公开(公告)号：US06712257B2

公开(公告)日：2004-03-30

申请号：US10075576

申请日：2002-02-13

申请人： David T. Beatson ,  Christian Hoffman ,  James E. Eder ,  John Ditri

发明人： David T. Beatson ,  Christian Hoffman ,  James E. Eder ,  John Ditri

IPC分类号： B23K3102

CPC分类号： B23K31/12 ,  B23K20/002 ,  B23K20/10 ,  B23K2101/40 ,  H05K13/08

摘要： A vision system and method for use with a bonding tool that takes into account variations due to temperature changes and other nonrandom systemic effects. The vision system includes a cornercube offset tool having a plurality of total internal reflection surfaces, the cornercube offset tool located below the vision plane of the optical system; and an optical detector to receive an indirect image of the bonding tool through the cornercube offset tool. The method comprises the steps of providing a cornercube offset tool having a plurality of total internal reflection surfaces below a vision plane of the bonding tool; and receiving an indirect image of the bonding tool through the cornercube offset tool.

摘要翻译： 一种与粘合工具一起使用的视觉系统和方法，其考虑到由于温度变化和其他非随机系统效应引起的变化。 所述视觉系统包括具有多个全内反射面的角架偏移工具，所述角架偏移工具位于所述光学系统的视平面的下方; 以及光学检测器，用于通过角架偏移工具接收粘合工具的间接图像。 该方法包括以下步骤：提供一种具有在接合工具的视平面下方的多个全内反射表面的角架偏移工具; 以及通过角架偏移工具接收粘合工具的间接图像。

公开(公告)号：US06529333B1

公开(公告)日：2003-03-04

申请号：US09961742

申请日：2001-09-24

申请人： David T. Beatson ,  Christian Hoffman ,  Michael Woodward ,  Lawrence B. Brown

发明人： David T. Beatson ,  Christian Hoffman ,  Michael Woodward ,  Lawrence B. Brown

IPC分类号： G02B2714

CPC分类号： G02B27/145 ,  G01N21/8806 ,  G01N2021/8845

摘要： A method and system for providing different magnified images of an electronic device. The vision system has a first beamsplitter for receiving an image of the device illuminated by a light source, the beamsplitter providing multiple of images of the device; optical elements for receiving the plural images of the device, each of the optical elements magnifying the image by a predetermined magnification factor to produce more than one magnified images; and a second beamsplitter for receiving the magnified images and filtering out all but one of the magnified images based on a wavelength of the light source.

公开(公告)号：US09097505B2

公开(公告)日：2015-08-04

申请号：US13263342

申请日：2010-10-22

申请人： James Kengo Andersen ,  Eric Lee Goldner ,  Agop Hygasov Cherbettchian ,  Gerald Robert Baker ,  David T. Beatson

发明人： James Kengo Andersen ,  Eric Lee Goldner ,  Agop Hygasov Cherbettchian ,  Gerald Robert Baker ,  David T. Beatson

IPC分类号： G01B9/02 ,  G01H9/00 ,  G01P15/093 ,  G01V1/18 ,  G01D5/353

CPC分类号： G01D5/35312 ,  G01B9/0201 ,  G01B9/02014 ,  G01B9/02015 ,  G01B9/02027 ,  G01B9/0205 ,  G01D5/35316 ,  G01D5/35377 ,  G01H9/004 ,  G01L1/246 ,  G01P15/093 ,  G01V1/181 ,  G02B6/022

摘要： A fiber optic transducer is provided. The fiber optic transducer includes a fixed portion configured to be secured to a body of interest, a moveable portion having a range of motion with respect to the fixed portion, a spring positioned between the fixed portion and the moveable portion, and a length of fiber wound between the fixed portion and the moveable portion. The length of fiber spans the spring. The fiber optic transducer also includes a mass engaged with the moveable portion. In one disclosed aspect of the transducer, the mass envelopes the moveable portion.

摘要翻译： 提供光纤换能器。 所述光纤换能器包括固定部分，其被固定到感兴趣的主体上，可移动部分具有相对于所述固定部分的运动范围，位于所述固定部分和所述可移动部分之间的弹簧以及一定长度的光纤 缠绕在固定部分和可移动部分之间。 纤维的长度跨越春天。 光纤传感器还包括与可移动部分接合的质量。 在换能器的一个公开的方面中，质量包围可移动部分。

公开(公告)号：US07523848B2

公开(公告)日：2009-04-28

申请号：US11148540

申请日：2005-06-09

申请人： David T. Beatson ,  Deepak Sood ,  Norman Lucas ,  Zhijie Wang

发明人： David T. Beatson ,  Deepak Sood ,  Norman Lucas ,  Zhijie Wang

IPC分类号： B23K31/02 ,  G01B11/00

CPC分类号： B23K20/007 ,  B23K20/10 ,  B23K31/12 ,  B23K2101/40 ,  H01L2224/78301 ,  H01L2924/14

摘要： A system for measuring the size of free air balls for use with a wire bonder having a wire bonding tool and an Electric Flame Off (EFO) device is provided. The system includes an imager disposed above a first image plane, a prism disposed below the imager, and at least one lens positioned between the first image plane and the prism in a first optical path. The at least one lens is positioned between the prism and the imager in a second optical path, where the second optical path is different from the first optical path. An image of the free air ball disposed at a lower portion of the wire bonding tool is provided to the imager via the prism and the at least one lens.

摘要翻译： 提供了一种用于测量与具有引线接合工具和电火焰熄灭（EFO）装置的引线接合器一起使用的自由空气球的尺寸的系统。 该系统包括设置在第一图像平面上方的成像器，设置在成像器下方的棱镜以及位于第一光路中的第一像面与棱镜之间的至少一个透镜。 所述至少一个透镜位于所述棱镜和所述成像器之间的第二光路中，其中所述第二光路不同于所述第一光路。 设置在引线接合工具的下部的自由空气球的图像通过棱镜和至少一个透镜被提供给成像器。

公开(公告)号：US07432728B2

公开(公告)日：2008-10-07

申请号：US11711319

申请日：2007-02-26

申请人： Habib Kilicaslan ,  David F. McDevitt ,  Bahadir Tunaboylu ,  David T. Beatson

发明人： Habib Kilicaslan ,  David F. McDevitt ,  Bahadir Tunaboylu ,  David T. Beatson

IPC分类号： G01R31/02

CPC分类号： G01R1/07342 ,  G01R1/06772

摘要： A blade probe card includes a plurality of blades that each includes a first end connected to a printed circuit board and a second end. A probe member is attached to the second end of each blade and extends outward to make contact with a device under test. A ground member is attached to the second end of each blade. The blade probe card also includes a common ground member that is separate from the printed circuit board and coupled to the ground member of each blade. Each blade may also include a first conductive signal trace and two or more conductive ground traces formed on a surface of each blade. The first conductive signal trace electrically connects the probe member to a contact on the printed circuit board. The two or more conductive ground traces are adjacent to the conductive signal trace and reduce crosstalk between the blades.

摘要翻译： 刀片探针卡包括多个叶片，每个叶片包括连接到印刷电路板的第一端和第二端。 探针构件附接到每个叶片的第二端并向外延伸以与待测试的装置接触。 接地构件附接到每个叶片的第二端。 刀片探针卡还包括与印刷电路板分离并联接到每个叶片的接地构件的公共接地构件。 每个叶片还可以包括形成在每个叶片的表面上的第一导电信号迹线和两个或更多个导电接地迹线。 第一导电信号迹线将探针构件电连接到印刷电路板上的触点。 两个或多个导电接地迹线与导电信号迹线相邻并且减小了叶片之间的串扰。

公开(公告)号：US07294217B2

公开(公告)日：2007-11-13

申请号：US10552429

申请日：2004-04-09

申请人： David T. Beatson ,  Horst Clauberg ,  Kenneth K. Dury

发明人： David T. Beatson ,  Horst Clauberg ,  Kenneth K. Dury

IPC分类号： B32B37/00

CPC分类号： H01L24/85 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48 ,  H01L2224/49175 ,  H01L2224/81801 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3011 ,  H01L2924/3025 ,  Y10T29/49204 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/20751 ,  H01L2924/20753 ,  H01L2924/00015

摘要： Disclosed are interconnect structures and methods which utilize a bonding surface comprising copper nitride. The interconnect structures include a bonding surface comprising copper nitride which is effective at preventing oxidation and/or other unwanted corrosion of the underlying conductive material while providing the basis for a high conductivity bond. The copper nitride bonding surface provides a relatively non-conductive, corrosion-resistant bonding surface while at the same time being readily transformed into a conductive layer at or just prior to the time of bonding.

摘要翻译： 公开了利用包含氮化铜的接合表面的互连结构和方法。 互连结构包括包含氮化铜的结合表面，其有效地防止下面的导电材料的氧化和/或其它不希望的腐蚀，同时为高导电性键提供基础。 氮化铜接合表面提供相对不导电的耐腐蚀粘合表面，同时在粘合时或之前容易地转变成导电层。

公开(公告)号：US07160797B2

公开(公告)日：2007-01-09

申请号：US11121703

申请日：2005-05-03

申请人： David T. Beatson

发明人： David T. Beatson

IPC分类号： H01L21/44

CPC分类号： H01L24/11 ,  G01R31/2884 ,  H01L22/32 ,  H01L24/05 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/81 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48471 ,  H01L2224/48477 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48844 ,  H01L2224/78301 ,  H01L2224/78302 ,  H01L2224/81801 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/48824 ,  H01L2224/45099

摘要： A method of processing a semiconductor wafer including a plurality of semiconductor dies is provided. The method includes providing a semiconductor wafer including a plurality of semiconductor dies, at least a portion of the semiconductor dies including contact pads for testing the respective semiconductor die. The method also includes positioning conductive bumps on the contact pads prior to completing wafer testing of the semiconductor wafer and prior to the singulation of the plurality of semiconductor dies from the semiconductor wafer. At least a portion of the conductive bumps are configured to be electrical paths during wafer testing of the semiconductor wafer.

摘要翻译： 提供了一种处理包括多个半导体管芯的半导体晶片的方法。 该方法包括提供包括多个半导体管芯的半导体晶片，半导体管芯的至少一部分包括用于测试各个半导体管芯的接触焊盘。 该方法还包括在完成半导体晶片的晶片测试之前和在从半导体晶片分离多个半导体管芯之前，在接触焊盘上定位导电凸块。 在半导体晶片的晶片测试期间，导电凸块的至少一部分被配置为电路径。

公开(公告)号：US06729530B2

公开(公告)日：2004-05-04

申请号：US10131873

申请日：2002-04-25

申请人： David T. Beatson ,  Deepak Sood ,  Ashoke Banerjee

发明人： David T. Beatson ,  Deepak Sood ,  Ashoke Banerjee

IPC分类号： B23K3102

CPC分类号： B23K20/007 ,  B23K20/002 ,  B23K20/10 ,  B23K31/12 ,  B23K2101/40 ,  H01L2224/78301 ,  H05K13/08

摘要： A system and method for aligning optical fibers that takes into account variations due to temperature changes and other nonrandom systemic effects. The system includes an alignment tool having a plurality of internal reflection surfaces and located below a vision plane of the first one of the pair of optical fibers, and an optical detector to receive an indirect image of a bottom surface of the first optical fiber through the alignment tool, such an offset between the first optical fiber and the optical detector is determined based on the indirect image received by the optical detector. The method comprises the steps of providing a cornercube offset tool having a plurality of total internal reflection surfaces below a vision plane of the first optical fiber, and receiving an indirect image of the first optical fiber through the cornercube offset tool.

摘要翻译： 用于对准考虑到温度变化和其他非随机系统影响的变化的光纤的系统和方法。 该系统包括具有多个内部反射表面并且位于该对光纤中的第一个的视平面下方的对准工具，以及光学检测器，用于通过第一光纤的第一光纤的底表面接收间接图像 基于由光学检测器接收的间接图像来确定第一光纤和光学检测器之间的这种偏移的对准工具。 该方法包括以下步骤：提供具有在第一光纤的视平面下方的多个全内反射表面的角架偏移工具，以及通过角架偏移工具接收第一光纤的间接图像。

公开(公告)号：US06599561B2

公开(公告)日：2003-07-29

申请号：US10010675

申请日：2001-11-30

申请人： Richard Dow ,  Tim W. Ellis ,  David T. Beatson ,  Michael Hillebrand

发明人： Richard Dow ,  Tim W. Ellis ,  David T. Beatson ,  Michael Hillebrand

IPC分类号： B05D512

CPC分类号： D03D15/0011 ,  D03D1/0082 ,  D03D15/00 ,  D03D15/0066 ,  D03D15/02 ,  D10B2101/06 ,  D10B2101/20 ,  D10B2321/042 ,  D10B2331/021 ,  D10B2331/04 ,  D10B2401/16 ,  H05K1/0366 ,  H05K3/045 ,  H05K3/4038 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/09609 ,  H05K2201/10287 ,  H05K2203/025 ,  Y10T29/49117 ,  Y10T29/49162 ,  Y10T29/49215 ,  Y10T428/24917

摘要： An inexpensive and high throughput process for manufacturing a printed circuit board (PCB) substrate includes first weaving a plurality of electrically non-conductive strands (e.g., fiberglass yarns) and at least one electrically conductive strand (e.g., a copper wire) to form a woven fabric with an upper surface and a lower surface. Next, the woven fabric is impregnated with a resin material to form an impregnated fabric, which is then cured to form a cured fabric. The upper and lower surfaces of the cured fabric are subsequently planed. The planing step segments the electrically conductive strand(s) and forms a PCB substrate that includes a planarized cured fabric with upper and lower planed surfaces and a plurality of electrically conductive strand segments extending from the upper planed surface to the lower planed surface. Since each of the electrically conductive strand segments extends from the upper planed surface to the lower planed surface, the segments function as electrically conductive vias of the PCB substrate. Also, a PCB substrate that includes a planarized woven fabric with a cured resin material impregnated therein. The planarized woven fabric includes planed upper and lower surfaces and a plurality of integrally formed electrically conductive strand segments (e.g., copper wire segments) extending from the upper planed surface to the lower planed surface. Since the electrically conductive strand segments were formed integrally with the remainder of the planarized woven fabric, PCB substrates are of high mechanical stability.

摘要翻译： 用于制造印刷电路板（PCB）基板的廉价且高通量的方法包括首先编织多根非导电线（例如，玻璃纤维纱线）和至少一根导电线（例如铜线），以形成 具有上表面和下表面的无纺织物。 接下来，用树脂材料浸渍织物以形成浸渍织物，然后将其固化以形成固化织物。 固化织物的上表面和下表面随后被平面化。 所述刨削步骤分段所述导电线并形成PCB衬底，所述PCB衬底包括具有上和下平面表面的平坦化固化织物以及从所述上平面表面延伸到所述下平面表面的多个导电线段。 由于每个导电线段从上平面表面延伸到下平面表面，所以这些段用作PCB基板的导电通孔。 此外，PCB基板包括其中浸渍有固化的树脂材料的平面化织物。 平面织造织物包括平面的上表面和下表面以及从上平面表面延伸到下平面表面的多个整体形成的导电线段（例如，铜线段）。 由于导电线段与平面化织物的其余部分一体形成，所以PCB基板具有高机械稳定性。

公开(公告)号：US06412683B1

公开(公告)日：2002-07-02

申请号：US09912024

申请日：2001-07-24

申请人： David T. Beatson ,  Christian Hoffman ,  James E. Eder ,  John Ditri

发明人： David T. Beatson ,  Christian Hoffman ,  James E. Eder ,  John Ditri

IPC分类号： B23K3112

CPC分类号： B23K31/12 ,  B23K20/002 ,  B23K20/10 ,  B23K2101/40 ,  H05K13/08

摘要： A vision system and method for use with a bonding tool that takes into account variations due to temperature changes and other nonrandom systemic effects. The vision system includes a cornercube offset tool having a plurality of total internal reflection surfaces, the cornercube offset tool located below the vision plane of the optical system; and an optical detector to receive an indirect image of the bonding tool through the cornercube offset tool. The method comprises the steps of providing a cornercube offset tool having a plurality of total internal reflection surfaces below a vision plane of the bonding tool; and receiving an indirect image of the bonding tool through the cornercube offset tool.

摘要翻译： 一种与粘合工具一起使用的视觉系统和方法，其考虑到由于温度变化和其他非随机系统效应引起的变化。 所述视觉系统包括具有多个全内反射面的角架偏移工具，所述角架偏移工具位于所述光学系统的视平面的下方; 以及光学检测器，用于通过角架偏移工具接收粘合工具的间接图像。 该方法包括以下步骤：提供一种具有在接合工具的视平面下方的多个全内反射表面的角架偏移工具; 以及通过角架偏移工具接收粘合工具的间接图像。