公开(公告)号：US20080017967A1

公开(公告)日：2008-01-24

申请号：US11780786

申请日：2007-07-20

申请人： Michael Bauer ,  Ludwig Heitzer ,  Jens Pohl ,  Peter Strobel ,  Christian Stuempfl

发明人： Michael Bauer ,  Ludwig Heitzer ,  Jens Pohl ,  Peter Strobel ,  Christian Stuempfl

IPC分类号： H01L23/02 ,  H01L21/00

CPC分类号： H05K1/141 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8388 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/3025 ,  H05K3/3436 ,  H05K2201/049 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10734 ,  H01L2924/00 ,  H01L2924/3512

摘要： An electronic circuit in a package-on-package configuration includes: a lower subassembly with a first electronic element, a first wiring carrier, a first housing with a first redistribution layer and an arrangement of solder balls disposed on the first redistribution layer and an upper subassembly with a second electronic element mounted on the lower subassembly. A method for producing the electronic circuit in a package-on-package configuration includes: adhering an upper side of the first electronic element to an underside of the first redistribution layer via a radiation-crosslinking thermoplastic adhesive.

摘要翻译： 封装在封装构造中的电子电路包括：具有第一电子元件的下部子组件，第一布线载体，具有第一再分布层的第一壳体和布置在第一再分布层上的焊球布置，以及上部 子组件具有安装在下部子组件上的第二电子元件。 一种封装在封装结构中的电子电路的制造方法，其特征在于，包括：通过辐射交联热塑性粘合剂将第一电子元件的上侧粘接到第一再分布层的下侧。

公开(公告)号：US07208827B2

公开(公告)日：2007-04-24

申请号：US10149892

申请日：2000-12-13

申请人： Christian Hauser ,  Simon Muff ,  Jens Pohl ,  Friedrich Wanninger

发明人： Christian Hauser ,  Simon Muff ,  Jens Pohl ,  Friedrich Wanninger

IPC分类号： H01L23/22 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/32 ,  H01L23/3107 ,  H01L23/3677 ,  H01L2224/27013 ,  H01L2224/83051 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3025

摘要： A semiconductor component package configuration includes a semiconductor chip mounted to a printed circuit board, and a substrate arranged between the semiconductor chip and the printed circuit board. The substrate is for routing the wiring terminals of the semiconductor chip to the printed circuit board. The substrate is connected to the printed circuit board by solder joints. A filler between the semiconductor chip and the substrate mechanically isolates the semiconductor chip and the solder joints. A metal layer, which is connected to solder joints, is applied to the substrate. At least one molded element of heat-dissipating material is applied to the metal layer and is connected in a heat-conducting manner to the metal layer. This provides the package configuration with an improved capability of conducting the lost power that is dissipated from the installed semiconductor chip, and the desired mechanical properties of the package arrangement are retained.

摘要翻译： 半导体部件封装构造包括安装到印刷电路板的半导体芯片和布置在半导体芯片和印刷电路板之间的基板。 基板用于将半导体芯片的布线端子布线到印刷电路板。 基板通过焊点连接到印刷电路板。 半导体芯片和基板之间的填充物机械地隔离半导体芯片和焊点。 将连接到焊接点的金属层施加到基板。 将至少一个散热材料的模制元件施加到金属层，并以导热方式连接到金属层。 这提供了封装配置，其具有改进的能够从所安装的半导体芯片散发的损失功率的能力，并且保持了封装布置的期望的机械特性。

公开(公告)号：US20060273443A1

公开(公告)日：2006-12-07

申请号：US11444530

申请日：2006-06-01

申请人： Michael Bauer ,  Jens Pohl

发明人： Michael Bauer ,  Jens Pohl

IPC分类号： H01L23/24

CPC分类号： H01L23/5389 ,  H01L21/563 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/49805 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73203 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/3011

摘要： A package for an electronic component includes a synthetic package compound. This synthetic package compound includes an upper outer contact on its upper side and a lower outer contact on its lower side, where the upper outer contact is electrically connected to the lower outer contact via a conduction path. The synthetic package compound includes a mixture of a plastic with filler particles. The conduction path is formed from free conducting metallic inclusions. The filler particles are provided with metallorganic compounds or inorganic complex compounds. The inclusions are formed by photolytic decomposition of the metallorganic compounds or inorganic complex compounds.

摘要翻译： 用于电子部件的包装包括合成包装化合物。 这种合成包装化合物包括其上侧的上外接触件和其下侧上的下外接触件，其中上外接触件通过传导路径电连接到下外触头。 合成包装化合物包括塑料与填料颗粒的混合物。 导电路径由自由导电金属夹杂物形成。 填料颗粒中含有金属有机化合物或无机络合物。 夹杂物是由金属有机化合物或无机络合物的光分解形成的。

公开(公告)号：US20060175419A1

公开(公告)日：2006-08-10

申请号：US11341892

申请日：2006-01-30

申请人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Peter Strobel ,  Holger Woerner

发明人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Peter Strobel ,  Holger Woerner

IPC分类号： G06K19/06

CPC分类号： H01L21/568 ,  G06K19/07743 ,  G06K19/07745 ,  G06K19/07747 ,  H01L21/561 ,  H01L21/566 ,  H01L23/3107 ,  H01L23/49855 ,  H01L23/5389 ,  H01L24/48 ,  H01L24/49 ,  H01L24/96 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A smart card for contact data transmission includes a card body and a smart card module which is fitted in the card body. The smart card module includes a semiconductor chip with an active upper surface, a plastic housing compound that surrounds the semiconductor chip and includes at least one surface that is coplanar with the active upper surface of the semiconductor chip, a first dielectric layer that is arranged on the plastic housing compound surface and on the active upper surface of the semiconductor chip, one or more interposer metallization levels, which are isolated via further dielectric layers and are connected to the active upper surface of the semiconductor chip, and external contact surfaces. The external contact surfaces are formed on the outermost interposer level and facilitate contact data transmission. The smart card module uses no bonding wires and has a very small physical volume.

公开(公告)号：US20050220794A1

公开(公告)日：2005-10-06

申请号：US11132241

申请日：2005-05-19

申请人： Gertrud Hotten ,  Helge Neidhardt ,  Rolf Bechtold ,  Jens Pohl ,  Michael Paulista

发明人： Gertrud Hotten ,  Helge Neidhardt ,  Rolf Bechtold ,  Jens Pohl ,  Michael Paulista

IPC分类号： A61K39/395 ,  C07K16/22

CPC分类号： C07K16/22 ,  A61K38/00 ,  C07K14/495 ,  Y10S435/81 ,  Y10S435/975

摘要： The invention relates to an antibody or antibody fragment which specifically binds to a protein of the TGF-β family. The invention also relates to a kit for detecting a protein of the TGF-β family which comprises the antibody or antibody fragment. Finally, the invention relates to method for detecting a protein of the TGF-β family which uses the antibody or antibody fragment.

摘要翻译： 本发明涉及特异性结合TGF-β家族的蛋白质的抗体或抗体片段。 本发明还涉及用于检测包含抗体或抗体片段的TGF-β家族的蛋白质的试剂盒。 最后，本发明涉及检测使用该抗体或抗体片段的TGF-β家族的蛋白质的方法。

公开(公告)号：US20050194674A1

公开(公告)日：2005-09-08

申请号：US10790907

申请日：2004-03-02

申请人： Jochen Thomas ,  Peter Weitz ,  Jurgen Grafe ,  Harry Hedler ,  Jens Pohl

发明人： Jochen Thomas ,  Peter Weitz ,  Jurgen Grafe ,  Harry Hedler ,  Jens Pohl

IPC分类号： G11C5/14 ,  H01L23/48 ,  H01L23/50 ,  H01L25/065

CPC分类号： H01L25/0657 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06575 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012

摘要： An apparatus and a method of manufacture for a stacked-die assembly. A first die is placed on a substrate such that the backside of the die, i.e., the side opposite the side with the bond pads, is coupled to the substrate, preferably by an adhesive. Wire leads electrically couple the bond pads of the first die to contacts on the substrate. A second die is placed on the first die, and wire leads electrically couple the bond pads of the second die to contacts on the substrate. Preferably, a spacer is placed between the first die and the second die. Additional dies may be stacked on the second die.

摘要翻译： 堆叠式模具组件的装置和制造方法。 第一管芯被放置在衬底上，使得管芯的背面，即与接合焊盘的侧面相反的一侧，优选地通过粘合剂耦合到衬底。 引线将第一管芯的接合焊盘电耦合到衬底上的接触点。 第二管芯被放置在第一管芯上，引线将第二管芯的接合焊盘电耦合到衬底上的接触点。 优选地，间隔件被放置在第一管芯和第二管芯之间。 另外的模具可以堆叠在第二模具上。

公开(公告)号：US20050169965A1

公开(公告)日：2005-08-04

申请号：US11080494

申请日：2005-03-16

申请人： Michael Paulista ,  Jens Pohl ,  Joachim Pabst ,  Helmut Heide

发明人： Michael Paulista ,  Jens Pohl ,  Joachim Pabst ,  Helmut Heide

IPC分类号： C12N15/09 ,  A61K38/00 ,  A61K38/18 ,  A61L27/00 ,  A61L27/22 ,  A61L27/42 ,  C07K14/495 ,  C07K14/51 ,  C07K19/00 ,  A61K38/17 ,  A61F2/00 ,  A61K33/42

CPC分类号： A61L27/425 ,  A61K38/1875 ,  A61L27/227 ,  C07K14/495 ,  C07K14/51

摘要： The present invention concerns a bioactive implant material having a cartilage-inducing and/or bone-inducing activity composed of two components A and B, of which A is a bone-inducing and/or cartilage-inducing protein or protein mixture and preferably one or several proteins from the TGF-β superfamily, preferably MP52 or a DNA sequence coding therefor and B is a carrier matrix composed of calcium phosphate ceramics with an interconnecting microporosity which already alone has bone-inducing properties. The invention additionally concerns the production of these compounds and their use for the treatment of diseases which affect cartilage and/or bones as well as to treat damage to cartilage and/or bone tissue.

摘要翻译： 本发明涉及具有由两种组分A和B组成的软骨诱导和/或骨诱导活性的生物活性植入材料，其中A是诱导骨诱导和/或软骨诱导蛋白或蛋白质混合物，优选其中一种或 来自TGF-β超家族的几种蛋白质，优选MP52或其编码的DNA序列，B是由磷酸钙陶瓷构成的载体基质，其具有已经单独具有骨诱导性质的互连微孔。 本发明还涉及这些化合物的生产及其用于治疗影响软骨和/或骨骼的疾病以及治疗软骨和/或骨组织损伤的用途。

公开(公告)号：US20050087851A1

公开(公告)日：2005-04-28

申请号：US10928458

申请日：2004-08-27

申请人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Holger Woerner ,  Peter Strobel

发明人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Holger Woerner ,  Peter Strobel

IPC分类号： H01L21/60 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L23/02

CPC分类号： H01L24/82 ,  H01L23/3107 ,  H01L23/49838 ,  H01L23/49855 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/3025 ,  H01L2224/96 ,  H01L2224/82

摘要： The invention relates to an electronic module having plug contacts, which has a semiconductor chip embedded in a plastics composition with its rear side and its edge sides. An active top side of the semiconductor chip forms, together with the plastics composition, an overall top side, there being arranged on the latter a rewiring layer with plug contact areas and rewiring lines that connect the plug contact areas to contact areas of the top side of the semiconductor chip.

摘要翻译： 本发明涉及一种具有插头触点的电子模块，其具有嵌入塑料组合物中的半导体芯片，其后侧及其边缘侧。 半导体芯片的有源顶侧与塑料组合物一起形成整个顶侧，其上布置有具有插头接触区域的重新布线层和将插头接触区域连接到顶侧的接触区域的重新布线 的半导体芯片。

公开(公告)号：US06377460B1

公开(公告)日：2002-04-23

申请号：US09583131

申请日：2000-05-30

申请人： Jens Pohl ,  Gerolf Thamm ,  Andreas Hippe

发明人： Jens Pohl ,  Gerolf Thamm ,  Andreas Hippe

IPC分类号： H05K720

CPC分类号： H01L23/3677 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2224/0401

摘要： An electronic circuit module has at least one electronic component and a heat sink, which is thermally connected to the at least one electronic component. A thermal conduction path between the at least one electronic component and the heat sink is formed by an intermediate layer, which adjoins a surface of the heat sink. The intermediate layer is formed by an island-like structure including pillars of a flexible, thermally conductive material.

摘要翻译： 电子电路模块具有与至少一个电子部件热连接的至少一个电子部件和散热器。 所述至少一个电子部件与所述散热器之间的热传导路径由与所述散热片的表面相邻的中间层形成。 中间层由包括柔性导热材料柱的岛状结构形成。

公开(公告)号：US08309454B2

公开(公告)日：2012-11-13

申请号：US11746936

申请日：2007-05-10

申请人： Markus Brunnbauer ,  Thorsten Meyer ,  Stephan Bradl ,  Ralf Plieninger ,  Jens Pohl ,  Klaus Pressel ,  Recai Sezi

发明人： Markus Brunnbauer ,  Thorsten Meyer ,  Stephan Bradl ,  Ralf Plieninger ,  Jens Pohl ,  Klaus Pressel ,  Recai Sezi

IPC分类号： H01L21/4763

CPC分类号： H01L25/50 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/48 ,  H01L23/5389 ,  H01L23/552 ,  H01L23/60 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1617 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2224/82 ,  H01L2924/00

摘要： A workpiece has at least two semiconductor chips, each semiconductor chip having a first main surface, which is at least partially exposed, and a second main surface. The workpiece also comprises an electrically conducting layer, arranged on the at least two semiconductor chips, the electrically conducting layer being arranged at least on regions of the second main surface, and a molding compound, arranged on the electrically conducting layer.

摘要翻译： 工件具有至少两个半导体芯片，每个半导体芯片具有至少部分暴露的第一主表面和第二主表面。 所述工件还包括布置在所述至少两个半导体芯片上的导电层，所述导电层至少布置在所述第二主表面的区域上，所述模制化合物布置在所述导电层上。