Curable silicone composition and cured product thereof
    21.
    发明授权
    Curable silicone composition and cured product thereof 失效
    可固化硅酮组合物及其固化产物

    公开(公告)号:US5276087A

    公开(公告)日:1994-01-04

    申请号:US824304

    申请日:1992-01-23

    Abstract: A curable silicone composition which can cure using hydrosilylation, comprising an aluminum oxide powder and/or silica powder, the powders each consisting of substantially spherical particles with an average particle diameter of 50 .mu.m or below and an elongation of from 1.0 to 1.4 and being such that the respective amounts of alkali metal ions and halogen ions are extracted with 50 ml of water from 5 g of the powder at 121.degree. C. for 20 hours are not more than 10 ppm, wherein the amount of the component (D) is from 25 to 90% by weight based on the composition, and the ratio of the amount of hydrosilyl groups contained in the components (A) and (B) to the amount of alkenyl groups contained in the components (A) and (B) is in the range from 0.5/1 to 1.5/1. When the composition is used as a protective material or encapsulating material for devices such as ICs, generated heat can be dissipated efficiently and the devices are not be broken by abrasion. There are no fears of causing corrosion of the devices.

    Abstract translation: 一种可固化的硅氧烷组合物,其可以使用氢化硅烷化固化,其包含氧化铝粉末和/或二氧化硅粉末,所述粉末各自由平均粒径为50(my)m或更小的基本上球形的颗粒和1.0至1.4的伸长率组成 并且使得在121℃下从5g粉末中用50ml水萃取碱金属离子和卤素离子的相应量不超过10ppm,其中组分(D )为25〜90重量%,组分(A)和(B)中所含的氢化甲硅烷基的量与组分(A)和(B)中所含的烯基的量的比率为25至90重量% )在0.5 / 1至1.5 / 1的范围内。 当组合物用作诸如IC之类的装置的保护材料或封装材料时,可以有效地消散所产生的热量,并且不会由于磨损而破坏装置。 没有担心会导致器件腐蚀。

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