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1.发明授权公开(公告)号：US07294217B2
公开(公告)日：2007-11-13
申请号：US10552429
申请日：2004-04-09
IPC分类号： B32B37/00
CPC分类号： H01L24/85 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/81 , H01L2224/04042 , H01L2224/05554 , H01L2224/05599 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48 , H01L2224/49175 , H01L2224/81801 , H01L2224/85205 , H01L2224/85399 , H01L2924/00014 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01022 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/10253 , H01L2924/12041 , H01L2924/14 , H01L2924/15747 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/3011 , H01L2924/3025 , Y10T29/49204 , H01L2224/78 , H01L2924/00 , H01L2924/20751 , H01L2924/20753 , H01L2924/00015
摘要： Disclosed are interconnect structures and methods which utilize a bonding surface comprising copper nitride. The interconnect structures include a bonding surface comprising copper nitride which is effective at preventing oxidation and/or other unwanted corrosion of the underlying conductive material while providing the basis for a high conductivity bond. The copper nitride bonding surface provides a relatively non-conductive, corrosion-resistant bonding surface while at the same time being readily transformed into a conductive layer at or just prior to the time of bonding.
摘要翻译： 公开了利用包含氮化铜的接合表面的互连结构和方法。 互连结构包括包含氮化铜的结合表面，其有效地防止下面的导电材料的氧化和/或其它不希望的腐蚀，同时为高导电性键提供基础。 氮化铜接合表面提供相对不导电的耐腐蚀粘合表面，同时在粘合时或之前容易地转变成导电层。
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2.发明申请公开(公告)号：US20090039141A1
公开(公告)日：2009-02-12
申请号：US12250369
申请日：2008-10-13
CPC分类号： H01L24/85 , B08B7/00 , B08B7/0057 , B23K20/004 , B23K20/24 , B23K2101/40 , C23F4/00 , H01L21/67138 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/45014 , H01L2224/45147 , H01L2224/48247 , H01L2224/7801 , H01L2224/78301 , H01L2224/85013 , H01L2224/85055 , H01L2224/85065 , H01L2224/85075 , H01L2224/851 , H01L2924/00014 , H01L2924/01007 , H01L2924/0101 , H01L2924/01013 , H01L2924/01018 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/01001 , H01L2924/01002 , H01L2924/206
摘要： A wire cleaning system for cleaning wire configured to be wirebonded is provided. The wire cleaning system includes a chamber through which a wire configured to be wirebonded extends prior to the wire being wirebonded. The wire cleaning system also includes an energy source for removing contamination from the wire in the chamber prior to the wire being wirebonded.
摘要翻译： 提供了一种用于清洁被配置为引线键合的导线的电线清洁系统。 电线清洁系统包括一个室，通过该室配置成引线接合的导线在导线接合之前延伸。 电线清洁系统还包括能量源，用于在电线被引线接合之前去除腔室中的电线的污染物。
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公开(公告)号：US09194738B2
公开(公告)日：2015-11-24
申请号：US13263850
申请日：2010-10-22
申请人： James Kengo Andersen , Eric Lee Goldner , Agop Hygasov Cherbettchian , Gerald Robert Baker , David T. Beatson
发明人： James Kengo Andersen , Eric Lee Goldner , Agop Hygasov Cherbettchian , Gerald Robert Baker , David T. Beatson
CPC分类号： G01D5/35312 , G01B9/0201 , G01B9/02014 , G01B9/02015 , G01B9/02027 , G01B9/0205 , G01D5/35316 , G01D5/35377 , G01H9/004 , G01L1/246 , G01P15/093 , G01V1/181 , G02B6/022
摘要： A fiber optic microseismic sensing system is provided. The system includes a plurality of nodes, each of the nodes including a surface portion, an underground portion, and an optical cable extending between the surface portion and the underground portion. The surface portion includes (1) an optical source for transmitting an optical signal along the optical cable to the underground portion, and (2) an optical receiver for receiving a return optical signal propagating along the optical cable from the underground portion. The underground portion includes at least one transducer, each of the at least one transducer including (1) a fixed portion configured to be secured to a body of interest, (2) a moveable portion having a range of motion with respect to the fixed portion, (3) a spring positioned between the fixed portion and the moveable portion, and (4) a mass engaged with the moveable portion. The optical cable includes a length of fiber wound between the fixed portion and the moveable portion of each of the at least one transducer, the length of fiber spanning the spring. In one disclosed aspect of the transducer, the mass envelopes the moveable portion.
摘要翻译： 提供了光纤微震感测系统。 该系统包括多个节点，每个节点包括表面部分，地下部分和在表面部分和地下部分之间延伸的光缆。 表面部分包括（1）用于将光信号沿着光缆传输到地下部分的光源，以及（2）光接收器，用于接收沿着光缆从地下部分传播的返回光信号。 所述地下部分包括至少一个换能器，所述至少一个换能器中的每一个包括：（1）固定部分，其被配置为固定到感兴趣的身体;（2）可移动部分，其具有相对于所述固定部分的运动范围 ，（3）定位在固定部分和可移动部分之间的弹簧，和（4）与可移动部分接合的质量块。 光缆包括缠绕在固定部分和至少一个换能器中的每一个的可移动部分之间的纤维的长度，纤维的长度跨过弹簧。 在换能器的一个公开的方面中，质量包围可移动部分。
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公开(公告)号：US20120257209A1
公开(公告)日：2012-10-11
申请号：US13263850
申请日：2010-10-22
申请人： James Kengo Andersen , Eric Lee Goldner , Agop Hygasov Cherbettchian , Gerald Robert Baker , David T. Beatson
发明人： James Kengo Andersen , Eric Lee Goldner , Agop Hygasov Cherbettchian , Gerald Robert Baker , David T. Beatson
CPC分类号： G01D5/35312 , G01B9/0201 , G01B9/02014 , G01B9/02015 , G01B9/02027 , G01B9/0205 , G01D5/35316 , G01D5/35377 , G01H9/004 , G01L1/246 , G01P15/093 , G01V1/181 , G02B6/022
摘要： A fiber optic microseismic sensing system is provided. The system includes a plurality of nodes, each of the nodes including a surface portion, an underground portion, and an optical cable extending between the surface portion and the underground portion. The surface portion includes (1) an optical source for transmitting an optical signal along the optical cable to the underground portion, and (2) an optical receiver for receiving a return optical signal propagating along the optical cable from the underground portion. The underground portion includes at least one transducer, each of the at least one transducer including (1) a fixed portion configured to be secured to a body of interest, (2) a moveable portion having a range of motion with respect to the fixed portion, (3) a spring positioned between the fixed portion and the moveable portion, and (4) a mass engaged with the moveable portion. The optical cable includes a length of fiber wound between the fixed portion and the moveable portion of each of the at least one transducer, the length of fiber spanning the spring. In one disclosed aspect of the transducer, the mass envelopes the moveable portion.
摘要翻译： 提供了光纤微震感测系统。 该系统包括多个节点，每个节点包括表面部分，地下部分和在表面部分和地下部分之间延伸的光缆。 表面部分包括（1）用于将光信号沿着光缆传输到地下部分的光源，以及（2）光接收器，用于接收沿着光缆从地下部分传播的返回光信号。 所述地下部分包括至少一个换能器，所述至少一个换能器中的每一个包括：（1）固定部分，其被配置为固定在感兴趣的身体上;（2）可移动部分，其具有相对于所述固定部分的运动范围 ，（3）定位在固定部分和可移动部分之间的弹簧，和（4）与可移动部分接合的质量块。 光缆包括缠绕在固定部分和至少一个换能器中的每一个的可移动部分之间的纤维的长度，纤维的长度跨过弹簧。 在换能器的一个公开的方面中，质量包围可移动部分。
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公开(公告)号：US20110148449A1
公开(公告)日：2011-06-23
申请号：US13038140
申请日：2011-03-01
申请人： Scott R. Williams , Edward Laurent , David T. Beatson , Bahadir Tunaboylu , Edward L. Malantonio
发明人： Scott R. Williams , Edward Laurent , David T. Beatson , Bahadir Tunaboylu , Edward L. Malantonio
IPC分类号： G01R31/00
CPC分类号： G01R1/06727
摘要： A probe for a probe card assembly includes a beam and a fulcrum element. The fulcrum element is positioned between a base end portion of the beam and a tip end portion of the beam and is adapted for contact with the beam such that the beam is cantilevered by the fulcrum.
摘要翻译： 用于探针卡组件的探针包括光束和支点元件。 支点元件位于梁的基端部分和梁的顶端部分之间，并且适于与梁接触，使得梁被支点悬臂。
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公开(公告)号：US07638028B2
公开(公告)日：2009-12-29
申请号：US11196194
申请日：2005-08-03
CPC分类号： C25D5/02 , C25D5/022 , C25D7/00 , C25D17/00 , G01R1/06738 , G01R1/06761 , G01R1/07307 , G01R3/00
摘要： A method of processing a probe element includes (a) providing a probe element comprising a first conductive material, and (b) coating only a tip portion of the probe element with a second conductive material.
摘要翻译： 一种处理探针元件的方法包括（a）提供包括第一导电材料的探针元件，和（b）用第二导电材料仅涂覆探针元件的尖端部分。
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公开(公告)号：US06778274B2
公开(公告)日：2004-08-17
申请号：US10620036
申请日：2003-07-15
申请人： David T. Beatson , Christian Hoffman , James E. Eder , Jonn Ditri
发明人： David T. Beatson , Christian Hoffman , James E. Eder , Jonn Ditri
IPC分类号： G01B1100
CPC分类号： B23K20/002 , B23K20/10 , B23K31/12 , B23K2101/40 , H01L21/681 , H01L2224/78301 , H05K13/08
摘要： A system and method having applications in semiconductor areas for accurate die placement on a substrate that takes into account any positional offset from the reference position due to variations caused by thermal change and other nonrandom systemic effects. The system includes an offset alignment tool having a plurality of internal reflection surfaces and located below a vision plane of the substrate, and an optical detector to receive an indirect image of a bottom surface of the die through the alignment tool, such that the die is accurately positioned on the substrate based on the indirect image received by the optical detector. The method comprises the steps of providing a cornercube offset alignment tool having a plurality of total internal reflection surfaces below a vision plane of the die, and receiving an indirect image of the die tool through the cornercube offset tool.
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公开(公告)号：US07442641B2
公开(公告)日：2008-10-28
申请号：US11123858
申请日：2005-05-05
申请人： David T. Beatson , Jamin Ling
发明人： David T. Beatson , Jamin Ling
IPC分类号： H01L21/44 , H01L23/52 , H01L23/48 , H01L23/40 , H01L23/538
CPC分类号： H01L24/85 , H01L21/486 , H01L21/565 , H01L21/568 , H01L21/6835 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2221/68372 , H01L2224/11003 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45164 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/4824 , H01L2224/48464 , H01L2224/48471 , H01L2224/48475 , H01L2224/48599 , H01L2224/48699 , H01L2224/78301 , H01L2224/85001 , H01L2224/85045 , H01L2224/85051 , H01L2224/85186 , H01L2224/85205 , H01L2224/85365 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/18301 , H01L2924/30107 , H01L2924/00 , H01L2924/00012 , H01L2224/85399 , H01L2224/05599
摘要： A method of processing a semiconductor device is provided. The method includes providing a semiconductor device supported by a carrier structure. The carrier structure defines a plurality of vias from a first surface of the carrier structure adjacent the semiconductor device to a second surface of the carrier structure. The method also includes extending a conductor through one of the vias such that a first end of the conductor at least partially extends below the second surface. The method also includes electrically coupling another portion of the conductor to a portion of the semiconductor device.
摘要翻译： 提供一种处理半导体器件的方法。 该方法包括提供由载体结构支撑的半导体器件。 载体结构从邻近半导体器件的载体结构的第一表面到载体结构的第二表面限定多个通孔。 该方法还包括将导体延伸通过其中一个通孔，使得导体的第一端至少部分地延伸到第二表面的下方。 该方法还包括将导体的另一部分电耦合到半导体器件的一部分。
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公开(公告)号：US07320423B2
公开(公告)日：2008-01-22
申请号：US10715809
申请日：2003-11-17
申请人： Krishnan Suresh , David T. Beatson
发明人： Krishnan Suresh , David T. Beatson
CPC分类号： H01L24/78 , B23K20/004 , B23K37/02 , B23K2101/40 , H01L2224/78301 , H01L2224/78822 , H01L2924/00014 , H01L2924/01005 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2224/48 , H01L2224/45099 , H01L2224/05599
摘要： A wire bonding machine is disclosed for bonding a wire to a semiconductor device. The wire bonding machine includes a wire bonding head having a bonding tool mounted to it. The bonding tool is adapted to attach a wire end to a semiconductor device. At least a portion of the bonding head is pivotable about a first horizontal axis so as to provide vertical displacement of the bonding tool. The bonding head is also rotatably mounted to the bonding machine so as to permit rotation of the bonding tool about a vertically oriented rotational axis. The machine also includes a work table for supporting at least one semiconductor device to be wire bonded. A conveyance system is used to translate the work table in a direction relative to the bonding head and in a substantially orthogonal direction to the horizontal pivot axis of the bonding head.
摘要翻译： 公开了一种用于将导线接合到半导体器件的引线接合机。 引线接合机包括具有安装到其上的接合工具的引线接合头。 接合工具适于将线端附接到半导体器件。 接合头的至少一部分可围绕第一水平轴线枢转，以便提供接合工具的垂直位移。 接合头也可旋转地安装到接合机上，以允许接合工具围绕垂直定向的旋转轴线旋转。 该机器还包括用于支撑至少一个待接线的半导体器件的工作台。 传送系统用于沿着与接合头相对的方向，在与接合头的水平枢转轴线大致正交的方向上平移工作台。
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公开(公告)号：US06960022B2
公开(公告)日：2005-11-01
申请号：US10616708
申请日：2003-07-10
申请人： David T. Beatson , E. Walter Frasch , Paul J. Schlosser , Jai R. Singh , David W. McKenna , Craig Emmons
发明人： David T. Beatson , E. Walter Frasch , Paul J. Schlosser , Jai R. Singh , David W. McKenna , Craig Emmons
CPC分类号： F16C29/005 , B23Q1/40 , B23Q1/42 , B23Q1/58 , F16C29/04 , F16C2322/39
摘要： A “hybrid” or macrocomposite guideway, wherein the “traditional” or existing guideway material (e.g., hardened steel) is maintained as the wear resistant, low friction surface intended to be in physical contact with one or more bearings, and further wherein this surface is backed up or supported by a substrate comprising a stiff, lightweight material. This macrocomposite guideway combines the desirable friction and wear characteristics of the traditional bearing materials with the stiffness and low mass of advanced materials. Candidate substrate materials include composites having a ceramic and/or a metallic matrix, monolithic ceramics or monolithic light metals. A cladding comprising the hardened steel wear surface layer may be attached to the rigid, lightweight substrate by adhesive bonding, mechanical fasteners or other mechanical fit such as a friction or interference fit. Preferably, though, the attachment is by means of a metallurgical bond. In a particularly preferred embodiment, a silicon carbide particulate reinforced aluminum composite is metallurgically bonded to a tool steel wear surface using an “active” soldering composition. A gib that utilizes such guideways is useful in machines requiring fast and precise movement of one pat relative to another, such as in machines for semiconductor chip fabrication and assembly.
摘要翻译： “混合”或大型复合导轨，其中“传统”或现有的导轨材料（例如，硬化钢）被保持为旨在与一个或多个轴承物理接触的耐磨低摩擦表面，并且其中该表面 由包括刚性轻质材料的基材支撑或支撑。 这种宏观复合导轨将传统轴承材料的理想摩擦和磨损特性与先进材料的刚度和质量相结合。 候选基板材料包括具有陶瓷和/或金属基体，单片陶瓷或单片轻金属的复合材料。 包含硬化的钢磨损表面层的包层可以通过粘合剂粘合，机械紧固件或其它机械配合（例如摩擦或过盈配合）附接到刚性轻质基底。 但是，优选地，附件是借助于冶金结合。 在特别优选的实施例中，碳化硅颗粒增强铝复合材料使用“主动”焊接组合物冶金地结合到工具钢耐磨表面。 使用这种导轨的双臂在需要相对于另一个拍拍的快速和精确移动的机器中是有用的，例如在用于半导体芯片制造和组装的机器中。
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