruber ,  Kevin S. Petrarca ,  Richard P. Volant ,  George F. Walker

Inventor： Robert A. Groves ,  Peter A. Gruber ,  Kevin S. Petrarca ,  Richard P. Volant ,  George F. Walker

IPC: H01L21/44

CPC classification number: H05K3/3468 ,  G01R1/07314 ,  G01R3/00 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01058 ,  H01L2924/01066 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/19042 ,  H05K3/325 ,  H05K2201/09745 ,  H05K2201/10734 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/128 ,  H05K2203/162 ,  H05K2203/167 ,  H01L2224/0401

Abstract: Methods of forming a conductive structure on a substrate prior to packaging, and a test probe structure generated according to the method, are disclosed. The conductive structure includes a high aspect ratio structure formed by injected molded solder. The invention can be applied to form passive elements and interconnects on a conventional semiconductor substrate after the typical BEOL, and prior to packaging. The method may provide better electromigration characteristics, lower resistivity, and higher Q factors for conductive structures. In addition, the method is backwardly compatible and customizable.

Abstract translation: 公开了在封装之前在基板上形成导电结构的方法和根据该方法生成的测试探针结构。 导电结构包括通过注射成型的焊料形成的高纵横比结构。 本发明可以应用于在典型的BEOL之后以及在封装之前在常规半导体衬底上形成无源元件和互连。 该方法可以为导电结构提供更好的电迁移特性，较低的电阻率和更高的Q因子。 此外，该方法可以向后兼容并可定制。

公开(公告)号：US07255586B2

公开(公告)日：2007-08-14

申请号：US11358121

申请日：2006-02-22

Applicant: Yoshikatsu Okada

Inventor： Yoshikatsu Okada

IPC: H01R13/625

CPC classification number: H01R13/20 ,  H01R12/721 ,  H01R13/6597 ,  H05K1/117 ,  H05K3/325 ,  H05K3/42 ,  H05K2201/09036 ,  H05K2201/09481 ,  H05K2201/09745

Abstract: A connector device includes a plug including a plurality of plug terminals and a socket including a plurality of socket terminals. Ground plug terminals each have a recess on the contact surface, and ground socket terminals each have a dimple on the contact surface thereof. The dimple of the ground socket terminal is elastically urged to the recess of the ground plug terminal for obtaining a firm electric contact between the ground plug terminal and the ground socket terminal.

Abstract translation: 连接器装置包括具有多个插头端子的插头和包括多个插座端子的插座。 接地插头端子各自在接触表面上具有凹部，并且接地插座端子在其接触表面上都具有凹坑。 接地插座端子的凹坑弹性地推动到接地插头端子的凹部，以获得接地插头端子和接地插座端子之间的牢固的电接触。

公开(公告)号：US20070164438A1

公开(公告)日：2007-07-19

申请号：US11715624

申请日：2007-03-08

Applicant: Jiun Sir ,  Eng Goh

Inventor： Jiun Sir ,  Eng Goh

IPC: H01L23/52

CPC classification number: H01L23/49827 ,  H01L21/486 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H05K1/115 ,  H05K3/423 ,  H05K2201/096 ,  H05K2201/09745 ,  H05K2201/09845 ,  H05K2203/0733 ,  Y10T29/49124 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Embodiments include interconnect of electrically conductive material with a contact surface, and a dielectric layer overlying the contact surface with a trench and via in the dielectric layer, the via extending to the contact surface. An interlock material is in the via with an interlock opening extending through the interlock material and into the interconnect. A layer of electroless material is on the base of the trench and the surfaces of the via, interlock material, and interlock opening. An subsequent interconnect is formed on the electroless material, in the trench, via, and interlock openings. The structure can be repeated to form a stack or column of interconnects that resist delamination.

Abstract translation: 实施例包括导电材料与接触表面的互连以及覆盖接触表面的电介质层，其中沟槽和电介质层中的通孔延伸到接触表面。 互锁材料在通孔中，具有延伸穿过互锁材料并进入互连件的互锁开口。 无电解材料层位于沟槽的底部和通孔，互锁材料和互锁开口的表面上。 在无电解材料，沟槽，通孔和互锁开口中形成随后的互连。 可以重复该结构以形成抵抗分层的互连的堆叠或列。

公开(公告)号：US20070111597A1

公开(公告)日：2007-05-17

申请号：US11478691

申请日：2006-07-03

Applicant: Takahiro Kondou ,  Kiyoshi Sato ,  Mitsuru Kobayashi ,  Satoshi Moriyama

Inventor： Takahiro Kondou ,  Kiyoshi Sato ,  Mitsuru Kobayashi ,  Satoshi Moriyama

IPC: H01R9/05

CPC classification number: H01R24/44 ,  H01R9/0515 ,  H01R13/6658 ,  H01R2103/00 ,  H05K3/3405 ,  H05K3/3484 ,  H05K2201/09745 ,  H05K2201/099 ,  H05K2201/09909 ,  H05K2201/10287 ,  H05K2201/10356 ,  H05K2203/0191 ,  H05K2203/0195 ,  H05K2203/043 ,  H05K2203/0545

Abstract: A cable connector includes a contact assembly including an electrical insulating block part which is configured to incorporate plural signal contacts; and a relay wiring substrate mounted to a back of the contact assembly. The relay wiring substrate includes, on a surface, a contact connecting pad electrically connected to one of the signal contacts, a wiring connecting pad, and a wiring pattern connecting the contact connecting pad and the wiring connecting pad. The relay wiring substrate further includes a ground layer inside the relay wiring substrate. The cable connector further includes a cable connected to the relay wiring substrate by electrically connecting an end of a wiring with the wiring connecting pad. The relay wiring substrate further includes a ground pattern for matching impedance inside the relay wiring substrate.

Abstract translation: 电缆连接器包括接触组件，其包括电绝缘块部分，其被配置成结合多个信号触头; 以及安装到所述接触组件的背面的中继布线基板。 所述中继布线基板在表面上包括电连接到所述信号触点之一的接触连接焊盘，布线连接焊盘和连接所述接触连接焊盘和所述布线连接焊盘的布线图案。 继电器配线基板还包括在中继布线基板内的接地层。 电缆连接器还包括通过将布线的端部与布线连接垫电连接而连接到中继布线基板的电缆。 继电器布线基板还包括用于匹配中继布线基板内的阻抗的接地图案。

公开(公告)号：US20070107930A1

公开(公告)日：2007-05-17

申请号：US11589905

申请日：2006-10-31

Applicant: Tatsunori Yamamoto

Inventor： Tatsunori Yamamoto

IPC: H05K1/03

CPC classification number: H05K3/281 ,  H05K1/111 ,  H05K3/243 ,  H05K3/386 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/09736 ,  H05K2201/09745 ,  H05K2203/0369

Abstract: An embodiment of a printed circuit board according to the present invention is provided with an insulating layer, a conductive layer that is laminated on the insulating layer and that has a connecting portion and a circuit pattern portion formed connected to the connecting portion, and a film cover layer that covers the insulating layer and the conductive layer via an adhesive layer and that has an opening for connecting a mounted component to the connecting portion. The circuit pattern portion is provided with a recessed portion that is concave with respect to the connecting portion.

Abstract translation: 根据本发明的印刷电路板的一个实施例设置有绝缘层，层压在绝缘层上的导电层，并且具有连接部分和连接到连接部分的电路图形部分，以及膜 覆盖层，其通过粘合剂层覆盖绝缘层和导电层，并且具有用于将安装部件连接到连接部分的开口。 电路图形部分设置有相对于连接部分凹入的凹部。

公开(公告)号：US20070102816A1

公开(公告)日：2007-05-10

申请号：US11431703

申请日：2006-05-11

Applicant: Shin Kim

Inventor： Shin Kim

IPC: H01L23/48

CPC classification number: H05K3/3436 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/4824 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/1815 ,  H05K2201/09745 ,  H05K2201/10977 ,  H05K2203/0465 ,  Y02P70/613 ,  H01L2224/05599

Abstract: A board structure, a ball grid array (BGA) package and method thereof and a solder ball and method thereof. The example solder ball may include a solder portion and a grooved connection portion, formed through a partitioning process, configured to fit a corresponding protruding portion on a board. The example BGA package may include a plurality of the example solder balls. The example board structure may include the example BGA package connected to the board via the grooved connection portions and the protruding portions.

Abstract translation: 板结构，球栅阵列（BGA）封装及其方法和焊球及其方法。 示例性焊球可以包括通过分隔工艺形成的焊接部分和带槽的连接部分，其被配置为将相应的突出部分装配在电路板上。 示例性BGA封装可以包括多个示例性焊球。 示例板结构可以包括通过带槽连接部分和突出部分连接到板的示例性BGA封装。

公开(公告)号：US20070018311A1

公开(公告)日：2007-01-25

申请号：US11432743

申请日：2006-05-10

Applicant: Jen-Tsorng Chang

Inventor： Jen-Tsorng Chang

IPC: H01L23/34

CPC classification number: H05K1/0203 ,  H05K1/053 ,  H05K2201/09054 ,  H05K2201/09745 ,  H05K2201/10106

Abstract: A circuit board comprises a substrate, a plurality of circuit islands, and a plurality of trenches. The circuit islands are formed on the substrate configured for mounting heat-generating devices thereon. The trenches are defined in the substrate configured for increasing a heat dissipation surface area of the substrate. Each of the trenches is arranged between each pair of adjacent circuit islands. A light source device comprises the above circuit board and a plurality of light-emitting diodes is mounted on the circuit island of the circuit board.

Abstract translation: 电路板包括衬底，多个电路岛和多个沟槽。 电路岛形成在其上配置用于安装发热装置的基板上。 沟槽被限定在衬底中，用于增加衬底的散热表面积。 每个沟槽布置在每对相邻的电路岛之间。 光源装置包括上述电路板，多个发光二极管安装在电路板的电路岛上。