公开(公告)号：US07214569B2

公开(公告)日：2007-05-08

申请号：US10769572

申请日：2004-01-30

申请人： Susan Swindlehurst ,  Mark A. Hadley ,  Paul S. Drzaic ,  Gordon S. W. Craig ,  Glenn Gengel ,  Scott Hermann ,  Aly Tootoochi ,  Randolph W. Eisenhardt

发明人： Susan Swindlehurst ,  Mark A. Hadley ,  Paul S. Drzaic ,  Gordon S. W. Craig ,  Glenn Gengel ,  Scott Hermann ,  Aly Tootoochi ,  Randolph W. Eisenhardt

IPC分类号： H01L21/00 ,  H01L21/44

CPC分类号： G06K19/07752 ,  G06K19/077 ,  H01L23/49855 ,  H01L23/5389 ,  H01L24/13 ,  H01L24/19 ,  H01L24/24 ,  H01L24/29 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L24/90 ,  H01L24/95 ,  H01L24/97 ,  H01L29/0657 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13019 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/13499 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24011 ,  H01L2224/2402 ,  H01L2224/24137 ,  H01L2224/24225 ,  H01L2224/24227 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/76155 ,  H01L2224/81201 ,  H01L2224/81205 ,  H01L2224/81207 ,  H01L2224/81224 ,  H01L2224/81801 ,  H01L2224/81898 ,  H01L2224/81903 ,  H01L2224/82102 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83865 ,  H01L2224/83868 ,  H01L2224/83871 ,  H01L2224/83874 ,  H01L2224/95085 ,  H01L2224/95136 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/10158 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15165 ,  H01L2924/3011 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2924/00012 ,  H01L2224/05599

摘要： An apparatus incorporating small-feature size and large-feature-size components. The apparatus comprise a strap including a substrate with an integrated circuit contained therein. The integrated circuit coupling to a first conductor disposed on the substrate. The first conductor is made of a thermosetting or a thermoplastic material including conductive fillers. A large-scale component having a second conductor is electrically coupled to the first conductor to electrically couple the large-scale component to the integrated circuit. The large-scale component includes a second substrate.

摘要翻译： 包含小特征尺寸和大特征尺寸组件的装置。 该装置包括带状物，其带有包含集成电路的基板。 集成电路耦合到设置在基板上的第一导体。 第一导体由包括导电填料的热固性或热塑性材料制成。 具有第二导体的大规模部件电耦合到第一导体，以将大尺寸部件电耦合到集成电路。 大规模部件包括第二基板。

公开(公告)号：US07531218B2

公开(公告)日：2009-05-12

申请号：US11639858

申请日：2006-12-15

申请人： John Stephen Smith ,  Mark A. Hadley ,  Gordon S. W. Craig ,  Frank Lowe

发明人： John Stephen Smith ,  Mark A. Hadley ,  Gordon S. W. Craig ,  Frank Lowe

IPC分类号： B05D3/12

CPC分类号： H01L24/32 ,  B82Y30/00 ,  H01L21/31122 ,  H01L21/32136 ,  H01L21/84 ,  H01L24/24 ,  H01L24/82 ,  H01L24/95 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/50 ,  H01L27/1214 ,  H01L28/55 ,  H01L2224/24225 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/95085 ,  H01L2224/95092 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2224/95144 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/15788 ,  Y10S977/882 ,  Y10S977/883 ,  H01L2224/82 ,  H01L2924/00

摘要： Methods and apparatuses for assembling a structure onto a substrate. A method according to one aspect of the invention includes dispensing a slurry onto a substrate wherein the slurry includes a first plurality of elements, each of which is designed to mate with a receptor region on said substrate and each of which comprises a functional element, and wherein the slurry also includes a second plurality of elements which are not designed to mate with receptor regions on the substrate. Typically, these second plurality of elements help movement of the first plurality of elements.

摘要翻译： 将结构组装到基板上的方法和装置。 根据本发明的一个方面的方法包括将浆料分配到基底上，其中所述浆料包括第一多个元件，每个元件设计成与所述基底上的受体区域配合，并且每个元件包括功能元件，以及 其中所述浆料还包括不被设计成与所述基底上的受体区域配合的第二多个元件。 通常，这些第二多个元件有助于第一多个元件的移动。

公开(公告)号：US07244326B2

公开(公告)日：2007-07-17

申请号：US10846753

申请日：2004-05-13

申请人： Gordon S. W. Craig ,  Kenneth D. Schatz ,  Mark A. Hadley ,  Paul S. Drzaic

发明人： Gordon S. W. Craig ,  Kenneth D. Schatz ,  Mark A. Hadley ,  Paul S. Drzaic

IPC分类号： B32B37/00

CPC分类号： G06K19/07718 ,  G06K19/07745 ,  H01L21/673 ,  H01L21/6835 ,  H01L23/49855 ,  H01L23/544 ,  H01L24/19 ,  H01L24/76 ,  H01L24/81 ,  H01L24/95 ,  H01L2221/68313 ,  H01L2221/68354 ,  H01L2223/54473 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/7665 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2224/95085 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H05K3/303 ,  H05K2201/10636 ,  H05K2203/0173 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T156/17 ,  Y10T156/171 ,  Y10T156/1744 ,  Y10T156/1798 ,  H01L2924/00

摘要： A method for assembling a device. The method comprises placing a functional element in a first opening formed in a template substrate and transferring the functional element to a device substrate having a second opening formed therein wherein the functional element is held within the second opening and against an adhesive film coupled to the device substrate.

摘要翻译： 一种组装装置的方法。 该方法包括将功能元件放置在形成于模板衬底中的第一开口中，并将功能元件转移到具有形成在其中的第二开口的器件衬底，其中功能元件保持在第二开口内并抵靠与该器件相连的粘合膜 基质。

公开(公告)号：US07172789B2

公开(公告)日：2007-02-06

申请号：US10634350

申请日：2003-08-04

申请人： John Stephen Smith ,  Mark A. Hadley ,  Gordon S. W. Craig ,  Frank Lowe

发明人： John Stephen Smith ,  Mark A. Hadley ,  Gordon S. W. Craig ,  Frank Lowe

IPC分类号： B05D5/06

CPC分类号： H01L24/32 ,  B82Y30/00 ,  H01L21/31122 ,  H01L21/32136 ,  H01L21/84 ,  H01L24/24 ,  H01L24/82 ,  H01L24/95 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/50 ,  H01L27/1214 ,  H01L28/55 ,  H01L2224/24225 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/95085 ,  H01L2224/95092 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2224/95144 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/15788 ,  Y10S977/882 ,  Y10S977/883 ,  H01L2224/82 ,  H01L2924/00

摘要： Methods and apparatuses for assembling a structure onto a substrate. A method according to one aspect of the invention includes dispensing a slurry onto a substrate wherein the slurry includes a first plurality of elements, each of which is designed to mate with a receptor region on said substrate and each of which comprises a functional element. The method further includes dispensing in a flow having a first direction a slurry onto a substrate, wherein the slurry includes a fluid.

摘要翻译： 将结构组装到基板上的方法和装置。 根据本发明的一个方面的方法包括将浆料分配到基底上，其中所述浆料包括第一多个元件，每个元件设计成与所述基底上的受体区域配合，并且每个元件包括功能元件。 该方法还包括将具有第一方向的流浆分配到基底上，其中浆料包括流体。

公开(公告)号：US07113250B2

公开(公告)日：2006-09-26

申请号：US11046651

申请日：2005-01-28

申请人： Jeffrey Jay Jacobsen ,  John Stephen Smith ,  Mark A. Hadley

发明人： Jeffrey Jay Jacobsen ,  John Stephen Smith ,  Mark A. Hadley

IPC分类号： G02F1/13 ,  G02F1/136 ,  H01L21/44

CPC分类号： H01L27/1214 ,  G02F1/133305 ,  G02F1/1362 ,  H01L24/24 ,  H01L24/82 ,  H01L24/95 ,  H01L24/97 ,  H01L25/0753 ,  H01L25/50 ,  H01L29/0657 ,  H01L2224/24101 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/76155 ,  H01L2224/7665 ,  H01L2224/82102 ,  H01L2224/95085 ,  H01L2224/95145 ,  H01L2224/97 ,  H01L2251/5338 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/10158 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01S5/0201 ,  H01L2224/82 ,  H01L2924/00

摘要： Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to forming a flexible active matrix display along a length of flexible substrate. Another embodiment of the invention relates to forming multiple flexible displays along a continuous flexible substrate. Another embodiment of the invention relates to forming a flexible display along a flexible reflective substrate. Another embodiment of the invention relates to using FSA generally with a flexible web process material. Another embodiment of the invention relates to using FSA and a deterministic method such as “pick and place” to place objects onto a rigid substrate or onto a web process material. Another embodiment of the invention relates to using web processing to deposit and/or pattern display material through an in-line process.

公开(公告)号：US06665044B1

公开(公告)日：2003-12-16

申请号：US09977518

申请日：2001-10-12

申请人： Jeffrey Jay Jacobsen ,  John Stephen Smith ,  Mark A. Hadley

发明人： Jeffrey Jay Jacobsen ,  John Stephen Smith ,  Mark A. Hadley

IPC分类号： G02F113

CPC分类号： G02F1/133305 ,  G02F1/1362 ,  H01L21/2007 ,  H01L24/95 ,  H01L24/97 ,  H01L27/1214 ,  H01L2224/95085 ,  H01L2224/95136 ,  H01L2251/5338 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15155 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/15153 ,  H01L2924/00

摘要： Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to forming a flexible active matrix display along a length of flexible substrate. Another embodiment of the invention relates to forming multiple flexible displays along a continuous flexible substrate. Another embodiment of the invention relates to forming a flexible display along a flexible reflective substrate. Another embodiment of the invention relates to using FSA generally with a flexible web process material. Another embodiment of the invention relates to using FSA and a deterministic method such as “pick and place” to place objects onto a rigid substrate or onto a web process material. Another embodiment of the invention relates to using web processing to deposit and/or pattern display material through an in-line process.

摘要翻译： 要求保护用于形成显示器的装置和方法。 本发明的一个实施例涉及沿柔性基底的长度形成柔性有源矩阵显示器。 本发明的另一个实施例涉及沿着连续柔性基底形成多个柔性显示器。 本发明的另一个实施例涉及沿柔性反射衬底形成柔性显示器。 本发明的另一个实施方案涉及一般使用FSA柔性网状物料的FSA。 本发明的另一个实施例涉及使用FSA和诸如“拾取和放置”的确定性方法将物体放置在刚性基底或网状物质材料上。 本发明的另一个实施例涉及使用网络处理来通过在线处理来沉积和/或图案显示材料。

公开(公告)号：US07615479B1

公开(公告)日：2009-11-10

申请号：US11159526

申请日：2005-06-22

申请人： Gordon S. W. Craig ,  Mark A. Hadley ,  Susan Swindlehurst ,  Ali A. Tootoonchi ,  Eric Kanemoto ,  Eric Jonathan Snyder ,  Scott Herrmann ,  Glenn Gengel ,  Lily Liong

发明人： Gordon S. W. Craig ,  Mark A. Hadley ,  Susan Swindlehurst ,  Ali A. Tootoonchi ,  Eric Kanemoto ,  Eric Jonathan Snyder ,  Scott Herrmann ,  Glenn Gengel ,  Lily Liong

IPC分类号： H01L21/4763 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L21/31

CPC分类号： G06K19/07718 ,  G06K19/07749 ,  G06K19/07752 ,  G06K19/07756 ,  H01L23/66 ,  H01L24/19 ,  H01L24/24 ,  H01L24/83 ,  H01L24/95 ,  H01L24/97 ,  H01L25/50 ,  H01L29/0657 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/83136 ,  H01L2224/95085 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  Y10T29/53178 ,  H01L2224/82 ,  H01L2224/83851 ,  H01L2924/00

摘要： An electronic assembly. The assembly includes a substrate, a plurality of recessed regions, and a plurality of functional blocks. Each functional block is deposited in one of the recessed regions. A substantial amount of the plurality of functional blocks is recessed below a top surface of the substrate. Substantial amount is defined by any one of less than 10% of said functional blocks protrudes above the top surface of the substrate; less than 1% of the functional blocks protrudes above the top surface of the substrate; more than 90% of the functional blocks are recessed below the top surface of the substrate; or more than 99% of the functional blocks are recessed below the top surface of the substrate.

摘要翻译： 电子组装。 组件包括衬底，多个凹陷区域和多个功能块。 每个功能块沉积在一个凹陷区域中。 大量的多个功能块被凹入到衬底的顶表面之下。 基本上限是由少于10％的所述功能块中的任何一个突出于衬底的顶表面之上; 少于1％的功能块突出于衬底的顶表面之上; 超过90％的功能块凹陷在基板的顶表面下方; 或超过99％的功能块凹陷在基板的顶表面下方。

公开(公告)号：US07500610B1

公开(公告)日：2009-03-10

申请号：US11269400

申请日：2005-11-07

申请人： Mark A. Hadley ,  Curt L. Carrender ,  John Stephen Smith ,  Gordon S. W. Craig

发明人： Mark A. Hadley ,  Curt L. Carrender ,  John Stephen Smith ,  Gordon S. W. Craig

IPC分类号： G06K7/08

CPC分类号： G06K19/07718 ,  G06K19/07749 ,  G06K19/07752 ,  G06K19/07756 ,  H01L23/66 ,  H01L24/19 ,  H01L24/24 ,  H01L24/83 ,  H01L24/95 ,  H01L24/97 ,  H01L25/50 ,  H01L29/0657 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/83136 ,  H01L2224/95085 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  Y10T29/53178 ,  H01L2224/82 ,  H01L2224/83851 ,  H01L2924/00

摘要： A Radio Frequency Identification (RFID) device. The RFID device comprises an antenna assembly and a resonator assembly. The antenna assembly comprises a first substrate and an antenna element. The resonator assembly comprises a second substrate having an integrated circuit connected to a resonator loop. The first substrate and the second substrate are attached to one another. The integrated circuit electrically couples to the antenna element without a direct mechanical contact.

摘要翻译： 射频识别（RFID）设备。 RFID设备包括天线组件和谐振器组件。 天线组件包括第一基板和天线元件。 谐振器组件包括具有连接到谐振器回路的集成电路的第二衬底。 第一基板和第二基板彼此附接。 集成电路电耦合到天线元件而不直接机械接触。

公开(公告)号：US06527964B1

公开(公告)日：2003-03-04

申请号：US09432289

申请日：1999-11-02

申请人： John Stephen Smith ,  Mark A. Hadley ,  Gordon S. W. Craig ,  Paul F. Nealey

发明人： John Stephen Smith ,  Mark A. Hadley ,  Gordon S. W. Craig ,  Paul F. Nealey

IPC分类号： H01L213065

CPC分类号： H01L24/32 ,  B82Y30/00 ,  H01L24/24 ,  H01L24/82 ,  H01L24/95 ,  H01L24/97 ,  H01L25/50 ,  H01L27/1214 ,  H01L29/66772 ,  H01L29/78603 ,  H01L29/78654 ,  H01L2224/24225 ,  H01L2224/24227 ,  H01L2224/73267 ,  H01L2224/95085 ,  H01L2224/95092 ,  H01L2224/95122 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15165 ,  H01L2924/15788 ,  H01L2224/82 ,  H01L2924/00

摘要： Methods and apparatuses for assembling elements onto a substrate. The surfaces of the elements and/or the substrate are treated and the elements are dispensed over the substrate in a slurry. In one example of the invention, the substrate is exposed to a surface treatment fluid to create a surface on the substrate which has a selected one of a hydrophilic or a hydrophobic nature, and a slurry is dispensed over the substrate. The slurry includes a fluid and a plurality of elements (each of which includes a functional component). Each of the plurality of elements is designed to be received by a receptor region on the substrate. The dispensing of the slurry with the fluid occurs after the substrate is exposed to the surface treatment fluid, and the fluid is the selected one of a hydrophilic or a hydrophobic nature. In another example of the invention, a plurality of elements is exposed to a surface treatment fluid to create surfaces on the elements having a selected one of a hydrophilic or a hydrophobic nature. A slurry is dispensed over a substrate, wherein the slurry contains a fluid and the plurality of elements which are designed to be received by a plurality of receptor regions. The fluid is the selected one of a hydrophilic or hydrophobic nature. In another example of an aspect of the invention, a surfactant is used with a slurry having elements which are deposited onto receptor regions in a fluidic self assembly process. Other examples of methods are also described.

摘要翻译： 将元件组装到基板上的方法和装置。 元件和/或基底的表面被处理并且元件以浆料分配在基底上。 在本发明的一个实例中，将衬底暴露于表面处理流体，以在衬底上形成具有亲水或疏水性质选择的表面，并且将浆料分配在衬底上。 浆料包括流体和多个元件（每个元件包括功能部件）。 多个元件中的每一个被设计成由衬底上的受体区域接收。 浆料与流体的分配发生在基材暴露于表面处理流体之后，并且流体是亲水或疏水性质中选择的一种。 在本发明的另一个实例中，多个元件暴露于表面处理流体，以在具有亲水或疏水性质的选定元件的元件上产生表面。 将浆料分配在基材上，其中浆料包含流体，并且多个元件被设计为被多个受体区域接收。 流体是亲水或疏水性质中选出的一种。 在本发明的一个方面的另一个实例中，使用具有在流体自组装方法中沉积到受体区上的元素的浆料的表面活性剂。 还描述了其它方法的实例。

公开(公告)号：US20090167534A1

公开(公告)日：2009-07-02

申请号：US12366617

申请日：2009-02-05

申请人： Glenn W. Gengel ,  Mark A. Hadley ,  Tom Pounds ,  Kenneth D. Schatz ,  Paul S. Drzaic

发明人： Glenn W. Gengel ,  Mark A. Hadley ,  Tom Pounds ,  Kenneth D. Schatz ,  Paul S. Drzaic

IPC分类号： G08B13/22

CPC分类号： G06K19/07749 ,  D10B2401/18 ,  G06K19/027 ,  G06K19/07722 ,  G06K19/07758 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24227 ,  H01L2224/76155 ,  H01L2224/82039 ,  H01L2224/82102 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3011 ,  Y10T29/49018 ,  Y10T29/49155 ,  H01L2924/00

摘要： A Radio Frequency Identification (RFID) tag. The RFID tag comprises a flexible substrate and an integrated circuit embedded within the flexible substrate. The top surface of the integrated circuit is coplanar with the flexible substrate. At least one conductive element is formed on the flexible substrate. The conductive element is electrically connected to the integrated circuit. The conductive element serves as an antenna for the RFID tag.

摘要翻译： 射频识别（RFID）标签。 RFID标签包括柔性基板和嵌入柔性基板内的集成电路。 集成电路的顶表面与柔性基板共面。 在柔性基板上形成至少一个导电元件。 导电元件电连接到集成电路。 导电元件用作RFID​​标签的天线。