公开(公告)号：US08558243B2

公开(公告)日：2013-10-15

申请号：US13708704

申请日：2012-12-07

Applicant: LuxVue Technology Corporation

Inventor： Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law ,  Hsin-Hua Hu

IPC: H01L27/15 ,  H01L29/18 ,  H01L23/02 ,  H01L21/00

CPC classification number: H01L33/06 ,  F21V7/00 ,  H01L25/0753 ,  H01L27/15 ,  H01L29/0684 ,  H01L33/0079 ,  H01L33/04 ,  H01L33/20 ,  H01L33/28 ,  H01L33/30 ,  H01L2224/95

Abstract: A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.

Abstract translation: 描述了微型发光二极管（LED）和形成用于传送到接收基板的微型LED阵列的方法。 微型LED结构可以包括微型p-n二极管和金属化层，金属化层位于微型p-n二极管和结合层之间。 保形介质阻挡层可以跨越微型p-n二极管的侧壁。 微型LED结构和微型LED阵列可以被拾取并转移到接收衬底。

公开(公告)号：US09370864B2

公开(公告)日：2016-06-21

申请号：US14723231

申请日：2015-05-27

Applicant: LuxVue Technology Corporation

Inventor： Andreas Bibl ,  John A. Higginson ,  Hsin-Hua Hu

IPC: G01P15/125 ,  B25J15/00 ,  H01L25/075 ,  H01L21/683 ,  B81C99/00 ,  H01L21/67 ,  H01L33/00 ,  H01L23/00

CPC classification number: B41J2/385 ,  B25J15/0052 ,  B25J15/0085 ,  B41J2/39 ,  B81B2201/038 ,  B81C99/002 ,  H01L21/67144 ,  H01L21/6835 ,  H01L24/75 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/0079 ,  H01L2221/68322 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2224/29036 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/7565 ,  H01L2224/7598 ,  H01L2224/83815 ,  H01L2224/83855 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2924/00014

Abstract: A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring portion that is deflectable into a space between a base substrate and the spring portion.

公开(公告)号：US20160001450A1

公开(公告)日：2016-01-07

申请号：US14852366

申请日：2015-09-11

Applicant: LuxVue Technology Corporation

Inventor： John A. Higginson ,  Andreas Bibl ,  David Albertalli

IPC: B25J15/00 ,  H02N13/00

CPC classification number: B25J15/0085 ,  B81C99/002 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/67259 ,  H01L24/75 ,  H01L24/95 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75753 ,  H01L2224/7598 ,  H02N13/00

Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool includes an articulating transfer head assembly, a carrier substrate holder, and an actuator assembly to adjust a spatial relationship between the articulating transfer head assembly and the carrier substrate holder. The articulating transfer head assembly may include an electrostatic voltage source connection and a substrate supporting an array of electrostatic transfer heads.

Abstract translation: 公开了用于从载体衬底传送微器件的系统和方法。 在一个实施例中，传质工具包括铰接传送头组件，载体衬底保持器和致动器组件，以调节关节式传送头组件和载体衬底保持器之间的空间关系。 铰接传送头组件可以包括静电电压源连接和支撑静电转印头阵列的基片。

公开(公告)号：US09095980B2

公开(公告)日：2015-08-04

申请号：US13776188

申请日：2013-02-25

Applicant: LuxVue Technology Corporation

Inventor： Dariusz Golda ,  John A. Higginson ,  Andreas Bibl ,  Paul Argus Parks ,  Stephen Paul Bathurst

IPC: B25J11/00 ,  H01L21/00 ,  B25J15/00

CPC classification number: B25J11/00 ,  B25J7/00 ,  B25J9/0015 ,  B25J15/0052 ,  B25J15/0085 ,  H01L24/75 ,  H01L2224/7598

Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices.

Abstract translation: 公开了用于从载体衬底传送微器件的系统和方法。 在一个实施例中，质量传递工具操纵器组件允许在微拾取阵列上的静电转印头阵列和载体衬底上的微器件阵列之间的主动对准。 可以检测质量传递工具操纵器组件的柔性元件的位移，以控制静电转印头阵列与微器件阵列之间的对准。

公开(公告)号：US20150093842A1

公开(公告)日：2015-04-02

申请号：US14563763

申请日：2014-12-08

Applicant: LuxVue Technology Corporation

Inventor： John A. Higginson ,  Andreas Bibl ,  Hsin-Hua Hu

IPC: H01L33/00 ,  H01L33/44 ,  H01L33/62 ,  H01L33/06 ,  H01L33/42

CPC classification number: H01L25/167 ,  H01L21/56 ,  H01L23/3171 ,  H01L25/0753 ,  H01L25/50 ,  H01L27/1214 ,  H01L27/1248 ,  H01L27/1262 ,  H01L33/005 ,  H01L33/06 ,  H01L33/42 ,  H01L33/44 ,  H01L33/54 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00

Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.

Abstract translation: 公开了一种用于在接收基板上接收微型装置的方法和结构。 诸如微型LED器件的微器件通过覆盖接收衬底上的导电层的钝化层穿孔，并且钝化层硬化。 在一个实施例中，微型LED器件通过B阶热固性材料穿孔。 在一个实施例中，微型LED器件穿过热塑性材料。

公开(公告)号：US20140169927A1

公开(公告)日：2014-06-19

申请号：US13715591

申请日：2012-12-14

Applicant: LUXVUE TECHNOLOGY CORPORATION

Inventor： Dariusz Golda ,  John A. Higginson ,  Andreas Bibl

IPC: B25J15/00 ,  H02N13/00

CPC classification number: B25J15/0085 ,  B25J7/00 ,  B81C99/002 ,  H01L24/75 ,  H01L2224/7598 ,  Y10T29/53174

Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a micro pick up array structure allows the micro pick up array to automatically align with the carrier substrate. Deflection of the micro pick up array may be detected to control further movement of the micro pick up array.

Abstract translation: 公开了用于从载体衬底传送微器件的系统和方法。 在一个实施例中，微拾取阵列结构允许微拾取阵列自动地与载体衬底对准。 可以检测微拾取阵列的偏转以控制微拾取阵列的进一步移动。

公开(公告)号：US20130210194A1

公开(公告)日：2013-08-15

申请号：US13749647

申请日：2013-01-24

Applicant: LuxVue Technology Corporation

Inventor： Andreas Bibl ,  John A. Higginson ,  Hsin-Hua Hu ,  Hung-Fai Stephen Law

IPC: H01L23/00

CPC classification number: H01L24/83 ,  H01L21/67144 ,  H01L24/75 ,  H01L24/95 ,  H01L2224/29105 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29118 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29183 ,  H01L2224/75261 ,  H01L2224/75281 ,  H01L2224/75282 ,  H01L2224/75283 ,  H01L2224/75725 ,  H01L2224/7598 ,  H01L2224/83 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83805 ,  H01L2224/83825 ,  H01L2224/8383 ,  H01L2224/83948 ,  H01L2224/95001 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/12041 ,  H01L2924/1461 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01031 ,  H01L2924/01051 ,  H01L2924/01029 ,  H01L2924/01048 ,  H01L2924/01082 ,  H01L2924/0103

Abstract: Electrostatic transfer head array assemblies and methods of transferring and bonding an array of micro devices to a receiving substrate are described. In an embodiment, a method includes picking up an array of micro devices from a carrier substrate with an electrostatic transfer head assembly supporting an array of electrostatic transfer heads, contacting a receiving substrate with the array of micro devices, transferring energy from the electrostatic transfer head assembly to bond the array of micro devices to the receiving substrate, and releasing the array of micro devices onto the receiving substrate.

Abstract translation: 描述静电转印头阵列组件以及将微器件阵列转移和接合到接收衬底的方法。 在一个实施例中，一种方法包括从载体基板拾取微器件阵列，其中静电转印头组件支持静电转印头阵列，使接收基片与微器件阵列接触，将静电转印头 组件将微器件阵列接合到接收衬底，以及将微器件阵列释放到接收衬底上。

公开(公告)号：US20130128585A1

公开(公告)日：2013-05-23

申请号：US13708704

申请日：2012-12-07

Applicant: LUXVUE TECHNOLOGY CORPORATION

Inventor： Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law ,  Hsin-Hua Hu

IPC: H01L33/04 ,  F21V7/00 ,  H01L29/06

CPC classification number: H01L33/06 ,  F21V7/00 ,  H01L25/0753 ,  H01L27/15 ,  H01L29/0684 ,  H01L33/0079 ,  H01L33/04 ,  H01L33/20 ,  H01L33/28 ,  H01L33/30 ,  H01L2224/95

Abstract: A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.

Abstract translation: 描述了微型发光二极管（LED）和形成用于传送到接收基板的微型LED阵列的方法。 微型LED结构可以包括微型p-n二极管和金属化层，金属化层位于微型p-n二极管和结合层之间。 保形介质阻挡层可以跨越微型p-n二极管的侧壁。 微型LED结构和微型LED阵列可以被拾取并转移到接收衬底。

公开(公告)号：US09425151B2

公开(公告)日：2016-08-23

申请号：US14307325

申请日：2014-06-17

Applicant: LuxVue Technology Corporation

Inventor： Dariusz Golda ,  Stephen P. Bathurst ,  John A. Higginson ,  Andreas Bibl ,  Jeffrey Birkmeyer

IPC: H01L21/768 ,  H01L23/538 ,  H01L23/00

CPC classification number: H01L23/5384 ,  B81C99/002 ,  H01L21/76898 ,  H01L24/75 ,  H01L24/95

Abstract: A compliant electrostatic transfer head and method of forming a compliant electrostatic transfer head are described. In an embodiment, a compliant electrostatic transfer head includes a cavity in a base substrate, a spring support layer on the base substrate, and a patterned device layer on the spring support layer. The spring support layer includes a spring support layer beam profile that extends over and is deflectable toward the cavity, and the patterned device layer includes an electrode beam profile that is supported by the spring support layer beam profile and extends over and is deflectable toward the cavity.

Abstract translation: 描述了柔性静电转印头和形成顺应性静电转印头的方法。 在一个实施例中，顺应性静电转印头包括基底衬底中的空腔，在基底衬底上的弹簧支撑层，以及弹簧支撑层上的图案化器件层。 弹簧支撑层包括弹簧支撑层梁轮廓，该弹性支撑层梁型材向空腔延伸并且可偏转，并且图案化的装置层包括由弹簧支撑层梁轮廓支撑并且朝向腔体可偏转的电极梁轮廓 。

公开(公告)号：US09391042B2

公开(公告)日：2016-07-12

申请号：US13715557

申请日：2012-12-14

Applicant: Luxvue Technology Corporation

Inventor： Dariusz Golda ,  John A. Higginson ,  Andreas Bibl

IPC: B23P19/00 ,  H01R43/042 ,  H01L23/00

CPC classification number: H01L24/75 ,  H01L24/97 ,  H01L25/167 ,  H01L33/00 ,  H01L2224/75725 ,  H01L2224/75843 ,  H01L2224/7598 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/351 ,  Y10T279/23 ,  H01L2924/00

Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a micro pick up array mount includes a pivot platform to allow a micro pick up array to automatically align with a carrier substrate. Deflection of the pivot platform may be detected to control further movement of the micro pick up array.

Abstract translation: 公开了用于从载体衬底传送微器件的系统和方法。 在一个实施例中，微拾取阵列安装件包括枢轴平台，以允许微拾取阵列自动对准载体衬底。 可以检测枢轴平台的偏转以控制微拾取阵列的进一步移动。