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29 条记录 (耗时 0.058 秒)

    Structure and method of forming capped chips
    24.
    发明申请
    Structure and method of forming capped chips 有权
    形成封盖芯片的结构和方法

    公开(公告)号：US20060033189A1

    公开(公告)日：2006-02-16

    申请号：US11201726

    申请日：2005-08-11

    申请人： Belgacem Haba ,  Masud Beroz ,  Glenn Urbish ,  David Tuckerman

    发明人： Belgacem Haba ,  Masud Beroz ,  Glenn Urbish ,  David Tuckerman

    IPC分类号： H01L23/02

    CPC分类号： B81B7/007 ,  H03H3/02 ,  H03H9/0547 ,  H03H9/059 ,  H03H9/1057 ,  H03H9/1092

    摘要： As disclosed herein, structures and methods are provided for forming capped chips. As provided by the disclosed method, a metal base pattern is formed on a chip insulated from wiring of the chip, and a cap is formed including a metal. The cap is joined to the metal base pattern on the chip to form the capped chip. In one embodiment, a front surface of the chip is exposed which extends from a contact of the chip to an edge of the chip. In another embodiment, a conductive connection is formed to the contact, the conductive connection extending from the contact to a terminal at an exposed plane above the front surface of the chip.

    摘要翻译： 如本文所公开的，提供了用于形成加盖芯片的结构和方法。 通过所公开的方法提供，在与芯片的布线绝缘的芯片上形成金属基底图案，并且形成包括金属的盖。 盖子连接到芯片上的金属基底图案以形成封盖的芯片。 在一个实施例中，芯片的前表面被暴露，其从芯片的触点延伸到芯片的边缘。 在另一个实施例中，导电连接形成于接触件，导电连接件从接触件延伸到芯片前表面上的暴露平面处的端子。

    Micro pin grid array with pin motion isolation
    25.
    发明申请
    Micro pin grid array with pin motion isolation 失效
    微针栅格阵列，具有引脚运动隔离

    公开(公告)号：US20050173805A1

    公开(公告)日：2005-08-11

    申请号：US10985119

    申请日：2004-11-10

    申请人： Philip Damberg ,  Belgacem Haba ,  David Tuckerman ,  Teck-Gyu Kang

    发明人： Philip Damberg ,  Belgacem Haba ,  David Tuckerman ,  Teck-Gyu Kang

    IPC分类号： H01L21/44 ,  H01L23/48 ,  H01L23/498 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34

    CPC分类号： H01L23/4985 ,  H01L23/49811 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K1/118 ,  H05K3/326 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/10674 ,  H01L2924/00

    摘要： A microelectronic package includes a microelectronic element having faces and contacts, a flexible substrate overlying and spaced from a first face of the microelectronic element, and a plurality of conductive terminals exposed at a surface of the flexible substrate. The conductive terminals are electrically interconnected with the microelectronic element and the flexible substrate includes a gap extending at least partially around at least one of the conductive terminals. In certain embodiments, the package includes a support layer, such as a compliant layer, disposed between the first face of the microelectronic element and the flexible substrate. In other embodiments, the support layer includes at least one opening that is at least partially aligned with one of the conductive terminals.

    摘要翻译： 微电子封装包括具有面和触点的微电子元件，覆盖并与微电子元件的第一面间隔开的柔性基板，以及暴露在柔性基板的表面处的多个导电端子。 导电端子与微电子元件电互连，并且柔性基板包括至少部分地围绕至少一个导电端子延伸的间隙。 在某些实施例中，封装包括设置在微电子元件的第一面和柔性基板之间的支撑层，例如顺应层。 在其他实施例中，支撑层包括至少一个与导电端子之一至少部分对准的开口。