公开(公告)号：US20020171516A1

公开(公告)日：2002-11-21

申请号：US09826548

申请日：2001-04-04

申请人： MCNC

发明人： William T. Joines ,  William D. Palmer

IPC分类号： H01P003/08

CPC分类号： H01P3/085 ,  H01P1/181 ,  H01P1/20363 ,  H01P3/081 ,  H01P5/04

摘要： A passive microwave component with constant impedance and electrically adjustable phase length utilizes a microstrip or stripline transmission line geometry incorporating a composite dielectric having both ferroelectric (FE) and ferromagnetic (FM) properties. These properties can be varied with externally applied electric and magnetic fields such that the phase length (or electrical length) of the line can be varied without varying the characteristic impedance of the transmission line. Thus, the component can be electrically tuned without adversely affecting the impedance match. The component can be used in microwave devices such as phase shifters, frequency filters, directional couplers, power dividers and combiners, and impedance-matching networks.

摘要翻译： 具有恒定阻抗和电可调相位长度的无源微波元件利用微带或带状线传输线几何结构，其结合具有铁电（FE）和铁磁（FM）特性两者的复合电介质。 这些性质可以随着外部施加的电场和磁场而变化，使得线的相位长度（或电长度）可以改变而不改变传输线的特性阻抗。 因此，该组件可以被电调谐而不会不利地影响阻抗匹配。 该元件可用于微波器件，如移相器，频率滤波器，定向耦合器，功率分配器和组合器以及阻抗匹配网络。

公开(公告)号：US20020148964A1

公开(公告)日：2002-10-17

申请号：US09834825

申请日：2001-04-13

申请人： MCNC

发明人： David E. Dausch ,  Gary E. McGuire

IPC分类号： G01J005/00

CPC分类号： B81B3/0035 ,  G02B26/0833 ,  G02B26/0841 ,  G02B26/0866

摘要： The present invention provides for an improved electromagnetic radiation detector having a micromachined electrostatic chopping device. The MEMS flexible film chopping device provides reliability, efficiency, noise reduction and temperature fluctuation compensation capabilities to the associated electromagnetic radiation detector. An electromagnetic radiation detector having an electrostatic chopper device comprises a detector material element, first and second electrodes in electrical contact with the detector material element and electrically isolated from one another. Additionally, the chopper device will incorporate a flexible film actuator overlying the detector material layer and moveable relative thereto. The flexible film actuator will typically include an electrode element and a biasing element such that the actuator remains in a fully curled, open state absent electrostatic voltage and moves to a fully uncurled, closed state upon the application of electrostatic voltage. Arrays that incorporate a plurality of electromagnetic radiation detectors and/or electrostatic chopping devices are additionally provided for.

摘要翻译： 本发明提供一种具有微加工静电斩波装置的改进的电磁辐射检测器。 MEMS柔性薄膜切断装置为相关的电磁辐射探测器提供可靠性，效率，降噪和温度波动补偿能力。 具有静电斩波装置的电磁辐射检测器包括检测器材料元件，与检测器材料元件电接触并彼此电隔离的第一和第二电极。 此外，斩波器装置将包括一个柔性膜致动器，覆盖检测器材料层并可相对于其移动。 柔性膜致动器通常将包括电极元件和偏置元件，使得致动器在静电电压下保持完全卷曲的打开状态，并且在施加静电电压时移动到完全未弯曲的闭合状态。 另外提供了并入有多个电磁辐射检测器和/或静电斩波装置的阵列。

公开(公告)号：US6117299A

公开(公告)日：2000-09-12

申请号：US854075

申请日：1997-05-09

申请人： Glenn A. Rinne ,  Christine Lizzul

发明人： Glenn A. Rinne ,  Christine Lizzul

IPC分类号： C25D7/12 ,  H01L21/60 ,  H01L23/12 ,  C25D5/02

CPC分类号： H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05558 ,  H01L2224/05599 ,  H01L2224/1147 ,  H01L2224/11912 ,  H01L2224/13016 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L23/5286 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/30107

摘要： Methods of electroplating solder bumps of uniform height on integrated circuit substrates include the steps of drawing plating current through an integrated circuit wafer by electrically shorting an integrated circuit's ground, power and signal pads together using an ultra-thin plating base layer (e.g.,

摘要翻译： 在集成电路基板上电镀均匀高度的焊料凸块的方法包括以下步骤：通过使用超薄电镀基底层将集成电路的接地，功率和信号焊盘电连接在一起，将电镀电流拉过集成电路晶片（例如，<0.075 μm厚），然后使用背面晶片接触件沿着延伸穿过地面和信号焊盘并进入衬底的平行路径绘制电镀电流。 接地焊盘优选地在衬底接触区域（例如，N +或P +扩散区域）处电耦合到衬底，并且信号焊盘优选地通过有源半导体器件（例如，FET，BJT等）电耦合到衬底。 ），信号垫被附着到其上。 优选通过集成电路的有源半导体器件和衬底接触区域平行地绘制电镀电流。 即使电镀底层具有小于约0.075μm的优选厚度，通过衬底接触区域和有源半导体器件的电镀电流的组合贡献足以将电镀基底层和下面的焊盘保持在均匀的电位。 这些均匀且典型的非零电位导致电镀速率通过限制通过电镀基层的横向电流流过晶片高度均匀。 电镀焊料凸块的均匀性也可以通过使用高密度控制崩溃芯片连接（C4）（“倒装芯片”）技术并通过在每个“倒装芯片”上散布接地和信号焊盘，从而增强每个信号焊盘 至少有一个接地垫作为最近的邻居。

公开(公告)号：US6087747A

公开(公告)日：2000-07-11

申请号：US285206

申请日：1999-04-01

申请人： Vijayakumar R. Dhuler ,  David A. Koester ,  Mark D. Walters ,  Karen W. Markus

发明人： Vijayakumar R. Dhuler ,  David A. Koester ,  Mark D. Walters ,  Karen W. Markus

IPC分类号： G02B26/10 ,  B32B3/10 ,  B81B3/00 ,  B81C1/00 ,  G02B26/08 ,  H02N1/00

CPC分类号： G02B26/0841 ,  B81B3/0051 ,  G02B26/101 ,  B81B2201/042 ,  B81B2203/058 ,  Y10S359/90 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/24355 ,  Y10T428/24479

摘要： An electromechanical device includes a first frame having a first aperture therein, a second frame suspended in the first frame wherein the second frame has a second aperture therein, and a plate suspended in the second aperture. A first pair of beams support the second frame along a first axis relative to the first frame so that the second frame rotates about the first axis. A second pair of beams supports the plate along a second axis relative to the second frame so that the plate rotates about the second axis relative to the frame. The first and second axes preferably intersect at a 90.degree. angle. A first actuator provides mechanical force for rotating the second frame relative to the first frame about the first axis. A second actuator provides mechanical force for rotating the plate relative to the second frame about the second axis. Accordingly, the plate can be independently rotated relative to the first axis and the second axis. Related methods are also disclosed.

摘要翻译： 机电装置包括其中具有第一孔的第一框架，悬挂在第一框架中的第二框架，其中第二框架在其中具有第二孔，以及悬挂在第二孔中的板。 第一对梁相对于第一框架沿着第一轴线支撑第二框架，使得第二框架围绕第一轴线旋转。 第二对梁相对于第二框架沿着第二轴支撑板，使得板相对于框架绕第二轴线旋转。 第一和第二轴优选地以90°角相交。 第一致动器提供用于使第二框架围绕第一轴线相对于第一框架旋转的机械力。 第二致动器提供用于相对于第二框架围绕第二轴线旋转板的机械力。 因此，板可以相对于第一轴线和第二轴线独立地旋转。 还公开了相关方法。

公开(公告)号：US6023121A

公开(公告)日：2000-02-08

申请号：US232940

申请日：1999-01-19

申请人： Vijayakumar R. Dhuler ,  Robert L. Wood ,  Ramaswamy Mahadevan

发明人： Vijayakumar R. Dhuler ,  Robert L. Wood ,  Ramaswamy Mahadevan

IPC分类号： B81B3/00 ,  B81C1/00 ,  F03G7/06 ,  F15C5/00 ,  F16K99/00 ,  G02B6/38 ,  G02B6/42 ,  H01H1/00 ,  H01H9/14 ,  H01H61/00 ,  H01H61/02 ,  H01H65/00 ,  H01H67/26 ,  H04Q1/16 ,  H02N10/00

CPC分类号： F16K99/0001 ,  B81B3/0024 ,  B81B3/0054 ,  F03G7/06 ,  F15C5/00 ,  F16K99/0011 ,  F16K99/0044 ,  H01H1/0036 ,  H01H61/02 ,  B81B2201/031 ,  B81B2201/054 ,  B81B2203/0109 ,  B81B2203/051 ,  F16K2099/0071 ,  F16K2099/0074 ,  F16K2099/008 ,  F16K99/0034 ,  G02B6/3803 ,  G02B6/4226 ,  H01H2001/0042 ,  H01H2001/0047 ,  H01H2001/0068 ,  H01H2061/006 ,  H01H61/00 ,  H01H67/26 ,  H01H9/14 ,  Y10T29/49105

摘要： A MEMS actuator is provided that produces significant forces and displacements while consuming a reasonable amount of power. The MEMS actuator includes a microelectronic substrate, spaced apart supports on the substrate and a metallic arched beam extending between the spaced apart supports. The MEMS actuator also includes a heater for heating the arched beam to cause further arching of the beam. In order to effectively transfer heat from the heater to the metallic arched beam, the metallic arched beam extends over and is spaced, albeit slightly, from the heater. As such, the MEMS actuator effectively converts the heat generated by the heater into mechanical motion of the metallic arched beam. A family of other MEMS devices, such as relays, switching arrays and valves, are also provided that include one or more MEMS actuators in order to take advantage of its efficient operating characteristics. In addition, a method of fabricating a MEMS actuator is further provided.

摘要翻译： 提供了一种MEMS致动器，其在消耗合理的功率的同时产生显着的力和位移。 MEMS致动器包括微电子基板，在基板上的间隔开的支撑件和在间隔开的支撑件之间延伸的金属拱形梁。 MEMS致动器还包括用于加热拱形梁以进一步拱起梁的加热器。 为了有效地将热量从加热器传递到金属拱形梁，金属拱形梁从加热器延伸过去并且稍微间隔开。 因此，MEMS致动器有效地将由加热器产生的热量转换成金属拱形梁的机械运动。 还提供了一系列其它MEMS器件，例如继电器，开关阵列和阀，其包括一个或多个MEMS致动器以便利用其有效的操作特性。 此外，还提供了一种制造MEMS致动器的方法。

公开(公告)号：US5992729A

公开(公告)日：1999-11-30

申请号：US724910

申请日：1996-10-02

申请人： Nicholas G. Koopman ,  Sundeep Nangalia

发明人： Nicholas G. Koopman ,  Sundeep Nangalia

IPC分类号： B23K1/06 ,  H05K3/34 ,  B23K1/20 ,  B23K31/02

CPC分类号： B23K1/06 ,  H05K3/3436

摘要： A first component is soldered to a second component by placing the first component on the second component with solder therebetween, then ultrasonically vibrating at least one of the first and second components to thereby tack the solder to at least one of the first and second components, and by reflowing the solder. Ultrasonic vibration of at least one of the first and second components to thereby tack the solder is preferably performed for less than one second. A component placer places the first component on the second component with solder therebetween. An ultrasonic vibrator ultrasonically vibrates at least one of the placed first and second components, to thereby tack the solder to at least one of the placed first and second components. A solder reflower reflows the tacked solder to thereby solder the first component to the second component.

摘要翻译： 将第一部件焊接到第二部件上，通过将第一部件放置在第二部件上，在其间具有焊料，然后对第一和第二部件中的至少一个进行超声波振动，从而将焊料固定到第一和第二部件中的至少一个， 并通过回流焊料。 第一和第二组分中的至少一个的超声波振动优选地进行少于1秒。 组件放置器将第一部件放置在第二部件上，其间具有焊料。 超声波振动器超声振动放置的第一和第二部件中的至少一个，从而将焊料固定到所放置的第一和第二部件中的至少一个。 焊料回流焊机将固定的焊料回流，从而将第一部件焊接到第二部件。

公开(公告)号：US5962949A

公开(公告)日：1999-10-05

申请号：US965277

申请日：1997-11-06

申请人： Vijayakumar R. Dhuler ,  Robert L. Wood

发明人： Vijayakumar R. Dhuler ,  Robert L. Wood

IPC分类号： G01B21/00 ,  B25J7/00 ,  B81B3/00 ,  B81B7/02 ,  F03G7/06 ,  G01B7/004 ,  G01B7/34 ,  G01N27/00 ,  G02B6/38 ,  G02B6/42 ,  H01H1/00 ,  H01H9/14 ,  H01H61/00 ,  H01H37/32 ,  H01L37/00

CPC分类号： F03G7/06 ,  B81B3/0024 ,  B81B2201/032 ,  B81B2201/054 ,  B81B2203/0109 ,  B81B2203/051 ,  G02B6/3803 ,  G02B6/4226 ,  H01H1/0036 ,  H01H2001/0042 ,  H01H2001/0068 ,  H01H2061/006 ,  H01H61/00 ,  H01H9/14

摘要： A microelectromechanical (MEMS) positioning apparatus is provided that can precisely microposition an object in each of the X, Y and Z directions. The MEMS positioning apparatus includes a reference surface, a support disposed in a fixed position to the reference surface, and a stage defining an XY plane that is suspended adjacent to the support and over at least a portion of the reference surface. The MEMS positioning apparatus also includes at least one and, more typically, several actuators for precisely positioning the stage and, in turn, objects carried by the stage. For example, the MEMS positioning apparatus can include first and second MEMS actuators for moving the stage in the XY plane upon actuation. In addition, the MEMS positioning apparatus can include a Z actuator, such as a thermal bimorph structure, for moving the stage in the Z direction. As such, the MEMS positioning apparatus can precisely position the stage as well as any objects carried by the stage in each of the X, Y and Z directions. As a result of the construction of the MEMS positioning apparatus, the MEMS positioning apparatus can also be fabricated in an affordable, reliable and reproducible manner without compromising the precision alignment provided by the MEMS positioning apparatus.

摘要翻译： 提供了一种微机电（MEMS）定位装置，其能够精确地将对象在X，Y和Z方向中的每一个定位。 MEMS定位设备包括参考表面，设置在参考表面的固定位置的支撑件以及限定垂直于支撑件悬挂并在参考表面的至少一部分上方的XY平面的平台。 MEMS定位装置还包括至少一个并且更典型的几个致动器，用于精确地定位平台，并且依次由舞台承载的物体。 例如，MEMS定位装置可以包括用于在致动时在XY平面中移动台的第一和第二MEMS致动器。 此外，MEMS定位装置可以包括用于在Z方向上移动台的Z致动器，例如热双压电晶片结构。 因此，MEMS定位装置可以精确地定位舞台以及在X，Y和Z方向中的每一个中由舞台承载的任何物体。 作为MEMS定位装置的结构的结果，MEMS定位装置也可以以可承受的，可靠的和可再生的方式制造，而不会损害由MEMS定位装置提供的精确对准。

公开(公告)号：US5923796A

公开(公告)日：1999-07-13

申请号：US842846

申请日：1997-04-17

申请人： Michael R. Feldman ,  Iwona Turlik ,  Gretchen M. Adema

发明人： Michael R. Feldman ,  Iwona Turlik ,  Gretchen M. Adema

IPC分类号： G02B6/10 ,  G02B6/42 ,  G02B6/43 ,  H01L23/48 ,  G03H1/00

CPC分类号： H01L24/73 ,  G02B6/43 ,  H01L23/48 ,  G02B6/4232 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15192

摘要： A multichip module having high density optical and electrical interconnections between integrated circuit chips includes a substrate overlaying an array of integrated circuit chips. An optical transmitter generates a first optical beam through the substrate and an optical detector receives a second optical beam through the substrate. A hologram is positioned in the path of at least one of the first and second optical beams. An array of electrical contact pads is located on the substrate corresponding to the array of electrical contact pads on the respective integrated circuit chips. A pattern of electrical interconnection lines is located on the substrate for electrically interconnecting the integrated circuit chips. A solder bump between electrical contact pads on the substrate and on the integrated circuit chips establish electrical connections between the substrate and the integrated circuit chips, and also facilitate alignment of the integrated circuit chips with respect to the substrate. The optical transmitter and detector may be mounted on/in the substrate or on/in the integrated circuit chips. The optical transmitter and detector may also be used to provide optical connections external to the microelectronic module, using a holographic substrate to optically link modules. The substrate may also be used to establish optical alignment of the hologram to an underlying optical emitter and/or optical detector without establishing electrical connections thereto.

公开(公告)号：US5647785A

公开(公告)日：1997-07-15

申请号：US527520

申请日：1995-09-13

申请人： Gary Wayne Jones ,  Ching-Tzong Sune

发明人： Gary Wayne Jones ,  Ching-Tzong Sune

IPC分类号： H01J1/304 ,  H01J9/02 ,  H01J29/04 ,  H01J29/87 ,  H01J31/12 ,  H01J1/30

CPC分类号： H01J3/021 ,  H01J1/3042 ,  H01J9/025 ,  H01J2201/319

摘要： A vertical microelectronic field emitter is formed by first forming tips on the face of a substrate and then forming trenches in the substrate around the tips to form columns in the substrate, with the tips lying on top of the columns. The trenches are filled with a dielectric and a conductor layer is formed on the dielectric. Alternatively, trenches may be formed in the face of the substrate with the trenches defining columns in the substrate. Then, tips are formed on top of the columns. The trenches are filled with dielectric and the conductor layer is formed on the dielectric to form the extraction electrodes.

摘要翻译： 通过在衬底的表面上首先形成尖端然后在衬底周围形成尖端的沟槽以在衬底中形成柱，其中尖端位于柱的顶部上，形成垂直微电子场发射器。 沟槽填充有电介质，并且在电介质上形成导体层。 或者，可以在衬底的表面形成沟槽，其中沟槽限定在衬底中的列。 然后，尖端形成在列的顶部。 沟槽用电介质填充，并且导体层形成在电介质上以形成提取电极。

公开(公告)号：US5381946A

公开(公告)日：1995-01-17

申请号：US127785

申请日：1993-09-27

申请人： Nicholas G. Koopman ,  Glenn A. Rinne ,  Iwona Turlik ,  Edward K. Yung

发明人： Nicholas G. Koopman ,  Glenn A. Rinne ,  Iwona Turlik ,  Edward K. Yung

IPC分类号： G01R31/26 ,  G01R31/28 ,  H01L21/326 ,  H01L21/66 ,  H01L23/58 ,  H01L21/60

CPC分类号： G01R31/2863 ,  H01L22/32 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/16 ,  H01L2924/01014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/15174 ,  H01L2924/15192 ,  Y10T29/49144

摘要： An integrated circuit chip having solder bumps thereon may be tested using a temporary substrate having substrate pads corresponding to locations of the input/output pads on the chip and having a sacrificial conductor layer on the temporary substrate pads. The solder bumps are placed adjacent the corresponding sacrificial metal layer and heated to form an electrical and mechanical connection between the chip and the temporary substrate. The chip is then tested and/or burned-in on the temporary substrate. After testing/burn-in, the sacrificial metal layer is dissolved into the solder bumps by heating. The integrated circuit chip, including a solder bump having the dissolved sacrificial metal layer therein, may be easily removed from the temporary substrate. Solder bumps may also be formed on the temporary substrate and transferred to unbumped chips. Solder bumps with different characteristics may be formed by varying the current-time product to each individual pad of the temporary substrate during a plating operation.

摘要翻译： 可以使用具有对应于芯片上的输入/输出焊盘的位置的衬底焊盘的临时衬底来测试其上具有焊料凸块的集成电路芯片，并且在临时衬底焊盘上具有牺牲导体层。 焊料凸点放置在相应的牺牲金属层附近，并被加热以在芯片和临时衬底之间形成电气和机械连接。 然后在临时衬底上测试和/或烧入芯片。 在测试/老化之后，通过加热将牺牲金属层溶解到焊料凸块中。 包括其中具有溶解的牺牲金属层的焊料凸块的集成电路芯片可以容易地从临时衬底移除。 也可以在临时衬底上形成焊料凸块并将其转移到未凸起的芯片。 可以通过在电镀操作期间通过改变临时衬底的每个单独衬垫的电流时间积来形成具有不同特性的焊料凸块。